CN115763410A - Ceramic-coated double-sided metal plate, preparation method and chip packaging module - Google Patents
Ceramic-coated double-sided metal plate, preparation method and chip packaging module Download PDFInfo
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Abstract
The invention discloses a ceramic-coated double-sided metal plate which comprises a ceramic insulating layer, a first metal layer, a second metal layer and a welding layer, wherein a groove penetrating through the ceramic insulating layer is formed in the ceramic insulating layer, the welding layer is positioned in the groove, the first metal layer and the second metal layer positioned on two sides of the ceramic insulating layer are connected in a welding mode through the welding layer positioned in the groove, and the groove is positioned on the lower surface of a metal circuit layer left after the metal layer is etched. Make the solder layer arrange ceramic insulation layer both sides in through the recess for first metal level, second metal level and ceramic insulation layer welding are a whole, make second metal level (back metal level) realize tensile stress to first metal level, have promoted mechanical properties such as peel strength, utilize the coefficient of thermal expansion of the welding layer in the ditch groove and the characteristic of metal level in addition, have promoted ageing-resistant properties such as high low temperature cycle.
Description
Technical Field
The invention relates to the technical field of metal-clad plates, in particular to a ceramic double-sided metal-clad plate, a preparation method and a chip packaging module.
Background
With the rise of the packaging of power electronic devices such as IGBTs, metal-clad plates used for packaging the power electronic devices have been raised. The ceramic-coated metal is composed of a ceramic substrate, a bonding adhesive layer and a conductive layer, and means that a metal foil is directly bonded at a high temperature or welded on a ceramic substrate such as alumina by means of active metal brazing. The prepared ultrathin composite substrate has high heat conduction property, high adhesion strength, excellent soft weldability and excellent electrical insulation performance, and is a basic material of the interconnection technology and the structure technology of high-power electronic circuits such as IGBT and the like.
Because the bonding layer adopts active metals such as titanium, silver, cake, gold and the like, the existing etching process is difficult to etch the active metals completely, so that the active metals such as titanium, silver, cake, gold and the like remain, the risks of line coupling and open circuit exist, the line width and line distance are inaccurate, the problems of uneven line resistance, short circuit or open circuit exist, and the high-precision power packaging module is difficult to prepare.
Therefore, a technical scheme is needed to solve the technical problem that the existing etching process cannot etch the active metal completely, so that the high-precision power packaging module is difficult to prepare.
Disclosure of Invention
In view of the above, the present invention provides a ceramic double-sided metal plate, which includes a ceramic insulating layer, a first metal layer, a second metal layer and a welding layer, wherein the ceramic insulating layer has a groove penetrating through the ceramic insulating layer, the welding layer is located in the groove, the first metal layer and the second metal layer on two sides of the ceramic insulating layer are connected by welding via the welding layer located in the groove, and the groove is located on the lower surface of the metal circuit layer left after the metal layer is etched.
Preferably, the width centerline of the solder layer coincides with the width centerline of the metal circuit layer remaining after the metal layer is etched and the width centerline of the trench.
Preferably, the ratio of the thickness of the solder layer/the ceramic insulating layer ranges from: the thickness of the welding layer/the ceramic insulating layer is more than or equal to 1.02 and less than or equal to 1.15.
Preferably, the width/groove width ratio of the solder layer ranges from: the width of the welding layer/the width of the groove is more than or equal to 1.05 and less than or equal to 2.5.
Preferably, the ratio range of the width of the welding layer/the line width of the metal circuit layer is as follows: the width of the welding layer is more than or equal to 0.85/the line width of the metal circuit layer is less than or equal to 0.98.
Preferably, the first metal layer is one of a copper layer or an aluminum layer, the second metal layer is one of a copper layer or an aluminum layer, and the ceramic insulating layer is one of an aluminum oxide layer, an aluminum nitride layer and a silicon nitride layer; the welding layer is one of Ti-Ag, ti-Ag-Cu-Zn and Au-Ag-Ge alloy.
Preferably, the width of the groove ranges from 0.1mm to 3.5mm.
Preferably, the thickness of the first metal layer or the second metal layer is 0.1mm to 2.2mm, and the thickness of the ceramic insulating layer is 0.3mm to 3.0mm.
A preparation method of a ceramic-coated double-sided metal plate comprises the following steps:
s1, carving a groove which penetrates through a ceramic insulating layer and has a pattern consistent with a circuit pattern formed by etching a metal layer on the ceramic insulating layer;
s2, printing an active metal bonding layer with a pattern consistent with a circuit pattern formed by etching the metal layer on the ceramic insulating layer along the central line direction of the groove;
and S3, sequentially laminating the ceramic insulating layer containing the active metal bonding layer obtained in the step S2 and the second metal layer according to the first metal layer, and then welding at high temperature to obtain the ceramic-coated double-sided metal plate.
A chip packaging module is packaged on the ceramic-coated double-sided metal plate, and the ceramic-coated double-sided metal plate is used as a circuit layer and a heat dissipation supporting layer.
The invention has the beneficial effects that: the invention discloses a ceramic-coated double-sided metal plate which comprises a ceramic insulating layer, a first metal layer, a second metal layer and a welding layer, wherein a groove penetrating through the ceramic insulating layer is formed in the ceramic insulating layer, the welding layer is positioned in the groove, the first metal layer and the second metal layer positioned on two sides of the ceramic insulating layer are connected in a welding mode through the welding layer positioned in the groove, and the groove is positioned on the lower surface of a metal circuit layer left after the metal layers are etched. Make the solder layer arrange ceramic insulation layer both sides in through the recess for first metal level, second metal level and ceramic insulation layer welding are a whole, make second metal level (back metal level) realize tensile stress to first metal level, have promoted performances such as peel strength, utilize the coefficient of thermal expansion of the welding layer in the ditch groove and the characteristic of metal level in addition, have promoted the cycle performance. And the further ratio of the thickness of the welding layer to the depth of the groove (the ceramic insulating layer) is 1.02 to 1.15, so that a downward tensile stress is formed on the metal layer due to the reduction and collapse of the melting volume of the active metal in the welding process, the welding strength of the metal layer and the ceramic insulating layer is improved, and the problem that the welded metal layer is not flat due to the height difference between the active metal bonding layer covered on the ceramic insulating layer and the active metal bonding layer not covered on the ceramic insulating layer is solved.
Drawings
FIG. 1 is a schematic cross-sectional view of a ceramic-coated double-sided metal plate before etching;
FIG. 2 is a schematic cross-sectional view of a ceramic-coated double-sided metal plate after etching;
FIG. 3 is a flow chart of a process for preparing a ceramic-coated double-sided metal plate.
Detailed Description
The present application will be described in further detail with reference to the following drawings and detailed description. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and that no limitation of the invention is intended. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
Referring to FIGS. 1 to 3, FIG. 1 is a schematic cross-sectional view of a ceramic-coated double-sided metal plate before etching; FIG. 2 is a schematic cross-sectional view of a ceramic-coated double-sided metal plate after etching; FIG. 3 is a flow chart of a process for preparing a ceramic-coated double-sided metal plate.
The embodiment provides a ceramic-coated double-sided metal plate and a preparation method thereof, the ceramic-coated double-sided metal plate comprises a ceramic insulating layer, a first metal layer, a second metal layer and a welding layer, wherein a groove penetrating through the ceramic insulating layer is formed in the ceramic insulating layer, the welding layer is positioned in the groove, the first metal layer and the second metal layer positioned on two sides of the ceramic insulating layer are connected in a welding mode through the welding layer positioned in the groove, and the groove is positioned on the lower surface of a metal circuit layer left after the metal layers are etched. The preparation method comprises the following steps:
s1, carving a groove with a pattern consistent with a circuit pattern formed by etching a metal layer on the ceramic insulating layer, thereby obtaining a through groove consistent with the circuit pattern on the ceramic insulating layer.
S2, printing an active metal bonding layer with a pattern consistent with a circuit pattern formed by etching the metal layer on the ceramic insulating layer along the central line direction of the groove; the active metal bonding layer arranged in the groove is obtained through screen printing or other modes, the melting volume of the active metal bonding layer is reduced through subsequent welding action, and the welding layer generating tensile stress on the first metal layer and the second metal layer is obtained.
And S3, sequentially laminating the ceramic insulating layer containing the active metal bonding layer obtained in the step S2 and the second metal layer according to the first metal layer, and then welding at high temperature to obtain the ceramic-coated double-sided metal plate.
In this embodiment, the width centerline of the further solder layer coincides with the width centerline of the remaining metal line layer after the metal layer is etched and the width centerline of the trench. Make the solder layer arrange ceramic insulating layer both sides in through the recess for first metal level, second metal level and ceramic insulating layer welding are a whole, make second metal level (back metal level) realize tensile stress to first metal level, have promoted performances such as peel strength. In this embodiment, a further preferred ratio range of the thickness of the solder layer/the ceramic insulating layer is: the thickness of the welding layer/the ceramic insulating layer is more than or equal to 1.02 and less than or equal to 1.15. The welding process can be used for forming downward tensile stress on the metal layer due to the fact that the melting volume of the active metal is reduced and collapsed, the welding strength of the metal layer and the ceramic insulation layer is improved, and the problem that the welded metal layer is not flat due to the fact that the ceramic insulation layer is covered with the active metal bonding layer and is not covered with the active metal bonding layer is solved.
In this embodiment, in order to further improve the welding strength and reduce the problem of incomplete etching caused by too wide welding layer, the ratio of the width of the welding layer to the width of the groove is defined as follows: the width of the welding layer/the width of the groove is more than or equal to 1.05 and less than or equal to 2.5. The ratio range of the width of the welding layer/the line width of the metal circuit layer is as follows: the width of the welding layer is more than or equal to 0.85/the line width of the metal circuit layer is less than or equal to 0.98.
In the present embodiment, any conductive material such as a metal, a metal alloy, or a semiconductor that is commonly used can be used as the metal layer for electrical and thermal conduction, and in the present embodiment, the metal layer is preferably a copper layer or an aluminum layer, and in the present embodiment, the copper layer or the aluminum layer is a simple substance of the metal or an alloy thereof. In the present embodiment, the preferable ceramic insulating layer is one of an aluminum oxide layer, an aluminum nitride layer and a silicon nitride layer, and the ceramic insulating layer to be described is a ceramic insulating layer formed by one simple substance of an aluminum oxide layer, an aluminum nitride layer and a silicon nitride layer, or a mixed ceramic formed by mainly one of them and other low-melting-point sintering aids or other ceramic components. In this embodiment, the solder layer is one of Ti-Ag, ti-Ag-Cu-Zn, and Au-Ag-Ge.
In the embodiment, the width of the groove is more than or equal to 0.1mm and less than or equal to 3.5mm, so that the matching between the processing difficulty and the strength of the ceramic insulating layer is realized, and the thickness of the metal layer is preferably 0.1mm to 2.2mm and the thickness of the ceramic insulating layer is preferably 0.3mm to 3.0mm.
The embodiment also discloses a chip packaging module which is packaged on the ceramic-coated double-sided metal plate, and the ceramic-coated double-sided metal plate is used as a circuit layer and a heat dissipation supporting layer.
The specific embodiment is as follows:
example 1
The alumina ceramic with the size of 100 multiplied by 0.3mm is dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ after being sequentially washed by sodium hydroxide solution, diluted hydrochloric acid and alcohol. Two copper foils with the thickness of 100 multiplied by 0.1mm are washed by dilute hydrochloric acid and alcohol, and then dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby.
Printing an Ag71Cu26Ti3 solder layer with the same shape as a subsequent copper foil circuit on one surface of an alumina ceramic insulating layer by a screen printing process, wherein the printing thickness is 0.25mm higher than that of the insulating layer, the printing width is 4.08mm, drying at 105 ℃ for 2-6 h, repeating the same printing and drying processes on the same position on the other surface of the ceramic insulating layer, and obtaining an active metal bonding layer with the same shape on the two surfaces for later use. And (3) bonding the upper and lower surfaces of the printed ceramic plate with copper foil, pressing a uniform weight of 100 multiplied by 100mm on the surface, heating to 825 ℃ at 5 ℃ in a vacuum furnace, and then preserving heat for 10min to cool along with the furnace to obtain the ceramic copper-clad plate.
The thickness of the printed part is measured to be 0.845mm by adopting a micrometer screw, namely the thickness of the welding layer is 0.345mm, the 3M adhesive tape is adopted to paste the conducting layer and the ceramic insulating layer for tensile test, the peeling strength of the circuit is 8.7N/mm, and the area of the welding layer is smaller than that of the whole ceramic insulating layer, so the peeling strength is lower. The width of the welding layer obtained after the metal layer is stripped is 3.98mm, the ceramic copper-clad plate is subjected to the traditional etching process, the line width is 3.76mm after the etching is carried out through the mask exposure, the line spacing is 1mm, the welding process of the printed active bonding layer collapses and transversely shrinks, the width of the welding layer after the welding is 3.98mm and is larger than the line width by 3.76mm, metal points or metal wires and the like are remained, and the metal layer is uneven, because the active metal bonding layers are all printed on the surface of the ceramic, the width of the welding layer is increased due to the flowing of the active metal bonding layers in the welding process, the metal layer is uneven due to the overhigh welding layer, and the stripping strength of the line is lower.
Example 2
Two copper foils with the thickness of 100 multiplied by 0.1mm are washed by dilute hydrochloric acid and alcohol, and then dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby. Carving the surface of the alumina insulating layer ceramic with the thickness of 100 multiplied by 0.3mm by a carving machine to obtain a groove with the width of 3.5mm consistent with the shape of the circuit layer, then sequentially carrying out sodium hydroxide solution, dilute hydrochloric acid pickling and alcohol cleaning, and drying for 20 to 24h at the temperature of 105 ℃ in a vacuum environment for later use.
Printing an Ag71Cu26Ti3 solder layer with the same shape as a subsequent copper foil circuit on one surface of a ceramic insulating layer through a screen printing process on alumina ceramic, printing the solder layer with the thickness of 0.10mm and the printing width of 4.08mm, drying at 105 ℃ for 2-6 h, repeating the same printing and drying processes on the same position of the other surface of the ceramic insulating layer, and obtaining an active metal bonding layer with the same shape on the two surfaces for later use. After the upper and lower surfaces of the printed ceramic plate are attached to the copper foil, a uniform weight of 100 multiplied by 100mm is pressed on the surface of the printed ceramic plate, the temperature is raised to 825 ℃ in a vacuum furnace at 5 ℃, and then the ceramic plate is cooled along with the furnace for 10min after heat preservation to obtain the ceramic copper-clad plate.
The thickness of a printed part is measured by adopting a micrometer screw to be 0.545mm, the depth of the groove is 0.3mm, namely the thickness of a welding layer (including a welding layer in the groove) is 0.345mm, the 3M adhesive tape is adopted to paste the conducting layer and the ceramic insulating layer for tensile test, and the line peeling strength is 19.0N/mm. The width of the welding layer obtained by testing after the metal layer is stripped is 3.68mm, the ceramic copper-clad plate is subjected to the traditional etching process, the line width is 3.76mm and the line distance is 1mm after the mask is exposed, the welding layer after welding is 3.68mm and is smaller than the line width by 3.76mm due to the fact that the welding process of the printed active bonding layer shrinks towards the inside of the groove, and no metal points or metal wires and the like are left, namely the scheme is that the welding layer is not printed on the non-circuit layer, and the problem that the active metal is difficult to etch is solved. The thickness of the welding layer is 0.345mm, the depth of the groove (the thickness of the ceramic insulating layer) is 0.3mm, the thickness of the welding layer surface leaking out of the ceramic insulating layer is only 0.023mm, and the surface of the metal layer which can be seen by naked eyes is relatively flat, so that the ceramic insulating layer is suitable for practical use.
Example 3
Two copper foils with the thickness of 100 multiplied by 0.1mm are washed by dilute hydrochloric acid and alcohol, and then dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby. Carving the surface of the alumina insulating layer ceramic with the thickness of 100 multiplied by 0.3mm by a carving machine to obtain a groove with the width of 0.1mm consistent with the shape of the circuit layer, then sequentially carrying out sodium hydroxide solution, dilute hydrochloric acid pickling and alcohol cleaning, and drying for 20 to 24h at the temperature of 105 ℃ in a vacuum environment for later use.
Printing an Ag71Cu26Ti3 solder layer with the shape consistent with that of a subsequent copper foil circuit on one surface of the ceramic insulating layer through a screen printing process on alumina ceramic, wherein the printing thickness is 0.068mm higher than that of the insulating layer, the printing width is 0.278mm, drying at 105 ℃ for 2-6 h, repeating the same printing and drying processes on the same position on the other surface of the ceramic insulating layer, and obtaining an active metal bonding layer with the same shape on the two surfaces for later use. After the printed ceramic plate is attached to the copper foil, a uniform weight of 100 multiplied by 100mm is pressed on the surface of the printed ceramic plate, the temperature is raised to 825 ℃ in a vacuum furnace at 5 ℃, and then the ceramic plate is cooled along with the furnace for 10min to obtain the ceramic copper clad plate.
The thickness of a printed part is measured to be 0.506mm by adopting a micrometer screw gauge, the depth of a groove is 0.3mm, namely the thickness of a welding layer is 0.306mm, a conducting layer and a ceramic insulating layer are adhered by adopting a 3M adhesive tape, the tensile test is carried out, the line peeling strength is 18.5N/mm, the width of the welding layer obtained after the metal layer is peeled is 0.25mm, the ceramic copper-clad plate is subjected to the traditional etching process, the line width is 0.3mm after the mask is exposed, the line spacing is 1mm, no metal points or metal lines and other residues exist, the surface of the metal layer is flat by observing with naked eyes, and the use requirement is met.
Example 4
Two copper foils with the thickness of 100 multiplied by 0.1mm are washed by dilute hydrochloric acid and alcohol, and then dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby. Carving the surface of the alumina insulating layer ceramic with the thickness of 100 multiplied by 0.3mm by a carving machine to obtain a groove with the width of 3mm consistent with the shape of the circuit layer, then sequentially washing by sodium hydroxide solution, dilute hydrochloric acid and alcohol, and drying for 20 to 24h at the temperature of 105 ℃ in a vacuum environment for later use.
Printing an Ag71Cu26Ti3 solder layer with the shape consistent with that of a subsequent copper foil circuit on one surface of an alumina ceramic insulating layer by a screen printing process, wherein the printing thickness is 0.086mm higher than that of the insulating layer, the printing width is 6.67mm, drying at 105 ℃ for 2-6 h, repeating the same printing and drying processes on the same position of the other surface of the ceramic insulating layer, and obtaining an active metal bonding layer with the same shape on the two surfaces for later use. After the printed ceramic plate is attached to the copper foil, a uniform weight of 100 multiplied by 100mm is pressed on the surface of the printed ceramic plate, the temperature is raised to 825 ℃ in a vacuum furnace at 5 ℃, and then the ceramic plate is cooled along with the furnace for 10min to obtain the ceramic copper clad plate.
The thickness of a printed part is measured to be 0.53mm by adopting a micrometer screw gauge, the depth of a groove is 0.3mm, namely the thickness of a welding layer is 0.33mm, a 3M adhesive tape is adopted to paste a conducting layer and a ceramic insulating layer, the tensile force test is carried out, the line peeling strength is 24.2N/mm, the width of the welding layer obtained after the metal layer is peeled is 6mm, the ceramic copper-clad plate is subjected to the traditional etching process, the line width is 6.6mm after the etching is carried out through a mask exposure, the line spacing is 1mm, no metal points or metal lines and the like are left, and the surface of the metal layer is smooth.
Example 5
Two copper foils with the thickness of 100 multiplied by 2.2mm are washed by dilute hydrochloric acid and alcohol, and then dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby. Carving the surface of the 100 x 3mm alumina insulating layer ceramic by a carving machine to obtain a groove which is consistent with the shape of the circuit layer and has the width of 3mm, then sequentially washing the groove by sodium hydroxide solution, dilute hydrochloric acid and alcohol, and drying the groove for 20 to 24h at the temperature of 105 ℃ in a vacuum environment for later use.
Printing an Ag71Cu26Ti3 solder layer with the same shape as a subsequent copper foil circuit on one surface of an alumina ceramic insulating layer by a screen printing process, wherein the printing thickness is 0.68mm higher than that of the insulating layer, the printing width is 6.67mm, drying at 105 ℃ for 2-6 h, repeating the same printing and drying processes on the same position of the other surface of the ceramic insulating layer, and obtaining an active metal bonding layer with the same shape on the two surfaces for later use. After the printed ceramic plate is attached to the copper foil, a uniform weight of 100 multiplied by 100mm is pressed on the surface of the printed ceramic plate, the temperature is raised to 825 ℃ in a vacuum furnace at 5 ℃, and then the ceramic plate is cooled along with the furnace for 10min to obtain the ceramic copper clad plate.
The thickness of a printed part is measured to be 7.46mm by adopting a screw micrometer, the depth of a groove is 3mm, namely the thickness of a welding layer is 3.06mm, a 3M adhesive tape is adopted to paste a conducting layer and a ceramic insulating layer for tensile test, the line peeling strength is 22.5N/mm, the width of the welding layer obtained after the metal layer is peeled is 6mm, the ceramic copper-clad plate is subjected to a traditional etching process, the circuit board with the line width of 6.6mm and the line distance of 1mm is obtained by etching after mask exposure, no metal points or metal lines and the like exist, and the surface of the metal layer is smooth.
Example 6
Two copper foils with the thickness of 100 multiplied by 0.6mm are washed by dilute hydrochloric acid and alcohol, and then dried for 20 to 24h under the vacuum environment at the temperature of 105 ℃ for standby. Carving the surface of the alumina insulating layer ceramic with the thickness of 100 multiplied by 0.63mm by a carving machine to obtain a groove with the width of 3mm consistent with the shape of the circuit layer, then sequentially washing by sodium hydroxide solution, dilute hydrochloric acid and alcohol, and drying for 20 to 24h at the temperature of 105 ℃ in a vacuum environment for later use.
Printing an Ag71Cu26Ti3 solder layer with the shape consistent with that of a subsequent copper foil circuit on one surface of the ceramic insulating layer through a screen printing process on alumina ceramic, wherein the printing thickness is 0.18mm higher than that of the insulating layer, the printing width is 6.67mm, then drying at 105 ℃ for 2-6 h, repeating the same printing and drying processes on the same position of the other surface of the ceramic insulating layer, and obtaining an active metal bonding layer with the same shape on the two surfaces for later use. After the printed ceramic plate is attached to the copper foil, a uniform weight of 100 multiplied by 100mm is pressed on the surface of the printed ceramic plate, the temperature is raised to 825 ℃ in a vacuum furnace at 5 ℃, and then the ceramic plate is cooled along with the furnace for 10min to obtain the ceramic copper-clad plate.
The thickness of a printed part is measured to be 1.893mm by adopting a micrometer screw gauge, the depth of a groove is 0.63mm, namely the thickness of a welding layer is 0.693mm, a conducting layer and a ceramic insulating layer are adhered by adopting a 3M adhesive tape, the tensile force test is carried out, the line peeling strength is 24.1N/mm, the width of the welding layer obtained after the metal layer is peeled is 6mm, the ceramic copper-clad plate is etched by adopting the traditional etching process after being exposed through a mask to obtain the line width of 6.6mm, the line distance is 1mm, no metal points or metal lines and the like are remained, and the surface of the metal layer is smooth.
Example 7
Two aluminum foils with the thickness of 100 multiplied by 0.6mm are washed by dilute hydrochloric acid and cleaned by alcohol, and then are dried for 20 to 24h under a vacuum environment at the temperature of 105 ℃ for standby. Carving the surface of the alumina insulating layer ceramic with the diameter of 100 multiplied by 0.63mm by a carving machine to obtain a groove with the width of 3mm consistent with the shape of the circuit layer, then sequentially carrying out sodium hydroxide solution, dilute hydrochloric acid pickling and alcohol cleaning, and drying for 20 to 24h at the temperature of 105 ℃ in a vacuum environment for later use.
Printing an Au-25.5Ag-25.2Ge solder layer with the shape consistent with that of a subsequent aluminum foil circuit on one surface of an aluminum oxide ceramic insulating layer by a screen printing process, wherein the printing thickness is 0.18mm higher than that of the insulating layer, the printing width is 6.67mm, drying is carried out at 105 ℃ for 2 to 6 hours, and then the same printing and drying processes are repeated on the same position of the other surface of the ceramic insulating layer to obtain an active metal adhesive layer with the same shape on the two surfaces for later use. After the printed ceramic plate is attached to the aluminum foil, a uniform weight with the size of 100 multiplied by 100mm is pressed on the surface of the ceramic plate, the ceramic plate is heated to 515 ℃ in a vacuum furnace at the temperature of 5 ℃ and then is cooled along with the furnace for 10min to obtain the ceramic aluminum-coated plate.
The thickness of a printed part is measured to be 1.893mm by adopting a micrometer screw gauge, the depth of a groove is 0.63mm, namely the thickness of a welding layer is 0.693mm, a 3M adhesive tape is adopted to paste a conducting layer and a ceramic insulating layer for tensile test, the line peeling strength is 26.9N/mm, the width of the welding layer obtained after the metal layer is peeled is 6mm, the ceramic copper-clad plate is etched by adopting a traditional etching process after being exposed through a mask to obtain the line width of 6.6mm, the line distance is 1mm, no metal points or metal lines and the like are remained, and the surface of the metal layer is smooth.
Example 7
Two aluminum foils with the thickness of 100 multiplied by 0.6mm are washed by dilute hydrochloric acid and cleaned by alcohol, and then are dried for 20 to 24h under a vacuum environment at the temperature of 105 ℃ for standby. Carving the surface of the zirconia insulating layer ceramic with the thickness of 100 multiplied by 0.63mm by a carving machine to obtain a groove with the width of 3mm consistent with the shape of the circuit layer, then sequentially washing by sodium hydroxide solution, dilute hydrochloric acid and alcohol, and drying for 20-24h at the temperature of 105 ℃ in a vacuum environment for later use.
Printing an Au-25.5Ag-25.2Ge solder layer with the shape consistent with that of a subsequent aluminum foil circuit on one surface of the zirconia ceramic insulating layer by a screen printing process, wherein the printing thickness is 0.18mm higher than that of the insulating layer, the printing width is 6.67mm, drying at 105 ℃ for 2-6 h, repeating the same printing and drying processes on the same position on the other surface of the ceramic insulating layer, and obtaining an active metal bonding layer with the same shape on the two surfaces for later use. After the printed ceramic plate is attached to the aluminum foil, a uniform weight with the size of 100 multiplied by 100mm is pressed on the surface of the ceramic plate, the ceramic plate is heated to 515 ℃ in a vacuum furnace at the temperature of 5 ℃ and then is cooled along with the furnace for 10min to obtain the ceramic aluminum-coated plate.
The thickness of a printed part is measured to be 1.893mm by adopting a micrometer screw gauge, the depth of a groove is 0.63mm, namely the thickness of a welding layer is 0.693mm, a conducting layer and a ceramic insulating layer are adhered by adopting a 3M adhesive tape, the line peeling strength is 28.5N/mm in a tensile test, the width of the welding layer obtained after the metal layer is peeled is 6mm, the ceramic aluminum-coated plate is etched by adopting a traditional etching process after being exposed through a mask to obtain the circuit board with the line width of 6.6mm and the line distance of 1mm, no metal points or metal lines and the like are remained, and the surface of the metal layer is smooth.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention according to the present application is not limited to the specific combination of the above-mentioned features, but also covers other embodiments where any combination of the above-mentioned features or their equivalents is made without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. Ceramic covers two-sided metal sheet, its characterized in that: the metal circuit board comprises a ceramic insulating layer, a first metal layer, a second metal layer and a welding layer, wherein a groove penetrating through the ceramic insulating layer is formed in the ceramic insulating layer, the welding layer is located in the groove, the first metal layer and the second metal layer which are located on two sides of the ceramic insulating layer are connected in a welding mode through the welding layer located in the groove, and the groove is located on the lower surface of a metal circuit layer which is left after the metal layers are etched.
2. The ceramic-coated double-sided metal sheet according to claim 1, wherein: the width central line of the welding layer is coincided with the width central line of the metal circuit layer and the width central line of the groove which are left after the metal layer is etched.
3. The ceramic-coated double-sided metal sheet according to claim 2, wherein: the ratio range of the welding layer thickness/the ceramic insulating layer is as follows: the thickness of the welding layer/the ceramic insulating layer is more than or equal to 1.02 and less than or equal to 1.15.
4. The ceramic-coated double-sided metal sheet as claimed in claim 2, wherein: the width/groove width ratio range of the weld layer is: the width of the welding layer/the width of the groove is more than or equal to 1.05 and less than or equal to 2.5.
5. The ceramic-coated double-sided metal sheet as claimed in claim 2, wherein: the ratio range of the width of the welding layer/the line width of the metal circuit layer is as follows: the width of the welding layer/the line width of the metal circuit layer is not less than 0.98 and not more than 0.85.
6. The ceramic-coated double-sided metal sheet as claimed in claim 2, wherein: the first metal layer is one of a copper layer or an aluminum layer, the second metal layer is one of a copper layer or an aluminum layer, and the ceramic insulating layer is one of an aluminum oxide layer, an aluminum nitride layer and a silicon nitride layer; the welding layer is one of Ti-Ag, ti-Ag-Cu-Zn and Au-Ag-Ge alloy.
7. The ceramic-coated double-sided metal sheet of claim 2, wherein: the width of the groove is 0.1mm to 3.5mm.
8. The ceramic-coated double-sided metal sheet as claimed in claim 2, wherein: the thickness of the first metal layer or the second metal layer is 0.1mm to 2.2mm, and the thickness of the ceramic insulating layer is 0.3mm to 3.0mm.
9. The method for preparing the ceramic-coated double-sided metal plate as claimed in any one of claims 1 to 8, which is characterized by comprising the following steps:
s1, carving a groove which penetrates through a ceramic insulating layer and has a pattern consistent with a circuit pattern formed by etching a metal layer on the ceramic insulating layer;
s2, printing an active metal bonding layer with a pattern consistent with a circuit pattern formed by etching the metal layer on the ceramic insulating layer along the central line direction of the groove;
and S3, sequentially laminating the ceramic insulating layer containing the active metal bonding layer obtained in the step S2 and the second metal layer according to the first metal layer, and then welding at high temperature to obtain the ceramic-coated double-sided metal plate.
10. The chip packaging module is characterized in that the circuit layer is prepared by using the ceramic-coated double-sided metal plate as claimed in any one of claims 1 to 8.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211420029.6A CN115763410A (en) | 2022-11-14 | 2022-11-14 | Ceramic-coated double-sided metal plate, preparation method and chip packaging module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211420029.6A CN115763410A (en) | 2022-11-14 | 2022-11-14 | Ceramic-coated double-sided metal plate, preparation method and chip packaging module |
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| CN115763410A true CN115763410A (en) | 2023-03-07 |
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| CN202211420029.6A Pending CN115763410A (en) | 2022-11-14 | 2022-11-14 | Ceramic-coated double-sided metal plate, preparation method and chip packaging module |
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| Country | Link |
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| CN (1) | CN115763410A (en) |
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