CN215871971U - High heat conduction flexible printed circuit board - Google Patents
High heat conduction flexible printed circuit board Download PDFInfo
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- CN215871971U CN215871971U CN202121967281.XU CN202121967281U CN215871971U CN 215871971 U CN215871971 U CN 215871971U CN 202121967281 U CN202121967281 U CN 202121967281U CN 215871971 U CN215871971 U CN 215871971U
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- adhesive
- heat dissipation
- copper foil
- dissipation copper
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Abstract
The utility model discloses a high-heat-conductivity flexible printed circuit board, which comprises a central substrate, wherein the central substrate comprises a central substrate, the upper end surface of the central substrate is provided with an adhesive A, the upper end surface of the adhesive A is provided with a heat-dissipation copper foil layer A, the upper end of the heat-dissipation copper foil layer A is provided with an adhesive B, the upper end surface of the adhesive B is provided with a graphic layer A, the upper end surface of the graphic layer A is provided with an adhesive C, the upper end surface of the adhesive C is provided with a protective film A, the lower end surface of the central substrate is provided with an adhesive D, the lower end surface of the adhesive D is provided with a heat-dissipation copper foil layer B, the lower end surface of the heat-dissipation copper foil layer B is provided with an adhesive E, the lower end surface of the adhesive E is provided with a graphic layer B, the lower end surface of the graphic layer B is provided with an adhesive F, and the lower end surface of the adhesive F is provided with a protective film B; the utility model has the advantages of excellent heat dissipation and long service life.
Description
Technical Field
The utility model belongs to the technical field of flexible printed circuit boards, and particularly relates to a high-thermal-conductivity flexible printed circuit board.
Background
The Flexible Printed Circuit board, also called Flexible Printed Circuit board, Flexible board, is a special Printed Circuit board, is mainly used for connecting with other Circuit boards, is characterized by light weight, thin thickness, flexibility, and can be widely applied to a plurality of electronic products such as mobile phones, notebook computers, PDAs, digital cameras, liquid crystal displays, and the like.
The heat carried in the existing flexible printed circuit board is not easy to dissipate, the heat dissipation performance is poor, and the electronic components, the flexible printed circuit board and other circuit boards connected with the flexible printed circuit board are easy to damage after a long time of use, thereby affecting the service life of electronic products; in order to solve the above problems, it is necessary to develop a flexible printed circuit board with high thermal conductivity.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art and provide a high-heat-conductivity flexible printed circuit board with excellent heat dissipation and long service life.
The purpose of the utility model is realized as follows: the high-thermal-conductivity flexible printed circuit board comprises a central substrate, wherein the central substrate comprises a central substrate, an adhesive A is arranged on the upper end face of the central substrate, a heat dissipation copper foil layer A is arranged on the upper end face of the adhesive A, an adhesive B is arranged on the upper end face of the heat dissipation copper foil layer A, a graphic layer A is arranged on the upper end face of the adhesive B, an adhesive C is arranged on the upper end face of the graphic layer A, a protective film A is arranged on the upper end face of the adhesive C, an adhesive D is arranged on the lower end face of the central substrate, a heat dissipation copper foil layer B is arranged on the lower end face of the adhesive D, an adhesive E is arranged on the lower end face of the heat dissipation copper foil layer B, a graphic layer B is arranged on the lower end face of the adhesive E, an adhesive F is arranged on the lower end face of the graphic layer B, and a protective film B is arranged on the lower end face of the adhesive F.
Preferably, the side plate comprises a side substrate A and a side plate B, the side substrate A comprises a side substrate A, the upper end surface of the side substrate A is provided with an adhesive A, the upper end surface of the adhesive A is provided with a heat dissipation copper foil layer A, the upper end surface of the heat dissipation copper foil layer A is provided with an adhesive B, the upper end surface of the adhesive B is provided with a heat dissipation copper foil layer C, the heat dissipation copper foil layer C is electrically connected with the grounding copper foil of the graphic layer A, the upper end surface of the heat dissipation copper foil layer C is provided with the adhesive C, the upper end surface of the adhesive C is provided with a protective film A, the lower end surface of the side substrate A is provided with an adhesive D, the lower end surface of the adhesive D is provided with a heat dissipation copper foil layer B, the lower end surface of the heat dissipation copper foil layer B is provided with an adhesive E, the lower end surface of the adhesive E is provided with a heat dissipation copper foil layer D, and the heat dissipation copper foil layer D is electrically connected with the grounding copper foil of the graphic layer B, the lower end face of the heat dissipation copper foil layer D is provided with an adhesive F, the lower end face of the adhesive F is provided with a protective film B, and the side plate B is provided with a layer structure which is the same as that of the side plate A.
Further preferably, the outer end of the side plate A is connected with a heat dissipation copper plate A, the heat dissipation copper plate A is electrically connected with the heat dissipation copper foil layer A, the heat dissipation copper foil layer C, the heat dissipation copper foil layer B and the heat dissipation copper foil layer D of the side plate A, the outer end of the side plate B is connected with a heat dissipation copper plate B, and the heat dissipation copper plate B has the same electrical connection setting as the heat dissipation copper plate A.
Further preferably, the heat-dissipating copper plate a is provided with two mounting holes a, and the heat-dissipating copper plate B is provided with two mounting holes B.
Further preferably, the side plate a and the side plate B are connected to two sides of the central plate in a staggered manner and then are respectively arranged close to two outer ends of the central plate.
Due to the adoption of the technical scheme, the utility model has the beneficial effects that: the novel radiating copper foil layer is adopted and symmetrically distributed, the flexible circuit board has good ductility, the radiating performance is effectively improved, and the service life is effectively prolonged; the novel side plate is adopted, the novel side plate comprises four heat dissipation copper foil layers which are well grounded, and the two novel side plates are respectively arranged close to two ends of the central plate, so that the central plate, other circuit boards connected with the central plate and electronic components of the circuit boards can dissipate heat nearby conveniently, and the heat dissipation effect is further improved; the utility model adopts the heat-radiating copper plate, so that the heat of the heat-radiating copper foil layer can be conveniently and fully radiated from the heat-radiating copper plate, and the heat-radiating performance of the flexible circuit board is further improved; in general, the utility model has the advantages of excellent heat dissipation and long service life.
Drawings
Fig. 1 is a schematic front view of the present invention.
Fig. 2 is a schematic of the layer structure of the center panel of the present invention.
Fig. 3 is a schematic view of the layer structure of the side panel a and the side panel B of the present invention.
In the figure: 1. the heat-dissipating copper plate comprises a center plate 2, a side plate A3, a side plate B4, a heat-dissipating copper plate A5, a mounting hole A6, a heat-dissipating copper plate B7, a mounting hole B8, a center substrate 9, an adhesive A10, a heat-dissipating copper foil layer A11, an adhesive B12, a graphic layer A13, an adhesive C14, a protective film A15, an adhesive D16, a heat-dissipating copper foil layer B17, an adhesive E18, a graphic layer B19, an adhesive F20, a protective film B21, a side substrate A22, a heat-dissipating copper foil layer C23, and a heat-dissipating copper foil layer D.
Detailed Description
The technical scheme of the utility model is further specifically described below with reference to the accompanying drawings.
As shown in fig. 1, 2 and 3, the present invention provides a high thermal conductivity flexible printed circuit board, including a central board 1, the central board 1 includes a central substrate 8, an upper end surface of the central substrate 8 is provided with an adhesive a9, an upper end surface of the adhesive a9 is provided with a heat dissipation copper foil layer a10, an upper end surface of the heat dissipation copper foil layer a10 is provided with an adhesive B11, an upper end surface of the adhesive B11 is provided with a graphic layer a12, an upper end surface of the graphic layer a12 is provided with an adhesive C13, an upper end surface of the adhesive C13 is provided with a protective film a14, a lower end surface of the central substrate 8 is provided with an adhesive D15, a lower end surface of the adhesive D15 is provided with a heat dissipation copper foil layer B16, a lower end surface of the heat dissipation copper foil layer B16 is provided with an adhesive E17, a lower end surface of the adhesive E17 is provided with a graphic layer B18, a lower end surface of the graphic layer B18 is provided with an adhesive F19, and a lower end surface of the adhesive F19 is provided with a protective film 20.
Preferably, the heat-radiating plate further comprises a side plate A2 and a side plate B3, wherein the side plate A and the side plate B3 are used for enhancing heat radiation. The side plate A2 comprises a side substrate A21, an adhesive A9 is arranged on the upper end face of the side substrate A21, the upper end surface of the adhesive A9 is provided with a heat dissipation copper foil layer A10, the upper end surface of the heat dissipation copper foil layer A10 is provided with an adhesive B11, the upper end surface of the adhesive B11 is provided with a heat dissipation copper foil layer C22, the heat dissipation copper foil layer C22 is electrically connected with the grounding copper foil of the graphic layer A12, the upper end surface of the heat dissipation copper foil layer C22 is provided with an adhesive C13, the adhesive C13 has a protective film A14 on its upper surface, an adhesive D15 on its lower surface of the side substrate A21, the lower end surface of the adhesive D15 is provided with a heat dissipation copper foil layer B16, the lower end surface of the heat dissipation copper foil layer B16 is provided with an adhesive E17, the lower end surface of the adhesive E17 is provided with a heat dissipation copper foil layer D23, the heat dissipation copper foil layer D23 is electrically connected with the grounding copper foil of the graphic layer B18, the lower end surface of the heat dissipation copper foil layer D23 is provided with an adhesive F19, the lower end surface of the adhesive F19 is provided with a protective film B20, and the side plate B3 has the same layer structure as the side plate a 2.
More preferably, the outer end of the side plate a2 is connected with a heat dissipation copper plate a4, the heat dissipation copper plate a4 is electrically connected with the heat dissipation copper foil layer a10, the heat dissipation copper foil layer C22, the heat dissipation copper foil layer B17 and the heat dissipation copper foil layer D23 of the side plate a2, the outer end of the side plate B3 is connected with a heat dissipation copper plate B6, and the heat dissipation copper plate B6 has the same electrical connection arrangement as the heat dissipation copper plate a 4.
Further preferably, the heat-dissipating copper plate a4 is provided with two mounting holes a5, the heat-dissipating copper plate B6 is provided with two mounting holes B7, the mounting holes a5 and the mounting holes B7 are used for mounting, so as to further facilitate heat dissipation, and in specific implementation, the side plate a and the side plate B are fixedly mounted and effectively grounded through the mounting holes a5 and the mounting holes B7 according to actual conditions.
Preferably, the side plates a2 and B3 are connected to both sides of the central plate 1 at staggered positions and are respectively arranged near the two outer ends of the central plate 1, so that the heat dissipation is facilitated.
During specific implementation, the central board 1, the side board A2 and the side board B3 have the same layer distribution, uniform production is facilitated, production cost can be reduced, and the heat dissipation performance of the uniformly produced flexible printed circuit board is greatly improved compared with that of a flexible printed circuit board only provided with the central board 1, so that the service lives of the central board 1 and related circuits are effectively prolonged.
In conclusion, the newly added heat dissipation copper foil layers are symmetrically distributed, the flexible circuit board is good in ductility, the heat dissipation performance is effectively improved, and meanwhile the service life is effectively prolonged; according to the utility model, the newly added side plates comprise four heat dissipation copper foil layers with good grounding, and the two newly added side plates are respectively arranged close to the two ends of the central plate, so that the central plate, other circuit boards connected with the central plate and electronic components of the circuit boards can dissipate heat nearby conveniently, and the heat dissipation effect is further improved; according to the utility model, through the heat dissipation copper plate, the heat of the heat dissipation copper foil layer can be conveniently and fully dissipated from the heat dissipation copper plate, and the heat dissipation performance of the flexible circuit board is further improved; in general, the utility model has the advantages of excellent heat dissipation and long service life.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included therein.
Claims (5)
1. A high heat conduction flexible printed circuit board, includes well board, its characterized in that: the center plate comprises a center substrate, an adhesive A is arranged on the upper end face of the center substrate, a heat dissipation copper foil layer A is arranged on the upper end face of the adhesive A, an adhesive B is arranged on the upper end face of the heat dissipation copper foil layer A, a graphic layer A is arranged on the upper end face of the adhesive B, an adhesive C is arranged on the upper end face of the graphic layer A, a protective film A is arranged on the upper end face of the adhesive C, an adhesive D is arranged on the lower end face of the center substrate, a heat dissipation copper foil layer B is arranged on the lower end face of the adhesive D, an adhesive E is arranged on the lower end face of the heat dissipation copper foil layer B, a graphic layer B is arranged on the lower end face of the adhesive E, an adhesive F is arranged on the lower end face of the graphic layer B, and a protective film B is arranged on the lower end face of the adhesive F.
2. The high thermal conductivity flexible printed circuit board according to claim 1, wherein: the side plate comprises a side substrate A, an adhesive A is arranged on the upper end surface of the side substrate A, a heat dissipation copper foil layer A is arranged on the upper end surface of the adhesive A, an adhesive B is arranged on the upper end surface of the heat dissipation copper foil layer A, a heat dissipation copper foil layer C is arranged on the upper end surface of the adhesive B, the heat dissipation copper foil layer C is electrically connected with the grounding copper foil of the graphic layer A, the adhesive C is arranged on the upper end surface of the heat dissipation copper foil layer C, a protective film A is arranged on the upper end surface of the adhesive C, an adhesive D is arranged on the lower end surface of the side substrate A, a heat dissipation copper foil layer B is arranged on the lower end surface of the adhesive D, an adhesive E is arranged on the lower end surface of the heat dissipation copper foil layer B, a heat dissipation copper foil layer D is arranged on the lower end surface of the adhesive E, and the heat dissipation copper foil layer D is electrically connected with the grounding copper foil of the graphic layer B, the lower end face of the heat dissipation copper foil layer D is provided with an adhesive F, the lower end face of the adhesive F is provided with a protective film B, and the side plate B is provided with a layer structure which is the same as that of the side plate A.
3. The high thermal conductivity flexible printed circuit board according to claim 2, wherein: the outer end of curb plate A is connected with heat dissipation copper A, heat dissipation copper A with curb plate A heat dissipation copper foil layer C heat dissipation copper foil layer B heat dissipation copper foil layer D electric connection, curb plate B's outer end is connected with heat dissipation copper B, heat dissipation copper B have with the same electric connection setting of heat dissipation copper A.
4. The high thermal conductivity flexible printed circuit board according to claim 3, wherein: the heat dissipation copper plate A is provided with two mounting holes A, and the heat dissipation copper plate B is provided with two mounting holes B.
5. The high thermal conductivity flexible printed circuit board according to claim 2, wherein: the side plate A and the side plate B are connected to two sides of the central plate in a staggered mode and then are respectively close to two outer ends of the central plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121967281.XU CN215871971U (en) | 2021-08-20 | 2021-08-20 | High heat conduction flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121967281.XU CN215871971U (en) | 2021-08-20 | 2021-08-20 | High heat conduction flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215871971U true CN215871971U (en) | 2022-02-18 |
Family
ID=80240946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121967281.XU Active CN215871971U (en) | 2021-08-20 | 2021-08-20 | High heat conduction flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215871971U (en) |
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2021
- 2021-08-20 CN CN202121967281.XU patent/CN215871971U/en active Active
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