CN208655584U - A kind of semiconductor frame arranging machine that bends - Google Patents
A kind of semiconductor frame arranging machine that bends Download PDFInfo
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- CN208655584U CN208655584U CN201821204107.8U CN201821204107U CN208655584U CN 208655584 U CN208655584 U CN 208655584U CN 201821204107 U CN201821204107 U CN 201821204107U CN 208655584 U CN208655584 U CN 208655584U
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- bends
- semiconductor frame
- forming blocks
- frame
- fixed
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Abstract
The utility model discloses a kind of semiconductor frame arranging machines that bends, including feeding mechanism, the shaping mechanism that bends, screening preheating mechanism and PLC control system；Nuclear structure is the shaping mechanism that bends, ball screw rotation is driven by servo motor, maneuvering board is driven to move up and down, the setting of frame upper end face upper and lower bend forming blocks and upper cover plate, maneuvering board drives forming blocks movement of bending by guide post, under forming blocks of bending be fixed on the rack end face, semiconductor frame is bended forming blocks above and below and upper cover plate edge joint is fixed；Sensing chip is set on maneuvering board, fixes upper and lower limit line sensor respectively above and below the sensing chip, maneuvering board stopping moves upwards when sensing chip is contacted with upper limit line sensor, and maneuvering board stopping moves downward when sensing chip is contacted with lower limit line sensor.The arranging machine that bends collects feeding, bend molding and screening preheating are in same automated system, high production efficiency, and the angle of bending of adjustable semiconductor frame.
Description
Technical field
The utility model relates to semiconductor packages important equipments, more specifically, the utility model relates to Semi-conductor plastic capsulation moulds
Tool plastic packaging before bend, a kind of semiconductor frame arranging machine that bends that preheating procedure uses.
Background technique
In the development of Chinese national economy, electronics and information industry is highly important industry, and semiconductor industry is then whole
The core of a electronics and information industry and basis.Semiconductor frame is bended, preheating procedure is the key that work before semiconductor packages production
Sequence.Process of bending is the product of guarantee plastic packaging frame plastic packaging out without leakage copper phenomenon, and guarantees that the fin portions of frame assign to modeling
The distance for sealing body surface face is 0.38-0.42mm, so that it is guaranteed that the heat sinking function of cooling fin, improves the qualification rate of finished semiconductor.
Present semiconductor frame bend the common method of process be a plurality of product or single product bending mould, efficiency
Low, dimensional accuracy is not high, and dangerous.Semiconductor frame preheating procedure is using preheater or uses arranging machine, and completion is beaten
Curved, preheating procedure needs two processes to complete in double harness.And the item of pre-molding up and down of bending mould is once formed, just very
It is difficult to adjust the angle bended, to improve processing cost, wastes manpower and material resources from new processing if you need to change and need.
Utility model content
The present invention combine bend in the past, all advantages of pre-heating device, avoid before equipment the shortcomings that.By semiconductor
Frame bends, screening preheats two processes and melts and referred to as bends arranging machine for an equipment, and structure includes feeding mechanism, is bended into
Type mechanism, screening preheating mechanism, by PLC control system overall control, each section work is completed in the coordinated movement of various economic factors for each mechanism operation.Its
In the shaping mechanism that bends be core of the invention part, the arranging machine that bends only needs to adjust the height or upper and lower of limited post
The upper and lower position of restricted driving sensor can adjust the angle that semiconductor frame is bended, and be simple and efficient, be easy to operate.
In order to solve the above technical problems, the utility model uses following technical scheme:
A kind of semiconductor frame arranging machine that bends, including feeding mechanism, the shaping mechanism that bends, screening preheating mechanism and
Semiconductor frame is sent into the shaping mechanism that bends and bended by PLC control system, the PLC control system control feeding mechanism
Type, control screening preheating mechanism pull out molding semiconductor frame of having bended from the shaping mechanism that bends, and to semiconductor frame
Frame carries out screening preheating；The shaping mechanism that bends includes servo motor, ball screw, maneuvering board and rack, the rack with
Relative position between the servo motor is fixed, and the maneuvering board is fixed on ball screw by middle part threaded hole, described
Servo motor driving ball screw rotates forward or backwards rotation；It is bended on the frame upper end face interval setting is movable
Type block and it is fixed under bend forming blocks, it is each on bend upper cover plate be set above forming blocks, it is each on forming blocks of bending it is logical
It crosses guide post to be fixedly connected on maneuvering board, ball screw rotation is moved upwardly or downwardly maneuvering board, and guide post, which drives, to bend into
Type block is moved accordingly, and the both sides of semiconductor frame are fixed respectively by forming blocks of bending on two adjacent, semiconductor frame
The middle part of frame bended by down forming blocks and upper cover plate edge joint fix；Sensing chip is arranged in the maneuvering board side, in the induction
Fixed upper limit line sensor and lower limit line sensor are distinguished above and below piece, sensing chip and upper limit line sensor contact luck
Movable plate stopping moves upwards, and maneuvering board stopping moves downward when sensing chip is contacted with lower limit line sensor.
The semiconductor frame arranging machine that bends, servo motor, which is connect with ball screw by shaft coupling, makes servo
Motor can drive ball screw to rotate；Fixed plate is set on the servo motor, and rack is fastened on this by support column and consolidates
Fix the relative position of rack and servo motor on fixed board.
Sensor fixing seat is arranged in the semiconductor frame arranging machine that bends, rack lower section, and the upper restricted driving passes
Sensor and lower limit line sensor are all fixed in the sensor fixing seat；Linear bearing is also equipped with to rack below the rack
It is fixed, to guarantee that guide post movement is steady.
The length of the semiconductor frame arranging machine that bends, guide post is less than or equal to 0.005mm；It bends on described
The limited post that the lower end setting height of forming blocks can be adjusted, forming blocks of above bending connect by the way that the limited post and the guide post are fixed
It connects.
The side of the semiconductor frame arranging machine that bends, forming blocks of bending thereon has groove, semiconductor frame
Side can be inserted into the groove to being fixed, groove, the upper cover are set in the middle part of the upper surface for forming blocks of bending under described
Bend under the recess sidewall upper surface of forming blocks of the edge of plate cooperates, and combines the middle part of fixed semiconductor frame.
The semiconductor frame arranging machine that bends is combined forming blocks of bending under fixed refer to and is fixed on the rack simultaneously
And it is located at the middle part of the middle part supported underneath semiconductor frame of semiconductor frame, while upper cover plate edge is buckled in semiconductor frame
The middle part of semiconductor frame is pushed down in middle part top and combining for being formed is fixed.
Side bumper block and spacer block, the side bumper block and upper cover are arranged in rack for the semiconductor frame arranging machine that bends
Plate, under forming blocks of bending match and be encircled into the activity spaces of forming blocks of bending on multiple, will be each on forming blocks of bending be limited in list
In only activity space, the spacer block is located at below forming blocks of above bending and forming blocks of bending under will be two neighboring separate and consolidate
It is fixed.
The semiconductor frame arranging machine that bends fixes the position setting of semiconductor frame on the shaping mechanism that bends
Whether sensor detection semiconductor frame is put into correct position, when the sensor detects that frame is put into correct position, PLC control
System processed just sends work order to the servo motor.
The semiconductor frame arranging machine that bends, feeding mechanism include belt conveyor, are fixed on belt
Push framework mechanism, the magazine being placed on workbench and the accurate lead screw being fixed below workbench, push framework mechanism tool
There is a push rod of the semiconductor frame in face magazine, drives push framework mechanism when the belt conveyor is positive or reverse movement
Movement, push rod advance are retracted after a semiconductor frame in magazine is pushed into the shaping mechanism that bends, and the accurate lead screw drives
Workbench declines a step pitch, and push rod is moved to bend another semiconductor frame push-in again and be retracted after shaping mechanism, successively
Back and forth, until the semiconductor frame in magazine is driven fully into the shaping mechanism that bends.
The semiconductor frame arranging machine that bends, screening preheating mechanism have discharging pull rod and pre- hot orbit, partly
Conductor frame is bended after molding, and lower limit line sensor sends a signal to PLC control system, and PLC control system, which issues instruction, to be made
Semiconductor frame is pulled on pre- hot orbit by discharging pull rod from the shaping mechanism that bends, and installs having heaters below pre- hot orbit
Entire pre- hot orbit is heated, semiconductor frame is heated and transported to stock shelf by pre- hot orbit.
Compared with prior art, the utility model at least has the advantages that the semiconductor frame arranging machine that bends
Collect feeding, bend molding and screening preheating are in same automated system, by PLC control system overall control, the coordinated movement of various economic factors is realized
Semiconductor frame, which bends to preheat with screening, to be automated, and the shaping mechanism that bends can while bend to multiple semiconductor frames
Molding, improves production efficiency, the shaping mechanism that bends can be by adjusting the biography in the height or sensor fixing seat of limited post
So as to adjust the angle of bending of semiconductor frame, equipment application range is wider for the position of sensor.
Detailed description of the invention
Fig. 1 is the shaping mechanism structural schematic diagram that bends.
Fig. 2 is the schematic perspective view of forming blocks of bending on one of shaping mechanism of bending.
Fig. 3 is the schematic perspective view of forming blocks of bending on the another kind to bend in shaping mechanism.
Fig. 4 is the schematic perspective view of forming blocks of bending under bending in shaping mechanism.
Fig. 5 is feeding machine structure schematic diagram.
Fig. 6 is screening preheating mechanism structural schematic diagram.
Fig. 7 is the feeding mechanism of the semiconductor frame arranging machine that bends, bend shaping mechanism and screening preheating mechanism position
Relation schematic diagram.
In figure, 1- servo motor, 2- ball screw, 3- support column, 4- maneuvering board, 5- guide post, 6- rack, 7- spacer block, 8-
On bend forming blocks, forming blocks of bending under 9-, 10- limited post, 11- upper cover plate, 12- side bumper block, 13- upper limit line sensor, 14-
Lower limit line sensor, 15- sensing chip, 16- sensor fixing seat, 17- fixed plate, 18- shaft coupling, 19- semiconductor frame, 20-
Linear bearing, 21- belt conveyor, 22- push framework mechanism, 23- workbench, 24- magazine, 25- accurate lead screw, 26- push rod,
27- discharges pull rod, the rack of 28- feeding mechanism, and 29- bends shaping mechanism riding position.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
Semiconductor frame is broadly divided into four parts with the arranging machine that bends: feeding mechanism, the shaping mechanism that bends, screening preheat
Mechanism and PLC control system.Feeding mechanism (region A), the shaping mechanism (region B) that bends, screening preheating mechanism are shown in Fig. 7
The positional relationship of (region C) three, PLC control system control three: PLC control system control feeding mechanism will partly be led
Body frame is sent into the shaping mechanism that bends and carries out molding of bending, and control screening preheating mechanism is pulled out from the shaping mechanism that bends have been beaten
The semiconductor frame of roll forming, and screening preheating is carried out to semiconductor frame.PLC control system is not shown in Fig. 7.
Semiconductor frame is the shaping mechanism that bends with the nuclear structure for the arranging machine that bends, and the structure for the shaping mechanism that bends is as schemed
Shown in 1.The shaping mechanism that bends includes servo motor 1, ball screw 2, maneuvering board 4 and rack 6, between rack 6 and servo motor 1
Relative position fix, their fixed form can use: fixed plate 17 be arranged on servo motor 1, rack 6 passes through support column
3 are fastened in the fixed plate 17 to fix rack 6 and the relative position of servo motor 1.The center of maneuvering board 4 is arranged
One threaded hole, which can match fixation with ball screw 2 with screw thread, therefore maneuvering board 4 is fixed by middle part threaded hole
On ball screw 2.Servo motor, which is connect with ball screw by shaft coupling 18, enables servo motor to drive ball screw 2 positive
Rotation or backwards rotation drive maneuvering board 4 to move downward when rotating forward, and when backwards rotation moves upwards maneuvering board 4.Machine
6 upper end face interval of frame be arranged on movable bend forming blocks 8 and it is fixed under bend forming blocks 9, a kind of specific embodiment
It is that there are three forming blocks of bending under above bend forming blocks and two, forming blocks of bending under two point for each shaping mechanism that bends
Cloth is bended on three between forming blocks, and forming blocks of bending on both sides only need side that there is groove partly to lead for fixation
Body frame, structure is as shown in Fig. 2, and being located in the middle forming blocks of bending and needing two sides all has groove, structure such as Fig. 3
Shown, forming blocks of bending on such three can bend two block semiconductor frames simultaneously.It is arranged above forming blocks 8 of bending on each
Upper cover plate 11, it is each on forming blocks 8 of bending be fixedly connected on maneuvering board 4 by guide post 5, the rotation of ball screw 2 makes to move
When plate 4 moves upwards, guide post 5 drives forming blocks 8 of bending also to move upwards, and the rotation of ball screw 2 moves downward maneuvering board 4
When, guide post 5 also drives forming blocks 8 of bending to move downward, and the both sides of semiconductor frame 19 are by molding of bending on two adjacent
Block 8 is fixed respectively, and fixed form is: the side for forming blocks of above bending has groove, and it is recessed that the side of semiconductor frame can be inserted into this
To be fixed in slot, as shown in Figures 2 and 3.Can bend semiconductor frame when forming blocks of above bending move downward.Semiconductor
Forming blocks 9 are bended at the middle part of frame 19 by down and 11 edge of upper cover plate joint is fixed, and concrete mode is: under bend forming blocks 9
Groove is set in the middle part of upper surface, as shown in figure 4, the edge of upper cover plate 11 bends under, the recess sidewall upper surface of forming blocks 9 is matched
Close, combine the middle part of fixed semiconductor frame, joint is fixed refer under forming blocks of bending be fixed on the rack and be located at and partly lead
The middle part of the middle part supported underneath semiconductor frame of body frame, while upper cover plate edge is buckled in pressure above the middle part of semiconductor frame
Firmly the middle part of semiconductor frame and combining for being formed is fixed.Under the groove that bends in the middle part of forming blocks be also convenient for screening preheating mechanism
Discharging pull rod protrudes into the pull-out of the semiconductor frame after bending in groove.Sensing chip 15 is arranged in 4 side of maneuvering board, in the sensing chip
Fixed upper limit line sensor 13 and lower limit line sensor 14 are distinguished above and below in the of 15, setting sensor is fixed below rack 6
Seat 16, the upper limit line sensor 13 and lower limit line sensor 14 are all fixed in the sensor fixing seat 16.Sensing chip 15 with
The stopping of maneuvering board 4 moves upwards when upper limit line sensor 13 contacts, maneuvering board 4 when sensing chip 15 and lower limit line sensor 14 contact
Stopping moves downward.After semiconductor frame is put into correct position, servo motor drives ball screw rotation, and maneuvering board is transported downwards
Dynamic, sensing chip downlink therewith, semiconductor frame of bending during this is then bended when sensing chip is gone downwards at lower restricted driving inductor
Movement stops, and frame, which bends to form, to be completed, and at this moment servo motor then rotates backward, and original position is returned to, when sensing chip is moved to the upper limit
When line sensor position, then servo motor movement stops.It, be to forming blocks of bending above and below when bending forming blocks processing above and below
Surface is processed by shot blasting, to avoid during bending semiconductor frame forming blocks of being bended above and below scratch and influence
Product quality.By adjusting the angle that the adjustable frame in position of upper and lower limit line sensor bends, it is simple and efficient, operation side
Just.
Consistent steady for the forming blocks movement that guarantees respectively to bend, the length of guide post is less than or equal to 0.005mm, and below rack
It is also equipped with linear bearing 20 rack is fixed, to guarantee that guide post movement is steady.Each semiconductor is ensured that in this way
The forming height that bends of frame is consistent, has reached the purpose finely bended.
Different angle is bended into order to enable to bend shaping mechanism for semiconductor frame, in the lower end of upper forming blocks of bending
The limited post 10 that height can be adjusted is set, and forming blocks of above bending are fixedly connected by the limited post with the guide post.Pass through tune
Save the height of the limited post, adjustable semiconductor frame is bended molding angle.
Be arranged in order to which the activity space for the forming blocks that make to bend above and below is restricted and protects, in rack side bumper block 12 and every
Block 7, the side bumper block 12 and upper cover plate 11, under forming blocks 9 of bending match the activity space for being encircled into forming blocks 8 of bending on multiple, will
Forming blocks 8 of bending on each are limited in individual activity space, and spacer block 7 is located at 8 lower section of forming blocks and by adjacent two of above bending
Forming blocks of bending under a 9 are separated and are fixed.
It bends and fixes the location settings sensor (not shown) detection semiconductor of semiconductor frame 19 on shaping mechanism
Whether frame is put into correct position, and when the sensor detects that frame is put into correct position, PLC control system is just to servo electricity
Machine 1 sends work order.
Feeding mechanism is as shown in Figure 5.Feeding mechanism includes belt conveyor 21, the push framework mechanism being fixed on belt
22, the magazine 24 being placed on workbench 23 and the accurate lead screw 25 being fixed below workbench, accurate lead screw can drive workbench
Automatic lifting.Belt conveyor 21 includes servo motor, belt wheel and belt, and servo motor provides transportation power, and belt wheel plays
The effect of belt is made, belt moves under the driving of servo motor, when belt by push framework mechanism 22 to magazine direction
It is positive transport when transport, is reversed transport when belt drives transport of the push framework mechanism 22 far from magazine direction when.Material
There are multiple semiconductor frames in box, be arranged in magazine in upper and lower stack manner, and each semiconductor frame is relatively independent
, therefore the semiconductor frame in magazine can be pushed into the shaping mechanism that bends one by one.Push framework mechanism 22 has face material
The push rod 26 of semiconductor frame in box 24 drives push framework mechanism kinematic when belt conveyor 21 is positive or reverse movement,
Push rod advance is retracted after a semiconductor frame in magazine is pushed into the shaping mechanism that bends, and accurate lead screw 25 drives workbench 23
Decline a step pitch, another semiconductor frame position for being now placed in higher position drops to face push rod, and push rod is transported again
It moves and is retracted after the semiconductor frame is pushed into the shaping mechanism that bends, successively back and forth, until the semiconductor frame in magazine is complete
It is pushed into the shaping mechanism that bends.The rack 28 of feeding mechanism plays a supporting role to belt conveyor 21, workbench 23 etc., bends
Shaping mechanism riding position 29 is beside magazine, therefore the semiconductor frame in magazine can be pushed into the shaping mechanism that bends by push rod
In.It is also provided with linear bearing 20 below workbench 23, keeps workbench more stable.
As shown in fig. 6, screening preheating mechanism has discharging pull rod 27 and pre- hot orbit (as shown in the region C in Fig. 7), movement
Plate, which moves downward, makes semiconductor frame gradually be bended, when the sensing chip on maneuvering board moves to downstream sensor position, half
Conductor frame is bended molding, and lower limit line sensor sends a signal to PLC control system, and PLC control system issues instruction and uses
Semiconductor frame is pulled on pre- hot orbit by material pull rod from the shaping mechanism that bends, and having heaters pair is installed below pre- hot orbit
Entire pre- hot orbit is heated, and semiconductor frame is heated and transported to stock shelf by pre- hot orbit.Have in semiconductor frame logical
Hole, and the pull rod that discharges has the rod-like structure that may pass through through-hole, discharges pull rod under the driving of servo motor, is inserted from above into and partly leads
In the through-hole of body frame, and semiconductor frame is pulled out from the side for forming blocks of bending above and below.
Although reference be made herein to the utility model is described in the explanatory embodiment of the utility model, however, it should
Understand, those skilled in the art can be designed that a lot of other modification and implementations, these modifications and implementations will be fallen
Within scope and spirit disclosed in the present application.It more specifically, can be to theme group in range disclosed in the present application
The building block and/or layout for closing layout carry out a variety of variations and modifications.In addition to the modification carried out to building block and/or layout
Outer with improving, to those skilled in the art, other purposes also will be apparent.
Claims (10)
1. a kind of semiconductor frame arranging machine that bends, it is characterised in that including feeding mechanism, the shaping mechanism that bends, screening preheating
Semiconductor frame is sent into the shaping mechanism that bends and carried out by mechanism and PLC control system, the PLC control system control feeding mechanism
It bends molding, control screening preheating mechanism pulls out molding semiconductor frame of having bended from the shaping mechanism that bends, and half-and-half
Conductor frame carries out screening preheating；The shaping mechanism that bends include servo motor (1), ball screw (2), maneuvering board (4) and
Rack (6), the relative position between the rack (6) and the servo motor (1) are fixed, and the maneuvering board (4) passes through middle part
Threaded hole is fixed on ball screw, and servo motor (1) driving ball screw (2) rotates forward or backwards rotation；Institute
State the setting of rack (6) upper end face interval it is movable on bend forming blocks (8) and it is fixed under bend forming blocks (9), each go up and beat
Upper cover plate (11) are set above roll forming block, it is each on forming blocks of bending pass through guide post (5) and be fixedly connected on maneuvering board (4)
On, ball screw (2) rotation is moved upwardly or downwardly maneuvering board (4), and guide post (5) drives forming blocks (8) progress phase of bending
The movement answered, the both sides of semiconductor frame (19) are fixed respectively by forming blocks (8) of bending on two adjacent, semiconductor frame
(19) middle part bended by down forming blocks (9) and upper cover plate (11) edge joint fix；Maneuvering board (4) the side setting induction
Piece (15) distinguishes fixed upper limit line sensor (13) and lower limit line sensor (14) above and below the sensing chip (15),
Maneuvering board (4) stops moving upwards when sensing chip (15) is contacted with upper limit line sensor (13), and sensing chip (15) and lower restricted driving pass
Maneuvering board (4) stops moving downward when sensor (14) contacts.
2. the semiconductor frame arranging machine that bends according to claim 1, it is characterised in that the servo motor and ball
Screw rod enables servo motor that ball screw to be driven to rotate by shaft coupling (18) connection；Fixed plate is set on the servo motor
(17), rack (6) is fastened in the fixed plate (17) by support column (3) keeps rack (6) opposite with servo motor (1)
Position is fixed.
3. the semiconductor frame arranging machine that bends according to claim 1, it is characterised in that setting passes below the rack
Sensor fixing seat (16), the upper limit line sensor and lower limit line sensor are all fixed in the sensor fixing seat；The machine
It is also equipped with linear bearing (20) below frame rack is fixed, to guarantee that guide post movement is steady.
4. the semiconductor frame arranging machine that bends according to claim 1, it is characterised in that the length of the guide post is less than
Or it is equal to 0.005mm；The limited post (10) that the lower end setting height for forming blocks of bending on described can be adjusted, forming blocks of above bending
It is fixedly connected by the limited post with the guide post.
5. the semiconductor frame arranging machine that bends according to claim 1, it is characterised in that forming blocks of bending on described
Side has groove, and the side of semiconductor frame can be inserted into the groove to be fixed, the upper end for forming blocks of bending under described
Middle face is arranged groove, and bend under the recess sidewall upper surface of forming blocks of the edge of the upper cover plate cooperates, joint fixed half
The middle part of conductor frame.
6. the semiconductor frame arranging machine that bends according to claim 1 or 5, it is characterised in that the joint fixation refers to
Under bend forming blocks be fixed on the rack and be located at semiconductor frame middle part supported underneath semiconductor frame middle part, simultaneously
The middle part of semiconductor frame is pushed down in the middle part top that upper cover plate edge is buckled in semiconductor frame and combining for being formed is fixed.
7. the semiconductor frame arranging machine that bends according to claim 1, it is characterised in that side bumper is arranged in the rack
Block (12) and spacer block (7), the side bumper block and upper cover plate, under bend forming blocks match be encircled into forming blocks of bending on multiple activity it is empty
Between, will be each on forming blocks of bending be limited in individual activity space, the spacer block is located at below forming blocks of above bending and will
Forming blocks of bending under two neighboring are separated and are fixed.
8. the semiconductor frame arranging machine that bends according to claim 1, it is characterised in that described to bend on shaping mechanism
Whether the location settings sensor detection semiconductor frame of fixed semiconductor frame is put into correct position, when the sensor detects
When frame is put into correct position, PLC control system just sends work order to the servo motor.
9. the semiconductor frame arranging machine that bends according to claim 1, it is characterised in that the feeding mechanism includes skin
With conveying mechanism (21), the push framework mechanism (22) being fixed on belt, the magazine (24) being placed on workbench (23) and fix
Accurate lead screw (25) below workbench, the push framework mechanism have the push rod of the semiconductor frame in face magazine
(26), push framework mechanism kinematic is driven when the belt conveyor is positive or reverse movement, push rod advances one in magazine
A semiconductor frame is retracted after being pushed into the shaping mechanism that bends, and the accurate lead screw drives workbench to decline a step pitch, and push rod is again
Secondary movement is retracted after another semiconductor frame is pushed into the shaping mechanism that bends, successively back and forth, until the semiconductor frame in magazine
Frame is driven fully into the shaping mechanism that bends.
10. the semiconductor frame arranging machine that bends according to claim 1, it is characterised in that the screening preheating mechanism tool
There are discharging pull rod and pre- hot orbit, semiconductor frame to be bended after molding, lower limit line sensor sends a signal to PLC control system
System, PLC control system, which issues instruction, is pulled to discharging pull rod on pre- hot orbit semiconductor frame from the shaping mechanism that bends,
Installation having heaters heats entire pre- hot orbit below pre- hot orbit, and semiconductor frame is heated and transported by pre- hot orbit
To stock shelf.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821204107.8U CN208655584U (en) | 2018-07-27 | 2018-07-27 | A kind of semiconductor frame arranging machine that bends |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821204107.8U CN208655584U (en) | 2018-07-27 | 2018-07-27 | A kind of semiconductor frame arranging machine that bends |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208655584U true CN208655584U (en) | 2019-03-26 |
Family
ID=65787472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821204107.8U Withdrawn - After Issue CN208655584U (en) | 2018-07-27 | 2018-07-27 | A kind of semiconductor frame arranging machine that bends |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208655584U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037107A (en) * | 2018-07-27 | 2018-12-18 | 成都尚明工业有限公司 | A kind of semiconductor frame arranging machine that bends |
| CN114749531A (en) * | 2022-06-16 | 2022-07-15 | 南通通州东大机械有限公司 | Full-automatic bending device for semiconductor frame |
-
2018
- 2018-07-27 CN CN201821204107.8U patent/CN208655584U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037107A (en) * | 2018-07-27 | 2018-12-18 | 成都尚明工业有限公司 | A kind of semiconductor frame arranging machine that bends |
| CN109037107B (en) * | 2018-07-27 | 2023-09-08 | 成都尚明工业有限公司 | Bending sheet arranging machine for semiconductor frame |
| CN114749531A (en) * | 2022-06-16 | 2022-07-15 | 南通通州东大机械有限公司 | Full-automatic bending device for semiconductor frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20190326 Effective date of abandoning: 20230908 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20190326 Effective date of abandoning: 20230908 |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |