CN209766425U - 一种带有过压斩波特性的可控硅芯片 - Google Patents
一种带有过压斩波特性的可控硅芯片 Download PDFInfo
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- CN209766425U CN209766425U CN201920529757.8U CN201920529757U CN209766425U CN 209766425 U CN209766425 U CN 209766425U CN 201920529757 U CN201920529757 U CN 201920529757U CN 209766425 U CN209766425 U CN 209766425U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 48
- 239000010703 silicon Substances 0.000 title claims abstract description 48
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 28
- 239000011574 phosphorus Substances 0.000 claims abstract description 28
- 238000009792 diffusion process Methods 0.000 claims description 43
- 230000002457 bidirectional effect Effects 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 7
- 238000005192 partition Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000002161 passivation Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000001052 transient effect Effects 0.000 abstract 1
- 238000001259 photo etching Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 7
- 229910052796 boron Inorganic materials 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 238000002513 implantation Methods 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QQMBHAVGDGCSGY-UHFFFAOYSA-N [Ti].[Ni].[Ag] Chemical compound [Ti].[Ni].[Ag] QQMBHAVGDGCSGY-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000004857 zone melting Methods 0.000 description 1
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920529757.8U CN209766425U (zh) | 2019-04-18 | 2019-04-18 | 一种带有过压斩波特性的可控硅芯片 |
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CN201920529757.8U CN209766425U (zh) | 2019-04-18 | 2019-04-18 | 一种带有过压斩波特性的可控硅芯片 |
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CN209766425U true CN209766425U (zh) | 2019-12-10 |
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CN201920529757.8U Withdrawn - After Issue CN209766425U (zh) | 2019-04-18 | 2019-04-18 | 一种带有过压斩波特性的可控硅芯片 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110071171A (zh) * | 2019-04-18 | 2019-07-30 | 江苏捷捷微电子股份有限公司 | 一种带有过压斩波特性的可控硅芯片及其制备方法 |
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2019
- 2019-04-18 CN CN201920529757.8U patent/CN209766425U/zh not_active Withdrawn - After Issue
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110071171A (zh) * | 2019-04-18 | 2019-07-30 | 江苏捷捷微电子股份有限公司 | 一种带有过压斩波特性的可控硅芯片及其制备方法 |
CN110071171B (zh) * | 2019-04-18 | 2024-04-16 | 江苏捷捷微电子股份有限公司 | 一种带有过压斩波特性的可控硅芯片及其制备方法 |
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Address after: No.3000 Qiantangjiang Road, Qidong Economic Development Zone, Nantong City, Jiangsu Province Patentee after: JIANGSU JIEJIE MICROELECTRONICS Co.,Ltd. Address before: 226200, No. 8, Xinglong Road, Qidong science and Technology Pioneer Park, Nantong, Jiangsu Patentee before: JIANGSU JIEJIE MICROELECTRONICS Co.,Ltd. |
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AV01 | Patent right actively abandoned | ||
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AV01 | Patent right actively abandoned |
Granted publication date: 20191210 Effective date of abandoning: 20240416 |
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AV01 | Patent right actively abandoned |
Granted publication date: 20191210 Effective date of abandoning: 20240416 |