CN113001304A - Circuit board edge polishing production line - Google Patents

Circuit board edge polishing production line Download PDF

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Publication number
CN113001304A
CN113001304A CN202110567700.9A CN202110567700A CN113001304A CN 113001304 A CN113001304 A CN 113001304A CN 202110567700 A CN202110567700 A CN 202110567700A CN 113001304 A CN113001304 A CN 113001304A
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CN
China
Prior art keywords
circuit board
conveying
polishing
grinding
along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110567700.9A
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Chinese (zh)
Inventor
艾克华
梁勋
侯学林
胡志强
张仁军
李清华
杨海军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Yingchuangli Electronic Technology Co Ltd
Original Assignee
Sichuan Yingchuangli Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Yingchuangli Electronic Technology Co Ltd filed Critical Sichuan Yingchuangli Electronic Technology Co Ltd
Priority to CN202110567700.9A priority Critical patent/CN113001304A/en
Publication of CN113001304A publication Critical patent/CN113001304A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0023Other grinding machines or devices grinding machines with a plurality of working posts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0076Other grinding machines or devices grinding machines comprising two or more grinding tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/005Feeding or manipulating devices specially adapted to grinding machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06Dust extraction equipment on grinding or polishing machines

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

The utility model provides a circuit board border production line of polishing, includes four grinding device of group, and grinding device includes the delivery track, and the delivery track is equipped with rotary mechanism and grinding machanism in proper order, and grinding machanism's position relatively is equipped with the side direction clamp plate. The rotating mechanism comprises a lower rotating disc and an upper rotating disc which are used for clamping and rotating the circuit board, the lower rotating disc and the upper rotating disc can rotate simultaneously, and the rotating angle is 90 degrees every time. The polishing mechanism comprises a conveying belt, and the bottom surface of the upper section of the conveying belt is in sliding contact with the top surface of the connecting plate; a pressing wheel is arranged above the conveying belt, the rolling direction of the pressing wheel is consistent with the conveying direction of the conveying track, and the height position of the pressing wheel is automatically adjusted along with the thickness of the circuit board; the outside of conveyer belt is equipped with a plurality of wheels of polishing along direction of delivery, and the rotation axis of wheel of polishing sets up along vertical direction, and the direction of rotation of wheel of polishing is anticlockwise rotation in the projection of conveying track bottom surface. The automation degree is high, manual operation can be effectively reduced, and the production efficiency is improved.

Description

Circuit board edge polishing production line
Technical Field
The invention belongs to the field of circuit board production and processing, and particularly relates to a circuit board edge polishing production line.
Background
After the circuit board original plate is cut to form a substrate with a preset size, the four edges of the circuit board original plate are very sharp, so that the circuit board original plate is not beneficial to transfer in the production process, and an operator is very easy to scratch. Therefore, the periphery of the circuit board needs to be polished after cutting, the conventional polishing device mostly adopts a single polishing wheel, and the circuit board is held by a hand by a worker after being delayed, so that the edge of the circuit board is close to the polishing wheel to move back and forth along the length direction of the edge, the edge of the circuit board is polished, and after polishing on one side is completed, the circuit board is rotated to polish the other side until polishing on the four sides of the circuit board is completed. This method requires manual operation for a long time, and is inefficient.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides the circuit board edge polishing production line which is high in automation degree, can automatically finish the polishing work of four edges of the circuit board, effectively reduces manual operation and improves production efficiency.
In order to realize the purpose of the invention, the following scheme is adopted:
the utility model provides a circuit board border production line of polishing, includes end to end's four groups of grinding device, and grinding device includes delivery track, and delivery track is equipped with rotary mechanism and grinding machanism with one side along direction of delivery in proper order, and the relative grinding machanism's of delivery track opposite side position is equipped with the side direction clamp plate, and the moving distance of side direction clamp plate to grinding machanism can be adjusted according to the width or the length size of circuit board.
The rotating mechanism comprises a lower rotating disc and an upper rotating disc which are coaxially arranged, the upper rotating disc is fixed along the height position in the vertical direction, the height position of the lower rotating disc in the vertical direction is adjusted through a lifting device, the top surface of the lower rotating disc is lower than a conveying roller of a conveying track in the process that a circuit board enters the rotating mechanism and moves out of the rotating mechanism, the lower rotating disc and the upper rotating disc can rotate simultaneously, the rotating angle is 90 degrees at each time, and the rotating directions of the lower rotating disc and the upper rotating disc are clockwise on the projection view of the bottom surface of the conveying track.
The polishing mechanism comprises a conveying belt, the conveying belt transmits the circuit board along the conveying direction of the conveying track, the top surface of the conveying belt is higher than the conveying rollers, two belt pulleys of the conveying belt are connected through a connecting plate, the top surface of the connecting plate is of a planar structure, the bottom surface of the upper section of the conveying belt is in sliding contact with the top surface of the connecting plate, and the top surface of the conveying belt is higher than the side edge of the belt pulley; a plurality of pressing wheel wheels are arranged above the conveying belt, the rolling direction of the pressing wheel wheels is consistent with the conveying direction of the conveying track, the height position of the pressing wheel wheels is automatically adjusted along with the thickness of the circuit board, and the pressing wheel wheels are arrayed along the conveying direction of the conveying belt; the outside of conveyer belt is equipped with a plurality of wheels of polishing along direction of delivery, and the rotation axis of wheel of polishing sets up along vertical direction, and on the projection view of conveying track bottom surface, the direction of rotation of wheel of polishing is anticlockwise.
Furthermore, the pressing roller is connected to the side wall of the conveying track through a support, a guide rod is arranged on the support in a sliding mode along the vertical direction, a spring is arranged on the guide rod sleeve, the pressing roller is enabled to automatically adjust the height along with the thickness of the circuit board through the spring, and the pressing roller rotates to be arranged at the bottom of the guide rod.
Furthermore, the circumference of the middle section of the polishing wheel is provided with an annular polishing groove, the cross section of the polishing groove is of a V-shaped groove structure, and the bottom of the V-shaped groove is of an arc structure.
Furthermore, the side wall of the conveying track is provided with a dust suction pipe corresponding to the polishing wheel for sucking out dust and impurities generated during polishing.
Furthermore, the bottom surface position of the lateral pressing plate is lower than the conveying surface of the conveying roller, and grooves are processed in the positions, corresponding to the conveying roller, of the lateral pressing plate along the moving direction so as to avoid the conveying roller.
Furthermore, the lateral pressing plate is provided with a pair of parallel stabilizer bars, the stabilizer bars slide along the moving direction of the lateral pressing plate and penetrate through the side wall of the conveying track, and the stability and the structural connection strength of the lateral pressing plate during moving are improved by the stabilizer bars.
Furthermore, the position of the side face of the conveying track, corresponding to the rotating mechanism, is provided with a limiting plate with a long strip-shaped structure along the conveying direction, and in the projection of the conveying track conveying direction, the inner wall of the limiting plate is closer to the middle of the conveying track relative to the working face of the polishing wheel, and the limiting plate is used for guiding the machine type of the circuit board, so that the circuit board can smoothly enter the polishing mechanism.
Furthermore, the lower turntable and the upper turntable are both connected with a driving motor, and the driving motor of the lower turntable is arranged at the movable end of the lifting device.
Furthermore, the surface that lower carousel and last carousel are relative all is equipped with the rubber layer for frictional force between increase and the circuit board can avoid pressing the circuit board simultaneously.
The invention has the beneficial effects that:
1. the production line is equipped with four grinding device of group, can polish around the circuit board in proper order to grinding device's the place ahead all is equipped with rotary mechanism, can carry out 90 rotations to the circuit board automatically, with the position that the conversion circuit board need be polished the edge, the limit that makes the circuit board need polish is towards grinding device one side, reduces manual operation, and messenger's production line automation degree is higher, thereby improves production efficiency.
2. The grinding device utilizes the conveyer belt to transmit the circuit board, and the rubber material of usable conveyer belt increases the frictional force during transmission, because the direction of polishing of the wheel of polishing can make the circuit board move towards the opposite direction of carrying, because the increase frictional force can prevent that the circuit board from moving to the opposite direction of carrying.
3. The top of conveyer belt is provided with the gyro wheel that compresses tightly, compresses tightly the circuit board in the conveyer belt, and the conveyer belt bottom is equipped with the connecting plate, and the top surface of connecting plate is used for supporting the conveyer belt, realizes the support to the circuit board through the transmission band, and the while is used and can be prevented to polish in-process circuit board and appear jumping from top to bottom, avoids influencing the effect of polishing.
4. The position that corresponds every wheel of polishing all is provided with the dust absorption pipe, can prevent dust and impurity effluvium with the dust and the quick effective suction of impurity that produce when polishing, improves operational environment's cleanliness.
5. Lower carousel all is equipped with driving motor with last carousel, carries out rotary drive simultaneously, prevents down carousel or go up to take place relative rotation between carousel and the circuit board, improves the rotational stability to the circuit board, improves the rotational position precision to the circuit board.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
FIG. 1 shows the overall construction of the present application;
FIG. 2 shows a construction diagram of the grinding apparatus;
FIG. 3 shows a partial enlarged view at A in FIG. 2;
figure 4 shows a side view of the grinding device;
FIG. 5 shows a partial enlarged view at B in FIG. 4;
fig. 6 shows a connecting structure of the conveyor belt;
fig. 7 shows a structural view of the grinding device;
fig. 8 shows a partial enlarged view at C in fig. 7.
The labels in the figure are: the device comprises a conveying track-100, a conveying roller-110, a dust suction pipe-120, a limiting plate-130, a rotating mechanism-200, a lower rotating disc-210, an upper rotating disc-220, a lifting device-230, a polishing mechanism-300, a conveying belt-310, a belt pulley-311, a connecting plate-312, a pressing roller-320, a bracket-321, a guide rod-322, a spring-323, a polishing wheel-330, a polishing groove-331, a lateral pressing plate-400, a telescopic cylinder-410 and a stabilizing rod-420.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are usually placed in when used, and are only for convenience of describing the present invention and simplifying the description. The terms "parallel", "perpendicular", etc. do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; either directly or indirectly through intervening media, or through both elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1, a circuit board edge grinding production line comprises four groups of grinding devices connected end to end.
Specifically, as shown in fig. 2 to 7, the polishing device includes a conveying rail 100, a rotating mechanism 200 and a polishing mechanism 300 are sequentially disposed on the same side of the conveying rail 100 along a conveying direction, a lateral pressure plate 400 is disposed on the other side of the conveying rail 100 opposite to the polishing mechanism 300, a moving distance from the lateral pressure plate 400 to the polishing mechanism 300 can be adjusted according to a width or length dimension of a circuit board, the lateral pressure plate 400 is driven by a telescopic cylinder 410, the circuit board is pushed to the polishing mechanism 300 by the lateral pressure plate 400, and an edge of the circuit board is tightly attached to a polishing wheel 330;
specifically, as shown in fig. 2 and 4, the rotating mechanism 200 includes a lower turntable 210 and an upper turntable 220 coaxially disposed, the lower turntable 210 is located below the upper turntable 220, a height position of the upper turntable 220 in the vertical direction is fixed, the height position of the lower turntable 210 in the vertical direction is adjusted by the lifting device 230, the top surface of the lower turntable 210 is lower than the conveying rollers 110 of the conveying track 100 in the process of the circuit board entering into and moving out of the rotating mechanism 200, the lower turntable 210 and the upper turntable 220 can rotate simultaneously, each rotation angle is 90 °, and the rotation directions of the lower turntable 210 and the upper turntable 220 are clockwise in a projection view of the bottom surface of the conveying track 100;
specifically, as shown in fig. 3 to 6, the polishing mechanism 300 includes a conveyor belt 310, the conveyor belt 310 is a parallel belt made of rubber, the conveyor belt 310 transports the circuit board along the conveying direction of the conveying rail 100, the top surface of the conveyor belt 310 is higher than the conveying rollers 110 of the conveying rail 100, the circuit board is conveyed by the conveyor belt 310 during polishing, and a predetermined gap is formed between the circuit board and the conveying rollers 110.
As shown in fig. 6, the two belt pulleys 311 of the conveying belt 310 are connected by a connecting plate 312, the top surface of the connecting plate 312 is a planar structure, the bottom surface of the upper section of the conveying belt 310 is in sliding contact with the top surface of the connecting plate 312, the top surface of the conveying belt 310 is higher than the side edge of the belt pulley 311, so that the circuit board and the side edge of the belt pulley 311 are arranged at intervals, the circuit board is prevented from being crushed, the conveying belt 310 is supported by the top surface of the connecting plate 312, the circuit board is supported by the conveying belt 310, the circuit board is prevented from sinking when being polished.
As shown in fig. 3 and 5, a pressing wheel 320 is disposed above the conveying belt 310, the rolling direction of the pressing wheel 320 is the same as the conveying direction of the conveying rail 100, and the height position of the pressing wheel 320 is adjusted by itself according to the thickness of the circuit board, so as to be suitable for grinding circuit boards with different thicknesses. The pressing rollers 320 are arranged in a plurality in an array along the conveying direction of the conveyor belt 310 to improve the stability of pressing the circuit board. The outer side of the conveying belt 310 is provided with a plurality of grinding wheels 330 along the conveying direction, the rotating shafts of the grinding wheels 330 are arranged along the vertical direction, the rotating direction of the grinding wheels 330 is counterclockwise in the projection view of the bottom surface of the conveying rail 100, and the force applied by the grinding wheels 330 to the circuit board during grinding is in the opposite direction of conveying the circuit board.
More specifically, as shown in fig. 3 and 4, the pressing roller 320 is connected to the side wall of the conveying track 100 through a bracket 321, the bracket 321 is provided with a guide rod 322 in a sliding manner in the vertical direction, the guide rod 322 is sleeved with a spring 323, the pressing roller 320 is self-adjusted in height position according to the thickness of the circuit board through the spring 323, the upper end of the spring 323 contacts with the bottom surface of the bracket 321, the lower end of the spring 323 contacts with the step surface of the guide rod 322, and the pressing roller 320 is rotatably arranged at the bottom of the guide rod 322.
Preferably, as shown in fig. 5, an annular polishing groove 331 is formed on the circumference of the middle section of the polishing wheel 330, the section of the polishing groove 331 is a V-shaped groove so as to adapt to circuit boards with different thicknesses, and the edges of the upper and lower surfaces of the circuit board can be simultaneously polished, and the bottom of the V-shaped groove is of an arc structure so as to form a smooth outer arc profile on the edge of the circuit board.
Preferably, the side wall of the conveying track 100 is provided with a dust suction pipe 120 at a position corresponding to the grinding wheel 330, for sucking out dust and impurities generated during grinding, so as to keep the working environment clean.
Preferably, as shown in fig. 8, the bottom surface of the lateral pressure plate 400 is lower than the conveying surface of the conveying roller 110 to facilitate more stable pushing of the circuit board, and a groove 401 is formed at a position of the lateral pressure plate 400 corresponding to the conveying roller 110 in the moving direction to avoid the conveying roller 110.
Preferably, as shown in fig. 7, the side press plate 400 is provided with a pair of parallel stabilizer bars 420, the stabilizer bars 420 are slidably disposed through the sidewalls of the conveying track 100 along the moving direction of the side press plate 400, and the stabilizer bars 420 improve the stability and the structural connection strength of the side press plate 400 during moving.
Preferably, as shown in fig. 2, the position of the side surface of the conveying track 100 corresponding to the rotating mechanism 200 is provided with a limiting plate 130 with a long strip-shaped structure along the conveying direction, in the projection of the conveying direction of the conveying track 100, the inner wall of the limiting plate 130 is closer to the middle of the conveying track 100 relative to the working surface of the grinding wheel 330, and the limiting plate 130 is used to guide the circuit board model to smoothly enter the grinding mechanism 300.
Preferably, as shown in fig. 4, both the lower turntable 210 and the upper turntable 220 are connected with a driving motor, the driving motor of the lower turntable 210 is installed at the movable end of the lifting device 230, and the height position of the driving motor connected with the upper turntable 220 is fixed. Two driving motors are adopted to respectively drive the lower turntable 210 and the upper turntable 220 to rotate simultaneously, so that the lower turntable 210 or the upper turntable 220 and the circuit board can be prevented from rotating relatively, and the accuracy of the rotation angle of the circuit board is prevented from being influenced.
Preferably, the surfaces of the lower rotary disk 210 opposite to the upper rotary disk 220 are provided with rubber layers for increasing the friction force with the circuit board and simultaneously avoiding crushing the circuit board.
The specific implementation mode is as follows: when the polishing device is used, the circuit board is fed from the inlet end of the polishing production line, one side of the circuit board is tightly attached to the limiting plate 130, and the conveying roller 110 drives the circuit board to convey forwards along the limiting plate 130; when the circuit board moves to a preset position of the rotating mechanism 200, the circuit board stops conveying, and the circuit board is detected at the stop position of the rotating mechanism 200 by arranging a proximity switch and a photoelectric switch; the movable end of the lifting device 230 pushes the lower turntable 210 upwards to isolate the bottom surface of the circuit board from the conveying roller 110, the lower turntable 210 pushes the circuit board upwards until the upper turntable 220 and the lower turntable 210 clamp the circuit board, then the upper turntable 220 and the driving motor of the lower turntable 210 work simultaneously, the circuit board is driven to rotate 90 degrees by the upper turntable 220 and the lower turntable 210, and one side of the circuit board facing the front end of the conveying line is attached to the limiting plate 130; the movable end of the lifting device 230 retracts the lower turntable 210 downward, so that the circuit board falls on the conveying roller 110. Conveying roller 110 drives the circuit board and removes to grinding machanism 300, when the circuit board was laminated with conveyer belt 310, telescopic cylinder 410 drive side direction clamp plate 400 removed the settlement distance to the circuit board, the distance that every grinding device's of group side direction clamp plate 400 removed all can set up according to the width and the length size of circuit board, make the side of circuit board and polish through side direction clamp plate 400 and take turns 330 outer wall to hug closely, so that polish, prevent that the circuit board from breaking away from and polishing wheel 330, it is sliding contact to polish in-process between circuit board and the side direction clamp plate 400. After the circuit board moves out of the polishing mechanism 300, the circuit board enters the next group of polishing devices to polish the other side of the circuit board until the four groups of polishing devices finish polishing the four sides of the circuit board, and the circuit board is transmitted and transferred between each group of polishing devices through the conveying rollers 110.
The foregoing is only a preferred embodiment of the present invention and is not intended to be exhaustive or to limit the invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.

Claims (9)

1. A circuit board edge polishing production line is characterized by comprising four groups of polishing devices which are connected end to end, wherein each polishing device comprises a conveying track (100), a rotating mechanism (200) and a polishing mechanism (300) are sequentially arranged on the same side of the conveying track (100) along the conveying direction, a lateral pressing plate (400) is arranged on the other side of the conveying track (100) opposite to the polishing mechanism (300), and the moving distance from the lateral pressing plate (400) to the polishing mechanism (300) can be adjusted according to the width or length of a circuit board;
the rotating mechanism (200) comprises a lower rotating disc (210) and an upper rotating disc (220) which are coaxially arranged, the height position of the upper rotating disc (220) along the vertical direction is fixed, the height position of the lower rotating disc (210) along the vertical direction is adjusted through a lifting device (230), the top surface of the lower rotating disc (210) is lower than the conveying roller (110) of the conveying track (100) in the process that a circuit board enters the rotating mechanism (200) and moves out of the rotating mechanism (200), the lower rotating disc (210) and the upper rotating disc (220) can rotate simultaneously, the rotating angle is 90 degrees each time, and the rotating directions of the lower rotating disc (210) and the upper rotating disc (220) are clockwise on the projection view of the bottom surface of the conveying track (100);
the grinding mechanism (300) comprises a conveying belt (310), the conveying belt (310) transmits a circuit board along the conveying direction of the conveying track (100), the top surface of the conveying belt (310) is higher than the conveying rollers (110), two belt pulleys (311) of the conveying belt (310) are connected through a connecting plate (312), the top surface of the connecting plate (312) is of a plane structure, the bottom surface of the upper section of the conveying belt (310) is in sliding contact with the top surface of the connecting plate (312), and the top surface of the conveying belt (310) is higher than the side edge of the belt pulley (311); a plurality of pressing wheel wheels (320) are arranged above the conveying belt (310), the rolling direction of the pressing wheel wheels (320) is consistent with the conveying direction of the conveying track (100), the height position of the pressing wheel wheels (320) is automatically adjusted along with the thickness of the circuit board, and the pressing wheel wheels (320) are arrayed along the conveying direction of the conveying belt (310); the outer side of the conveying belt (310) is provided with a plurality of grinding wheels (330) along the conveying direction, the rotating shafts of the grinding wheels (330) are arranged along the vertical direction, and the rotating direction of the grinding wheels (330) is anticlockwise on the projection view of the bottom surface of the conveying track (100).
2. The circuit board edge grinding production line of claim 1, wherein the pressing roller (320) is connected to the side wall of the conveying track (100) through a bracket (321), a guide rod (322) is arranged on the bracket (321) in a sliding mode along the vertical direction, a spring (323) is sleeved on the guide rod (322), the height of the pressing roller (320) is automatically adjusted along with the thickness of the circuit board through the spring (323), and the pressing roller (320) is rotatably arranged at the bottom of the guide rod (322).
3. The circuit board edge grinding production line of claim 1, wherein the grinding wheel (330) is provided with an annular grinding groove (331) at the circumference of the middle section, the section of the grinding groove (331) is a V-shaped groove structure, and the bottom of the V-shaped groove is a circular arc structure.
4. The circuit board edge grinding production line as claimed in claim 1, wherein the side wall of the conveying track (100) is provided with a dust suction pipe (120) at a position corresponding to the grinding wheel (330) for sucking out dust and impurities generated during grinding.
5. The circuit board edge grinding production line as claimed in claim 1, wherein the bottom surface of the lateral pressing plate (400) is lower than the conveying surface of the conveying roller (110), and grooves (401) are formed in the positions, corresponding to the conveying roller (110), of the lateral pressing plate (400) along the moving direction so as to avoid the conveying roller (110).
6. The circuit board edge grinding production line as claimed in claim 1, wherein the side press plate (400) is provided with a pair of parallel stabilizing bars (420), the stabilizing bars (420) are slidably arranged through the side wall of the conveying track (100) along the moving direction of the side press plate (400), and the stabilizing bars (420) are used for improving the stability and the structural connection strength of the side press plate (400) during moving.
7. The circuit board edge grinding production line according to claim 1, wherein a position, corresponding to the rotating mechanism (200), of the side surface of the conveying track (100) is provided with a limiting plate (130) with a long strip-shaped structure along the conveying direction, on the projection of the conveying direction of the conveying track (100), the inner wall of the limiting plate (130) is closer to the middle of the conveying track (100) relative to the working surface of the grinding wheel (330), and the limiting plate (130) is utilized to guide the machine type of the circuit board so that the circuit board can smoothly enter the grinding mechanism (300).
8. The circuit board edge grinding production line according to claim 1, wherein the lower turntable (210) and the upper turntable (220) are both connected with a driving motor, and the driving motor of the lower turntable (210) is mounted at the movable end of the lifting device (230).
9. The edge grinding production line of the circuit board as claimed in claim 1, wherein the surfaces of the lower turntable (210) opposite to the upper turntable (220) are provided with rubber layers for increasing the friction force between the lower turntable and the circuit board and avoiding crushing the circuit board.
CN202110567700.9A 2021-05-24 2021-05-24 Circuit board edge polishing production line Pending CN113001304A (en)

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Application Number Priority Date Filing Date Title
CN202110567700.9A CN113001304A (en) 2021-05-24 2021-05-24 Circuit board edge polishing production line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110567700.9A CN113001304A (en) 2021-05-24 2021-05-24 Circuit board edge polishing production line

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Publication Number Publication Date
CN113001304A true CN113001304A (en) 2021-06-22

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
CN115781791A (en) * 2022-11-16 2023-03-14 深圳市华联森自动化设备有限公司 Circuit board processing device
CN117047587A (en) * 2023-10-12 2023-11-14 四川英创力电子科技股份有限公司 Six-axis forming machine for circuit board processing and using method thereof

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CN208992344U (en) * 2018-09-30 2019-06-18 杭州九州环保科技有限公司 A kind of full-automatic wiring board multi-panel edging device
CN210732128U (en) * 2019-05-31 2020-06-12 佛山市顺德汉玻自动化有限公司 Conveying device of glass double-edge grinding machine
CN210879153U (en) * 2019-11-05 2020-06-30 青岛德泰沃机械有限公司 Non-planar polishing ultrathin sheet conveying belt for polishing machine
CN212145752U (en) * 2020-04-21 2020-12-15 泉州艾特卫浴有限公司 Stainless steel equipment of polishing
CN111571362A (en) * 2020-05-22 2020-08-25 重庆嘉涌电子有限公司 Glass member four-side polishing production line
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* Cited by examiner, † Cited by third party
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CN115781791A (en) * 2022-11-16 2023-03-14 深圳市华联森自动化设备有限公司 Circuit board processing device
CN117047587A (en) * 2023-10-12 2023-11-14 四川英创力电子科技股份有限公司 Six-axis forming machine for circuit board processing and using method thereof
CN117047587B (en) * 2023-10-12 2023-12-19 四川英创力电子科技股份有限公司 Six-axis forming machine for circuit board processing and using method thereof

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