CN209234104U - A kind of flexible circuit board with stiffening plate - Google Patents
A kind of flexible circuit board with stiffening plate Download PDFInfo
- Publication number
- CN209234104U CN209234104U CN201821632162.7U CN201821632162U CN209234104U CN 209234104 U CN209234104 U CN 209234104U CN 201821632162 U CN201821632162 U CN 201821632162U CN 209234104 U CN209234104 U CN 209234104U
- Authority
- CN
- China
- Prior art keywords
- stiffening plate
- copper
- ground connection
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
This application discloses a kind of flexible circuit board with stiffening plate, comprising: the first ground connection layers of copper is stacked the first PI cover film, conducting resinl, stiffening plate in the first ground connection layers of copper；Wherein, the first PI cover film has windowed regions, so that stiffening plate is bonded by windowed regions with the first ground connection layers of copper by conducting resinl.The application is provided with windowed regions due to the first PI cover film, stiffening plate can be bonded by windowed regions and the first ground connection layers of copper, stiffening plate is not only set to form good earthing effect, also help the discharge of heat and steam, and then flexible circuit board in electronic product production process can be reduced and sheet deformation occur, bubble and stiffening plate fall off and other issues, it avoids flexible circuit board and welds scrapping for material, improve the yield of product, production cost is reduced, the competitiveness of product in market is enhanced.
Description
Technical field
The utility model relates to wiring board production fields, more particularly to a kind of flexible circuit board with stiffening plate.
Background technique
Flexible circuit board (Flexible Printed Circuit, FPC) is primarily referred to as the printing electricity of substrate and hardboard
The different another kind of printed circuit board of road plate, it can be bent, wind, can be not empty by installation with installation space flexible topology
Between limitation, thus realize electronic component assembly connected with conducting wire it is integrated.Generally, the ground connection layers of copper and reinforcement of FPC
Plate (such as steel disc) is tightly bonded together by conducting resinl, and stiffening plate can become good Jie of internal heat dissipating and static conductive
Matter.
But in electronic product during manufacturing, FPC need to be by part high-temperature processing technology, such as the table of high temperature
Face package technique (Surface Mount Technology, SMT) soldered elements process, if the ground connection layers of copper and stiffening plate of FPC
Joint place closed area without heat dissipation well and the design of aproll vapour, the heated expanding gas in the inside and steam can not be arranged
Out, it will lead to FPC regional area bubble, sheet deformation occur, it is serious that stiffening plate is led to problems such as to fall off, make FPC product
It directly scraps, to reduce production yield, production cost is caused to increase.
Therefore, FPC how to be avoided sheet deformation occur, bubble and stiffening plate fall off and other issues, it is this field skill
Art personnel technical problem urgently to be resolved.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of flexible circuit board with stiffening plate, it can be in favor of heat
The discharge of amount and steam reduces flexible circuit board in electronic product production process and sheet deformation occurs, and bubble and stiffening plate are de-
Fall and other issues.Its concrete scheme is as follows:
A kind of flexible circuit board with stiffening plate, comprising: the first ground connection layers of copper is stacked in the first ground connection layers of copper
On the first PI cover film, conducting resinl, stiffening plate；Wherein,
The first PI cover film has windowed regions, so that the stiffening plate passes through the windowing by the conducting resinl
Region is bonded with the first ground connection layers of copper.
Preferably, in the above-mentioned flexible circuit board with stiffening plate provided by the embodiment of the utility model, the windowing area
Domain is located at the edge of the first PI cover film.
Preferably, in the above-mentioned flexible circuit board with stiffening plate provided by the embodiment of the utility model, further includes: be located at
The substrate of first ground connection layers of copper lower surface is grounded layers of copper positioned at the second of the substrate lower surface, and is located at described the
2nd PI cover film of two ground connection layers of copper lower surfaces；
The underface of the windowed regions has via hole；The via hole is through the first ground connection layers of copper, the base
Material and the second ground connection layers of copper.
Preferably, in the above-mentioned flexible circuit board with stiffening plate provided by the embodiment of the utility model, the via hole
Diameter be greater than or equal to 0.2mm.
Preferably, in the above-mentioned flexible circuit board with stiffening plate provided by the embodiment of the utility model, described first is connect
Ground layers of copper is latticed.
Preferably, in the above-mentioned flexible circuit board with stiffening plate provided by the embodiment of the utility model, described second is connect
Ground layers of copper is latticed.
Preferably, in the above-mentioned flexible circuit board with stiffening plate provided by the embodiment of the utility model, the stiffening plate
For steel plate.
A kind of flexible circuit board with stiffening plate provided by the utility model, comprising: the first ground connection layers of copper is stacked
The first PI cover film, conducting resinl, stiffening plate in the first ground connection layers of copper；Wherein, the first PI cover film has windowed regions, with
It is bonded stiffening plate by windowed regions with the first ground connection layers of copper by conducting resinl.The utility model is set due to the first PI cover film
Windowed regions are equipped with, stiffening plate can be bonded by windowed regions and the first ground connection layers of copper, not only be formed stiffening plate good
Good earthing effect, also helps the discharge of heat and steam, and then can reduce soft route in electronic product production process
There is sheet deformation in plate, and bubble and stiffening plate fall off and other issues, avoids flexible circuit board and welds the report of material
It is useless, the yield of product is improved, production cost is reduced, enhances the competitiveness of product in market.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 is one of the structural schematic diagram of flexible circuit board provided by the embodiment of the utility model with stiffening plate；
Fig. 2 is the second structural representation of the flexible circuit board provided by the embodiment of the utility model with stiffening plate；
Fig. 3 is the third structural representation of the flexible circuit board provided by the embodiment of the utility model with stiffening plate；
Fig. 4 is the top view of the first ground connection layers of copper provided by the embodiment of the utility model.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of flexible circuit board with stiffening plate, as shown in Figure 1, comprising: the first ground connection layers of copper 1,
It is stacked the first PI cover film 2, conducting resinl 3, stiffening plate 4 in the first ground connection layers of copper 1；Wherein,
First PI cover film 2 has windowed regions A, so that stiffening plate 4 passes through windowed regions A and first by conducting resinl 3
Layers of copper 1 is grounded to be bonded.
In the above-mentioned flexible circuit board with stiffening plate provided by the embodiment of the utility model, since the first PI cover film is set
Windowed regions are equipped with, stiffening plate can be bonded by windowed regions and the first ground connection layers of copper, not only be formed stiffening plate good
Good earthing effect, also helps the discharge of heat and steam.
Further, in the specific implementation, in the above-mentioned soft route with stiffening plate provided by the embodiment of the utility model
In plate, as shown in Fig. 2, windowed regions A can be located at the edge of the first PI cover film 2.It is also assumed that being windowed regions A
It is adjustable at flexible circuit board outline edge, is conducive to heat and steam in this way and is discharged from edge, better effect prevents soft
Wiring board and stiffening plate joint place cause stiffening plate to fall off because of high temperature bubble.
Further, in the specific implementation, in the above-mentioned flexible wire with stiffening plate provided by the embodiment of the utility model
In the plate of road, as shown in figure 3, can also include: the substrate 5 positioned at the first ground connection 1 lower surface of layers of copper, positioned at 5 lower surface of substrate
Second ground connection layers of copper 6, and the 2nd PI cover film 7 positioned at the second ground connection 6 lower surface of layers of copper；The underface of windowed regions A has
There is via hole B；Via hole B is through the first ground connection layers of copper 1, substrate 5 and the second ground connection layers of copper 6.It should be noted that the via hole
It is no electric attribute, diameter can be greater than or equal to 0.2mm, and the design of via hole is more advantageous to the discharge of heat and steam.
In the specific implementation, in the above-mentioned flexible circuit board with stiffening plate provided by the embodiment of the utility model, such as Fig. 4
Shown, the first ground connection layers of copper 1 can be set to latticed, and the existing real copper in part is changed to grid copper in this way, can increase and connect
Contacting surface product, is more advantageous to the discharge of heat and steam.Similarly, the second ground connection layers of copper may be set to be latticed, better effect.
In the specific implementation, in the above-mentioned flexible circuit board with stiffening plate provided by the embodiment of the utility model, reinforcement
Plate can choose as steel plate, the setting for stiffening plate, as long as it is good to meet thermal diffusivity and electric conductivity, not limit herein
It is fixed.
To sum up, a kind of flexible circuit board with stiffening plate provided by the embodiment of the utility model, comprising: the first grounding copper
Layer is stacked the first PI cover film, conducting resinl, stiffening plate in the first ground connection layers of copper；Wherein, the first PI cover film has
Windowed regions, so that stiffening plate is bonded by windowed regions with the first ground connection layers of copper by conducting resinl.The utility model is due to
One PI cover film is provided with windowed regions, and stiffening plate can be bonded by windowed regions and the first ground connection layers of copper, not only be made
Stiffening plate forms good earthing effect, also helps the discharge of heat and steam, and then can reduce electronic product and produce
There is sheet deformation in flexible circuit board in journey, and bubble and stiffening plate fall off and other issues, avoid flexible circuit board and
Welding material is scrapped, and the yield of product is improved, and reduces production cost, enhances the competitiveness of product in market.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that
A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
The flexible circuit board provided by the utility model with stiffening plate is described in detail above, it is used herein
Specific case is expounded the principles of the present invention and embodiment, and the explanation of above example is only intended to help
Understand the method and its core concept of the utility model；At the same time, for those skilled in the art, according to the utility model
Thought, there will be changes in the specific implementation manner and application range, in conclusion the content of the present specification should not be understood
For limitations of the present invention.
Claims (7)
1. a kind of flexible circuit board with stiffening plate characterized by comprising the first ground connection layers of copper is stacked described the
The first PI cover film, conducting resinl, stiffening plate in one ground connection layers of copper；Wherein,
The first PI cover film has windowed regions, so that the stiffening plate passes through the windowed regions by the conducting resinl
It is bonded with the first ground connection layers of copper.
2. the flexible circuit board according to claim 1 with stiffening plate, which is characterized in that the windowed regions are located at described
The edge of first PI cover film.
3. the flexible circuit board according to claim 1 or 2 with stiffening plate, which is characterized in that further include: it is located at described the
The substrate of one ground connection layers of copper lower surface is grounded layers of copper positioned at the second of the substrate lower surface, and is located at second ground connection
2nd PI cover film of layers of copper lower surface；
The underface of the windowed regions has via hole；The via hole through it is described first ground connection layers of copper, the substrate and
The second ground connection layers of copper.
4. the flexible circuit board according to claim 3 with stiffening plate, which is characterized in that the diameter of the via hole is greater than
Or it is equal to 0.2mm.
5. the flexible circuit board according to claim 4 with stiffening plate, which is characterized in that the first ground connection layers of copper is net
Trellis.
6. the flexible circuit board according to claim 5 with stiffening plate, which is characterized in that the second ground connection layers of copper is net
Trellis.
7. the flexible circuit board according to claim 1 with stiffening plate, which is characterized in that the stiffening plate is steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821632162.7U CN209234104U (en) | 2018-10-08 | 2018-10-08 | A kind of flexible circuit board with stiffening plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821632162.7U CN209234104U (en) | 2018-10-08 | 2018-10-08 | A kind of flexible circuit board with stiffening plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209234104U true CN209234104U (en) | 2019-08-09 |
Family
ID=67499654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821632162.7U Active CN209234104U (en) | 2018-10-08 | 2018-10-08 | A kind of flexible circuit board with stiffening plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209234104U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112105157A (en) * | 2020-08-31 | 2020-12-18 | 广州源康精密电子股份有限公司 | Processing method for increasing bonding force of reinforcing film of flexible circuit board |
| CN113395821A (en) * | 2021-05-17 | 2021-09-14 | 景旺电子科技(龙川)有限公司 | Flexible circuit board for side key fingerprint identification and manufacturing method thereof |
-
2018
- 2018-10-08 CN CN201821632162.7U patent/CN209234104U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112105157A (en) * | 2020-08-31 | 2020-12-18 | 广州源康精密电子股份有限公司 | Processing method for increasing bonding force of reinforcing film of flexible circuit board |
| CN113395821A (en) * | 2021-05-17 | 2021-09-14 | 景旺电子科技(龙川)有限公司 | Flexible circuit board for side key fingerprint identification and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209234104U (en) | A kind of flexible circuit board with stiffening plate | |
| CN106409774A (en) | Shielding cover, packaging structure, and manufacturing method of packaging structure | |
| CN102365005B (en) | Printed circuit board (PCB) processing method | |
| CN102131342B (en) | Printed circuit board and liquid crystal display device | |
| CN201303461Y (en) | Layout structure for preventing electrostatic discharge and electromagnetic interference | |
| CN204560015U (en) | The thick copper foil printed circuit plate of Novel high-stability | |
| TW201611681A (en) | Micro-resistance structure with high bending strength, manufacturing method and semi-finished structure thereof | |
| CN103338590B (en) | Flexible circuit board and manufacture method thereof | |
| CN202103945U (en) | Circuit board for assembling LED (light-emitting diode) | |
| CN102083272A (en) | Circuit board with grounding structure | |
| CN105916291A (en) | Method for manufacturing high-density interconnected printed circuit board | |
| CN102970822A (en) | Hot wind bonding pad structure | |
| CN212812140U (en) | Induction chip, circuit board and electronic equipment | |
| CN207410581U (en) | A kind of preferable Double-layer flexible circuit board of thermal diffusivity | |
| CN209643066U (en) | A kind of integrated backlight software flexible circuit board | |
| CN101652027B (en) | Making process of circuit board with radiation fins | |
| CN206164979U (en) | Composite circuit board | |
| CN109714894A (en) | A method of improving pad intensity | |
| CN210432028U (en) | Printed circuit board with double-layer structure | |
| CN205987528U (en) | Printed circuit board assembly easily dispels heat | |
| CN100461982C (en) | Circuit board | |
| CN206650919U (en) | A kind of printed circuit board (PCB), PCBA board and electronic equipment | |
| CN219740727U (en) | Super long size's new forms of energy flexible circuit board | |
| CN205693970U (en) | Printed circuit board (PCB) | |
| CN205179511U (en) | Power electronic component circuit board of high heat dissipating ability |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |