CN210073799U - Wafer taking device - Google Patents
Wafer taking device Download PDFInfo
- Publication number
- CN210073799U CN210073799U CN201921164447.7U CN201921164447U CN210073799U CN 210073799 U CN210073799 U CN 210073799U CN 201921164447 U CN201921164447 U CN 201921164447U CN 210073799 U CN210073799 U CN 210073799U
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- Prior art keywords
- rotating
- rotating arm
- parallel
- wafer
- axis manipulator
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- 235000012431 wafers Nutrition 0.000 abstract description 24
- 239000000463 material Substances 0.000 abstract description 3
- 230000001360 synchronised effect Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer taking device, which comprises a multi-shaft manipulator and a base, wherein the multi-shaft manipulator comprises two parallel rotating arms, namely a first rotating arm and a second rotating arm, one end of the first rotating arm is arranged on the base and can be rotationally arranged, the other end of the first rotating arm is connected with the end part of the second rotating arm, the other end of the second rotating arm is provided with a rotating table, and a wafer sucking disc and an infrared sensor are arranged on the rotating table; the first rotating arm, the second rotating arm and a rotating shaft of the rotating platform are arranged in parallel; the multi-axis manipulator is arranged in a lifting mode. The two rotating arms are arranged in parallel, and the rotating shafts of the rotating arms and the rotating table are arranged in parallel, so that the sucker can linearly move in the material box through the rotation of the two rotating arms, and wafers can be taken out or fed in. And the wafer can be inserted into any slot by matching with the lifting mechanism.
Description
Technical Field
The utility model relates to a wafer delivery technical field, concretely relates to wafer gets piece device.
Background
The application number is CN 201720195344.1's patent discloses a wafer of wafer handling machine draws and deposits manipulator, and this manipulator is including the robotic arm that is used for the clamping wafer and the drive mechanism who is used for conveying robotic arm, drive mechanism includes the fixing base, locates the linear guide of fixing base upper surface and locates the power unit of fixing base one side, power unit is including being used for driven servo motor, locating the synchronous pulley at fixing base both ends and the synchronous belt who is used for linkage synchronous pulley, robotic arm is fixed with the xarm of tray including the tray that is used for the clamping wafer and one end, the other end of xarm is equipped with the installation piece, the installation piece is equipped with spout and linear guide cooperation, still connect on the installation piece and be used for carrying out the fixation clamp fixed with synchronous belt, the opposite side of fixing base is equipped with folding vacuum trachea.
However, many wafers are loaded in the magazine, the magazine is provided with a plurality of slots, each slot is loaded with a wafer, the gap between the slots is small, and the robot is not used for extracting the wafers from the magazine.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to solve above-mentioned prior art not enough, provide and be convenient for take out the wafer from the magazine that has the slot or get the piece device with the wafer in the wafer packing into the magazine.
In order to solve the technical problem, the utility model discloses a technical scheme be: a wafer taking device comprises a multi-axis manipulator and a base, wherein the multi-axis manipulator comprises two parallel rotating arms which are respectively a first rotating arm and a second rotating arm, one end of the first rotating arm is mounted on a base and can be arranged in a rotating mode, the other end of the first rotating arm is connected with the end portion of the second rotating arm, the other end of the second rotating arm is provided with a rotating table, and a wafer sucking disc and an infrared sensor are arranged on the rotating table; the first rotating arm, the second rotating arm and a rotating shaft of the rotating platform are arranged in parallel; the multi-axis manipulator is arranged in a lifting mode.
Further, be provided with the lead screw module in the frame, the screw rod of lead screw module is parallel with multi-axis manipulator's pivot, is provided with a connecting plate on lead screw module's the nut seat, and the both sides of connecting plate set up a fixed plate respectively, and the top of fixed plate is provided with a roof, and multi-axis manipulator installs on this roof, still is provided with a plurality of connecting blocks on the fixed plate, and the connecting block is used for installing the motor that drives multi-axis manipulator.
Furthermore, a base plate of the parallel screw rod is arranged on the base, two slide rails of the parallel screw rod are arranged on the base plate, a cross beam is arranged between the two fixing plates, two slide blocks are arranged on the cross beam, and the slide blocks correspond to the slide rails one by one.
Furthermore, the number of the infrared sensors is two, and the infrared sensors are located at the same height.
According to the above technical scheme, the utility model has the advantages of it is following: the two rotating arms are arranged in parallel, and the rotating shafts of the rotating arms and the rotating table are arranged in parallel, so that the sucker can linearly move in the material box through the rotation of the two rotating arms, and wafers can be taken out or fed in. And the wafer can be inserted into any slot by matching with the lifting mechanism.
Drawings
FIG. 1 is a schematic structural diagram of the present invention
Fig. 2 is a cross-sectional view of the present invention.
Detailed Description
The following description will specifically explain embodiments of the present invention with reference to the accompanying drawings.
As shown in fig. 1 and 2, the wafer taking device of the present invention includes a multi-axis manipulator and a frame 13, the multi-axis manipulator includes two parallel rotating arms, namely a first rotating arm 9 and a second rotating arm 8, one end of the first rotating arm is mounted on the base and is rotatably disposed, the other end is connected with the end of the second rotating arm 8, the other end of the second rotating arm 8 is provided with a turntable 6, and the turntable 6 is provided with a wafer chuck 5 and an infrared sensor 7; the first rotating arm 9, the second rotating arm 8 and the rotating shaft of the rotating platform 6 are arranged in parallel; the multi-axis manipulator is arranged in a lifting mode. The quantity of infrared sensor is two, and is located same height, and infrared sensor scans the wafer of judgement magazine and whether deposited the material in every slot, sets up two infrared sensor and can reduce the erroneous judgement and miss the judgement.
In order to realize the lift of multiaxis manipulator, the utility model discloses a following structure: the multi-axis manipulator structure is characterized in that a lead screw module is arranged in the machine base, a screw rod 4 of the lead screw module is parallel to a rotating shaft of the multi-axis manipulator, a connecting plate 14 is arranged on a nut base 12 of the lead screw module, two sides of the connecting plate 14 are respectively provided with a fixing plate 15, the top of each fixing plate 15 is provided with a top plate 18, the multi-axis manipulator is installed on the top plate 18, a plurality of connecting blocks 17 are further arranged on the fixing plates 15, and the connecting blocks 17 are used for installing and driving. A base plate 11 of a parallel screw rod is arranged on a machine base, two slide rails 3 of the parallel screw rod are arranged on the base plate 11, a cross beam 2 is arranged between two fixing plates, two slide blocks 1 are arranged on the cross beam 2, and the slide blocks correspond to the slide rails one by one.
The screw rotates the reciprocating of nut seat to driving the reciprocating of connecting plate, the connecting plate drives two fixed plates and reciprocates again, and the fixed plate drives roof, connecting block and the crossbeam of being connected with it and removes, and then orders about multiaxis manipulator, motor and slider and reciprocate, and the slider plays direction, supporting role.
In addition, a cover shell 10 is arranged on the outer side of the fixing plate, and the cover shell 10 extends downwards along the side edge of the top plate, so that dust and impurities are prevented from entering the interior of the equipment.
Claims (4)
1. The utility model provides a wafer device of getting, includes multi-axis manipulator and frame, its characterized in that: the multi-axis manipulator comprises two parallel rotating arms which are respectively a first rotating arm and a second rotating arm, one end of the first rotating arm is mounted on the base and can be arranged in a rotating mode, the other end of the first rotating arm is connected with the end portion of the second rotating arm, the other end of the second rotating arm is provided with a rotating table, and a wafer sucker and an infrared sensor are arranged on the rotating table; the first rotating arm, the second rotating arm and a rotating shaft of the rotating platform are arranged in parallel; the multi-axis manipulator is arranged in a lifting mode.
2. The wafer taking device as claimed in claim 1, wherein: the multi-axis manipulator is characterized in that a lead screw module is arranged in the machine base, a screw of the lead screw module is parallel to a rotating shaft of the multi-axis manipulator, a connecting plate is arranged on a nut seat of the lead screw module, two sides of the connecting plate are respectively provided with a fixing plate, the top of the fixing plate is provided with a top plate, the multi-axis manipulator is installed on the top plate, a plurality of connecting blocks are further arranged on the fixing plate, and the connecting blocks are used for installing and driving a.
3. The wafer taking device as claimed in claim 2, wherein: the base plate is provided with a base plate of parallel screw rods, the base plate is provided with two slide rails of the parallel screw rods, a cross beam is arranged between the two fixing plates, the cross beam is provided with two slide blocks, and the slide blocks correspond to the slide rails one by one.
4. The wafer taking device as claimed in claim 1, wherein: the number of the infrared sensors is two, and the infrared sensors are located at the same height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921164447.7U CN210073799U (en) | 2019-07-23 | 2019-07-23 | Wafer taking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921164447.7U CN210073799U (en) | 2019-07-23 | 2019-07-23 | Wafer taking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210073799U true CN210073799U (en) | 2020-02-14 |
Family
ID=69429723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921164447.7U Active CN210073799U (en) | 2019-07-23 | 2019-07-23 | Wafer taking device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210073799U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992748A (en) * | 2021-02-26 | 2021-06-18 | 苏州新米特电子科技有限公司 | Full-automatic grain machine of getting of wafer |
| CN114378443A (en) * | 2021-12-30 | 2022-04-22 | 深圳泰德半导体装备有限公司 | Wafer ID marking equipment |
| CN117558668A (en) * | 2024-01-10 | 2024-02-13 | 无锡星微科技有限公司杭州分公司 | Double fork type mechanical arm for conveying wafers and conveying device |
-
2019
- 2019-07-23 CN CN201921164447.7U patent/CN210073799U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992748A (en) * | 2021-02-26 | 2021-06-18 | 苏州新米特电子科技有限公司 | Full-automatic grain machine of getting of wafer |
| CN114378443A (en) * | 2021-12-30 | 2022-04-22 | 深圳泰德半导体装备有限公司 | Wafer ID marking equipment |
| CN117558668A (en) * | 2024-01-10 | 2024-02-13 | 无锡星微科技有限公司杭州分公司 | Double fork type mechanical arm for conveying wafers and conveying device |
| CN117558668B (en) * | 2024-01-10 | 2024-04-09 | 无锡星微科技有限公司杭州分公司 | Double fork type mechanical arm for conveying wafers and conveying device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240523 Address after: 214135 417, 418, building 3 (A6), Zhongguancun Software Park, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Wuxi Qizhong Electronic Technology Co.,Ltd. Country or region after: China Address before: Room 103, Building 3, Software Park, Zhongguancun, Xinwu District, Wuxi City, Jiangsu Province, China, 214135 Patentee before: Yukai Electronic Technology Wuxi Co.,Ltd. Country or region before: China |