CN209328940U - LED light source with 3030 patches - Google Patents
LED light source with 3030 patches Download PDFInfo
- Publication number
- CN209328940U CN209328940U CN201920062958.1U CN201920062958U CN209328940U CN 209328940 U CN209328940 U CN 209328940U CN 201920062958 U CN201920062958 U CN 201920062958U CN 209328940 U CN209328940 U CN 209328940U
- Authority
- CN
- China
- Prior art keywords
- mirror
- base board
- aluminum base
- surface aluminum
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 40
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 238000005538 encapsulation Methods 0.000 claims abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000006071 cream Substances 0.000 claims abstract description 5
- 238000005476 soldering Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 abstract description 9
- 241000218202 Coptis Species 0.000 abstract description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 abstract description 4
- 238000005219 brazing Methods 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000243 photosynthetic effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model discloses a kind of LED light sources with 3030 patches, including mirror-surface aluminum base board, mirror-surface aluminum base board is set as being provided with box dam on strip structure and its surface, positive terminal pad and negative terminal pad are provided at box dam in mirror-surface aluminum base board, the area strip circuit a and the area strip circuit b are provided in box dam, the LED wafer for being provided with 1 row between the area strip circuit a and the area strip circuit b and being evenly distributed, LED wafer upside-down mounting setting, LED wafer is by the reflow soldering of high thermal conductivity tin cream in mirror-surface aluminum base board, it is located at LED wafer above and around in box dam and is provided with encapsulation glue-line；The utility model is by setting thin strip structure for mirror-surface aluminum base board, it is evenly distributed with row's flip chip up and down in aluminum substrate, it is connected using no gold thread, failure of not breaking, more reliable performance, heat source is closer away from substrate, thermally conductive faster, brazing metal is thermally conductive, eliminates hot bottleneck, low thermal resistance facilitates multiple COB light source curtain to be mounted in curtain frame.
Description
Technical field
The utility model belongs to the technical field of the lighting device and system that generate the illuminating effect of variation, specifically relates to
And a kind of LED light source with 3030 patches with high photosynthetic efficiency low cost.
Background technique
Currently, paster light source becomes the mainstream of current encapsulation with its unique advantage, the extensive use of product is also patch
Piece encapsulation brings unprecedented development, but almost all of patch products forming defects problem is always generally existing,
Its existing defect are as follows:
1. rack space limits, influence large size chip and put, limits light efficiency；
2. bracket reflecting layer is electrosilvering, intolerant to vulcanization；
3. bracket supplied materials is stringent for storage-space requirement, more sensitive to temperature and humidity, easily aoxidize.
Summary of the invention
In view of this, 3030 should be had the purpose of this utility model is to provide a kind of LED light source with 3030 patches
The LED light source of patch is evenly distributed with row's flip chip by setting thin strip structure for mirror-surface aluminum base board, in aluminum substrate up and down, adopts
It being connected with no gold thread, failure of not breaking, more reliable performance, heat source is closer away from substrate, and thermally conductive faster, brazing metal is thermally conductive,
Hot bottleneck is eliminated, low thermal resistance facilitates multiple COB light source curtain to be mounted in curtain frame.
In order to achieve the above object, a kind of LED light source with 3030 patches of the utility model, including mirror-surface aluminum base board,
The mirror-surface aluminum base board is set as being provided with box dam on strip structure and its surface, sets at box dam in the mirror-surface aluminum base board
It is equipped with positive terminal pad and negative terminal pad, the area strip circuit a connecting with positive terminal pad is provided in the box dam and is welded with cathode
The area strip circuit b of disk connection, the LED for being provided with 1 row between the area the strip circuit a and the area strip circuit b and being evenly distributed
Chip, the LED wafer upside-down mounting setting, the LED wafer passes through the reflow soldering of high thermal conductivity tin cream in mirror-surface aluminum base board, described
It is located at LED wafer above and around in box dam and is provided with encapsulation glue-line.
Further, the positive terminal pad and negative terminal pad are located at the two sides of the mirror-surface aluminum base board.
Further, the two sides of the mirror-surface aluminum base board are additionally provided with conductive copper sheet, and the conductive copper sheet is respectively welded at just
On pole pad and negative terminal pad.
Further, kept apart between the area the strip circuit a and the area strip circuit b by isolating trenches.
Further, the isolating trenches distance is set as 4-6mm.
Further, the two sides of the mirror-surface aluminum base board are provided with mounting hole.
The utility model has the beneficial effects that:
1, the utility model with 3030 patches LED light source by setting thin strip structure for mirror-surface aluminum base board,
Aluminum substrate is evenly distributed with row's flip chip up and down, is connected using no gold thread, failure of not breaking, more reliable performance, heat source is away from substrate
Closer, thermally conductive faster, brazing metal is thermally conductive, eliminates hot bottleneck, and low thermal resistance facilitates multiple COB light source curtain to be mounted on curtain frame
On；
2, the mirror-surface aluminum base board of LED light source of the utility model with 3030 patches is that both sides folder is surveyed, and chip-bracket-dissipates
Hot device.
3, bracket is 98% using its reflectivity of mirror surface aluminum frame, and mirror surface aluminum frame has high heat resistance, and anti-UV, brightness is high,
Logical high current, it is small in size the features such as；
4, doing 1W luminous efficiency of source using the highlighted chip of such bracket appropriate mix size can be in original 180lm/W light efficiency base
10% is promoted on plinth, reaches 200lm/W.
5,10% can be being improved plus original mould top dispensing technology, is reaching 210-220lm/W.
Detailed description of the invention
In order to keep the purpose of this utility model, technical scheme and beneficial effects clearer, the utility model provides as follows
Attached drawing is illustrated:
Fig. 1 is the structural schematic diagram for curtain LED light；
Fig. 2 is the structural schematic diagram of LED light source of the utility model with 3030 patches；
Fig. 3 is the installation place cross-sectional view of LED light source of the utility model with 3030 patches.
Appended drawing reference: 1- mirror-surface aluminum base board；2- positive terminal pad；3- negative terminal pad；4-LED chip；5- isolating trenches；6- installation
Hole；7- conductive copper sheet.
Specific embodiment
Below in conjunction with attached drawing, the preferred embodiment of the utility model is described in detail.
The structural schematic diagram of LED light source for the utility model with 3030 patches as shown in figure 1-3；The utility model one
Kind has the LED light source of 3030 patches, including mirror-surface aluminum base board 1, the mirror-surface aluminum base board 1 are set as strip structure and its surface
On be provided with box dam, positive terminal pad 2 and negative terminal pad 3 are provided in the mirror-surface aluminum base board 1 at box dam, in the box dam
The area strip circuit b for being provided with the area strip circuit a connecting with positive terminal pad 2 and being connect with negative terminal pad 3, the strip circuit
The LED wafer 4 for being provided with 1 row between the area a and the area strip circuit b and being evenly distributed, 4 upside-down mounting of the LED wafer setting are described
LED wafer 4 in mirror-surface aluminum base board 1, is located at LED wafer above and around by the reflow soldering of high thermal conductivity tin cream in the box dam
It is provided with encapsulation glue-line.
By setting thin strip structure for mirror-surface aluminum base board in the present embodiment, it is brilliant that it is evenly distributed with row's upside-down mounting up and down in aluminum substrate
Piece, is connected using no gold thread, and failure of not breaking, more reliable performance, heat source is closer away from substrate, thermally conductive faster, brazing metal
It is thermally conductive, hot bottleneck is eliminated, low thermal resistance facilitates multiple COB light source curtain to be mounted on Film rolling up frame.
It is import high thermal conductivity mirror-surface aluminum base board that LED substrate is used in the present embodiment, and reflectivity is led up to 98% or more using height
Hot tin cream, thermal coefficient reach 50-70w/m.k, and fusing point is 217-220 DEG C, particle size 10-20um, and chip uses average mark
Cloth, it is uniform to use light distribution, is easier to secondary optical lens, 250 DEG C of high temperature resistant fast sedimentation glue, pad design can match
102114302235mil equal-specification chip.
Further, the positive terminal pad 2 and negative terminal pad 3 are located at the two sides of the mirror-surface aluminum base board, the mirror surface aluminium base
The two sides of plate are additionally provided with conductive copper sheet 7, and the conductive copper sheet is respectively welded in positive terminal pad and negative terminal pad, and the structure is logical
It crosses Film rolling up frame two sides flexible hose structure, electric wire is accessed by flexible wire and compresses the copper sheet being bonded with conductive copper sheet 7, convenient
Power supply is accessed, electrical safety of leaking electricity and improve is avoided.
Further, kept apart between the area the strip circuit a and the area strip circuit b by isolating trenches 5.
Further, 5 distance of isolating trenches is set as 4-6mm.
Further, the two sides of the mirror-surface aluminum base board 1 are provided with mounting hole 6, and the present embodiment is coupled hole 6 by bolt
Mirror-surface aluminum base board 1 is pressed on Film rolling up frame, while compresses conductive copper sheet 7 on the copper sheet being fitted on Film rolling up frame, is conveniently connect
Enter power supply, improves energization safety.
The utility model has the LED light source integrated manufacturing process of 3030 patches, comprising steps of
A it) chooses specular aluminium bottom folder and surveys bracket；
B) suitable luminescent wafer is fixed with plate；
C) LED after the die bond qualified to detection carries out bonding wire:
D a powder) is carried out to the good material of bonding wire；
E dispensing) is carried out to material after powder, carries out baking-curing:
F) finished product is carried out to light test.
Wherein packaging plastic, material are that phenyl height rolls over silicon resin glue, have light transmittance high, and weatherability is good, can -60 DEG C~
Turning high temperature after outdoor use, low-temperature bake solidification for a long time at 250 DEG C discharges internal stress completely, reduces thermal expansion, is promoted
Properties of product significantly improve LED product cost performance.
Finally, it is stated that preferred embodiment above is merely intended for describing the technical solutions of the present application, but not for limiting the present application, to the greatest extent
Pipe has been described in detail the utility model by above preferred embodiment, but those skilled in the art should manage
Solution, can make various changes, without departing from the utility model claims book institute to it in the form and details
The range of restriction.
Claims (6)
1. a kind of LED light source with 3030 patches, including mirror-surface aluminum base board, it is characterised in that: the mirror-surface aluminum base board setting
To be provided with box dam on strip structure and its surface, positive terminal pad and cathode are provided at box dam in the mirror-surface aluminum base board
Pad, the strip circuit b for being provided with the area strip circuit a connecting with positive terminal pad and being connect with negative terminal pad in the box dam
Area, the LED wafer for being provided with 1 row between the area the strip circuit a and the area strip circuit b and being evenly distributed, the LED wafer are fallen
Installing is set, and the LED wafer in mirror-surface aluminum base board, is located at LED wafer by the reflow soldering of high thermal conductivity tin cream in the box dam
Above and around is provided with encapsulation glue-line.
2. a kind of LED light source with 3030 patches as described in claim 1, it is characterised in that: the positive terminal pad and negative
Pole pad is located at the two sides of the mirror-surface aluminum base board.
3. a kind of LED light source with 3030 patches as claimed in claim 1 or 2, it is characterised in that: the mirror-surface aluminum base board
Two sides be additionally provided with conductive copper sheet, the conductive copper sheet is respectively welded in positive terminal pad and negative terminal pad.
4. a kind of LED light source with 3030 patches as claimed in claim 3, it is characterised in that: the area the strip circuit a and
Strip circuit b is kept apart between area by isolating trenches.
5. a kind of LED light source with 3030 patches as claimed in claim 4, it is characterised in that: the isolating trenches distance is set
It is set to 4-6mm.
6. a kind of LED light source with 3030 patches as claimed in claim 1 or 2, it is characterised in that: the mirror-surface aluminum base board
Two sides be provided with mounting hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920062958.1U CN209328940U (en) | 2019-01-15 | 2019-01-15 | LED light source with 3030 patches |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920062958.1U CN209328940U (en) | 2019-01-15 | 2019-01-15 | LED light source with 3030 patches |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209328940U true CN209328940U (en) | 2019-08-30 |
Family
ID=67731311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920062958.1U Expired - Fee Related CN209328940U (en) | 2019-01-15 | 2019-01-15 | LED light source with 3030 patches |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209328940U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112071972A (en) * | 2020-09-04 | 2020-12-11 | 谷麦光电科技股份有限公司 | LED integrated light source manufacturing process and LED integrated light source |
-
2019
- 2019-01-15 CN CN201920062958.1U patent/CN209328940U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112071972A (en) * | 2020-09-04 | 2020-12-11 | 谷麦光电科技股份有限公司 | LED integrated light source manufacturing process and LED integrated light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190830 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |