CN115799211A - High-welding-strength ceramic-coated metal plate, preparation method and chip packaging module - Google Patents
High-welding-strength ceramic-coated metal plate, preparation method and chip packaging module Download PDFInfo
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Abstract
The invention discloses a high-welding-strength ceramic-coated metal plate which comprises a ceramic insulating layer, a metal layer and a solder layer, wherein a groove is formed in one surface of the ceramic insulating layer, which is close to the metal layer, the width of the solder layer is larger than that of the groove, and the width central line of the solder layer is superposed with the width central line of the groove and the width central line of a metal circuit layer left after the metal layer is etched. Through arranging the solder layer in the ceramic insulation layer groove and forming the T-shaped solder layer at the two ends of the groove, the surface connection of the solder layer and the ceramic insulation layer is realized, the ceramic layer is connected with the metal layer in the thickness direction in the groove through the solder layer, the welding connection area is increased, and the welding strength is improved. Further, the ratio of the thickness of the solder layer to the depth of the groove is limited to be 1.02-1.15, so that the downward tensile stress can be formed on the metal layer in the welding process, the welding strength is improved, and the problem that the welded metal layer is not flat can be solved.
Description
Technical Field
The invention relates to the technical field of metal-clad plates, in particular to a high-welding-strength ceramic metal-clad plate, a preparation method and a chip packaging module.
Background
With the rise of packaging of power electronic devices such as IGBTs, metal-clad plates used for packaging the power electronic devices have been raised. The ceramic-coated metal is composed of a ceramic base material, a bonding adhesive layer and a conductive metal layer, and is characterized in that a metal foil is welded on a ceramic substrate such as alumina and the like in a direct bonding mode at high temperature or an active metal brazing mode, so that the manufactured ultrathin composite substrate has the advantages of high heat conduction property, high adhesion strength, excellent solderability and excellent electric insulation performance, and is a basic material of the interconnection technology and the structure technology of high-power electronic circuits such as IGBT and the like.
Because the bonding adhesive layer adopts active metals such as titanium, silver, bak, gold and the like, the existing etching process is difficult to etch the active metals completely, so that the active metals such as titanium, silver, bak, gold and the like remain, the risks of circuit coupling and circuit breaking exist, the line width and the line distance are inaccurate, the problems of uneven line resistance, short circuit or circuit breaking and the like exist, and the requirement for preparing a high-precision power packaging module is difficult to meet.
Therefore, a technical scheme is needed to solve the technical problem that the existing etching process cannot etch the active metal completely, so that the high-precision power packaging module is difficult to prepare.
Disclosure of Invention
In view of the above, the present invention provides a high welding strength ceramic-coated metal plate, which includes a ceramic insulation layer, a metal layer and a solder layer, wherein a groove is formed on a surface of the ceramic insulation layer adjacent to the metal layer, a width of the solder layer is greater than a width of the groove, and a central line of the width of the solder layer coincides with a central line of a width of a metal line layer remaining after the metal layer is etched and a central line of the width of the groove.
Preferably, the ratio of the width of the solder layer/the width of the groove ranges from: the width of the solder layer/the width of the groove is more than or equal to 1.05 and less than or equal to 2.5.
Preferably, the ratio range of the width of the solder layer/the line width of the metal circuit layer is: the width of the solder layer/the line width of the metal circuit layer is not less than 0.98 and not more than 0.85.
Preferably, the ratio of the thickness of the solder layer/the depth of the groove ranges from: the thickness of the solder layer/the depth of the groove is more than or equal to 1.02 and less than or equal to 1.15.
Preferably, the metal layer is one of a copper layer or an aluminum layer, and the ceramic insulating layer is one of an aluminum oxide layer, an aluminum nitride layer and a silicon nitride layer; the solder layer is one of Ti-Ag, ti-Ag-Cu-Zn and Au-Ag-Ge.
Preferably, the depth of the groove is more than or equal to 0.015mm and less than or equal to 0.05mm, the width of the groove is more than or equal to 0.1mm and less than or equal to 3.5mm, and the cross section of the width of the groove is in one of an inverted triangle shape, a square shape and a U shape.
Preferably, the thickness of the metal layer is 0.1mm to 2.2mm, and the thickness of the ceramic insulating layer is 0.3mm to 3.0mm.
Preferably, the cross-sectional shape of the groove width is an inverted triangle.
The invention also aims to disclose a preparation method of the ceramic-coated metal plate with high welding strength, which comprises the following steps:
s1, carving a groove with a pattern consistent with a circuit pattern formed by etching a metal layer on one surface of a ceramic insulating layer, which is close to the metal layer;
s2, printing an active metal bonding layer with a pattern consistent with a circuit pattern formed by etching the metal layer on the ceramic insulating layer along the central line direction of the groove;
and S3, welding the ceramic insulating layer containing the active metal bonding layer obtained in the step S2 with the metal layer at high temperature to obtain a solder layer, and realizing the welding connection of the active metal bonding layer and the metal layer through the solder layer to obtain the high-welding-strength ceramic-coated metal plate comprising the ceramic insulating layer, the metal layer and the solder layer.
The invention also aims to disclose a chip packaging module, which is packaged on a circuit layer and prepared by using the high-welding-strength ceramic-coated metal plate.
The invention has the beneficial effects that: the invention discloses a high-welding-strength ceramic-coated metal plate which comprises a ceramic insulating layer, a metal layer and a solder layer, wherein a groove is formed in one surface of the ceramic insulating layer, which is close to the metal layer, the width of the solder layer is larger than that of the groove, and the width central line of the solder layer is superposed with the width central line of the groove and the width central line of a metal circuit layer left after the metal layer is etched. Through arranging the solder layer in the ceramic insulation layer groove and forming the T-shaped solder layer at the two ends of the groove, the surface connection of the solder layer and the ceramic insulation layer is realized, the ceramic layer is connected with the metal layer in the thickness direction in the groove through the solder layer, the welding connection area is increased, and the welding strength is improved. The further ratio of the thickness of the solder layer to the depth of the groove is 1.02 to 1.15, so that a downward tensile stress is formed on the metal layer due to the fact that the melting volume of the active metal is reduced and collapsed in the welding process, the welding strength of the metal layer and the ceramic insulating layer is improved, the problem that the welded metal layer surface is not flat due to the fact that the ceramic insulating layer is covered with the active metal bonding layer and the active metal bonding layer is not covered with the ceramic insulating layer is solved, meanwhile, the further groove width cross section is in an inverted triangle shape, and the problem that the strength of the ceramic plate is reduced due to the fact that the groove exists is solved.
Drawings
FIG. 1 is a flow chart of a process for manufacturing a ceramic-coated metal plate with high etching precision;
FIG. 2 is a schematic diagram of a structure of a ceramic insulating layer after grooves are etched;
FIG. 3 is a schematic diagram of a structure of a high etching precision ceramic-coated metal plate after etching.
Detailed Description
The present application will be described in further detail with reference to the following drawings and detailed description. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
Referring to FIG. 1~3, FIG. 1 is a flow chart of a process for manufacturing a ceramic-coated metal plate with high etching precision; FIG. 2 is a schematic structural diagram of the ceramic insulating layer after the groove is etched; fig. 3 is a schematic structural diagram of the etched ceramic-coated metal plate with high etching precision, fig. 2 shows a ceramic layer a1 and a groove a2, and fig. 3 shows a ceramic layer a1 and a circuit layer b2. As shown in fig. 1~3:
the embodiment provides a high welding strength pottery covers metal sheet, and this high welding strength pottery covers metal sheet includes ceramic insulating layer, metal level and solder layer, and wherein ceramic insulating layer is close to metal level one side fluted, and the width on solder layer is greater than the recess width, and remaining metal line layer line width midline and recess width midline coincidence after solder layer width midline and metal level are etched. Through arranging the solder layer in the ceramic insulation layer groove and forming the T-shaped solder layer at the two ends of the groove, the height of the solder layer is higher than the depth of the groove, so that the surface connection of the solder layer and the ceramic insulation layer is realized, the solder layer is connected with the solder layer in the groove in the thickness direction, the welding connection area is increased, and the welding strength is improved. Further in this embodiment, the solder layer thickness/groove depth satisfies: the thickness of the solder layer/the depth of the groove is more than or equal to 1.02 and less than or equal to 1.15. The thickness of the solder layer formed by the reduction and collapse of the melting volume of the active metal after welding is limited within the range, the downward tensile stress is formed on the metal layer, the welding strength of the metal layer and the ceramic insulating layer is improved, the height difference of the active metal bonding layer covered on the ceramic insulating layer and the active metal bonding layer not covered on the ceramic insulating layer is guaranteed to be solved, and the problem that the welded metal layer is not flat can be reduced to the maximum extent.
In this embodiment, in order to further improve the soldering strength and reduce the problem of incomplete etching caused by too wide soldering layer, the ratio of the width of the solder layer to the width of the groove is defined as: the width of the solder layer/the width of the groove is more than or equal to 1.05 and less than or equal to 2.5. The ratio range of the width of the solder layer/the line width of the metal circuit layer is as follows: the width of the solder layer/the line width of the metal circuit layer is not less than 0.98 and not more than 0.85. Through the width of further injecing solder layer, recess width, the line width on metal line layer, and three width size becomes the progressive relation, has not only guaranteed "T style of calligraphy" welding, and the width on solder layer is less than the line width on metal line layer, guarantees that the circuit sculpture is clean, does not have risks such as short circuit, open circuit to the current etching technique has been solved and has been difficult to the clean technical problem of active metal sculpture.
In the present embodiment, any one of the metal layers, the copper layer or the aluminum layer, which is a simple substance of the metal or an alloy thereof, is preferably used as the metal layer. In the present embodiment, the ceramic compound layer, which is common to ceramic insulating layers, or the metal composite ceramic insulating layer, for example, an aluminum oxide ceramic insulating layer obtained by coating or oxidizing the surface of an aluminum substrate, in the present embodiment, a preferred ceramic insulating layer is one of an aluminum oxide layer, an aluminum nitride layer, and a silicon nitride layer, and the ceramic insulating layer to be described is a ceramic insulating layer formed by one simple substance of the aluminum oxide layer, the aluminum nitride layer, and the silicon nitride layer, or a mixed ceramic formed by one of them as a main component, and other low-melting-point sintering aid or other ceramic components. In this embodiment, the solder layer is one of Ti-Ag, ti-Ag-Cu-Zn, and Au-Ag-Ge.
In the present embodiment, it is preferable that the groove depth is 0.015mm or less and 0.05m or less, the groove width is 0.1mm or less and 3.5mm or less, the cross-sectional shape of the groove width is one of an inverted triangle, a square and a U, and the opening directions of the inverted triangle and the U face the solder layer in the present embodiment. Preferably, the thickness of the metal layer is 0.1mm to 2.2mm, and the thickness of the ceramic insulating layer is 0.3mm to 3.0mm. Preferably, the groove width cross-sectional shape is an inverted triangle.
The embodiment also provides a preparation method of the ceramic-coated metal plate with high welding strength, which comprises the following steps: s1, carving a groove (t 1) on one surface, close to a metal layer (b 1), of a ceramic insulating layer (a 1); s2, printing an active metal bonding layer with a pattern consistent with a circuit pattern formed by etching the metal layer on the ceramic insulating layer; and S3, welding the ceramic insulating layer containing the active metal bonding layer obtained in the step S2 and the metal layer at a high temperature to obtain a solder layer, and realizing the welding connection of the active metal bonding layer and the metal layer through the solder layer to obtain the ceramic-coated metal plate with high welding strength, which comprises the ceramic insulating layer, the metal layer and the solder layer. The embodiment also provides a chip packaging module, which is packaged on a circuit layer quickly and prepared by using the high-welding-strength ceramic-coated metal plate.
The specific embodiment is as follows:
example 1
The alumina ceramic with the size of 100 multiplied by 0.63mm is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ after being sequentially washed by sodium hydroxide solution, diluted hydrochloric acid and alcohol. The copper foil with the thickness of 100 multiplied by 0.3mm is washed by dilute hydrochloric acid and alcohol in sequence, and then is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby. Printing an Ag71Cu26Ti3 solder layer with the shape consistent with that of a subsequent copper foil circuit on the alumina ceramic by a screen printing process, wherein the printing thickness is 0.025mm, the printing width is 4.08mm, and then drying at 105 ℃ for 2-6 h for later use. After the printed ceramic plate is attached to the copper foil, a uniform weight of 100 multiplied by 100mm is pressed on the surface of the printed ceramic plate, the temperature is raised to 825 ℃ in a vacuum furnace at 5 ℃, and then the ceramic plate is cooled along with the furnace for 10min to obtain the ceramic copper-clad plate.
The thickness of a printed part is measured to be 0.945mm by adopting a spiral micrometer, namely the thickness of a solder layer is 0.017mm, a conductive layer and a ceramic insulating layer are adhered by adopting a 3M adhesive tape, the tensile force test is carried out, the line peeling strength is 10.5N/mm, the width of the solder layer obtained after a metal layer is peeled is 3.68mm, the ceramic copper-clad plate is subjected to the traditional etching process, the circuit board with the line width of 3.76mm and the line distance of 1mm is obtained by etching after mask exposure, and no metal points or metal lines and other residues exist.
Example 2
The whole surface of the alumina ceramic is printed with an Ag71Cu26Ti3 solder layer with the printing thickness of 0.025mm, and other processes are the same as those in the embodiment 1.
The method is characterized in that a 3M adhesive tape is adopted to bond a conductive layer and a ceramic insulating layer for tension test, the peeling strength of a circuit is 13.8N/mm, the ceramic copper-clad plate is subjected to a traditional etching process, the exposed mask is etched to obtain a circuit board with a line width of 3.76mm and a line distance of 1mm, the active solder layer is difficult to etch completely, metal points and the like are obviously remained between lines, the adhesion outage risk is easily caused, and the breakdown field intensity is also obviously reduced.
Example 3
The alumina ceramic with the size of 100 multiplied by 0.63mm is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ after being sequentially washed by sodium hydroxide solution, diluted hydrochloric acid and alcohol. The copper foil with the thickness of 100 multiplied by 0.3mm is washed by dilute hydrochloric acid and alcohol, and then is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby.
Etching and etching the surface of an alumina ceramic insulating layer by laser to obtain a groove with the width of 3.5mm and the depth of 0.015mm, printing an Ag71Cu26Ti3 solder layer with the width of 4.08mm and the thickness of 0.025mm along the central line in the groove by a screen printing process, drying at 105 ℃ for 2 to 6 hours for later use, pressing a 100 x 100mm uniform weight on the surface of the printed ceramic plate and a copper foil after the printed ceramic plate is attached to the copper foil, heating to 825 ℃ at 5 ℃ in a vacuum furnace, preserving heat for 10min, and cooling in the furnace to obtain the ceramic copper-clad plate.
The thickness of a printed part is measured to be 0.932mm by adopting a micrometer screw gauge, the depth of a groove is 0.015mm, namely the thickness of a solder layer is 0.017mm, a 3M adhesive tape is adopted to paste a conductive layer and a ceramic insulating layer for tensile test, the line peeling strength is 16.3N/mm, the width of the solder layer obtained after a metal layer is peeled is 3.68mm, the ceramic copper-clad plate is subjected to a traditional etching process, the line width is obtained by etching after mask exposure to be 3.76mm, the line distance is 1mm, and no metal points or metal lines and other residues exist. Compared with the embodiment 1, the contact area between the welding layer and the ceramic insulating layer is increased due to the existence of the groove, so that the line peeling strength is greatly improved, and compared with the embodiment 2, the problem that the active metal is difficult to etch is solved by not printing the welding layer on the non-circuit layer.
Example 4
The alumina ceramic with the size of 100 multiplied by 0.63mm is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ after being sequentially washed by sodium hydroxide solution, diluted hydrochloric acid and alcohol. The copper foil with the thickness of 100 multiplied by 0.3mm is washed by dilute hydrochloric acid and alcohol, and then is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby.
Etching and etching the surface of an alumina ceramic insulating layer by laser to obtain a groove with the width of 0.1mm and the depth of 0.05mm, printing an Ag71Cu26Ti3 brazing filler metal layer with the width of 0.278mm and the thickness of 0.073mm along the central line in the groove by a screen printing process, drying at 105 ℃ for 2 to 6 hours, pressing a 100 x 100mm uniform weight on the surface of the ceramic plate after being attached to a copper foil, heating to 825 ℃ at 5 ℃ in a vacuum furnace, keeping the temperature for 10min, and cooling in the furnace to obtain the ceramic copper-clad plate.
The thickness of a printed part is measured to be 0.981mm by adopting a micrometer screw gauge, the depth of a groove is 0.05mm, namely the thickness of a solder layer is 0.051mm, 3M adhesive tape is adopted for pasting a conductive layer and a ceramic insulating layer for tensile test, the line peeling strength is 15.5N/mm, the width of the solder layer obtained after a metal layer is peeled is 0.25mm, the ceramic copper-clad plate is subjected to the traditional etching process, the line width is obtained by etching after mask exposure, the line spacing is 1mm, and no metal points or metal lines and other residues exist.
Example 5
The alumina ceramic with the size of 100 multiplied by 0.63mm is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ after being sequentially washed by sodium hydroxide solution, diluted hydrochloric acid and alcohol. The copper foil with the thickness of 100 multiplied by 0.3mm is washed by dilute hydrochloric acid and alcohol, and then is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby.
Etching and etching the surface of an alumina ceramic insulating layer by laser to obtain a groove with the width of 3mm and the depth of 0.04mm, printing an Ag71Cu26Ti3 solder layer with the width of 6.67m and the thickness of 0.031mm along the central line in the groove by a screen printing process, drying at 105 ℃ for 2-6 h for later use, pressing a 100 x 100mm uniform weight on the surface after the printed ceramic plate is attached to a copper foil, heating to 825 ℃ at 5 ℃ in a vacuum furnace, preserving heat for 10min, and cooling along with the furnace to obtain the ceramic copper-clad plate.
The thickness of a printed part is measured to be 0.974mm by adopting a micrometer screw gauge, the depth of a groove is 0.04mm, namely the thickness of a solder layer is 0.044mm, a 3M adhesive tape is adopted for pasting a conductive layer and a ceramic insulating layer for tensile test, the line peeling strength is 18.9N/mm, the width of the solder layer obtained after a metal layer is peeled is 6mm, the ceramic copper-clad plate is subjected to a traditional etching process, the line width is 6.6mm after the ceramic copper-clad plate is exposed through a mask, a circuit board with the line distance of 1mm is obtained, and no metal points or metal lines and the like are left.
Example 6
The alumina ceramic with the size of 100 multiplied by 3mm is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ after being sequentially washed by sodium hydroxide solution, diluted hydrochloric acid and alcohol. The copper foil with the thickness of 100 multiplied by 2.2mm is washed by dilute hydrochloric acid and alcohol, and then is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby.
Etching and etching the surface of an alumina ceramic insulating layer by laser to obtain a groove with the width of 3mm and the depth of 0.04mm, printing an Ag71Cu26Ti3 solder layer with the width of 6.67m and the thickness of 0.031mm along the central line in the groove by a screen printing process, drying at 105 ℃ for 2-6 h for later use, pressing a 100 x 100mm uniform weight on the surface after the printed ceramic plate is attached to a copper foil, heating to 825 ℃ at 5 ℃ in a vacuum furnace, preserving heat for 10min, and cooling along with the furnace to obtain the ceramic copper-clad plate.
The thickness of a printed part is 5.244mm measured by a spiral micrometer, the depth of a groove is 0.04mm, namely the thickness of a solder layer is 0.044mm, a conductive layer and a ceramic insulating layer are adhered by a 3M adhesive tape, tension test is carried out, the line peeling strength is 19.1N/mm, the width of the solder layer obtained after a metal layer is peeled is 6mm, the ceramic copper clad laminate is subjected to a traditional etching process, the circuit board with the line width of 6.6mm and the line distance of 1mm is obtained by etching after mask exposure, and no metal points or metal lines and other residues exist.
Example 7
The alumina ceramic with the size of 100 multiplied by 0.3mm is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ after being sequentially washed by sodium hydroxide solution, diluted hydrochloric acid and alcohol. The copper foil with the thickness of 100 multiplied by 0.1mm is washed by dilute hydrochloric acid and alcohol, and then is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby.
Etching and etching the surface of an alumina ceramic insulating layer by laser to obtain a groove with the width of 3mm and the depth of 0.04mm, printing an Ag71Cu26Ti3 solder layer with the width of 6.67m and the thickness of 0.031mm along the central line in the groove by a screen printing process, drying at 105 ℃ for 2-6 h for later use, pressing a 100 x 100mm uniform weight on the surface after the printed ceramic plate is attached to a copper foil, heating to 825 ℃ at 5 ℃ in a vacuum furnace, preserving heat for 10min, and cooling along with the furnace to obtain the ceramic copper-clad plate.
The thickness of a printed part is measured to be 0.444mm by adopting a spiral micrometer, the depth of a groove is 0.04mm, namely the thickness of a welding flux layer is 0.044mm, a 3M adhesive tape is adopted to paste a conducting layer and a ceramic insulating layer for tensile test, the line peeling strength is 18.7N/mm, the width of the welding flux layer obtained after a metal layer is peeled is 6mm, the ceramic copper-clad plate is subjected to a traditional etching process, the line width is 6.6mm through etching after mask exposure, the line distance is 1mm, and no metal points or metal lines and other residues exist.
Example 8
The alumina ceramic with the size of 100 multiplied by 0.3mm is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ after being sequentially washed by sodium hydroxide solution, diluted hydrochloric acid and alcohol. The copper foil with the thickness of 100 multiplied by 0.1mm is washed by dilute hydrochloric acid and alcohol, and then is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby.
And etching the surface of the alumina ceramic insulating layer by laser to obtain a groove with the width of 3mm and the depth of 0.04mm, printing an Au-25.5Ag-25.2Ge solder layer with the width of 6.67m and the thickness of 0.031mm along the central line in the groove by a screen printing process, and drying at 105 ℃ for 2-6 h for later use. And (3) attaching the printed ceramic plate and the copper foil, heating to 515 ℃ at 5 ℃ in a vacuum furnace, and then keeping the temperature for 10min to cool along with the furnace to obtain the ceramic copper-clad plate.
The thickness of a printed part is measured to be 0.444mm by adopting a micrometer screw gauge, the depth of a groove is 0.04mm, namely the thickness of a solder layer is 0.044mm, a 3M adhesive tape is adopted to paste a conducting layer and a ceramic insulating layer on two sides, the tensile test is carried out, the line peeling strength is 19.2N/mm, the width of the solder layer obtained after a metal layer is peeled is 6mm, the ceramic copper-clad plate is subjected to the traditional etching process, the line width is obtained by etching after the mask exposure is 6.6mm, the line distance is 1mm, and no metal points or metal lines and other residues exist.
Example 9
The alumina ceramic with the size of 100 multiplied by 0.3mm is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ after being sequentially washed by sodium hydroxide solution, diluted hydrochloric acid and alcohol. Washing 100 × 100 × 0.1mm aluminum foil with dilute hydrochloric acid and alcohol, and drying at 105 ℃ for 20-24h in a vacuum environment for later use.
And etching the surface of the alumina ceramic insulating layer by laser to obtain a groove with the width of 3mm and the depth of 0.04mm, printing an Au-25.5Ag-25.2Ge solder layer with the width of 6.67m and the thickness of 0.031mm along the central line in the groove by a screen printing process, and drying at 105 ℃ for 2-6 h for later use. And (3) attaching the printed ceramic plate and the aluminum foil, heating to 515 ℃ at 5 ℃ in a vacuum furnace, preserving the temperature for 10min, and cooling along with the furnace to obtain the ceramic aluminum-coated plate.
The thickness of a printed part is measured to be 0.444mm by adopting a micrometer screw gauge, the depth of a groove is 0.04mm, namely the thickness of a solder layer is 0.044mm, a 3M adhesive tape is adopted for pasting a conductive layer and a ceramic insulating layer for tensile test, the line peeling strength is 20.7N/mm, the width of the solder layer obtained after a metal layer is peeled is 6mm, the ceramic aluminum-clad plate is subjected to a traditional etching process, the line width is 6.6mm after the ceramic aluminum-clad plate is exposed through a mask, a circuit board with the line distance of 1mm is obtained, and no metal points or metal lines and the like are left.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. High welding strength pottery covers metal sheet, its characterized in that: the groove-type soldering flux structure comprises a ceramic insulating layer, a metal layer and a soldering flux layer, wherein a groove is formed in one surface of the ceramic insulating layer, which is close to the metal layer, the width of the soldering flux layer is larger than the width of the groove, and the width center line of the soldering flux layer is coincided with the width center line of the groove and the width center line of the metal circuit layer, which is left after the metal layer is etched, of the metal line layer.
2. The high weld strength ceramic-clad metal plate as claimed in claim 1, wherein: the width/groove width ratio range of the solder layer is: the width of the solder layer/the width of the groove is more than or equal to 1.05 and less than or equal to 2.5.
3. The high weld strength ceramic-clad metal plate as claimed in claim 2, wherein: the ratio range of the width of the solder layer/the line width of the metal circuit layer is as follows: the width of the solder layer/the line width of the metal circuit layer is not less than 0.98 and not more than 0.85.
4. The high weld strength ceramic-clad metal plate as claimed in claim 3, wherein: the ratio range of the solder layer thickness/the groove depth is: the thickness of the solder layer/the depth of the groove is more than or equal to 1.02 and less than or equal to 1.15.
5. The high weld strength ceramic-clad metal plate as claimed in claim 4, wherein: the metal layer is one of a copper layer or an aluminum layer, and the ceramic insulating layer is one of an aluminum oxide layer, an aluminum nitride layer and a silicon nitride layer; the active metal bonding layer is one of Ti-Ag, ti-Ag-Cu-Zn and Au-Ag-Ge.
6. The high weld strength ceramic-clad metal plate as claimed in claim 5, wherein: the depth of the groove is more than or equal to 0.015mm and less than or equal to 0.05mm.
7. The high weld strength ceramic-clad metal plate as claimed in claim 6, wherein: the width of the groove is more than or equal to 0.1mm and less than or equal to 3.5mm.
8. The high weld strength ceramic-clad metal plate as claimed in claim 7, wherein: the thickness of the metal layer is 0.1mm to 2.2mm; the thickness of the ceramic insulating layer is 0.3mm to 3.0mm.
9. The method of making a high weld strength ceramic coated metal sheet of any one of claims 1~8 comprising the steps of:
s1, carving a groove with a pattern consistent with a circuit pattern formed by etching a metal layer on one surface of a ceramic insulating layer, which is close to the metal layer;
s2, printing an active metal bonding layer with a pattern consistent with a circuit pattern formed by etching the metal layer on the ceramic insulating layer along the central line direction of the groove;
and S3, welding the ceramic insulating layer containing the active metal bonding layer obtained in the step S2 with the metal layer to obtain the high-welding-strength ceramic-coated metal plate comprising the ceramic insulating layer, the metal layer and the solder layer.
10. The chip package module is characterized in that the circuit layer is prepared by using the high-welding-strength ceramic-coated metal plate as claimed in any one of claims 1~8.
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| CN202211420725.7A CN115799211A (en) | 2022-11-14 | 2022-11-14 | High-welding-strength ceramic-coated metal plate, preparation method and chip packaging module |
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| CN202211420725.7A CN115799211A (en) | 2022-11-14 | 2022-11-14 | High-welding-strength ceramic-coated metal plate, preparation method and chip packaging module |
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2022
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