CN210381452U - Prevent short circuit flexible line way board - Google Patents
Prevent short circuit flexible line way board Download PDFInfo
- Publication number
- CN210381452U CN210381452U CN201921243857.0U CN201921243857U CN210381452U CN 210381452 U CN210381452 U CN 210381452U CN 201921243857 U CN201921243857 U CN 201921243857U CN 210381452 U CN210381452 U CN 210381452U
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- coating
- bottom plate
- lead powder
- thickness
- organic silicon
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Abstract
The utility model discloses a prevent short circuit flexible line way board, including body, heat conduction pad and bottom plate, the heat conduction pad is connected through glue with the bottom of body, the bottom plate is connected through glue with the bottom of heat conduction pad, the body includes varnish coating, phosphate lead powder coating, organic silicon ceramic glass coating, radiation type thermal-insulated coating and base plate, the upper portion of locating phosphate lead powder coating is scribbled to the varnish coating, the upper portion of locating organic silicon ceramic glass coating is scribbled to phosphate lead powder coating. The utility model discloses a varnish coating, phosphate lead powder coating, organic silicon ceramic glass coating, radiant type thermal-insulated coating, heat conduction pad and bottom plate mutually support, have solved the long-time work of flexible line way board, can appear powder electrophoresis phenomenon, because different IC's operating voltage scope is different, and temperature environment is more abominable when voltage is higher, will appear the problem of powder electrophoresis back touch-sensitive screen short circuit.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a prevent short circuit flexible line way board.
Background
The flexible circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material, has high reliability and excellent flexibility, is called a flexible board or FPC for short, has the characteristics of high wiring density, light weight and thin thickness, is mainly used for a plurality of products such as mobile phones, notebook computers, PDAs, digital cameras, LCMs and the like, is designed for improving the space utilization rate and the product design flexibility, can meet the design requirements of more small-sized and higher-density installation, and is also beneficial to reducing the assembly process and enhancing the reliability, but the phenomenon of powder electrophoresis can occur when the flexible circuit board works for a long time.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a prevent short circuit flexible line way board possesses the advantage of preventing the short circuit, has solved the long-time work of flexible line way board, can appear the powder electrophoresis phenomenon, because different IC's operating voltage scope is different, and temperature environment is more abominable when the voltage is higher simultaneously, will appear the problem of powder electrophoresis back touch-sensitive screen short circuit.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an prevent short circuit flexible line way board, includes body, heat conduction pad and bottom plate, the heat conduction pad is connected through glue with the bottom of body, the bottom plate is connected through glue with the bottom of heat conduction pad, the body includes varnish coating, phosphate lead powder coating, organic silicon ceramic glass coating, radiation type thermal-insulated coating and base plate, the varnish coating is scribbled and is located the upper portion of phosphate lead powder coating, phosphate lead powder coating is scribbled and is located the upper portion of organic silicon ceramic glass coating, organic silicon ceramic glass coating is scribbled and is located the upper portion of radiation type thermal-insulated coating, radiation type thermal-insulated coating is scribbled and is located the upper portion of base plate.
Preferably, the bottom plate is provided with heat dissipation holes, the heat dissipation holes are circular, the thickness of the bottom plate is 0.4 mm-0.5 mm, and the thickness of the heat conduction pad is 0.3 μm-0.35 μm.
Preferably, the thickness of the varnish coating is 0.15-0.17 μm, and the thickness of the phosphate lead powder coating is 0.15-0.164 μm.
Preferably, the thickness of the silicone ceramic glass coating is 0.14-0.149 μm, the thickness of the radiant heat-insulating coating is 0.16-0.166 μm, and the thickness of the substrate is 0.46 mm-0.5 mm.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model has the advantages that the varnish coating can play an insulating effect, the phosphate lead powder coating, the organic silicon ceramic glass coating and the radiation type heat insulation coating are utilized to have good high temperature resistant effect, so that the circuit board has good high temperature resistant effect, the radiation type heat insulation coating is utilized to play a heat insulation effect, the circuit board can not be influenced by external high temperature environment by utilizing three different coatings, short circuit is avoided, the heat conducting pad is utilized to have good heat conducting capability by utilizing the heat conducting pad, the temperature of the body is reduced, the heat dissipation effect is achieved, through the bottom plate, hot air can be rapidly dissipated by utilizing the heat dissipation holes on the bottom plate, the heat dissipation effect is further improved, the circuit board is prevented from damaging short circuit due to overhigh temperature, the long-time work of the flexible circuit board is solved, and the powder electrophoresis phenomenon can occur, due to the fact that working voltage ranges of different ICs are different, when the voltage is high and the temperature environment is severe, the problem that the touch screen is short-circuited after powder electrophoresis occurs.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic diagram of the circuit board structure of the present invention.
In the figure: 1. a body; 11. a varnish coating; 12. phosphate lead powder coating; 13. an organic silicon ceramic glass coating; 14. a radiant heat insulating coating; 15. a substrate; 2. a thermally conductive pad; 3. a base plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses a body 1, varnish coating 11, phosphate lead powder coating 12, organic silicon ceramic glass coating 13, radiant type thermal-insulated coating 14, base plate 15, heat conduction pad 2 and bottom plate 3 part are the parts that general standard spare or technical staff in the field know, and its structure and principle all are that this technical staff all can learn through the technical manual or learn through conventional experimental method.
Referring to fig. 1-2, a short-circuit prevention flexible circuit board includes a main body 1, a thermal pad 2, and a bottom plate 3, where the thermal pad 2 is connected to the bottom of the main body 1 by glue, the bottom plate 3 is connected to the bottom of the thermal pad 2 by glue, the bottom plate 3 is provided with thermal vias, the thermal vias are circular, the thickness of the bottom plate 3 is 0.4 mm to 0.5 mm, the thickness of the thermal pad 2 is 0.3 μm to 0.35 μm, the main body 1 includes a varnish coating 11, a phosphate lead powder coating 12, a silicone ceramic glass coating 13, a radiation type thermal insulation coating 14, and a substrate 15, the varnish coating 11 is coated on the upper portion of the phosphate lead powder coating 12, the thickness of the varnish coating 11 is 0.15 μm to 0.17 μm, the thickness of the phosphate lead powder coating 12 is 0.15 μm to 0.164 μm, the phosphate lead powder coating 12 is coated on the upper portion of the silicone ceramic glass coating 13, the silicone ceramic glass coating 13 is coated on the upper portion of the radiation type thermal insulation, the radiation type heat insulation coating 14 is coated on the upper portion of the substrate 15, the varnish coating 11 can play an insulation effect, the phosphate lead powder coating 12, the organic silicon ceramic glass coating 13 and the radiation type heat insulation coating 14 are used, the phosphate lead powder coating 12 and the organic silicon ceramic glass coating 13 both have good high temperature resistance effect, so that the circuit board has good high temperature resistance effect, the radiation type heat insulation coating 14 plays a heat insulation effect, the circuit board can not be influenced by external high temperature environment by using three different coatings, short circuit is avoided, the heat conducting pad 2 has good heat conducting capacity, the temperature of the body 1 is reduced, the heat radiating effect is played, through the bottom plate 3, hot air can be quickly radiated by using the radiating holes on the bottom plate 3, the heat radiating effect is further improved, and the circuit board is prevented from being damaged and short circuit due to overhigh temperature, the problem that a powder electrophoresis phenomenon occurs when a flexible circuit board works for a long time, and due to different working voltage ranges of different ICs, when the voltage is higher and the temperature environment is worse, a touch screen after powder electrophoresis is short-circuited is solved, wherein the thickness of the organic silicon ceramic glass coating 13 is 0.14-0.149 mu m, the thickness of the radiation type heat insulation coating 14 is 0.16-0.166 mu m, and the thickness of the substrate 15 is 0.46-0.5 mm.
When in use, the varnish coating 11 can play an insulating effect, the phosphate lead powder coating 12, the organic silicon ceramic glass coating 13 and the radiation type heat insulation coating 14 are utilized, the phosphate lead powder coating 12 and the organic silicon ceramic glass coating 13 have good high temperature resistant effect, so that the circuit board has good high temperature resistant effect, the radiation type heat insulation coating 14 plays a heat insulation effect, the circuit board can not be influenced by external high temperature environment by utilizing three different coatings, short circuit is avoided, the heat conducting pad 2 has good heat conducting capability by utilizing the heat conducting pad 2, the temperature of the body 1 is reduced, the heat dissipation effect is played, hot gas can be quickly dissipated by utilizing the heat dissipation holes on the bottom plate 3 through the bottom plate 3, the heat dissipation effect is further improved, the short circuit of the circuit board caused by overhigh temperature is avoided, and the long-time work of the flexible circuit board is solved, the phenomenon of powder electrophoresis can appear, because the operating voltage scope of different IC is different, when the higher while temperature environment of voltage is more abominable, the problem of powder electrophoresis back touch-sensitive screen short circuit will appear.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a prevent short circuit flexible line way board, includes body (1), heat conduction pad (2) and bottom plate (3), its characterized in that: the heat conducting pad (2) is connected with the bottom of the body (1) through glue, the bottom plate (3) is connected with the bottom of the heat conducting pad (2) through glue, the body (1) comprises a varnish coating (11), a phosphate lead powder coating (12), an organic silicon ceramic glass coating (13), a radiation type heat insulation coating (14) and a substrate (15), the varnish coating (11) is coated on the upper portion of the phosphate lead powder coating (12), the phosphate lead powder coating (12) is coated on the upper portion of the organic silicon ceramic glass coating (13), the organic silicon ceramic glass coating (13) is coated on the upper portion of the radiation type heat insulation coating (14), and the radiation type heat insulation coating (14) is coated on the upper portion of the substrate (15).
2. The short-circuit prevention flexible circuit board of claim 1, characterized in that: the heat dissipation holes are formed in the bottom plate (3) and are circular, the thickness of the bottom plate (3) is 0.4 mm-0.5 mm, and the thickness of the heat conduction pad (2) is 0.3 mu m-0.35 mu m.
3. The short-circuit prevention flexible circuit board of claim 1, characterized in that: the thickness of the varnish coating (11) is 0.15-0.17 μm, and the thickness of the phosphate lead powder coating (12) is 0.15-0.164 μm.
4. The short-circuit prevention flexible circuit board of claim 1, characterized in that: the thickness of the organic silicon ceramic glass coating (13) is 0.14-0.149 mu m, the thickness of the radiant heat-insulating coating (14) is 0.16-0.166 mu m, and the thickness of the substrate (15) is 0.46 mm-0.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921243857.0U CN210381452U (en) | 2019-08-02 | 2019-08-02 | Prevent short circuit flexible line way board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921243857.0U CN210381452U (en) | 2019-08-02 | 2019-08-02 | Prevent short circuit flexible line way board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210381452U true CN210381452U (en) | 2020-04-21 |
Family
ID=70248442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921243857.0U Expired - Fee Related CN210381452U (en) | 2019-08-02 | 2019-08-02 | Prevent short circuit flexible line way board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210381452U (en) |
-
2019
- 2019-08-02 CN CN201921243857.0U patent/CN210381452U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200421 Termination date: 20210802 |
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| CF01 | Termination of patent right due to non-payment of annual fee |