CN213755452U - Heat dissipation device for substrate-free power module - Google Patents
Heat dissipation device for substrate-free power module Download PDFInfo
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- CN213755452U CN213755452U CN202022691210.3U CN202022691210U CN213755452U CN 213755452 U CN213755452 U CN 213755452U CN 202022691210 U CN202022691210 U CN 202022691210U CN 213755452 U CN213755452 U CN 213755452U
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Abstract
The utility model discloses a heat dissipation device for a substrate-free power module, which comprises a heat dissipation die holder, a mounting plate and a power module; the power module comprises a PCB, and a power device is arranged on the bottom surface of the PCB; the top surface of the heat dissipation die holder is provided with an inwards concave cavity, and the shape and the size of the cavity are matched with those of a power device; the power module is installed on the heat dissipation die holder through the installation plate, and the power device is located inside the cavity. The utility model has the advantages that: the utility model discloses an inlay power module's power device and establish inside the cavity at the heat dissipation die holder for the power module that does not have the base plate can the radiating installation environment of adaptation base plate conduction, need not to reform transform the radiating installation environment of traditional base plate, has saved the cost.
Description
Technical Field
The utility model belongs to the technical field of power module's heat dissipation, specifically a heat abstractor for no base plate power module.
Background
With the development of power electronic technology and the improvement of devices and processes, the efficiency of the power supply module is higher and higher, and the size of the power supply module is smaller and smaller. The aluminum substrate patch of the power device is gradually replaced by the PCB patch. The power module with the substrate heat dissipation mode is gradually replaced by the power module without the substrate air cooling (or self cooling) heat dissipation mode. In practical applications, however, scenes are often encountered in which heat can only be conducted through the substrate. Many customers are forced to modify the design and select older, less efficient power modules. Doing so not only increases the size of the power module, but also runs the risk of the power module being out of production for older models.
Disclosure of Invention
The utility model aims at the problem that prior art exists, provide a heat abstractor for no base plate power module, solve among the prior art the radiating problem of the unable adaptation base plate conduction of no base plate power module.
In order to achieve the above object, the utility model adopts the following technical scheme:
a heat sink for a substrate-free power module comprises a heat sink base, a mounting plate and a power module; the power module comprises a PCB, and a power device is arranged on the bottom surface of the PCB; the top surface of the heat dissipation die holder is provided with an inwards concave cavity, and the shape and the size of the cavity are matched with those of a power device; the power module is installed on the heat dissipation die holder through the installation plate, and the power device is located inside the cavity.
The utility model discloses an inlay power module's power device and establish inside the cavity at the heat dissipation die holder for the power module that does not have the base plate can the radiating installation environment of adaptation base plate conduction, need not to reform transform the radiating installation environment of traditional base plate, has saved the cost.
Specifically, a hollow-out area is arranged in the middle of the mounting plate, and the shape and the size of the hollow-out area are matched with those of the PCB; the inner wall of the hollowed-out area is provided with an inward convex edge, the PCB is embedded on the top surface of the inward convex edge in the hollowed-out area, and the edge of the PCB can be supported by the convex edge, so that the power module can be installed and positioned.
Specifically, the four corners of the top surface of the heat dissipation die holder are provided with blind holes, the four corners of the mounting plate are provided with through holes corresponding to the blind holes, and the mounting plate and the heat dissipation die holder are fixed through screws.
Preferably, the cavity is filled with heat-conducting pouring sealant which can play two roles; one is that the heat conducting function is achieved, the heat generated by the power device is conducted to the bottom surface of the heat dissipation die holder, and then the heat of the bottom surface of the heat dissipation die holder is dissipated through the radiator; and the heat-conducting pouring sealant can adhere the PCB and the cavity of the heat-radiating die holder together after being solidified, so that the heat-conducting pouring sealant plays a role in fixing and packaging.
Furthermore, the top surface of the mounting plate is provided with an overflow slot hole, the overflow slot hole is positioned above the cavity, and the overflow slot hole is formed in the top surface of the mounting plate, so that redundant heat-conducting pouring sealant can be conveniently discharged from the overflow slot hole when the power supply module is packaged.
Specifically, the cavity is made of heat conducting materials, and heat dissipation efficiency is improved.
Specifically, the mounting panel is made for insulating material, can carry out electrical isolation with PCB board and heat dissipation die holder, prevents that PCB board and heat dissipation die holder contact from leading to short circuit fault.
Compared with the prior art, the beneficial effects of the utility model are that: the power device of the power module is embedded in the cavity of the heat dissipation die holder, so that the power module without the substrate can adapt to the installation environment of the substrate for heat conduction and dissipation, the installation environment of the traditional substrate for heat dissipation is not required to be improved, and the cost is saved; and the PCB is fixedly installed through the installation plate, so that the problem of short circuit fault caused by direct contact of the PCB and the heat dissipation die holder is avoided, and the safety of the device is improved.
Drawings
Fig. 1 is an exploded view of a heat dissipation device for a substrate-less power module according to an embodiment of the present invention;
fig. 2 is a schematic view of an installation structure of the installation plate and the heat dissipation mold base in the embodiment of the present invention;
fig. 3 is a schematic diagram of an overall structure of a packaged heat dissipation device for a substrate-less power module according to an embodiment of the present invention;
in the figure: 1. a heat dissipation die holder; 2. mounting a plate; 3. a power supply module; 4. a PCB board; 5. a power device; 6. a cavity; 7. a hollow-out area; 8. a convex edge; 9. blind holes; 10. a through hole; 11. and (4) overflowing slotted holes.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1 to 3, the present embodiment provides a heat dissipation apparatus for a substrate-less power module 3, including a heat dissipation mold base 1, a mounting plate 2 and a power module 3; the power module 3 comprises a PCB (printed circuit board) 4, and a power device 5 is arranged on the bottom surface of the PCB 4; the top surface of the heat dissipation die holder 1 is provided with an inwards concave cavity 6, and the shape and the size of the cavity 6 are matched with those of the power device 5; the power module 3 is installed on the heat dissipation die holder 1 through the installation plate 2, and the power device 5 is located inside the cavity 6.
Specifically, a hollow-out area 7 is arranged in the middle of the mounting plate 2, and the shape and the size of the hollow-out area 7 are matched with those of the PCB 4; the inner wall of fretwork district 7 is equipped with inside protruding edge 8, PCB board 4 inlays and establishes protruding 8 top surfaces along in fretwork district 7, protruding edge 8 can hold the edge of PCB board 4, realizes power module 3's installation, location. In this embodiment, the thickness of mounting panel 2 is greater than the thickness of PCB board 4, guarantees that PCB board 4 imbeds fretwork district 7 after, the top surface parallel and level of PCB board 4 and mounting panel 2, and is whole more pleasing to the eye.
Specifically, 1 top surface four corners of heat dissipation die holder all is equipped with blind hole 9, the four corners of mounting panel 2 all be equipped with the through-hole 10 that blind hole 9 corresponds, mounting panel 2 passes through the fix with screw with heat dissipation die holder 1.
Preferably, heat-conducting pouring sealant is injected into the cavity 6, and the heat-conducting pouring sealant can play two roles; one is that the heat conduction function is achieved, the heat generated by the power device 5 is conducted to the bottom surface of the heat dissipation die holder 1, and then the heat on the bottom surface of the heat dissipation die holder 1 is dissipated through the radiator; and the heat-conducting pouring sealant can adhere the PCB 4 and the cavity 6 of the heat-radiating die holder 1 together after being cured, so that the heat-conducting pouring sealant plays a role in fixing and packaging. The heat-conducting pouring sealant also has the insulating characteristic, and can not cause short circuit of the PCB 4.
Furthermore, the top surface of the mounting plate 2 is provided with two overflow slot holes 11, the overflow slot holes 11 are located above the cavity 6, and the overflow slot holes 11 are formed in the top surface of the mounting plate 2, so that redundant heat-conducting pouring sealant can be discharged from the overflow slot holes 11 when the power module 3 is packaged.
Specifically, the cavity 6 is made of a heat conducting material (specifically, aluminum) so as to improve the heat dissipation efficiency.
Specifically, the mounting plate 2 is made of an insulating material (specifically, a bakelite plate can be adopted), and can electrically isolate the PCB 4 from the heat dissipation die holder 1, so that short-circuit faults caused by contact between the PCB 4 and the heat dissipation die holder 1 are prevented.
In this embodiment, the bottom surface of the cavity 6 of the heat dissipation die holder 1 is an irregular plane, and a certain gap is left between the highest position of the bottom surface of the cavity 6 and the top surface of the heat dissipation die holder 1, so as to prevent electrical components on the bottom surface of the PCB 4 from directly contacting the bottom surface of the cavity 6. The top surface of the PCB 4 is also provided with a plurality of electrical components and binding posts, so that wiring is facilitated.
The packaging method of the power module 3 of the embodiment is as follows: firstly, placing the mounting plate 2 on the top surface of the heat-radiating die holder 1, aligning 4 through holes 10 with 4 blind holes 9 respectively, and fixing the mounting plate 2 on the heat-radiating die holder 1 by using 4 screws; then, injecting a certain amount (about 15.2 g) of heat-conducting pouring sealant into the cavity 6, then placing the power module 3 into the hollow-out area 7 of the mounting plate 2, embedding the power device 5 into the cavity, clamping the PCB 4 into the hollow-out area 7, and supporting the PCB 4 through the convex edge 8 of the hollow-out area 7; and cleaning the redundant heat-conducting potting adhesive overflowing from the overflow slot 11, and waiting for the heat-conducting potting adhesive to be cured.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A heat sink for a substrate-free power module is characterized by comprising a heat sink die holder, a mounting plate and a power module; the power module comprises a PCB, and a power device is arranged on the bottom surface of the PCB; the top surface of the heat dissipation die holder is provided with an inwards concave cavity, and the shape and the size of the cavity are matched with those of a power device; the power module is installed on the heat dissipation die holder through the installation plate, and the power device is located inside the cavity.
2. The heat dissipation device of claim 1, wherein a hollow-out area is formed in the middle of the mounting plate, and the shape and size of the hollow-out area are matched with those of a PCB (printed circuit board); the inner wall of the hollowed-out area is provided with an inward convex edge, and the PCB is embedded on the top surface of the inward convex edge of the hollowed-out area.
3. The heat dissipating device for a substrate-less power module as claimed in claim 1, wherein the heat dissipating die holder has blind holes at four corners of the top surface, the mounting plate has through holes corresponding to the blind holes at four corners, and the mounting plate and the heat dissipating die holder are fixed by screws.
4. The heat dissipating device of claim 2, wherein the cavity is filled with a thermally conductive potting adhesive.
5. The heat sink device as claimed in claim 4, wherein the top surface of the mounting plate is provided with an overflow slot, and the overflow slot is located above the cavity.
6. The heat dissipation device as claimed in claim 1, wherein the cavity is made of a thermally conductive material.
7. The heat dissipation device of claim 1, wherein the mounting plate is made of an insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022691210.3U CN213755452U (en) | 2020-11-19 | 2020-11-19 | Heat dissipation device for substrate-free power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022691210.3U CN213755452U (en) | 2020-11-19 | 2020-11-19 | Heat dissipation device for substrate-free power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213755452U true CN213755452U (en) | 2021-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022691210.3U Active CN213755452U (en) | 2020-11-19 | 2020-11-19 | Heat dissipation device for substrate-free power module |
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| CN (1) | CN213755452U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115622474A (en) * | 2022-12-15 | 2023-01-17 | 山西省机电设计研究院有限公司 | Sealed water-cooling motor controller |
| WO2023037240A1 (en) * | 2021-09-08 | 2023-03-16 | Vijay Bolloju | Substrateless hybrid power module assembly and method for fabricating thereof |
-
2020
- 2020-11-19 CN CN202022691210.3U patent/CN213755452U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023037240A1 (en) * | 2021-09-08 | 2023-03-16 | Vijay Bolloju | Substrateless hybrid power module assembly and method for fabricating thereof |
| CN115622474A (en) * | 2022-12-15 | 2023-01-17 | 山西省机电设计研究院有限公司 | Sealed water-cooling motor controller |
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