CN209766404U - Demetalization ceramic substrate with capillary micro-groove structure - Google Patents
Demetalization ceramic substrate with capillary micro-groove structure Download PDFInfo
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- CN209766404U CN209766404U CN201920620193.9U CN201920620193U CN209766404U CN 209766404 U CN209766404 U CN 209766404U CN 201920620193 U CN201920620193 U CN 201920620193U CN 209766404 U CN209766404 U CN 209766404U
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- ceramic substrate
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Abstract
The utility model discloses a demetalization ceramic substrate with surperficial capillary microgroove structure. Two capillary microgrooves which are not communicated are carved on the two side surfaces and the upper surface of the ceramic substrate and are used for driving solder to rise, and the chip is electrically connected with the printed circuit board. The utility model provides a pair of demetalization ceramic substrate with surperficial capillary microgroove structure, its structural design is simple reasonable, compares in traditional low temperature co-fired ceramic substrate and the more extensive direct copper facing ceramic substrate of present application, removes the photoetching from and covers the technology of copper and metallization via hole, has reduced the complexity of whole manufacturing process to the cost is reduced.
Description
Technical Field
The utility model belongs to the technical field of the microelectronic packaging, in particular to demetallization ceramic substrate with capillary microgroove structure.
Background
The ceramic substrate is a sheet material which takes electronic ceramics as a substrate and forms a supporting base for the membrane circuit element and the external attaching and cutting element. The high-temperature-resistant high-temperature.
The ceramic substrate serving as the substrate of the led chip belongs to a medium for guiding heat energy between the led chip and the system circuit board, and is combined with the led chip by eutectic crystals or flip chips, and the ceramic substrate plays a role in supporting and protecting the chip. In order to ensure the stable heat dissipation of the LED and the luminous efficiency of the LED, the heat dissipation ceramic substrate on the market mainly includes the following four types: low temperature co-fired ceramic (LTCC), high temperature co-fired ceramic (HTCC), direct bonded copper substrate (DBC), direct copper plated substrate (DPC). However, the existing ceramic substrate can not avoid the metallization process in the production process, and particularly when a flip chip is adopted, the upper surface (the surface for placing the chip) of the ceramic substrate needs to be coated with copper, the lower surface needs to be coated with an electrode, and meanwhile, a metallized through hole is needed. This results in a complicated and costly production process of such ceramic substrates.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a demetallized ceramic substrate with a capillary micro-groove structure.
To the problem, the utility model provides a demetallization ceramic substrate and welding method with surperficial capillary microstructure, it has structure, simple process to can provide advantages such as reliable electrical connection for chip and printed circuit board.
The purpose of the utility model is realized through one of following technical scheme at least.
The utility model provides a demetallized ceramic substrate with a surface capillary micro-groove structure, which comprises a ceramic substrate main body and a surface capillary micro-structure; the surface capillary microstructure is a capillary micro-groove.
Furthermore, the surface capillary microstructure is two bilaterally symmetrical capillary microgrooves which are respectively arranged on two sides of the ceramic substrate main body and are not communicated; the capillary micro-groove is formed by etching the ceramic substrate body inwards from the upper surface and the side surface.
Further, the shape of the capillary micro-groove includes a rectangular micro-groove, a zigzag micro-groove and a circular micro-groove, but is not limited to the above.
Furthermore, the capillary microgrooves are prepared by laser processing, photoetching and chemical etching.
further, the average width of the capillary micro grooves is 10-100 μm, and the average groove depth is 10-100 μm, so that the required force for capillary driving the solder can be met by forming a small enough linear degree.
The ceramic substrate (1) is formed by sintering Al 2 O 3, BeO or AlN at a high temperature.
Preferably, the ceramic substrate main body is prepared by adopting a ceramic chip sintering method, and the sintering temperature is 850-1900 ℃; the method for forming the ceramic substrate comprises powder pressing, tape casting and rolling.
The utility model provides a pair of demetalization ceramic substrate's welding method with surperficial capillary microgroove structure, including following step:
(1) Fixing (die bonding) a chip (3) on the upper surface of the demetallized ceramic substrate with the surface capillary micro-groove structure;
(2) Fixing the ceramic substrate with the chip on a printed circuit board (4) with a bonding pad at a proper position;
(3) Molten solder (6) is placed on the bonding pad (5), and capillary force is utilized to drive the solder to rise from the lower bonding pad to the chip electrode, so that the chip is electrically connected with the printed circuit board.
Further, the fixing mode in the step (1) comprises fixing by using insulating glue.
Further, the fixing mode in the step (2) includes fixing by using an insulating adhesive or mechanically clamping.
Further, the molten solder in the step (3) comprises a gold-tin eutectic solder, the melting point of the gold-tin eutectic solder is 217-230 ℃, and the gold content is 10 wt% -15 wt%; the welding mode comprises reflow welding, the power of the reflow welding equipment is 11-15kw, the length of a heating zone is 1000-2000mm, and the heating temperature is 220-240 ℃.
Compared with the prior art, the utility model has the advantages of as follows and beneficial effect:
(1) The utility model provides a demetalization ceramic substrate with surperficial capillary microgroove structure, ceramic substrate structure and manufacturing process are simple, thereby saved and covered the production degree of difficulty that technology such as copper photoetching, coating by vaporization electrode greatly reduced metallized ceramic substrate in the past, are applicable to mass production.
(2) The utility model provides a demetalization ceramic substrate's welding method with surperficial capillary micro-groove structure utilizes reflow soldering's method to make gold tin eutectic solder rise under the capillary force drive, has reduced the welding degree of difficulty of metallization ceramic substrate in the past, has simplified process flow greatly, and furthest has reduced manufacturing cost when guaranteeing reliable connection.
Drawings
FIG. 1 is a schematic view of a rectangular capillary microstructure demetallized ceramic substrate (demetallized ceramic substrate with surface capillary micro-groove structure);
FIG. 2 is a schematic view of a demetallized ceramic substrate with a rectangular capillary micro-groove structure holding a led chip;
FIG. 3 is a schematic view of a demetallized ceramic substrate having a rectangular capillary micro-groove structure soldered to a printed circuit board;
FIG. 4 is a cross-sectional view of a demetallized ceramic substrate having a rectangular capillary micro-groove structure soldered to a printed circuit board;
Wherein, 1 is a ceramic substrate main body; 2 is a surface capillary microstructure; 3 is a chip; 4, a printed circuit board; 5 is a bonding pad; and 6, molten solder.
Detailed Description
The following description of the present invention will be made with reference to the accompanying drawings and examples, but the present invention is not limited thereto. It is noted that the processes described below, if not specifically described in detail, are all realizable or understandable by those skilled in the art with reference to the prior art. The reagents or apparatus used are not indicated to the manufacturer, and are considered to be conventional products available by commercial purchase.
Example 1
a demetallized ceramic substrate with a surface capillary micro-groove structure comprises a ceramic substrate main body 1 and a surface capillary micro-structure 2; the surface capillary microstructures 2 are arranged on two sides of the ceramic substrate main body 1, the surface capillary microstructures are capillary micro grooves, and the structure of the demetallized ceramic substrate with the surface capillary micro groove structure can be referred to fig. 1.
The surface capillary microstructure is two bilaterally symmetrical capillary micro grooves, the two capillary micro grooves are respectively arranged on two sides of the ceramic substrate main body, and the two capillary micro grooves are not communicated; the capillary micro-groove is formed by etching the ceramic substrate body inwards from the upper surface and the side surface. The capillary micro-groove comprises a rectangular micro-groove, a sawtooth-shaped micro-groove and a circular micro-groove.
The ceramic substrate body is made of AlN, and the AlN material is sintered at 1500 ℃. And then coating two strips of photoresist which are not in contact with each other on the upper surface and two side surfaces of the sintered ceramic substrate main body according to the shape and the position of the chip electrode, wherein the interval distance is 25 mu m, the thickness of the photoresist is 2 mu m, and carrying out exposure and development by utilizing ultraviolet light to obtain a rectangular capillary micro-groove with the width of 10 mu m and the length of 10 mu m, thereby obtaining the demetallized ceramic substrate with the surface capillary micro-groove structure.
A method for welding a demetallized ceramic substrate with a surface capillary micro-groove structure comprises the following steps:
(1) fixing a chip 3 on the upper surface of the demetallized ceramic substrate with the surface capillary micro-groove structure (fixed by using DX-20 insulating glue), as shown in FIG. 2;
(2) The ceramic substrate with the chip is fixed on a printed circuit board 4 with a pad (fixed by using an insulation paste of DX-20 type), as shown in FIG. 3;
(3) And placing molten solder 6 on the bonding pad 5, driving the solder to flow from a lower bonding pad to a chip electrode by utilizing capillary force, placing gold-tin eutectic solder with the melting point of 217 ℃ on the printed circuit board by adopting a reflow soldering device of 11kw, heating to 230 ℃ within 3s to melt the solder, and driving the solder to flow to the chip electrode by utilizing the capillary force to realize the electrical connection between the chip and the printed circuit board, thereby completing the soldering process.
Example 1 a layer of solder is applied to the pads of the lower printed circuit board, and a reflow soldering method is used to make the molten solder drop flow to the led chip electrodes and connect with the led chip electrodes under the driving of capillary force, so as to form the demetallized ceramic substrate which has the function of protecting heat dissipation and can provide reliable electrical connection, as shown in fig. 4. The welding strength is tested to meet the normal use requirement of the LED lamp, the production time of the whole production flow is less than 1min on the premise of ensuring reliable electrical performance, the production time is greatly reduced, and the production cost is saved.
The above embodiments are only preferred embodiments of the present invention, and are not intended to limit the present invention, and the changes, replacements, modifications, etc. made by those skilled in the art without departing from the spirit of the present invention should belong to the protection scope of the present invention.
Claims (7)
1. A demetallized ceramic substrate with a surface capillary micro-groove structure is characterized by comprising a ceramic substrate main body and a surface capillary micro-structure; the surface capillary microstructures are arranged on two sides of the ceramic substrate main body, and are capillary microgrooves.
2. The demetallized ceramic substrate with the surface capillary micro-groove structure as claimed in claim 1, wherein the surface capillary micro-structure is two mirror symmetric capillary micro-grooves, the two capillary micro-grooves are respectively disposed on two sides of the ceramic substrate body, and the two capillary micro-grooves are not communicated.
3. The demetallized ceramic substrate of claim 2, wherein the capillary microchannels are etched inward from the top surface and sides of the ceramic substrate body.
4. The demetallized ceramic substrate of claim 1, wherein the capillary microchannels comprise rectangular microchannels, saw tooth microchannels and circular microchannels.
5. the demetallized ceramic substrate of claim 1, wherein the capillary microchannels are formed by laser machining, photolithography or chemical etching.
6. the demetallized ceramic substrate of claim 1, wherein the capillary microchannels have an average width of 10 μ ι η to 100 μ ι η and an average depth of 10 μ ι η to 100 μ ι η.
7. The demetallized ceramic substrate of claim 1, wherein the material of the ceramic substrate body is Al 2 O 3, BeO or AlN.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920620193.9U CN209766404U (en) | 2019-04-30 | 2019-04-30 | Demetalization ceramic substrate with capillary micro-groove structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920620193.9U CN209766404U (en) | 2019-04-30 | 2019-04-30 | Demetalization ceramic substrate with capillary micro-groove structure |
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| Publication Number | Publication Date |
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| CN209766404U true CN209766404U (en) | 2019-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920620193.9U Expired - Fee Related CN209766404U (en) | 2019-04-30 | 2019-04-30 | Demetalization ceramic substrate with capillary micro-groove structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137141A (en) * | 2019-04-30 | 2019-08-16 | 华南理工大学 | A kind of metallization removal ceramic substrate and its welding method with capillary slot structure |
-
2019
- 2019-04-30 CN CN201920620193.9U patent/CN209766404U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137141A (en) * | 2019-04-30 | 2019-08-16 | 华南理工大学 | A kind of metallization removal ceramic substrate and its welding method with capillary slot structure |
| WO2020220643A1 (en) * | 2019-04-30 | 2020-11-05 | 华南理工大学 | Demetallized ceramic substrate having capillary microgroove structure and welding method therefor |
| US12009270B2 (en) | 2019-04-30 | 2024-06-11 | South China University Of Technology | Welding method of demetallized ceramic substrate having surface capillary microgroove structure |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191210 Termination date: 20200430 |