CN207165566U - A kind of LED light source structure - Google Patents
A kind of LED light source structure Download PDFInfo
- Publication number
- CN207165566U CN207165566U CN201720669318.8U CN201720669318U CN207165566U CN 207165566 U CN207165566 U CN 207165566U CN 201720669318 U CN201720669318 U CN 201720669318U CN 207165566 U CN207165566 U CN 207165566U
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- Prior art keywords
- led
- light source
- area
- source structure
- led light
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Links
- 239000013078 crystal Substances 0.000 claims abstract description 37
- 239000003292 glue Substances 0.000 claims abstract description 24
- 238000005538 encapsulation Methods 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 230000005619 thermoelectricity Effects 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 230000001788 irregular Effects 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 235000003392 Curcuma domestica Nutrition 0.000 description 1
- 244000008991 Curcuma longa Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000003373 curcuma longa Nutrition 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 235000013976 turmeric Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED light source structure.The LED light source structure includes crystal bonding area, box dam is provided with around the crystal bonding area, the crystal bonding area includes low colour temperature area and high color temperature area, the low colour temperature area is strip and is located at the middle part of the crystal bonding area, one section of preset distance is reserved between the one end in the low colour temperature area and the box dam, so that secondary fluorescent glue for dispensing glue can be flowed with both sides during encapsulation.In LED light source structure of the present utility model, between low colour temperature area and box dam reserve a segment distance so that the fluorescent glue in high color temperature area can left and right flowing, to solve the problems, such as both sides irregular colour.
Description
Technical field
It the utility model is related to a kind of light emitting diode in lighting technical field, more particularly to a kind of LED light sources knot
Structure.
Background technology
Current LED light source structure includes COB light source, and COB light source is that the minute surface of high reflecting rate is placed directly against in LED chip
Specular removal on metal substrate integrates area source technology, and this technology eliminates support concept, electroless plating, without Reflow Soldering, without paster
Process, therefore process reduces nearly 1/3rd, cost also saves 1/3rd.
In the process that LED makes, the inequality of fluorescent glue can cause the color on both sides to have serious aberration, middle first dispensing
Afterwards, the bad control of dispensing glue amount behind both sides, can not also confirm color when it is tested, and color is observed only after finished product is lighted
It can find.If the dispensing of both sides elder generation, it is middle after dispensing can cause middle fluorescence glue sticking is insecure, the difficult control of initial workpiece, finished product glue
Amount is high, irregular colour is even.
Therefore, above-mentioned technical problem needs to solve.
Utility model content
For overcome the deficiencies in the prior art, the utility model proposes a kind of LED light source structure, it is intended to solves LED light source
The problem of irregular colour.
In order to solve above-mentioned technical problem, the utility model proposes basic technical scheme be：
A kind of LED light source structure, including crystal bonding area, box dam is provided with around the crystal bonding area, and the crystal bonding area includes low
Colour temperature area and high color temperature area, the low colour temperature area be strip and positioned at the crystal bonding area middle part, the one of the low colour temperature area
One section of preset distance is reserved between end and the box dam, so that secondary fluorescent glue for dispensing glue can be flowed with both sides during encapsulation.
Wherein, the preset distance is 1-1.5mm.
Wherein, the LED light source structure also includes LED-baseplate and LED wafer, is provided with the LED-baseplate described solid
Crystalline region, some LED wafers are adhesively fixed on the crystal bonding area by crystal-bonding adhesive.
Wherein, the material of the crystal-bonding adhesive is pure silicon.
Wherein, for the LED-baseplate using thermoelectricity separation sheet material, the LED-baseplate is 1700AG HP aluminium bases.
Wherein, the area of the bottom surface pad of the LED wafer is more than or equal to the base area of the LED wafer.
Wherein, after the LED wafer is fixed on the crystal bonding area, the crystal-bonding adhesive arrives the 1/4 of the LED wafer height
1/3 position.
Wherein, the LED light source structure also includes the radiator below the LED-baseplate.
Wherein, the LED light source structure also includes the resistance pad being arranged on the outside of the crystal bonding area and is arranged on described
Built-in wire welding area on the inside of box dam, the side outside the crystal bonding area are provided with positive terminal pad, and opposite side is provided with negative terminal pad.
The beneficial effects of the utility model are：The utility model proposes a kind of LED light source structure.The LED light-source structure bags
Crystal bonding area is included, box dam is provided with around the crystal bonding area, the crystal bonding area includes low colour temperature area and high color temperature area, the low colour temperature
Area be strip and positioned at the crystal bonding area middle part, between the one end in the low colour temperature area and the box dam reserve one section it is preset
Distance, so that secondary fluorescent glue for dispensing glue can be flowed with both sides during encapsulation.In LED light source structure of the present utility model, low
Between colour temperature area and box dam reserve a segment distance so that the fluorescent glue in high color temperature area can left and right flowing, to solve both sides color
The problem of uneven.
Brief description of the drawings
, below will be to the utility model embodiment in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
The required accompanying drawing used is briefly described in description, it should be apparent that, drawings in the following description are only that this practicality is new
Some embodiments of type, for those of ordinary skill in the art, on the premise of not paying creative work, can be with root
Other accompanying drawings are obtained according to the content of the utility model embodiment and these accompanying drawings.
Fig. 1 is a kind of structural representation of the LED light source structure provided in the utility model specific embodiment.
Drawing reference numeral explanation：
| Label | Title | Label | Title |
| 10 | Crystal bonding area | 11 | Low colour temperature area |
| 12 | High color temperature area | 20 | Box dam |
| 30 | LED wafer | 40 | Resistance pad |
| 50 | Built-in wire welding area | 60 | Positive terminal pad |
| 70 | Negative terminal pad |
Embodiment
The technical scheme in the embodiment of the utility model is clearly and completely described below in conjunction with accompanying drawing 1, shown
So, described embodiment is only part of the embodiment of the present utility model, rather than whole embodiments.Based on this practicality
Embodiment in new, the every other reality that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example is applied, belongs to the scope of the utility model protection.
If it is to be appreciated that related in the utility model embodiment directionality instruction (such as upper and lower, left and right, it is preceding,
Afterwards ...), then directionality instruction be only used for explain it is relative between each part under a certain particular pose (as shown in drawings)
Position relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith.
As shown in figure 1, the present embodiment provides a kind of LED light source structure, including crystal bonding area 10, set around the crystal bonding area 10
Box dam 20 is equipped with, the crystal bonding area 10 includes low colour temperature area 11 and high color temperature area 12, and the low colour temperature area 11 is strip and position
One section of preset distance is reserved between the middle part of the crystal bonding area 10, the one end in the low colour temperature area 11 and the box dam 20, with
Secondary fluorescent glue for dispensing glue during encapsulation is set to be flowed with both sides.
Specifically, the low colour temperature fluorescent material of point in low colour temperature area 11, the low colour temperature fluorescent material of point in high color temperature area 12.Enter one
Step, the LED light source structure in the present embodiment uses highly viscous fluorescent glue in encapsulation.
In the present embodiment, the preset distance is 1-1.5mm.
LED light source structure in the present embodiment, in addition to LED-baseplate and LED wafer 30, it is provided with the LED substrates
The crystal bonding area 10, some LED wafers 30 are adhesively fixed on the crystal bonding area 10 by crystal-bonding adhesive.
In the present embodiment, the crystal-bonding adhesive is white glue, it is preferred that the material of the white glue is pure silicon.
In the present embodiment, for the LED-baseplate using thermoelectricity separation sheet material, the LED-baseplate is 1700AG HP aluminium bases.
Between thermoelectricity separation sheet material reduces light source surface temperature 10-15 degree, so that light source reliability is lifted；Thermoelectricity separation material is compared
Common aluminium sheet has cut middle insulating barrier, so heat-conducting effect is more preferable, service life is longer.
Further, the manufacturing cycle of LED product is shortened using thermoelectricity separation sheet material, simultaneously structure is solid to turmeric sheet material string
Fixed, that is to say, that string and structure are just known after client places an order, and thermoelectricity separation sheet material can then be stocked up in advance, make LED system
Cycle time is made to encapsulate to LED within the 1/2 of manufacture.
In the present embodiment, the area of the bottom surface pad of the LED wafer 30 is more than or equal to the bottom surface face of the LED wafer 30
Product, to meet radiating during LED formal dress chip normal works.
In the present embodiment, after the LED wafer 30 is fixed on the crystal bonding area 10, the crystal-bonding adhesive is in the LED wafer
1/4 to 1/3 position of 30 height.When the bottom of LED wafer 30 is stained with white glue completely, glue amount is high not above LED wafer 30
The 1/3 of degree, to prevent glue amount is too high from forming short circuit.
LED light source structure in the present embodiment, in addition to the radiator below the LED-baseplate.
LED light source structure in the present embodiment, in addition to be arranged on the resistance pad 40 in the outside of crystal bonding area 10 and set
The side put outside the built-in wire welding area 50 of the inner side of box dam 20, the crystal bonding area 10 is provided with positive terminal pad 60, opposite side
It is provided with negative terminal pad 70.
LED light source structure in the present embodiment includes crystal bonding area 10, box dam 20 being provided with around the crystal bonding area 10, described
Crystal bonding area 10 includes low colour temperature area 11 and high color temperature area 12, and the low colour temperature area 11 is strip and is located at the crystal bonding area 10
Middle part, one section of preset distance is reserved between the one end in the low colour temperature area 11 and the box dam 20, so that secondary dispensing during encapsulation
Fluorescent glue can be flowed with both sides.In LED light source structure of the present utility model, reserved between low colour temperature area 11 and box dam 20
One segment distance so that the fluorescent glue in high color temperature area 12 can left and right flowing, to solve the problems, such as both sides irregular colour, reduce material
The waste of material, using effect is more preferably.
The announcement and teaching of book according to the above description, the utility model those skilled in the art can also be to above-mentioned realities
The mode of applying is changed and changed.Therefore, the utility model is not limited to embodiment disclosed and described above, right
Some modifications and changes of the present utility model should also be as falling into scope of the claims of the present utility model.In addition, to the greatest extent
Some specific terms have been used in pipe this specification, but these terms are merely for convenience of description, not to the utility model
Form any restrictions.
Claims (9)
1. a kind of LED light source structure, it is characterised in that including crystal bonding area (10), box dam is provided with around the crystal bonding area (10)
(20), the crystal bonding area (10) includes low colour temperature area (11) and high color temperature area (12), the low colour temperature area (11) be strip and
Positioned at the middle part of the crystal bonding area (10), between one end of the low colour temperature area (11) and the box dam (20) reserve one section it is preset
Distance, so that secondary fluorescent glue for dispensing glue can be flowed with both sides during encapsulation.
2. LED light source structure according to claim 1, it is characterised in that the preset distance is 1-1.5mm.
3. LED light source structure according to claim 1, it is characterised in that also including LED-baseplate and LED wafer (30), institute
State and the crystal bonding area (10) is provided with LED-baseplate, some LED wafers (30) are adhesively fixed on described solid by crystal-bonding adhesive
Crystalline region (10).
4. LED light source structure according to claim 3, it is characterised in that the material of the crystal-bonding adhesive is pure silicon.
5. LED light source structure according to claim 3, it is characterised in that the LED-baseplate separates sheet material using thermoelectricity,
The LED-baseplate is 1700AG HP aluminium bases.
6. LED light source structure according to claim 3, it is characterised in that the face of the bottom surface pad of the LED wafer (30)
Base area of the product more than or equal to the LED wafer (30).
7. LED light source structure according to claim 3, it is characterised in that the LED wafer (30) is fixed on the die bond
Behind area (10), the crystal-bonding adhesive is in 1/4 to 1/3 position of the LED wafer (30) height.
8. LED light source structure according to claim 3, it is characterised in that also include dissipating below the LED-baseplate
Hot device.
9. LED light source structure according to claim 1, it is characterised in that also include being arranged on the crystal bonding area (10) outside
The resistance pad (40) of side and the built-in wire welding area (50) being arranged on the inside of the box dam (20), the crystal bonding area (10) outside one
Side is provided with positive terminal pad (60), and opposite side is provided with negative terminal pad (70).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720669318.8U CN207165566U (en) | 2017-06-09 | 2017-06-09 | A kind of LED light source structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720669318.8U CN207165566U (en) | 2017-06-09 | 2017-06-09 | A kind of LED light source structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207165566U true CN207165566U (en) | 2018-03-30 |
Family
ID=61710495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720669318.8U Expired - Fee Related CN207165566U (en) | 2017-06-09 | 2017-06-09 | A kind of LED light source structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207165566U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110047824A (en) * | 2019-04-04 | 2019-07-23 | 深圳市立洋光电子股份有限公司 | Double-colored temperature COB light source and its manufacturing method |
| CN111554787A (en) * | 2020-05-15 | 2020-08-18 | 珠海市宏科光电子有限公司 | COB structure packaging process convenient for dimming and color mixing |
-
2017
- 2017-06-09 CN CN201720669318.8U patent/CN207165566U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110047824A (en) * | 2019-04-04 | 2019-07-23 | 深圳市立洋光电子股份有限公司 | Double-colored temperature COB light source and its manufacturing method |
| CN111554787A (en) * | 2020-05-15 | 2020-08-18 | 珠海市宏科光电子有限公司 | COB structure packaging process convenient for dimming and color mixing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180330 |