CN211267233U - Novel circuit board assembly with electronic device protection function - Google Patents
Novel circuit board assembly with electronic device protection function Download PDFInfo
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- CN211267233U CN211267233U CN201921476792.4U CN201921476792U CN211267233U CN 211267233 U CN211267233 U CN 211267233U CN 201921476792 U CN201921476792 U CN 201921476792U CN 211267233 U CN211267233 U CN 211267233U
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- circuit board
- heat dissipation
- electronic device
- protection function
- board assembly
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Abstract
A novel circuit board assembly with the function of protecting electronic devices comprises a circuit board, an insulating layer, a heat conduction copper layer and a heat dissipation copper block; the heat dissipation copper block is arranged in the mounting hole, the top of the heat dissipation copper block extends to the outer side of the circuit board, and the bottom of the heat dissipation copper block penetrates through the insulating layer and is directly connected with the heat conduction copper layer; a plurality of gaps with wave-shaped structures are symmetrically arranged on the circuit board on two sides of the mounting hole; the gap width of the wavy gap is 0.2-0.4 times of the thickness of the circuit board. Therefore, the problems that the traditional circuit board is poor in heat dissipation performance and the heat conduction capacity of the plate is weak are solved. The practicability is strong, and the popularization significance is strong.
Description
Technical Field
The utility model relates to a circuit board field especially relates to a novel circuit board assembly with protection electron device function.
Background
With the increasingly complex electrical characteristics of modern electronic products, the requirements for power supply and signals are higher and higher. The circuit board has many electronic devices, and the electronic devices generate heat during operation, so that the internal temperature of the equipment is increased.
The heat dissipation of the circuit board is poor, and the heat conduction capability of the board itself is weak, which may affect the performance of the electronic device over time.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is necessary to provide a novel circuit board assembly having a function of protecting electronic devices in order to overcome the disadvantages of the prior art.
A novel circuit board assembly with the function of protecting electronic devices comprises a circuit board, an insulating layer, a heat conduction copper layer and a heat dissipation copper block; the heat dissipation copper block is arranged in the mounting hole, the top of the heat dissipation copper block extends to the outer side of the circuit board, and the bottom of the heat dissipation copper block penetrates through the insulating layer and is directly connected with the heat conduction copper layer; a plurality of gaps with wave-shaped structures are symmetrically arranged on the circuit board on two sides of the mounting hole; the gap width of the wavy gap is 0.2-0.4 times of the thickness of the circuit board.
Furthermore, the novel circuit board assembly with the function of protecting the electronic device further comprises a rubber ring, and the heat dissipation copper block is fixed inside the mounting hole through the rubber ring.
Further, the thickness of the insulating layer is between 1 and 5 millimeters.
Further, the radius size of the mounting hole is equal to the thickness of the circuit board.
Furthermore, the number of the gaps is four, and the four gaps are uniformly arranged on the circuit board and surround the mounting hole.
Further, the wavy gaps are distributed in a sine curve mode.
The beneficial effects of the utility model reside in that: the circuit board is provided with a gap of a wave-shaped structure, a heat dissipation copper block is arranged in the circuit board, the bottom of the circuit board is sequentially provided with an insulating layer and a heat conduction copper layer, and the heat dissipation copper block penetrates through the insulating layer and is directly connected with the heat conduction copper layer. Therefore, the problems that the traditional circuit board is poor in heat dissipation performance and the heat conduction capacity of the plate is weak are solved. The practicability is strong, and the popularization significance is strong.
Drawings
Fig. 1 is a schematic structural diagram of a novel circuit board assembly with an electronic device protection function according to the present invention;
fig. 2 is a schematic structural diagram of the circuit board in fig. 1.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments.
As shown in fig. 1 and 2, the present invention provides a novel circuit board assembly with the function of protecting electronic devices, which is used for heat dissipation of the circuit board itself and the electronic devices arranged on the circuit board. The novel circuit board assembly with the function of protecting electronic devices comprises a circuit board 10, an insulating layer 20, a heat conduction copper layer 30 and a heat dissipation copper block 40. The circuit board 10 is provided with a mounting hole 11 at the center, and the insulating layer 20 and the heat-conducting copper layer 30 are sequentially mounted at the bottom of the circuit board 10 for performing heat dissipation treatment on the circuit board 10. The heat dissipation copper block 40 is arranged in the mounting hole 11, the top of the heat dissipation copper block 40 extends to the outer side of the circuit board 10, and the bottom of the heat dissipation copper block 40 penetrates through the insulating layer 20 and is directly connected with the heat conduction copper layer 30. A plurality of gaps 12 with a wave-shaped structure are symmetrically arranged on the circuit board 10 at two sides of the mounting hole 11; the width of the wave-shaped gap 12 is 0.2-0.4 times of the thickness of the circuit board 10.
The novel circuit board assembly 10 with the function of protecting the electronic device further comprises a rubber ring 50, and the heat dissipation copper block 40 is fixed inside the mounting hole 11 through the rubber ring 50, so that friction between the heat dissipation copper block 40 and the circuit board 10 is avoided, and the circuit board 10 is damaged.
The thickness of the insulating layer 20 is between 1 and 5 mm, so that the circuit board 10 and the heat-conducting copper layer 30 are not electrically connected, and the normal operation of the electronic devices on the circuit board 10 is ensured.
The radius of the mounting hole is equal to the thickness of the circuit board, so that the heat dissipation performance of the circuit board 10 can be greatly enhanced.
The number of the gaps 12 is four, and the four gaps 12 are uniformly arranged on the circuit board 10 and surround the mounting hole 11 to improve the heat dissipation performance.
The wavy gaps 12 are distributed in a sine curve to improve the heat dissipation performance of the circuit board 10.
In operation, when the electronic device on the circuit board 10 generates heat, the heat dissipation copper block 40 inside the mounting hole 11 conducts heat, and since the heat dissipation copper block 40 passes through the insulating layer 20 and is directly connected to the heat conduction copper layer 30, the heat can be quickly transmitted to the heat conduction copper layer 30, and the heat can be quickly dissipated through metal. And by virtue of the provision of the "wave" type structure on the circuit board 10, heat may also be dissipated through the circuit board 10 itself.
The beneficial effects of the utility model reside in that: the circuit board 10 is provided with the gap 12 with a wave-shaped structure, the circuit board 10 is internally provided with the heat dissipation copper block 40, the bottom of the circuit board 10 is sequentially provided with the insulating layer 20 and the heat conduction copper layer 30, and the heat dissipation copper block 40 penetrates through the insulating layer 20 and is directly connected with the heat conduction copper layer 30. Therefore, the problems that the traditional circuit board is poor in heat dissipation performance and the heat conduction capacity of the plate is weak are solved. The practicability is strong, and the popularization significance is strong.
The above-described embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, many variations and modifications can be made without departing from the spirit of the invention, and these are within the scope of the invention. Therefore, the protection scope of the utility model patent should be subject to the appended claims.
Claims (6)
1. A novel circuit board assembly with electronic device protection function, its characterized in that: comprises a circuit board, an insulating layer, a heat conducting copper layer and a heat radiating copper block; the heat dissipation copper block is arranged in the mounting hole, the top of the heat dissipation copper block extends to the outer side of the circuit board, and the bottom of the heat dissipation copper block penetrates through the insulating layer and is directly connected with the heat conduction copper layer; a plurality of gaps with wave-shaped structures are symmetrically arranged on the circuit board on two sides of the mounting hole; the gap width of the wavy gap is 0.2-0.4 times of the thickness of the circuit board.
2. The novel circuit board assembly with electronic device protection function as claimed in claim 1, wherein: still include a rubber circle, the heat dissipation copper billet passes through the rubber circle to be fixed inside the mounting hole.
3. The novel circuit board assembly with electronic device protection function as claimed in claim 1, wherein: the thickness of the insulating layer is between 1 and 5 millimeters.
4. The novel circuit board assembly with electronic device protection function as claimed in claim 1, wherein: the radius of the mounting hole is equal to the thickness of the circuit board.
5. The novel circuit board assembly with electronic device protection function as claimed in claim 1, wherein: the number of the gaps is four, and the four gaps are uniformly arranged on the circuit board and surround the mounting holes.
6. The novel circuit board assembly with electronic device protection function as claimed in claim 1, wherein: the wavy gaps are distributed in a sine curve manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921476792.4U CN211267233U (en) | 2019-09-05 | 2019-09-05 | Novel circuit board assembly with electronic device protection function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921476792.4U CN211267233U (en) | 2019-09-05 | 2019-09-05 | Novel circuit board assembly with electronic device protection function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211267233U true CN211267233U (en) | 2020-08-14 |
Family
ID=71990231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921476792.4U Active CN211267233U (en) | 2019-09-05 | 2019-09-05 | Novel circuit board assembly with electronic device protection function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211267233U (en) |
-
2019
- 2019-09-05 CN CN201921476792.4U patent/CN211267233U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee after: Jiangxi hongban Technology Co.,Ltd. Address before: 343100 national Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: RED BOARD (JIANGXI) Co.,Ltd. |
|
| CP03 | Change of name, title or address |