CN206098439U

CN206098439U - Exempt from bonding wire formal dress LED chip

Info

Publication number: CN206098439U
Application number: CN201620929684.8U
Authority: CN
Inventors: 郑敏
Original assignee: Xiamen Zhong Xinda Ltd
Current assignee: Xiamen Zhong Xinda Ltd
Priority date: 2016-08-24
Filing date: 2016-08-24
Publication date: 2017-04-12
Anticipated expiration: 2026-08-24

Abstract

The utility model discloses an exempt from bonding wire formal dress LED chip, it is including the sapphire base plate line base plate, N electronic shell, P electronic shell that locate the bottom, and protective layer, and this line base plate top is located to the N electronic shell, and this N electronic shell has high -endly and the low side, and the P electronic shell is equipped with the P electrode on locating this N electronic shell high -end in this P electronic shell, be equipped with the N electrode on the low side of N electronic shell, and the protective layer cladding is in the outside of P electrode and N electrode, the P electrode reaches does the surface integral of N electrode do not account for 18 of this LED chip light shield area 1 3. The utility model discloses utilizing special design's increasing electrode and carrying on electrode chemical plating gold to another termination electrode that has the electrode difference in height, let the chip electrode have great area and same height, increase processing procedure simplification, the big electrode of chip can increase area of contact simultaneously, and is easy to be solid brilliant, avoids rosin joint, dummy solder joint's possibility, effectively reduces the impedance.

Description

Exempt from bonding wire packed LED chip

Technical field

The utility model is related to a kind of technical field of LED chip, particularly relates to one kind and exempts from bonding wire formal dress LTD chips.

Background technology

At present, the chip inside common LED filaments has two kinds, and one kind is positive cartridge chip, and another kind is flip-chip.

Up, from top to bottom material is formal dress chip electrode：P electrodes, luminescent layer, N electrodes, substrate.Existing formal dress LED chips need to carry out gold thread welding processing procedure, its high cost, and processing procedure can cause gold thread easily empty because of expanding with heat and contract with cold for encapsulation Weldering open circuit, gold thread shading luminosity is relatively low, simultaneously because the solder joint of gold thread is less, thermal conductivity can be made poor.

In order to improve the luminous efficiency of chip, technical staff have developed flip-chip.The substrate of flip-chip is stripped, core Sheet material is transparent, the light that luminescent layer is inspired directly is sent from the another side of electrode.Although flip-chip is in luminous effect There is advantage in rate, but the price of flip-chip is higher, and the technique for preparing LED filaments is also more complicated, causes the big of production cost Width rises.

At present, on the market some existing formal dress are inverted the LED of chip, and it needs first to carry out tin in circuit and chip electrode Cream point postwelding is polished, simultaneously because chip electrode face is little, such spot welding process rate uniformity is not high, and when attaching, is held very much Easily occur tin cream and electrode points not in contact with situation, cause to be turned between chip and circuit, and then cause LED chips to go out Occurrence product, still make production cost be difficult to reduce, and in addition the processing procedure more takes, unfavorable a large amount of productions.

In view of this, the design people improves many disappearances and inconvenience caused by institute for not attaining in the design of above-mentioned LED chip, And deeply conceive, and actively research improvement has a fling at and develops and design the utility model.

Utility model content

The purpose of this utility model is that a kind of thermal conductivity of offer is good, and packaging cost is relatively low, can be beneficial to rapid, high volume metaplasia That what is produced exempts from bonding wire packed LED chip.

In order to reach above-mentioned purpose, solution of the present utility model is：

One kind exempts from bonding wire packed LED chip, it include located at the sapphire circuit base plate of bottom, N electronic shell, P electronic shell, And protective layer, above sapphire circuit base plate, the N electronic shell has high-end and low side, the P electronics to the N electronic shell Layer located at the N electronic shell it is high-end on, the P electronic shell is provided with P electrode, and the low side of N electronic shell is provided with N electrode, the guarantor Sheath is coated on the area in the outside of P electrode and N electrode, the P electrode and the N electrode and accounts for the LED chip light cover respectively Long-pending 1/8-1/3.

Further, the top of the P electrode and the top of N electrode are concordant.

Further, the area of the N electrode and P electrode is equal to the 1/6 of the LED chip light shield area.

Further, the N electrode and P electrode are square.

After said structure, the utility model is exempted from bonding wire packed LED chip and mainly increases electricity by specially designed Pole and another termination electrode for having electrode altitude difference is carried out electric polarization is gold-plated, allow chip electrode that there is larger area and same Highly, mode of printing so can be directly utilized, is quickly covered with conductive connecting material, increase processing procedure summary, while core The large electrode of piece can increase contact area, easy die bond, it is to avoid rosin joint, the possibility of dry joint, effectively reduce impedance, solve existing The shortcomings of LED chip cost of manufacture height, processing procedure is complicated, and heat conduction is poor, defect rate is high, the utility model can be beneficial to rapid, high volume Metaplasia is produced, and needs the mode that gold thread is welded entirely different with the small electrode of existing positive cartridge chip construction.

Description of the drawings

Fig. 1 is the front view of the utility model packed LED chip.

Fig. 2 is the side view of the utility model packed LED chip.

Specific embodiment

In order to the technical solution of the utility model is explained further, the utility model is entered below by specific embodiment Row is elaborated.

As shown in Figure 1 and Figure 2, the utility model exempts from bonding wire packed LED chip, and it includes the sapphire circuit located at bottom Substrate 1, N electronic shell 2, P electronic shell 3 and protective layer 4, the N electronic shell 2 is located at the top of circuit sapphire substrate 1, and the N is electric Sublayer 2 have high-end and low side, the P electronic shell 3 located at the N electronic shell 2 it is high-end on, the P electronic shell is provided with P electrode The low side of 31, N electronic shell 2 is provided with N electrode 21, and the protective layer 4 is coated on the outside of P electrode 31 and N electrode 21, the P The area of electrode 31 and the N electrode 21 accounts for respectively the 1/8-1/3 of the LED chip light shield area, preferably, the N electrode 21 And the area of P electrode 31 is equal to the 1/6 of the LED chip light shield area, as illustrated, in the embodiment of the present utility model, the N Electrode 21 and P electrode 31 are square, certainly, other shapes may also be employed, and are not limited with direction.

As shown in Fig. 2 the top of the P electrode 31 is concordant with the top of N electrode 21, make between N electrode 21 and P electrode 31 Without potential difference, when making the LED chip be applied to reverse installation process, due to there is no potential difference between P, N electrode, it is easier to die bond, keep away Exempt from rosin joint and dry joint, can also effectively reduce impedance.

The utility model is mainly by specially designed plus large electrode and another termination electrode for having an electrode altitude difference Carry out that electric polarization is gold-plated, allow chip electrode that there is larger area and sustained height, so can directly utilize mode of printing, quickly Conductive connecting material is covered with, increase processing procedure summary, it is easily solid while the large electrode of chip can increase contact area It is brilliant, it is to avoid rosin joint, the possibility of dry joint, impedance is effectively reduced, existing LED chip cost of manufacture height is solved, processing procedure is complicated, and leads The shortcomings of heat is poor, defect rate is high, the utility model can be produced beneficial to rapid, high volume metaplasia, the small electrode structure with existing positive cartridge chip Make the mode for needing gold thread to weld entirely different.

Above-described embodiment and schema and non-limiting product form of the present utility model and style, any art Appropriate change or modification that those of ordinary skill is done to it, all should be regarded as without departing from patent category of the present utility model.

Claims

1. one kind exempts from bonding wire packed LED chip, it is characterised in that include：Sapphire circuit base plate, N electronic shell located at bottom, P electronic shell and protective layer, the N electronic shell has high-end and low side, the P located at the circuit surface, the N electronic shell Electronic shell located at the N electronic shell it is high-end on, the P electronic shell is provided with P electrode, and the low side of N electronic shell is provided with N electrode, institute The area for stating the outside that protective layer is coated on P electrode and N electrode, the P electrode and the N electrode accounts for respectively the LED chip light The 1/8-1/3 of cover product.

2. bonding wire packed LED chip is exempted from as claimed in claim 1, it is characterised in that：The top of the P electrode and N electrode Top is concordant.

3. bonding wire packed LED chip is exempted from as claimed in claim 1 or 2, it is characterised in that：The area of the N electrode and P electrode Equal to the 1/6 of the LED chip light shield area.

4. bonding wire packed LED chip is exempted from as claimed in claim 1, it is characterised in that：The N electrode and P electrode are square.