CN210429806U

CN210429806U - High temperature resistant long-life miniature side-emitting three-color LED chip

Info

Publication number: CN210429806U
Application number: CN201921675496.7U
Authority: CN
Inventors: 张小虎; 盛刚
Original assignee: Changzhou Amicc Optoelectronics Technology Co ltd
Current assignee: Changzhou Amicc Optoelectronics Technology Co ltd
Priority date: 2019-10-09
Filing date: 2019-10-09
Publication date: 2020-04-28
Anticipated expiration: 2029-10-09

Abstract

The utility model discloses a three-colour LED chip is sent out to miniature side of high temperature resistant high life, include the base plate and fix the LED chip on base plate 1, penetrating electrically conductive through-hole about setting up two on the base plate, the top and the below of electrically conductive through-hole all set up the conducting layer, the conducting layer is located the upper surface and the lower surface of base plate, the LED chip is LED chip 1, LED chip 2, LED chip 3, three LED chip connects the conducting layer on the base plate upper surface respectively, the top encapsulation epoxy of three LED chip, the lateral wall cladding has the electrically conductive metal layer about the base plate, the electrically conductive metal layer is originated from the upper surface of base plate, extend to the lateral wall, reach the lateral wall after downwardly extending to the base plate bottom, then extend to the base plate lower surface, with the complete cladding. The utility model discloses a product SMT welding position is 4 pads, and wherein the both ends pad is the cladding of whole metal copper foil, and the welding effect that reaches far exceeds current product, can make the SMT defective rate from 20% fall to 0%.

Description

High temperature resistant long-life miniature side-emitting three-color LED chip

Technical Field

The utility model relates to a three-colour LED chip is sent out to high temperature resistant high life's miniature side belongs to technical field.

Background

The maximum size of the existing side-emitting three-color LED lamp is 2.0mm (L) 1.1mm (W) 0.5mm (H), and further reduction can cause that the product cannot be used due to poor SMT welding at a client side.

The traditional LED chip packaging mode product cannot resist high temperature due to poor heat conduction performance, and the packaging material is easy to yellow to cause large light attenuation and cannot bear large current.

SUMMERY OF THE UTILITY MODEL

To two above difficult points, the utility model provides a three-colour LED chip is sent out to miniature side of high temperature resistant high life can reach and reduce size to 1.6mm (L) 0.8mm (W) 0.4mm (H), and does not influence the performance that SMT welding has high temperature resistant high life simultaneously.

The technical scheme of the utility model as follows:

the utility model provides a high temperature resistant high life's miniature side is sent out three-colour LED chip, includes the base plate and fixes the LED chip on base plate 1, set up two penetrating electrically conductive through-holes from top to bottom on the base plate, electrically conductive through-hole's top and below all set up the conducting layer, and the conducting layer is located the upper surface and the lower surface of base plate, the LED chip is LED chip 1, LED chip 2, LED chip 3, and three LED chip connects the conducting layer on the base plate upper surface respectively, and the top encapsulation epoxy of three LED chip, the lateral wall cladding has the electrically conductive metal layer about the base plate, the electrically conductive metal layer is originated from the upper surface of base plate, extends to the lateral wall, reaches the lateral wall after downwardly extending to the base plate bottom, then extends to the base plate lower surface.

The LED chip 1 is connected with a conducting layer, and the LED chip are connected with the conducting layer.

The conductive through hole is filled with copper by drilling thick electroplating or resin plugging or ink plugging.

The conductive metal layer is a gold-plated layer, a silver-plated layer or a copper foil layer.

The utility model discloses the beneficial effect who reaches:

the utility model discloses a product SMT welding position is 4 pads, and wherein the both ends pad is the cladding of whole conductive metal layer, and the welding effect that reaches far exceeds current product, can make the SMT defective rate from 20% fall to 0%.

Drawings

Fig. 1 is a front view of the present invention;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a diagram of the effect of the product after SMT welding.

Detailed Description

The present invention will be further described with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.

As shown in fig. 1 and fig. 2, a high temperature resistant and long life miniature side-emitting three-color LED chip comprises a substrate 1 and an LED chip 2 fixed on the substrate 1, wherein two conductive through holes 3 which are vertically conducted are arranged on the substrate 1, and the conductive through holes 3 are vertically conducted, and the purpose of improving heat dissipation is also provided. The top and the below of electrically conductive through-hole 3 all set up the conducting layer, and the conducting layer is located the upper surface and the lower surface of base plate 1, LED chip 2, LED chip 3 are LED chip 2, and three LED chip connects the conducting layer on the base plate 1 upper surface respectively, and epoxy 4 is encapsulated to the top of three LED chip, the lateral wall cladding has electrically conductive metal layer 5 about base plate 1, electrically conductive metal layer 5 is originated from the upper surface of base plate 1, extends to the lateral wall, and downward extension to base plate 1 bottom after arriving the lateral wall, then extends to base plate 1 lower surface, with the complete cladding of lateral wall about base plate 1.

The LED chip 1 is connected with a conducting layer, and the LED chip 2 and the LED chip 3 are connected with a conducting layer.

The conductive through hole 3 is drilled and then plated with copper or resin or ink.

The conductive metal layer 5 is a gold-plated layer, a silver-plated layer or a copper foil layer.

As shown in fig. 3, the product adopting the above design is packaged according to the conventional packaging process flow: die bonding, wire bonding, film pressing and cutting, wherein the cutting mode is that single devices with the sizes of 1.6mm by 0.8mm by 0.4mm are cut according to a cutting circuit designed in advance.

In addition, the product also has the following characteristics:

(1) the encapsulating epoxy resin 4 is molded by using a special high Tg epoxy resin encapsulating material, and the molding temperature is 170 ℃ (the molding temperature of the common epoxy resin is 150 ℃).

(2) The product adopts the high Tg packaging epoxy resin to improve the color change resistance even after high temperature is applied, thereby maintaining the optical performance.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.

Claims

1. The utility model provides a three colour LED chip is sent out to high temperature resistant high life's miniature side, includes base plate (1) and fixes LED chip (2) on base plate (1), set up two upper and lower penetrating electrically conductive through-hole (3) on base plate (1), its characterized in that: the top and the below of electrically conductive through-hole (3) all set up the conducting layer, and the conducting layer is located the upper surface and the lower surface of base plate (1), LED chip (2) are LED chip 1, LED chip 2, LED chip 3, and three LED chip connects the conducting layer on base plate (1) upper surface respectively, and epoxy (4) are packaged to the top of three LED chip, the lateral wall cladding has electrically conductive metal layer (5) about base plate (1), electrically conductive metal layer (5) are from the upper surface of base plate (1) is originated to the lateral wall, and extend to base plate (1) bottom after arriving the lateral wall, then extend to base plate (1) lower surface, with the complete cladding of lateral wall about base plate (1).

2. The high temperature resistant long-life micro side-emitting tricolor LED chip as claimed in claim 1, wherein: the LED chip 1 is connected with a conducting layer, and the LED chip 2 and the LED chip 3 are connected with a conducting layer.

3. The high temperature resistant long-life micro side-emitting tricolor LED chip as claimed in claim 1, wherein: and the conductive through hole (3) is drilled and then plated with copper or resin or ink.

4. The high temperature resistant long-life micro side-emitting tricolor LED chip as claimed in claim 1, wherein: the conductive metal layer (5) is a gold-plated layer or a silver-plated layer or a copper foil layer.