CN210061631U

CN210061631U - Automatic wafer separator

Info

Publication number: CN210061631U
Application number: CN201822111365.8U
Authority: CN
Inventors: 曾小毛
Original assignee: Shenzhen Great Wall Development Precision Technology Co Ltd
Current assignee: Shenzhen Great Wall Development Precision Technology Co Ltd
Priority date: 2018-12-14
Filing date: 2018-12-14
Publication date: 2020-02-14
Anticipated expiration: 2028-12-14

Abstract

The utility model relates to a hard disk substrate makes processing technology field, discloses an automatic wafer separator. The utility model discloses an automatic wafer separator is including processing fence, collection fence, the processing fence is used for placing the material of treating the burst, processing fence below is equipped with and is used for upwards propelling movement's electric jar with the material one by one, automatic wafer separator still includes first guide rail, burst subassembly and clamping component, the burst subassembly is followed first guide rail is in processing fence with slide between the collection fence, during the burst, the burst subassembly snatchs the material of top, clamping component presss from both sides the material clamp of below, so that the burst subassembly will be the material burst of top and deliver to collect the fence. The utility model discloses an automatic burst of hard disk substrate that automatic wafer separator realized, the cost of using manpower sparingly increases into production efficiency.

Description

Automatic wafer separator

Technical Field

The utility model belongs to the technical field of hard disk substrate manufacturing technology and specifically relates to an automatic wafer separator is related to.

Background

In the processing of the hard disk substrate, two square surfaces of two groups of materials are stacked in a mirror image mode, then auxiliary tools are used for pressurization and high-temperature treatment to enable the raw materials to form blocks, the treated block materials need to be separated, and at present, in the field of hard disk substrate manufacturing and processing, material separation is finished manually. Therefore, it is necessary to design an automatic sheet separator to realize automatic sheet separation of materials.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides an automatic wafer separator realizes the automatic wafer separation process of hard disk substrate.

The utility model provides a technical scheme that its technical problem adopted is: the utility model provides an automatic wafer separator, including processing fence, collection fence, the processing fence is used for placing the material of treating the burst, processing fence below is equipped with and is used for upwards propelling movement's electric jar with the material one by one, automatic wafer separator still includes first guide rail, burst subassembly and clamping component, the burst subassembly is followed first guide rail is in processing fence with slide between the collection fence, during the burst, the burst subassembly snatchs the material of top, clamping component presss from both sides the material clamp of below, so that the burst subassembly will be the material burst of top and deliver to collect the fence.

As a further improvement of the above technical solution, the first guide rail is provided with two of the slicing assemblies, the collecting column includes two material storage columns, and the two material storage columns are respectively disposed at two sides of the processing column.

As a further improvement of the above technical solution, the system further comprises a cache processing fence and a second guide rail, wherein the cache processing fence and the processing fence are slidably arranged on the second guide rail.

As a further improvement of the above technical solution, the second guide rail and the first guide rail have different sliding directions.

As a further improvement of the above technical solution, the collecting rail is disposed on a third guide rail, and the third guide rail is further provided with a cache collecting rail.

As a further improvement of the above technical solution, the third rail and the first rail have different sliding directions.

As a further improvement of the technical scheme, the slicing assembly comprises a lifting cylinder, a slicing cutter and a flexible module, wherein the movable end of the lifting cylinder is connected with the flexible module, the slicing cylinder is fixedly arranged on the flexible module, and the slicing cutter is connected with the movable end of the slicing cylinder.

As a further improvement of the above technical scheme, the clamping assembly comprises a clamping cylinder and a clamping tool connected with the movable end of the clamping cylinder, before the material is sliced by the slicing assembly, the clamping tool clamps the material below under the driving of the clamping cylinder, and when the slicing assembly finishes slicing and is sent away, the clamping tool is loosened under the driving of the clamping cylinder, so that the electric cylinder pushes the material upwards.

As a further improvement of the technical scheme, the movable end of the clamping cylinder is connected with the clamping cutter through a floating joint.

As a further improvement of the technical scheme, the device further comprises a material sensor, wherein the detection end of the material sensor points to the uppermost material and is used for detecting whether the material to be sliced exists or not.

The utility model has the advantages that:

the utility model discloses an automatic wafer separator makes progress the material that the propelling movement needs the burst one by one through the electric jar, and the burst subassembly carries out the burst to the material to transmit the good material of burst to collecting the fence and collect, during the burst, the material clamp of clamping component with the below presss from both sides tightly, with the material burst of guaranteeing that the burst subassembly will be the top. The utility model discloses an automatic burst of hard disk substrate that automatic wafer separator realized, the cost of using manpower sparingly increases into production efficiency.

Drawings

The present invention will be further explained with reference to the drawings and examples.

Fig. 1 is a schematic view of a main view structure of an automatic wafer separator according to an embodiment of the present invention;

fig. 2 is a schematic view of a depression structure of an automatic wafer separator according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a flexible module according to an embodiment of the present invention.

Detailed Description

The conception, specific structure and technical effects of the present invention will be described clearly and completely with reference to the accompanying drawings and embodiments, so as to fully understand the objects, aspects and effects of the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. Furthermore, the description of the upper, lower, left, right, front, rear, etc. used in the present invention is only relative to the mutual position relationship of the components of the present invention in the drawings.

Furthermore, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any combination of one or more of the associated listed items.

Referring to fig. 1 and 2, the utility model provides an automatic wafer separator, including processing fence 1, collection fence 2, electric jar 3, first guide rail 4, burst subassembly 5 and clamping assembly 6. Deposit the hard disk substrate material of treating the burst in processing fence 1, collect fence 2 and be used for depositing the material after the burst, electric jar 3 is used for upwards propelling movement material one by one, and burst subassembly 5 carries out the burst to the material one by one with the cooperation of clamping component 6, and burst subassembly 5 slides and deposits the material to collecting fence 2 along first guide rail 4 behind the material burst.

The processing fence 1 comprises a sleeve rod 10, materials to be sliced penetrate through the sleeve rod 10, the electric cylinder 3 is arranged below the processing fence 1, the movable end of the electric cylinder is abutted to the materials penetrating through the sleeve rod 10, and the electric cylinder 3 pushes one material upwards when working after the slicing is completed each time.

The first guide rail 4 is arranged above a straight line determined by the processing fence 1 and the collecting fence 2 in parallel, and the slicing assembly 5 is arranged on the first guide rail 4 in a sliding manner, so that the slicing assembly 5 slides between the processing fence 1 and the collecting fence 2 to finish the transmission of materials.

Preferably, the collecting column 2 comprises two parts which are respectively arranged at two sides of the processing column 1, meanwhile, the first guide rail 4 is provided with two slicing assemblies 5, when one slicing assembly 5 carries out slicing processing, the other slicing assembly 5 transmits sliced hard disk substrate materials to the corresponding collecting column 2, the slicing assembly 5 is reasonably utilized to carry out slicing and feeding conversion, and the production efficiency is accelerated.

Further, the utility model discloses an automatic wafer separator still includes buffer memory processing fence 7 and second guide rail 70, buffer memory processing fence 7 and processing fence 1 all slide and set up on second guide rail 70, second guide rail 70 has different slip directions with first guide rail 4, in operation, at first carry out the burst processing to the material in processing fence 1, and simultaneously, place the material that another part needs the burst in buffer memory processing fence 7, treat that the material processing in processing fence 1 finishes the back, slide along second guide rail 70 simultaneously with buffer memory processing fence 1 and buffer memory processing fence 7, make processing fence 1 leave the burst station, buffer memory processing fence 7 slides to burst station department, begin to process the material in buffer memory processing fence 7, and to replenishing the material in processing fence 1. Preferably, the sliding directions of the second guide rail 70 and the first guide rail 4 are perpendicular to each other.

Further, the utility model discloses an automatic wafer separator still includes that two branches locate the buffer memory of processing 1 both sides and collect fence 8 and two branches and locate the third guide rail 80 of processing 1 both sides of fence, fence 8 and two collection 8 one-to-ones of collecting are collected to two buffer memories, buffer memory is collected fence 8 and is slided with the collection fence 2 that corresponds and set up on corresponding third guide rail 80, buffer memory collection 8's theory of operation is the same with buffer memory processing fence 7, after collecting the material in fence 2 and fill up, buffer memory collection fence 8 removes to collecting station department work, at this moment, can take out the material of collecting in 2 in collecting fence in order to empty collection fence 2, treat reuse.

In this embodiment, the slicing assembly 5 includes a lifting cylinder 50, a flexible module 51, a slicing cylinder 52, and a slicing knife 53. The lifting cylinder 50 is connected with the first guide rail 4, the slicing cutter 53 is connected with the movable end of the slicing cylinder 52, the slicing cylinder 52 and the slicing cutter 53 are connected with the movable end of the lifting cylinder 50, when slicing works, the lifting cylinder 50 drives the slicing cylinder 52 and the slicing cutter 53 to move downwards to a slicing station, and then the slicing cylinder 52 drives the slicing cutter 53 to clamp materials. Because hard disk substrate material generally has certain error on the concentricity, if the tight material of clamp of burst cutter 53 rigidity carries out the burst, can lead to damaging the material, for this reason, be provided with flexible module 51 between lift cylinder 50 and burst cutter 53, when burst cutter 53 presss from both sides tight material, flexible module 51 has the activity of removal, can drive burst cutter 53 adaptation material's actual position and finely tune self position and gesture.

As shown in fig. 3, the flexible module 51 includes a fixed block 510, a rotating block 511, a first sliding plate 512, and a second sliding plate 513 in sequence from top to bottom. The fixed block 510 is fixedly connected with the lifting cylinder 50, the upper end of the rotating block 511 is spherical and is hinged with the lower end of the fixed block 510, the lower end of the rotating block 511 is provided with a first sliding groove 5110, the upper end of the first sliding plate 512 is provided with a first sliding block 5120 embedded in the first sliding groove 5110, the lower end of the first sliding plate 512 is provided with a second sliding groove, the upper end of the second sliding plate 513 is provided with a second sliding block 5130 embedded in the second sliding groove, the sliding directions of the first sliding groove 5110 and the second sliding groove are mutually perpendicular, and the slicing cylinder 50 is fixedly connected with the second sliding plate 513. During slicing, the rotation of the rotating block 511 can drive the slicing cutter 53 to rotate together, so as to adjust the posture of the slicing cutter 53 according to the deviation of the material, and the sliding of the first sliding plate 512 and the second sliding plate 513 in two directions perpendicular to each other adjusts the position of the slicing cutter 53 on the horizontal plane, so that the slicing cutter 53 is ensured not to damage the material during slicing the material.

The clamping assembly 6 comprises a clamping cylinder 60 and a clamping cutter 61, and during slicing, the clamping cutter 61 clamps the material below the material to be sliced, so that the slicing cutter 53 can slice the uppermost material. The clamping tool 61 is connected with the movable end of the clamping cylinder 60, and the clamping cylinder 60 drives the clamping tool 61 to clamp or release the material. Preferably, the movable end of the clamping cylinder 60 is connected with the clamping tool 61 through a floating joint to ensure that a certain floating amount exists between the clamping cylinder 60 and the clamping tool 61, so that the material is prevented from being damaged when the clamping tool 61 clamps the material.

Preferably, the utility model discloses an automatic wafer separator still includes detection sensor (not shown in the figure), and the directional burst position department of sense terminal that detects the sensor needs the position department of the material of burst to detect the existence of this position material.

The utility model discloses an automatic wafer separator's detailed theory of operation does: 3 upwards propelling movement materials of electricity jar, simultaneously, slicing assembly 5 removes to slicing station department, the material of the below that clamping assembly 6 will need the sliced material is tight, then slicing assembly 5 carries out the burst to the material of top, later, slicing assembly 5 takes the material after the burst to remove to collecting fence 2 and collects the material of having handled, simultaneously, clamping assembly 6 loosens the clamp tight to the material, electricity jar 3 continues the upwards propelling movement material, and begin the burst of next material.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. The utility model provides an automatic wafer separator, a serial communication port, including processing fence, collection fence, the processing fence is used for placing the material of treating the burst, processing fence below is equipped with and is used for the electric jar of material propelling movement one by one, automatic wafer separator still includes first guide rail, burst subassembly and clamping component, the burst subassembly is followed first guide rail is in processing fence with slide between the collection fence, during the burst, the burst subassembly snatchs the material of top, clamping component presss from both sides the material clamp of below, so that the burst subassembly will be topmost the material burst and deliver to the collection fence.

2. The automatic wafer separator according to claim 1, wherein two said wafer separating assemblies are disposed on said first guide rail, said collecting column comprises two material storage columns, and said two material storage columns are disposed on two sides of said processing column.

3. The automatic wafer separator according to claim 2, further comprising a buffer machining column and a second guide rail, wherein the buffer machining column and the machining column are slidably disposed on the second guide rail.

4. The automatic wafer separator of claim 3 wherein the second guide rail has a different sliding direction than the first guide rail.

5. The automatic wafer separator according to claim 2, wherein said collection column is disposed on a third guide rail, said third guide rail further having a buffer collection column disposed thereon.

6. The automatic wafer separator of claim 5 wherein the third rail has a different sliding direction than the first rail.

7. The automatic wafer separator according to any one of claims 1-6, wherein the wafer separating assembly comprises a lifting cylinder, a wafer separating cutter and a flexible module, wherein the flexible module is connected to a movable end of the lifting cylinder, the wafer separating cylinder is fixedly arranged on the flexible module, and the wafer separating cutter is connected to a movable end of the wafer separating cylinder.

8. The automatic wafer separator according to any one of claims 1-6, wherein the clamping assembly comprises a clamping cylinder and a clamping knife connected with a movable end of the clamping cylinder, the clamping knife is driven by the clamping cylinder to clamp the material below before the wafer separation assembly separates the material, and the clamping knife is driven by the clamping cylinder to release when the wafer separation assembly completes the wafer separation and is conveyed away, so that the electric cylinder pushes the material upwards.

9. The automatic wafer separator of claim 8 wherein the free end of the clamp cylinder is connected to the clamp knife by a floating joint.

10. The automatic wafer separator according to claim 1, further comprising a material sensor, wherein a detecting end of the material sensor points to the uppermost material for detecting the presence of the material to be separated.