CN218004827U

CN218004827U - Novel ceramic multilayer packaging structure

Info

Publication number: CN218004827U
Application number: CN202220418902.7U
Authority: CN
Inventors: 张馨月; 陶文成; 朱莉
Original assignee: Aigner Semiconductor Technology Suzhou Co ltd
Current assignee: Aigner Semiconductor Technology Suzhou Co ltd
Priority date: 2022-03-01
Filing date: 2022-03-01
Publication date: 2022-12-09
Anticipated expiration: 2032-03-01

Abstract

The utility model discloses a novel pottery multilayer packaging structure, including ceramic substrate and dielectric layer, a plurality of notches are evenly seted up to the ceramic substrate top surface, and are a plurality of the notch bottom surface is fixed respectively and is rabbeted a plurality of conductive metal layers, the notch degree of depth is greater than conductive metal layer thickness, it sets up a plurality of lower through-holes respectively perpendicularly to correspond a plurality of notch positions on the ceramic substrate, lead portion under the ceramic substrate bottom surface rigid coupling, lead portion top surface corresponds a plurality of lead link bottoms under the perpendicular rigid coupling in a plurality of through-hole positions down. The utility model discloses set up the notch, with the conductive metal layer scarf joint in the notch, form the space between notch and the conductive metal layer top surface, when carrying out multilayer integration, the welding position is in this space department, can be so that in close contact with between dielectric layer and the ceramic substrate layer, can not produce the clearance, avoided getting into the air between ceramic substrate and the dielectric layer and lead to corroding or the phenomenon of oxidation, also can make the whole thickness of base plate after the encapsulation thinner simultaneously, save space.

Description

Novel ceramic multilayer packaging structure

Technical Field

The utility model relates to a ceramic substrate multilayer integrated technology field specifically is a novel pottery multilayer packaging structure.

Background

The ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface (single or double side) of an alumina (Al 2O 3) or aluminum nitride (AlN) ceramic substrate at a high temperature. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction property, excellent soft weldability and high adhesion strength, can be etched into various patterns like a PCB (printed Circuit Board), and has great current carrying capacity. Therefore, the ceramic substrate has become a basic material of high-power electronic circuit structure technology and interconnection technology, in the current ceramic substrate process, the situation of bottom layer integration is needed, i.e. a plurality of ceramic substrates are stacked and integrated to form a connection state, the current multilayer integrated packaging process is mainly formed by welding metal positions on two or more ceramic substrates together, and the packaging mode has the following defects:

by adopting the welding mode, welding spots can be formed between the two ceramic substrates, so that gaps are generated between the ceramic substrates and are in a non-sealing state, the thickness of the multi-layer integrated substrate is too thick, the space is wasted, and the gaps enter air, so that the phenomena of oxidation and corrosion are easily generated.

To this end, we propose a novel ceramic multilayer package structure to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel pottery multilayer packaging structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a novel ceramic multilayer packaging structure comprises a ceramic substrate and a dielectric layer, wherein a plurality of notches are uniformly formed in the top surface of the ceramic substrate, a plurality of conductive metal layers are fixedly embedded in the bottom surfaces of the notches respectively, the depth of each notch is larger than the thickness of each conductive metal layer, and a plurality of lower through holes are vertically formed in the positions, corresponding to the notches, of the ceramic substrate respectively;

the bottom surface of the ceramic substrate is fixedly connected with a lower lead part, the top surface of the lower lead part is vertically and fixedly connected with the bottom ends of a plurality of lower lead connecting ends corresponding to the positions of a plurality of through holes, and the top ends of the lower lead connecting ends penetrate through the lower through holes and are fixedly connected with the bottom surface of the conductive metal layer.

Preferably, the lower lead portion is electrically connected to a plurality of lower lead connection terminals, and the plurality of lower lead connection terminals are electrically connected to a plurality of conductive metal layers, respectively.

Preferably, the dielectric layer is vertically provided with a plurality of upper through holes corresponding to the plurality of notches, and the top surface of the dielectric layer is fixedly connected with the upper lead part.

Preferably, the bottom surface of the upper lead portion is fixedly connected with the top ends of the plurality of upper lead connecting ends respectively corresponding to the plurality of upper through holes, the bottom ends of the plurality of upper lead connecting ends respectively penetrate through the upper through holes and are positioned on the same horizontal plane with the bottom surface of the dielectric layer, and the upper lead portion is electrically connected with the plurality of upper lead connecting ends.

Preferably, the ceramic substrate top surface is located the conducting metal layer outside position and sets up the frame fluting, fixed scarf joint a plurality of metal frame layers respectively in the frame fluting, dielectric layer bottom surface contact ceramic substrate top surface, go up the rigid coupling welding point portion between wire link bottom and the conducting metal layer.

Preferably, the lower lead portion, the upper lead connecting end and the lower lead connecting end are made of silver.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses set up the notch, with the conducting metal layer scarf joint in the notch, form the space between notch and the conducting metal layer top surface, when carrying out multilayer integration, welding position is in this space department, can be so that in close contact with between dielectric layer and the ceramic substrate layer, can not produce the clearance, avoided getting into the phenomenon that the air leads to corroding or oxidizing between ceramic substrate and the dielectric layer, also can make the whole thickness of base plate after the encapsulation thinner simultaneously, save space.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged schematic view of the explosion structure of the present invention;

fig. 3 is the enlarged structure schematic diagram of the junction of the medium ceramic substrate and the medium layer of the present invention.

In the figure: 1. a ceramic substrate; 2. a dielectric layer; 3. a welding point; 11. a recess; 12. a conductive metal layer; 13. a lower through hole; 14. a lower lead portion; 15. a lower lead connecting end; 16. slotting the frame; 17. a metal frame layer; 21. an upper through hole; 22. an upper lead portion; 23. and an upper wire connecting end.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1:

referring to fig. 1-3, the present invention provides a technical solution: a novel ceramic multilayer packaging structure comprises a ceramic substrate 1 and a dielectric layer 2, wherein a plurality of notches 11 are uniformly formed in the top surface of the ceramic substrate 1, a plurality of conductive metal layers 12 are fixedly embedded in the bottom surfaces of the notches 11 respectively, the depth of each notch 11 is larger than the thickness of each conductive metal layer 12, and a plurality of lower through holes 13 are vertically formed in the positions, corresponding to the notches 11, of the ceramic substrate 1 respectively;

wire portion 14 under 1 bottom surface rigid coupling of ceramic substrate, wire portion 14 top surface corresponds a plurality of wire connection end 15 bottoms under the perpendicular rigid coupling of a plurality of through-hole positions down, through-hole 13 and rigid coupling conductive metal layer 12 bottom surface under the 15 tops of wire connection end pass down, the utility model discloses notch 11 has been set up, with conductive metal layer 12 scarf joint in notch 11, form the space between notch 11 and the conductive metal layer 12 top surface, when carrying out multilayer integration, the welding position is in this space department, can be so that in close contact with between dielectric layer 2 and the ceramic substrate layer 1, can not produce the clearance, avoided getting into the phenomenon that the air leads to corroding or oxidizing between ceramic substrate 1 and the dielectric layer 2, also can make the whole thickness of base plate after the encapsulation thinner simultaneously, save space.

Example 2:

referring to fig. 2-3, the lower conductive portion 14 is electrically connected to a plurality of lower conductive connection terminals 15, and the plurality of lower conductive connection terminals 15 are electrically connected to the plurality of conductive metal layers 12, respectively.

Referring to fig. 2-3, a plurality of upper vias 21 are vertically formed in the dielectric layer 2 corresponding to the plurality of recesses 11, and an upper conductive portion 22 is fixedly connected to the top surface of the dielectric layer 2.

Referring to fig. 2-3, the bottom surface of the upper conductive portion 22 is fixedly connected to the top ends of the plurality of upper conductive connecting terminals 23 corresponding to the plurality of upper through holes 21, the bottom ends of the plurality of upper conductive connecting terminals 23 respectively penetrate through the upper through holes 21 and are located on the same horizontal plane as the bottom surface of the dielectric layer 2, and the upper conductive portion 22 is electrically connected to the plurality of upper conductive connecting terminals 23.

Referring to fig. 2-3, a frame slot 16 is formed in the top surface of the ceramic substrate 1 at the outer side of the conductive metal layer 12, a plurality of metal frame layers 17 are fixedly embedded in the frame slot 16, the bottom surface of the dielectric layer 2 contacts the top surface of the ceramic substrate 1, a welding point portion 3 is fixedly connected between the bottom end of the upper lead connecting end 23 and the conductive metal layer 12, when packaging is performed, a welding point is formed in a gap between the notch 11 and the conductive metal layer 12, then the dielectric layer 2 covers the surface of the ceramic substrate 1, at this time, the upper lead connecting end 23 is connected with the welding point, and the welding point portion 3 is formed at the welding point, so that packaging can be completed.

Referring to fig. 2-3, the lower conductive portion 14, the upper conductive portion 22, the upper conductive connecting end 23 and the lower conductive connecting end 15 are made of silver.

Example 3:

the utility model discloses when encapsulating, the solder joint is do in space department between notch 11 and conductive metal layer 12, later cover dielectric layer 2 on ceramic substrate 1 surface, go up wire link 23 this moment and be connected with solder joint department, solder joint department forms welding point portion 3, can accomplish the encapsulation, the utility model discloses set up notch 11, scarf joint conductive metal layer 12 in notch 11, form the space between notch 11 and the conductive metal layer 12 top surface, when carrying out multilayer integration, the welding position is in this space department, can be so that in close contact with between dielectric layer 2 and the ceramic substrate layer 1, can not produce the clearance, avoided getting into the phenomenon that the air leads to corroding or oxidizing between ceramic substrate 1 and the dielectric layer 2, also can make the whole thickness of base plate after the encapsulation thinner simultaneously, save space.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a novel ceramic multilayer packaging structure, includes ceramic substrate (1) and dielectric layer (2), its characterized in that:

a plurality of notches (11) are uniformly formed in the top surface of the ceramic substrate (1), the bottom surfaces of the plurality of notches (11) are fixedly embedded with a plurality of conductive metal layers (12) respectively, the depth of each notch (11) is greater than the thickness of each conductive metal layer (12), and a plurality of lower through holes (13) are vertically formed in the positions, corresponding to the plurality of notches (11), of the ceramic substrate (1);

the bottom surface of the ceramic substrate (1) is fixedly connected with a lower lead part (14), the top surface of the lower lead part (14) is vertically and fixedly connected with the bottom ends of a plurality of lower lead connecting ends (15) corresponding to the positions of a plurality of through holes, and the top ends of the lower lead connecting ends (15) penetrate through the lower through holes (13) and are fixedly connected with the bottom surface of the conductive metal layer (12).

2. The novel ceramic multilayer package structure of claim 1, wherein: the lower lead portion (14) is electrically connected to a plurality of lower lead connection terminals (15), and the plurality of lower lead connection terminals (15) are electrically connected to the plurality of conductive metal layers (12), respectively.

3. The novel ceramic multilayer package structure of claim 1, wherein: the dielectric layer (2) is vertically provided with a plurality of upper through holes (21) corresponding to the positions of the plurality of notches (11), and the top surface of the dielectric layer (2) is fixedly connected with an upper wire part (22).

4. The novel ceramic multilayer packaging structure of claim 3, wherein: the bottom surface of the upper lead part (22) is fixedly connected with the top ends of a plurality of upper lead connecting ends (23) corresponding to the positions of a plurality of upper through holes (21), the bottom ends of the plurality of upper lead connecting ends (23) penetrate through the upper through holes (21) respectively and are positioned on the same horizontal plane with the bottom surface of the dielectric layer (2), and the upper lead part (22) is electrically connected with the plurality of upper lead connecting ends (23).

5. The novel ceramic multilayer packaging structure of claim 4, wherein: the ceramic substrate is characterized in that a frame groove (16) is formed in the position, located on the outer side of the conductive metal layer (12), of the top surface of the ceramic substrate (1), a plurality of metal frame layers (17) are fixedly embedded in the frame groove (16) respectively, the bottom surface of the dielectric layer (2) contacts with the top surface of the ceramic substrate (1), and a welding point part (3) is fixedly connected between the bottom end of the upper lead connecting end (23) and the conductive metal layer (12).

6. The novel ceramic multilayer package structure of claim 1, wherein: the lower lead part (14), the upper lead part (22), the upper lead connecting end (23) and the lower lead connecting end (15) are all made of silver.