CN206003809U

CN206003809U - Formal dress flip LED chip packaging body and its application

Info

Publication number: CN206003809U
Application number: CN201620929338.XU
Authority: CN
Inventors: 郑敏
Original assignee: Xiamen Zhong Xinda Ltd
Current assignee: Xiamen Zhong Xinda Ltd
Priority date: 2016-08-24
Filing date: 2016-08-24
Publication date: 2017-03-08
Anticipated expiration: 2026-08-24

Abstract

The utility model discloses a kind of formal dress flip LED chip packaging body and its application，This packaging body includes the circuit base plate located at bottom、Epitaxial chip、And fluorescent coating，Conductive silver glue or tin cream are printed with described circuit base plate，Epitaxial chip has transparent substrates、N electron layer and P electronic shell，N electron layer is in transparent substrates，This N electron layer has high-end and low side，Described P electronic shell located at this N electron layer high-end on，This P electronic shell is provided with P electrode，The low side of N electrode is provided with N electrode，The top of this P electrode is concordant with the top of N electrode，The area of P electrode and N electrode accounts for the 1/8 1/3 of this epitaxial chip light shield area respectively，The P electrode of this epitaxial chip and N electrode flip are on the conductive silver glue or tin cream of circuit base plate，Described fluorescent coating is covered in the transparent substrates top of circuit base plate and epitaxial chip.This utility model processing procedure is simple, and heat conductivity is good, and packaging cost is relatively low, can produce beneficial to rapid, high volume metaplasia.

Description

Formal dress flip LED chip packaging body and its application

Technical field

This utility model is related to a kind of technical field of light emitting diode, particularly relates to a kind of formal dress flip LED chip envelope Dress body and its application.

Background technology

At present, the common chip within LED lamp has two kinds, and one kind is positive cartridge chip, and another kind is flip-chip.

Up, material is formal dress chip electrode from top to bottom：P electrode, luminescent layer, N electrode, substrate.Existing formal dress LED chip needs to carry out gold thread welding processing procedure, its high cost, and processing procedure can lead to the easy rosin joint of gold thread because of expanding with heat and contract with cold of encapsulation Open circuit, gold thread shading luminosity is relatively low, simultaneously because the solder joint of gold thread is less, heat conductivity can be made poor.

In order to improve the luminous efficiency of chip, technical staff have developed flip-chip.The substrate of flip-chip is stripped, core Sheet material is transparent, so that the light that luminescent layer inspires directly is sent from the another side of electrode.Although flip-chip is in luminous effect Advantage is existed on rate, but the price of flip-chip is higher, the technique preparing LED filament is also more complicated, cause the big of production cost Width rises.

At present, some existing formal dress are inverted the LED of chip on the market, and it needs first to carry out stannum in circuit and chip electrode Cream point postwelding polishes, simultaneously because chip electrode face is little, such spot welding process rate uniformity is not high, and when attaching, holds very much Easily occur tin cream and electrode points not in contact with situation, lead to cannot turn between chip and circuit, and then lead to LED chip to go out Occurrence product, still make production cost be difficult to reduce, in addition this processing procedure is more time-consuming, unfavorable a large amount of productions.

In view of this, the design people is directed to and does not attain perfect led to many disappearances and inconvenience in above-mentioned LED chip design, And deeply conceive, and positive research improvement has a fling at and develops and design this utility model.

Utility model content

The purpose of this utility model is to provide a kind of processing procedure simple, and heat conductivity is good, and packaging cost is relatively low, can be beneficial to quick The formal dress flip LED chip packaging body of large production and its application.

In order to reach above-mentioned purpose, solution of the present utility model is：

A kind of formal dress flip LED chip packaging body, it includes circuit base plate located at bottom, epitaxial chip and fluorescent glue Film, described circuit base plate is printed with conductive silver glue or tin cream, and described epitaxial chip has transparent substrates, N electron layer and P electronics Layer, in transparent substrates, this N electron layer has high-end and low side to described N electron layer, and described P electronic shell is located at this N electron layer High-end on, this P electronic shell is provided with P electrode, and the low side of N electrode is provided with N electrode, the top of this P electrode and the top of N electrode Hold level with both hands neat, the area of described P electrode and described N electrode accounts for the 1/8-1/3 of this epitaxial chip light shield area, this epitaxial chip respectively P electrode and N electrode flip on the conductive silver glue or tin cream of circuit base plate, described fluorescent coating is covered in circuit base plate and outer Prolong the transparent substrates top of chip.

Further, the electrode of described epitaxial chip is in the square structure of diagonal setting.

Further, the material of described N electrode and P electrode is metal：Any one in gold, silver, nickel, aluminum.

After said structure, this utility model formal dress flip LED chip packaging body and its application mainly use especially It is gold-plated that the increasing epitaxial chip of electrode of design and the termination electrode that this epitaxial chip is had electrode altitude difference carry out electric polarization Processing procedure, allows epitaxial chip electrode have larger area and sustained height, so directly utilize mode of printing can quickly by Conductive connecting material is covered with, and increases processing procedure summary, and the large electrode cooperation of chip, solves the cost of existing encapsulation simultaneously Height, the shortcomings of processing procedure is complicated, and heat conduction is poor, and can produce beneficial to rapid, high volume metaplasia, need with the small electrode construction of existing chip Want the packaged type of gold thread welding entirely different.

Brief description

Fig. 1 is the front view of this utility model epitaxial chip.

Fig. 2 is the side view of this utility model epitaxial chip.

Fig. 3 is the side view of this utility model circuit base plate.

Fig. 4 is the top view of this utility model circuit base plate.

Fig. 5 is the partial enlarged drawing of Fig. 4.

Fig. 6 prints the side view of elargol or tin cream for this utility model on circuit base plate.

Fig. 7 is the local overlooking enlarged drawing of Fig. 6.

Fig. 8 is the side view of this utility model flip epitaxial chip.

Fig. 9 is the local overlooking enlarged drawing of Fig. 8.

Figure 10 covers the side view of fluorescent coating for this utility model.

Figure 11 is the close-up schematic view of Figure 10.

Specific embodiment

In order to the technical solution of the utility model is explained further, this utility model is entered below by specific embodiment Row elaborates.

As shown in Figure 1 to 11, this utility model discloses a kind of formal dress flip LED chip packaging body, and it includes having The substrate 1 of circuit 11（As shown in Figures 3 to 5）, epitaxial chip 2（As shown in Figures 1 and 2）, and fluorescent coating 3（As Figure 10 and Shown in Figure 11）, described circuit base plate 1 is printed with conductive silver glue or tin cream 4, described epitaxial chip 2 has transparent substrates 21, N Electronic shell 22 and P electronic shell 23, in transparent substrates 21, this N electron layer 22 has high-end and low side to described N electron layer 22, Described P electronic shell 23 located at this N electron layer 22 high-end on, this P electronic shell 23 is provided with P electrode 231, the low side of N electrode 221 It is provided with N electrode 221, the top of this P electrode 231 is concordant with the top of N electrode 221, as illustrated, N electrode 221 and P electrode 231 can be arranged in diagonal, and respectively square, and the material of described N electrode 221 and P electrode 231 is metal：Gold, silver, nickel, aluminum In any one, the set location of electrode 221,231 and shape, be not limited thereto, described P electrode 231 and described N electrode 221 area accounts for the 1/8-1/3 of this epitaxial chip 2 light shield area respectively, and the P electrode 231 of this epitaxial chip 2 and N electrode 221 are covered Brilliant on the conductive silver glue or tin cream 4 of circuit base plate 1, described fluorescent coating 3 is covered in the saturating of circuit base plate 1 and epitaxial chip 2 Bright substrate 21 top.

Above-mentioned formal dress flip LED chip packaging body can be applicable to point source of light（Single led chip packing-body）, strip-shaped light source （I.e. linear light sorurce, multiple LED chip packaging bodies are in line）Or flat light source（Many according to different permutation and combination form multirows Row, send the light in variously-shaped face, form a face）.

The method for packing of above-mentioned formal dress flip LED chip packaging body, comprises the following steps：

A：On the line width pad of the corresponding LED chip size of transparency carrier, carry out the coating of elargol or tin cream, elargol Or the coated area of tin cream is the 1/8-1/3 of epitaxial chip light shield area；

B：Fluorescent powder membrane epitaxial chip electrode flip will be posted using bonder on corresponding para-position elargol or tin cream, this is outer The electrode area of the P electrode and N electrode of prolonging chip is the 1/8-1/3 of this epitaxial chip light shield area；

C：Carry out the laminating of preforming support；

D：Carry out reflow or baking；

E：Carry out the coating of fluorescent material；

F：Toasted；

G：The substrate that baking is completed is cut.

In step B, described elargol or tin cream are to be coated on substrate by way of printing or being coated with.

In step F, the coating of described fluorescent material is using any in pad pasting pressing, thermal transfer, dispensing, film top or printing A kind of mode.

In step G, described baking is to be toasted using infrared ray or intelligence control baking box.

In step H, described cutting is to be cut using laser or diamond jet cutting machine.

This utility model formal dress flip LED chip packaging body and its application mainly use specially designed increasing electrode Epitaxial chip and the termination electrode that this epitaxial chip is had electrode altitude difference carry out the gold-plated processing procedure of electric polarization, make epitaxial chip electric Have larger area and sustained height, so directly can quickly conductive connecting material be covered using mode of printing On, increase processing procedure summary, the large electrode cooperation of chip, solves the high cost of existing encapsulation, processing procedure is complicated, and heat conduction simultaneously Poor the shortcomings of, and can produce beneficial to rapid, high volume metaplasia, the encapsulation side of gold thread welding is needed with the small electrode construction of existing chip Formula is entirely different.

Above-described embodiment and schema non-limiting product form of the present utility model and style, any art Suitable change or modification that those of ordinary skill is done to it, all should be regarded as without departing from patent category of the present utility model.

Claims

1. a kind of formal dress flip LED chip packaging body, it includes circuit base plate located at bottom, epitaxial chip and fluorescent coating, Conductive silver glue or tin cream are printed with described circuit base plate, described epitaxial chip has transparent substrates, N electron layer and P electronic shell, In transparent substrates, this N electron layer has high-end and low side to described N electron layer, and described P electronic shell is located at this N electron layer On high-end, this P electronic shell is provided with P electrode, and the low side of N electrode is provided with N electrode, the top of this P electrode and the top of N electrode Concordantly, the area of described P electrode and described N electrode accounts for the 1/8-1/3 of this epitaxial chip light shield area respectively, this epitaxial chip , on the conductive silver glue or tin cream of circuit base plate, described fluorescent coating is covered in circuit base plate and extension for P electrode and N electrode flip The transparent substrates top of chip.

2. formal dress flip LED chip packaging body as claimed in claim 1 it is characterised in that：The N electrode of described epitaxial chip and P electrode is in the square structure of diagonal setting.

3. a kind of application of formal dress flip LED chip packaging body as claimed in claim 1 it is characterised in that：This formal dress flip LED chip packaging body is applied to any one in point source of light, strip-shaped light source or flat light source.