CN112105157A - Processing method for increasing bonding force of reinforcing film of flexible circuit board - Google Patents
Processing method for increasing bonding force of reinforcing film of flexible circuit board Download PDFInfo
- Publication number
- CN112105157A CN112105157A CN202010897289.7A CN202010897289A CN112105157A CN 112105157 A CN112105157 A CN 112105157A CN 202010897289 A CN202010897289 A CN 202010897289A CN 112105157 A CN112105157 A CN 112105157A
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- CN
- China
- Prior art keywords
- flexible circuit
- circuit board
- film
- reinforcing
- increasing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003014 reinforcing effect Effects 0.000 title claims abstract description 57
- 238000003672 processing method Methods 0.000 title claims abstract description 11
- 239000010408 film Substances 0.000 claims abstract description 67
- 238000004140 cleaning Methods 0.000 claims abstract description 32
- 239000013039 cover film Substances 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 4
- 239000007921 spray Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000012459 cleaning agent Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 239000012787 coverlay film Substances 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
Abstract
The invention discloses a processing method for increasing the bonding strength of a reinforcing film of a flexible circuit board, which comprises the following steps: step S1, preparing a flexible circuit board to be pasted with a reinforcing film and a cover film; step S2, alkaline cleaning is carried out on one surface of the flexible circuit board to be adhered with the reinforced film in the step S1; step S3, drying the flexible circuit board after alkaline cleaning; step S4, adhering a reinforcing rubber sheet to one surface of the dried flexible circuit board to which the rubber sheet is to be adhered; and step S5, pressing the reinforcing films bonded in the step S4. The processing method for increasing the bonding force of the reinforcing rubber sheet of the flexible circuit board can increase the bonding force between the reinforcing rubber sheet and the covering film of the flexible circuit board and increase the peeling strength of the reinforcing rubber sheet.
Description
Technical Field
The invention relates to the technical field of FPC (flexible printed circuit) board manufacturing, in particular to a processing method for increasing the bonding force of a reinforcing rubber sheet of a flexible circuit board.
Background
The flexible circuit board is characterized by being light, thin, short and small, so that the problems of scratch, fracture and the like are easily generated in the using process, the mechanical strength is low, and the cracking is easy to occur. The purpose of the reinforcing film is to reinforce the mechanical strength of the FPC and facilitate surface mounting of parts and the like. The material of the reinforcing film is usually FR4 material, PET material, steel sheet material or PI material.
The installation process of the reinforcing rubber sheet is generally divided into two steps of reinforcing lamination and reinforcing pressing. Wherein the reinforcement laminating is divided into hot-pressing reinforcement and pressure-sensing reinforcement again, and hot-pressing reinforcement means that at a certain temperature, the hot hardening glue of reinforcement film begins to melt and makes the reinforcement film glue on the cover film of flexible circuit board, and pressure-sensing reinforcement means that the reinforcement film just can glue on the cover film of flexible circuit board without heating. The reinforcing and pressing means that the reinforcing rubber sheet is pressed on the covering film of the flexible circuit board by a pressing machine. At present, the reinforcing film often falls off from the cover film of the flexible circuit board due to the reinforcement of the binding force, which has a certain influence on the quality of the flexible circuit board.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a processing method for increasing the bonding force of a reinforcing film of a flexible circuit board, which can increase the bonding force between the reinforcing film and a covering film of the flexible circuit board and increase the peeling strength of the reinforcing film.
The purpose of the invention is realized by adopting the following technical scheme:
a processing method for increasing the bonding strength of a flexible circuit board reinforcing film comprises the following steps:
step S1, preparing a flexible circuit board to be pasted with a reinforcing film and a cover film;
step S2, alkaline cleaning is carried out on one surface of the flexible circuit board to be adhered with the reinforced film in the step S1;
step S3, drying the flexible circuit board after alkaline cleaning;
step S4, adhering a reinforcing rubber sheet to one surface of the dried flexible circuit board to which the rubber sheet is to be adhered;
and step S5, pressing the reinforcing films bonded in the step S4.
Further, the coverlay film in the step S1 is a polyimide film.
Further, the alkaline cleaning in the step S2 is to spray and clean the flexible circuit board with an alkaline cleaning agent solution with a temperature of 50 ± 2 ℃ and a concentration of 4 ± 1 g/L; and the flexible circuit board is suitable for synchronous motion along with the production line during spraying and cleaning, and the motion speed of the production line is 3 +/-0.2 m/min.
Further, when the flexible circuit board is sprayed and cleaned, if one surface of the flexible circuit board to be adhered with the reinforced film is positioned below the flexible circuit board, the flexible circuit board is sprayed and cleaned downwards, and the pressure of the spraying and cleaning downwards is 1.8 +/-0.2 kg/cm2(ii) a If the surface of the flexible circuit board with the reinforcing adhesive sheet is positioned above the flexible circuit board, performing upper spraying cleaning under the pressure of 1.5 +/-0.2 kg/cm2。
Further, the material of the reinforcing rubber sheet in the step S4 is a steel sheet.
Further, between the step S3 and the step S4, the method further includes:
and S31, carrying out roughness detection on one side of the dried flexible circuit board to which the film is to be pasted, screening out qualified flexible circuit boards, and entering the next step.
Further, in the step S31, the roughness of the side of the dried flexible circuit board to which the film is to be attached is detected by a 34# dyne pen.
Further, the step S5 is followed by:
and step S6, detecting the peeling strength of the laminated reinforcing film through a peeling strength testing machine.
Compared with the prior art, the invention has the beneficial effects that: the surface of the covering film is subjected to corrosion coarsening, the reinforcing film is attached after the surface of the covering film is subjected to corrosion coarsening, and the reinforcing film is pressed on the reinforcing film, so that the bonding strength of the reinforcing film and the covering film can be increased.
Drawings
FIG. 1 is a flow chart of a processing method for increasing the bonding force of the reinforced film of the flexible printed circuit board according to the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The invention discloses a processing method for increasing the bonding strength of a reinforcing film of a flexible circuit board, which comprises the following steps: step S1, preparing a flexible circuit board to be pasted with a reinforcing film and a cover film; step S2, alkaline cleaning is carried out on one surface of the flexible circuit board to be adhered with the reinforced film in the step S1; step S3, drying the flexible circuit board after alkaline cleaning; step S4, adhering a reinforcing rubber sheet to one surface of the dried flexible circuit board to which the rubber sheet is to be adhered; and step S5, pressing the reinforcing films bonded in the step S4. Specifically, the cover film in step S1 is a polyimide film (PI film), and the reinforcing rubber sheet in step S4 is a steel sheet.
In the processing method, one surface of the flexible circuit board to be adhered with the reinforcing film is subjected to alkaline cleaning, the surface of the covering film is subjected to corrosion coarsening by utilizing the characteristic of poor alkali resistance of the covering film, the reinforcing film is adhered to the surface of the covering film after the surface of the covering film is subjected to corrosion coarsening, and the reinforcing film is pressed, so that the bonding strength between the reinforcing film and the covering film can be increased.
As a preferred embodiment, the alkaline cleaning in step S2 is to spray and clean the flexible circuit board with an alkaline cleaning agent solution with a temperature of 50 ± 2 ℃ and a concentration of 4 ± 1 g/L; and the flexible circuit board is suitable for synchronous motion along with the production line during spraying and cleaning, and the motion speed of the production line is 3 +/-0.2 m/min. Specifically, the spray cleaning can be achieved using existing spray equipment having an upper spray head located above the production line and a lower spray head located below the production line. It is noted that the alkaline cleaner should meet the emission standards and not be easily left on the surface of the cover film.
Preferably, during the spray cleaning, if one surface of the flexible circuit board to be adhered with the reinforced film is positioned below, the lower spray cleaning is carried out, and the pressure of the lower spray cleaning is 1.8 +/-0.2 kg/cm2(ii) a If the surface of the flexible circuit board with the reinforcing adhesive sheet is positioned above the flexible circuit board, performing upper spraying cleaning under the pressure of 1.5 +/-0.2 kg/cm2. When cleaning by lower sprayThe pressure of the lower spray cleaning is slightly larger than that of the upper spray cleaning to ensure the same biting and coarsening effect by overcoming the gravity.
Preferably, step S31 is further included between step S3 and step S4, and step S31 specifically includes: and carrying out roughness detection on one surface of the dried flexible circuit board to be pasted with the film, screening out qualified flexible circuit boards, and entering the next step. And in the step S31, specifically, carrying out roughness detection on one side of the dried flexible circuit board to be pasted with the film through a 34# dyne pen. By the aid of the method, unqualified flexible circuit boards can be prevented from entering a production line, and production quality of products is guaranteed. And because the coarsening effect of the surface of the cover film needs to be amplified by thousands of times to visually see the appearance change, whether the surface tension of the cover film reaches the numerical value of the test pen or not can be accurately tested by the pen, when the test pen is used, only a straight line needs to be drawn on the surface of the cover film, and then the straight line handwriting can be observed, thereby being very convenient.
Preferably, step S6 is further included after step S5, and step S6 is specifically as follows: and (4) carrying out peel strength detection on the laminated reinforcing rubber sheet by using a peel strength testing machine. The product delivery quality can be further ensured by the peeling strength detection.
Comparison table of peel strength of cover film and steel sheet without and after alkaline cleaning:
as can be seen from the above table, the binding force of the coating film subjected to alkaline cleaning to the steel sheet is greater than that of the coating film not subjected to alkaline cleaning to the steel sheet.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A processing method for increasing the bonding strength of a flexible circuit board reinforcing film is characterized by comprising the following steps:
step S1, preparing a flexible circuit board to be pasted with a reinforcing film and a cover film;
step S2, alkaline cleaning is carried out on one surface of the flexible circuit board to be adhered with the reinforced film in the step S1;
step S3, drying the flexible circuit board after alkaline cleaning;
step S4, adhering a reinforcing rubber sheet to one surface of the dried flexible circuit board to which the rubber sheet is to be adhered;
and step S5, pressing the reinforcing films bonded in the step S4.
2. The process of increasing the bonding strength of a reinforcing film for a flexible circuit board according to claim 1, wherein: the coverlay film in step S1 is a polyimide film.
3. The process of increasing the bonding strength of a reinforcing film for a flexible circuit board according to claim 1, wherein: the alkaline cleaning in the step S2 is to spray and clean the flexible circuit board by using an alkaline cleaning agent solution with the temperature of 50 +/-2 ℃ and the concentration of 4 +/-1 g/L; and the flexible circuit board is suitable for synchronous motion along with the production line during spraying and cleaning, and the motion speed of the production line is 3 +/-0.2 m/min.
4. The process of increasing the bonding strength of a reinforcing film for a flexible circuit board according to claim 3, wherein: when in spray cleaning, if one surface of the flexible circuit board to be adhered with the reinforced film is positioned below, the flexible circuit board is subjected to lower spray cleaning, and the pressure of the lower spray cleaning is 1.8 +/-0.2 kg/cm2(ii) a If the surface of the flexible circuit board with the reinforcing adhesive sheet is positioned above the flexible circuit board, performing upper spraying cleaning under the pressure of 1.5 +/-0.2 kg/cm2。
5. The process of increasing the bonding strength of a reinforcing film for a flexible circuit board according to claim 1, wherein: the material of the reinforcing rubber sheet in the step S4 is a steel sheet.
6. The process of increasing the bonding strength of a reinforcing film for a flexible circuit board according to claim 1, wherein: the steps between the step S3 and the step S4 further include:
and S31, carrying out roughness detection on one side of the dried flexible circuit board to which the film is to be pasted, screening out qualified flexible circuit boards, and entering the next step.
7. The process of increasing the bonding strength of a reinforcing film for a flexible circuit board according to claim 6, wherein: and in the step S31, specifically, carrying out roughness detection on one side of the dried flexible circuit board to be pasted with the film through a 34# dyne pen.
8. The process of increasing the bonding strength of a reinforcing film for a flexible circuit board according to claim 1, wherein: the step S5 is followed by:
and step S6, detecting the peeling strength of the laminated reinforcing film through a peeling strength testing machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010897289.7A CN112105157A (en) | 2020-08-31 | 2020-08-31 | Processing method for increasing bonding force of reinforcing film of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010897289.7A CN112105157A (en) | 2020-08-31 | 2020-08-31 | Processing method for increasing bonding force of reinforcing film of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112105157A true CN112105157A (en) | 2020-12-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010897289.7A Pending CN112105157A (en) | 2020-08-31 | 2020-08-31 | Processing method for increasing bonding force of reinforcing film of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112105157A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597090A (en) * | 2021-07-28 | 2021-11-02 | 京东方科技集团股份有限公司 | Flexible circuit board, display panel and display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1956629A (en) * | 2005-10-25 | 2007-05-02 | 比亚迪股份有限公司 | Flexible printed circuit board and its manufacturing method |
| CN203368901U (en) * | 2013-05-31 | 2013-12-25 | 信利光电股份有限公司 | Reinforcing steel sheet of flexible circuit board |
| CN105578729A (en) * | 2016-01-29 | 2016-05-11 | 上海温良昌平电器科技股份有限公司 | One-piece aluminum reinforcing flexible circuit board and technology |
| CN209234104U (en) * | 2018-10-08 | 2019-08-09 | 信利光电股份有限公司 | A kind of flexible circuit board with stiffening plate |
-
2020
- 2020-08-31 CN CN202010897289.7A patent/CN112105157A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1956629A (en) * | 2005-10-25 | 2007-05-02 | 比亚迪股份有限公司 | Flexible printed circuit board and its manufacturing method |
| CN203368901U (en) * | 2013-05-31 | 2013-12-25 | 信利光电股份有限公司 | Reinforcing steel sheet of flexible circuit board |
| CN105578729A (en) * | 2016-01-29 | 2016-05-11 | 上海温良昌平电器科技股份有限公司 | One-piece aluminum reinforcing flexible circuit board and technology |
| CN209234104U (en) * | 2018-10-08 | 2019-08-09 | 信利光电股份有限公司 | A kind of flexible circuit board with stiffening plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597090A (en) * | 2021-07-28 | 2021-11-02 | 京东方科技集团股份有限公司 | Flexible circuit board, display panel and display device |
| CN113597090B (en) * | 2021-07-28 | 2024-03-26 | 京东方科技集团股份有限公司 | Flexible circuit board, display panel and display device |
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