CN210394497U - 掩模 - Google Patents
掩模 Download PDFInfo
- Publication number
- CN210394497U CN210394497U CN201921029729.6U CN201921029729U CN210394497U CN 210394497 U CN210394497 U CN 210394497U CN 201921029729 U CN201921029729 U CN 201921029729U CN 210394497 U CN210394497 U CN 210394497U
- Authority
- CN
- China
- Prior art keywords
- mask
- less
- hole
- peripheral region
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title description 20
- 238000004519 manufacturing process Methods 0.000 title description 7
- 230000002093 peripheral effect Effects 0.000 claims abstract description 45
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims description 42
- 239000010410 layer Substances 0.000 description 104
- 239000000758 substrate Substances 0.000 description 64
- 238000007740 vapor deposition Methods 0.000 description 43
- 239000000463 material Substances 0.000 description 28
- 230000004048 modification Effects 0.000 description 22
- 238000012986 modification Methods 0.000 description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 21
- 238000010586 diagram Methods 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 238000002360 preparation method Methods 0.000 description 16
- 229910000640 Fe alloy Inorganic materials 0.000 description 12
- 229910052759 nickel Inorganic materials 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000004873 anchoring Methods 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000012733 comparative method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- SQZYOZWYVFYNFV-UHFFFAOYSA-L iron(2+);disulfamate Chemical compound [Fe+2].NS([O-])(=O)=O.NS([O-])(=O)=O SQZYOZWYVFYNFV-UHFFFAOYSA-L 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- UQPSGBZICXWIAG-UHFFFAOYSA-L nickel(2+);dibromide;trihydrate Chemical compound O.O.O.Br[Ni]Br UQPSGBZICXWIAG-UHFFFAOYSA-L 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/08—Perforated or foraminous objects, e.g. sieves
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-127076 | 2018-07-03 | ||
| JP2018127076 | 2018-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210394497U true CN210394497U (zh) | 2020-04-24 |
Family
ID=69060392
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910593177.XA Active CN110670015B (zh) | 2018-07-03 | 2019-07-03 | 掩模及其制造方法 |
| CN202210852845.8A Active CN115142012B (zh) | 2018-07-03 | 2019-07-03 | 掩模及其制造方法 |
| CN201921029729.6U Active CN210394497U (zh) | 2018-07-03 | 2019-07-03 | 掩模 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910593177.XA Active CN110670015B (zh) | 2018-07-03 | 2019-07-03 | 掩模及其制造方法 |
| CN202210852845.8A Active CN115142012B (zh) | 2018-07-03 | 2019-07-03 | 掩模及其制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP6997975B2 (ko) |
| KR (1) | KR102631580B1 (ko) |
| CN (3) | CN110670015B (ko) |
| TW (1) | TWI781328B (ko) |
| WO (1) | WO2020009088A1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670015A (zh) * | 2018-07-03 | 2020-01-10 | 大日本印刷株式会社 | 掩模及其制造方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7391719B2 (ja) * | 2020-03-05 | 2023-12-05 | 株式会社ジャパンディスプレイ | 蒸着マスクユニットの作製方法 |
| JP7561504B2 (ja) * | 2020-03-10 | 2024-10-04 | 株式会社ジャパンディスプレイ | 蒸着マスクユニットの作製方法 |
| JP2021161509A (ja) * | 2020-04-01 | 2021-10-11 | 株式会社ジャパンディスプレイ | 蒸着マスクの作製方法 |
| KR20220007800A (ko) | 2020-07-10 | 2022-01-19 | 삼성디스플레이 주식회사 | 마스크 및 이를 포함하는 증착 설비 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4862236B2 (ja) * | 2001-08-24 | 2012-01-25 | 大日本印刷株式会社 | 有機ｅｌ素子製造に用いる真空蒸着用多面付けマスク装置 |
| TW558914B (en) * | 2001-08-24 | 2003-10-21 | Dainippon Printing Co Ltd | Multi-face forming mask device for vacuum deposition |
| JP4369199B2 (ja) * | 2003-06-05 | 2009-11-18 | 九州日立マクセル株式会社 | 蒸着マスクとその製造方法 |
| JP4863247B2 (ja) * | 2004-12-08 | 2012-01-25 | 九州日立マクセル株式会社 | 金属多孔体とその製造方法 |
| JP4677363B2 (ja) * | 2006-04-07 | 2011-04-27 | 九州日立マクセル株式会社 | 蒸着マスクおよびその製造方法 |
| CN110965020B (zh) * | 2015-02-10 | 2022-05-17 | 大日本印刷株式会社 | 金属板的筛选方法以及蒸镀掩模的制造方法 |
| CN110551973B (zh) * | 2015-02-10 | 2022-06-14 | 大日本印刷株式会社 | 蒸镀掩模 |
| JP6432072B2 (ja) * | 2015-07-17 | 2018-12-05 | 凸版印刷株式会社 | メタルマスク基材、および、メタルマスクの製造方法 |
| JP6722512B2 (ja) * | 2016-05-23 | 2020-07-15 | マクセルホールディングス株式会社 | 蒸着マスクおよびその製造方法 |
| JP7008288B2 (ja) * | 2017-07-05 | 2022-01-25 | 大日本印刷株式会社 | 蒸着マスク、蒸着マスク装置、蒸着マスクの製造方法及び蒸着マスク装置の製造方法 |
| WO2019087749A1 (ja) * | 2017-11-01 | 2019-05-09 | 大日本印刷株式会社 | 蒸着マスク装置 |
| KR102631580B1 (ko) * | 2018-07-03 | 2024-02-01 | 다이니폰 인사츠 가부시키가이샤 | 마스크 및 그 제조 방법 |
-
2019
- 2019-07-02 KR KR1020217002880A patent/KR102631580B1/ko active IP Right Grant
- 2019-07-02 JP JP2020528996A patent/JP6997975B2/ja active Active
- 2019-07-02 WO PCT/JP2019/026219 patent/WO2020009088A1/ja active Application Filing
- 2019-07-03 CN CN201910593177.XA patent/CN110670015B/zh active Active
- 2019-07-03 CN CN202210852845.8A patent/CN115142012B/zh active Active
- 2019-07-03 TW TW108123399A patent/TWI781328B/zh active
- 2019-07-03 CN CN201921029729.6U patent/CN210394497U/zh active Active
-
2021
- 2021-12-17 JP JP2021205481A patent/JP2022037147A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670015A (zh) * | 2018-07-03 | 2020-01-10 | 大日本印刷株式会社 | 掩模及其制造方法 |
| CN110670015B (zh) * | 2018-07-03 | 2022-08-09 | 大日本印刷株式会社 | 掩模及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102631580B1 (ko) | 2024-02-01 |
| JP2022037147A (ja) | 2022-03-08 |
| TW202006794A (zh) | 2020-02-01 |
| CN115142012A (zh) | 2022-10-04 |
| CN115142012B (zh) | 2023-12-29 |
| CN110670015B (zh) | 2022-08-09 |
| TWI781328B (zh) | 2022-10-21 |
| WO2020009088A1 (ja) | 2020-01-09 |
| JP6997975B2 (ja) | 2022-01-18 |
| CN110670015A (zh) | 2020-01-10 |
| KR20210025633A (ko) | 2021-03-09 |
| JPWO2020009088A1 (ja) | 2021-07-08 |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |