CN208643954U - The tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit - Google Patents
The tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit Download PDFInfo
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- CN208643954U CN208643954U CN201820723999.6U CN201820723999U CN208643954U CN 208643954 U CN208643954 U CN 208643954U CN 201820723999 U CN201820723999 U CN 201820723999U CN 208643954 U CN208643954 U CN 208643954U
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Abstract
The utility model relates to a kind of tubulature devices of the automatic Trim Molding equipment of semiconductor integrated circuit, processing stations are sent into for double semiconductor element, it includes a rotating base, one rotating mechanism and at least three tubulature tracks being fixed on rotating base, the rotating base includes the first supporting table and the second supporting table, wherein two tubulature tracks are separately fixed at the both ends of the first supporting table, and end to end by the rotating mechanism between two tubulature tracks；In addition at least a tubulature track is fixed in second supporting table.The tubulature device of the automatic Trim Molding equipment of the semiconductor integrated circuit of the utility model perfectly realize double semiconductor element can the same direction carry out the function of double tubulature feeding, meet the rapidly and efficiently tubulature of biserial pin interfix product, tubulature efficiency is twice of existing single-line held Manifold technology.
Description
[technical field]
The utility model relates to semiconductor processing technology field, more particularly to it is a kind of can double tubulature the integrated electricity of semiconductor
The tubulature device of the automatic Trim Molding equipment in road.
[background technique]
The existing automatic Trim Molding equipment of semiconductor integrated circuit is mostly using the structure of single tubulature, single tubulature
Lead material frame 80 as shown in Figure 1, the stitch 802 of each semiconductor element 801 is arranged side by side in the same direction, cut one by one
It has no progeny and is abreast transported in tubulature device, be then delivered on next processing stations.This single tubulature of the prior art
Mode can only single channel feeding, efficiency is very low.
As the continuous upgrading of semiconductor integrated circuit lead frame improves, a kind of lead frame 90 of biserial stitch interfix
To be born, as shown in Fig. 2, two rows of 901 side by side parallel of semiconductor element settings, the opposite connection setting of stitch 902.In tubulature
When, after each semiconductor element 901 is cut one by one, stitch 902 is also cut in junction simultaneously, and keeps 902 phase of stitch
To being transported in tubulature device.
Such lead frame 90 greatly improves tubulature efficiency due to being double synchronous feeding.But it is later half by Trim Molding
Conductor element 901 be packed into expects pipe direction influence, the direction difference of two rows of semiconductor elements 901 can not be put into simultaneously expects pipe into
Enter next station, can only successively enter feeding in expects pipe, the excellent of the synchronous feeding of double semiconductor element 901 can not be fully achieved
Gesture.
In view of the above deficiency, in order to can satisfy the rapidly and efficiently tubulature of biserial stitch interfix product, it is necessary to provide one
It is kind completely new can binary channels tubulature the automatic Trim Molding equipment of semiconductor integrated circuit tubulature device.
[utility model content]
For overcome the automatic Trim Molding equipment of existing semiconductor integrated circuit tubulature device problems, this is practical new
Type provide it is a kind of completely new can double tubulature the automatic Trim Molding equipment of semiconductor integrated circuit tubulature device.
The scheme that the utility model solves technical problem is to provide a kind of automatic Trim Molding equipment of semiconductor integrated circuit
Tubulature device, for double semiconductor element be sent into processing stations comprising a rotating base, a rotating mechanism and fixation
At least three tubulature tracks on rotating base, the rotating base include the first supporting table and the second supporting table, wherein
Two tubulature tracks are separately fixed at the both ends of the first supporting table, and pass through the rotating mechanism head and the tail between two tubulature tracks
Connect；In addition at least a tubulature track is fixed in second supporting table.
Preferably, the tubulature track for being fixed on the second supporting table is higher than two tubulature rails being fixed in the first supporting table
Road.
Preferably, it is respectively provided with a track hopper on at least three tubulatures track, wherein the one of double semiconductor element
The track hopper feeding forward one by one that row passes through at least tubulature track in the second supporting table；The semiconductor element of an other row
It is first transported in the first supporting table in the track hopper of left side tubulature track, then rotates 180 ° by rotating mechanism and be transported to again
In the track hopper of the right tubulature track.
Preferably, the rotating mechanism includes a turntable, a rotary drive mechanism and an elevating mechanism, the turntable
It is placed on the rotating base, left end is connect with a tubulature track, and right end is connect with another tubulature track；The rotation is driven
Motivation structure is sequentially connected in the turntable bottom and turntable, and the disk peripheral is driven to rotate；In the turntable bottom,
The periphery setting of the driving mechanism elevating mechanism.
Preferably, the turntable is a sheet discs, and the diametric two sides of surface perimeter are symmetrically arranged with the on it
One track hopper and the second track hopper, the first turntable hopper are mutually connected with the track hopper on the left side in the first supporting table, and second
Turntable hopper is mutually connected with the track hopper on the right in the first supporting table.
Preferably, a positioning hole is also set up on disk upper surface circle diameter direction, the location hole is through turning
The through-hole of disk is located among the first turntable hopper and the second turntable hopper, at the position of turntable periphery circumference.
Preferably, one axis hole, the rotary shaft insertion of the rotary drive mechanism are set in the position in the disk upper surface center of circle
Turntable is driven to be rotated in the axis hole.
Preferably, in the setting of the lower surface of turntable there are four backgauge manipulator, which corresponds to turntable
The both ends of two turntable hoppers of upper surface and be arranged, two backgauge manipulators on the left side are connected by a backgauge shaft, and are worn
The backgauge shaft is crossed to be swung around it；Two backgauge manipulators on the right are arranged independently of one another, the backgauge of the right lower part
Manipulator can also be swung around its internal shaft, and the backgauge manipulator on the right top is fixed on disk lower surface can not
It swings.
Preferably, the elevating mechanism includes at least two lifting cylinders, a lifter plate and multiple elevating levers, the lifting air
The output end of cylinder is connected on the lifter plate, and the multiple elevating lever is separately fixed on the lifter plate.
Preferably, a positioning rod is also set up on lifter plate, the locating rod and the multiple elevating lever are in lifting cylinder
Driving under synchronize and move up and down, the position of the locating rod corresponds to the location hole of turntable.
Compared with prior art, the tubulature device of the automatic Trim Molding equipment of the semiconductor integrated circuit of the utility model is complete
Beauty realize double semiconductor element can the same direction carry out the function of double tubulature feeding, meet biserial pin interfix product
Rapidly and efficiently tubulature, tubulature efficiency is twice of existing single-line held Manifold technology.And two rows of tubulature rails of the utility model
Road is provided separately, and single tubulature and double tubulature flexibly can be selected voluntarily.
The rotary drive mechanism of the utility model rotates sub-material with retarder using servo motor, rotates angle parameterisable
Adjustment is not influenced by tubulature track using abrasion.
In addition, three backgauge manipulator synchronization liftings, keep the clamping of semiconductor element more steady reliable.
[Detailed description of the invention]
Fig. 1 is the structural schematic diagram of the lead material frame of the prior art；
Fig. 2 is the structural schematic diagram for the lead material frame that the utility model uses；
Fig. 3 is the stereochemical structure signal of the tubulature device of the automatic Trim Molding equipment of the utility model semiconductor integrated circuit
Figure；
Fig. 4 is the schematic perspective view of the rotating mechanism of the utility model tubulature device；
Fig. 5 is turntable the first view stereo structural schematic diagram of Fig. 4 rotating mechanism；
Fig. 6 is turntable the second view stereo structural schematic diagram of Fig. 4 rotating mechanism；
Fig. 7 is the elevating mechanism schematic perspective view of Fig. 4 rotating mechanism；
Fig. 8 is the schematic perspective view of Fig. 4 rotating mechanism removed after turntable.
[specific embodiment]
In order to make the purpose of this utility model, technical solution and advantage are more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to solve
The utility model is released, is not used to limit the utility model.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or it may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can
To be directly to another element or may be simultaneously present centering elements.
It is only each other relatively it should also be noted that, the positional terms such as left and right, upper and lower in the utility model embodiment
Concept or be reference with the normal operating condition of product, and should not be regarded as restrictive.
Referring to Fig. 3, the tubulature device 10 of the automatic Trim Molding equipment of the semiconductor integrated circuit of the utility model is used for
Each row's semiconductor element 901 of lead material frame 90 shown in Fig. 2 is sent into next processing stations all in accordance with the same direction
On.It includes a rotating base 104, and one rotating mechanism 105 and three tubulature tracks being fixed on rotating base 104.It is described
Rotating base 104 include the first supporting table 1041 and the second supporting table 1042, the first tubulature track 101 and the second tubulature track
102 are separately fixed at the both ends of the first supporting table 1041, and connect with the rotating mechanism 105 between two tubulature tracks
It connects, third tubulature track 103 is fixed in the second supporting table 1042.The first tubulature track 101, the second tubulature track
102, it after third tubulature track 103 is mounted on rotating base 104, is set parallel to each other, and the first tubulature track 101, second
Tubulature track 102 is end to end by the rotating mechanism 105.The third track being fixed in the second supporting table 1042
103 the first tubulature tracks 101 and the second tubulature track 102 being slightly above fixed in the first supporting table.
A track hopper is respectively provided on first tubulature track 101, the second tubulature track 102 and third tubulature track 103.
As shown, a wherein row for double semiconductor element 901 passes through the third track hopper 1031 of third tubulature track 103 one by one
Feeding forward；The semiconductor element 901 of an other row is first transported in the first track hopper 1011 of the first tubulature track 101.
Since the stitch 902 of double semiconductor element 901 is oppositely arranged, the element stitch 902 in the first track hopper 1011 and
The element stitch 902 of three track hoppers 1031 can be also oppositely arranged, in order to guarantee conveying in the first track hopper 1011
Element stitch 902 towards with the element stitch 902 of third track hopper 1031 towards identical, in the first track hopper 1011
Semiconductor element 901 can first pass through the second track material for being transported to the second tubulature track 102 after rotating mechanism 105 rotates 180 ° again
Feeding forward in slot 1021.At this point, the element stitch 902 of the second track hopper 1021 is towards will be with third track hopper 1031
Interior element stitch 902 realizes the double synchronous feeding of double semiconductor element 901 towards keeping identical, and production efficiency is mesh
Twice of preceding single tubulature feeding.
Referring to Fig. 4, the rotating mechanism 105 includes a turntable 106, a rotary drive mechanism 107 and an elevator
Structure 108, the turntable 106 are placed in first supporting table 1041, and left end is connect with the first tubulature track 101, right
End is connect with the second tubulature track 102.The rotary drive mechanism 107 is driven in 106 bottom of turntable and turntable 106
Connection, drives 106 circle rotation of turntable.In 106 bottom of turntable, described in the periphery setting of driving mechanism 107
Elevating mechanism 108, the elevating mechanism 108 is looped around the periphery of the rotary drive mechanism 107, but does not connect with it
Touching, for controlling the clamping and release that are transported to 106 semiconductor elements 901 of turntable.
The rotary drive mechanism 107 includes a servo motor 1071, one speed reducer 1072 and a rotary shaft 1073, described
Servo motor 1071, retarder 1072, rotary shaft 1073 and the turntable 106 are arranged concentrically vertically.Servo motor 1071 is driven
The retarder 1072 is connected, the rotary shaft 1073 is connected to the power output end of the retarder 1072.The rotary shaft
1073 are connected at the center of the turntable 106 and drive its circle rotation.
Referring to Fig. 5, the turntable 106 is a sheet discs, the diametric two sides of surface perimeter are symmetrically set on it
It is equipped with the first track hopper 1061 and the second track hopper 1062, the first turntable hopper 1061 and the first track hopper
The linking of 1011 phases, the second turntable hopper 1062 are connected with 1021 phase of the second track hopper.First turntable hopper 1061,
The size of second turntable hopper 1062 and any track hopper is all the same, and corresponding with the size of semiconductor element 901, really
Protecting semiconductor element 901 can smoothly transmit inside it.
A positioning hole 1063 is also set up on 106 upper surface circle diameter direction of turntable, the location hole 1063 is to pass through
The through-hole of turntable 106 is worn, is located among the first turntable hopper 1061 and the second turntable hopper 1062, close to turntable
At the position of 106 peripheral circumferentials.
In the position in the 106 upper surface center of circle of turntable, one axis hole 1064, the rotary shaft of the rotary drive mechanism 107 are set
The 1073 interior drive turntables 106 of the insertion axis hole 1064 are rotated.
Referring to Fig. 6, in the setting of the lower surface of turntable 106, there are four backgauge manipulator 1065, four backgauge manipulators
1065 correspond to the both ends of two turntable hoppers of 106 upper surface of turntable and are arranged.Wherein, two backgauge manipulators on the left side
1065 are connected by a backgauge shaft 1066, and two backgauge manipulators 1065 on the right are arranged independently of one another.Two gears on the left side
Material manipulator 1065 passes through the backgauge shaft 1066 and is swung around it；The backgauge manipulator 1065 of the right lower part can also be around
Its internal shaft is swung, and the backgauge manipulator 1065 on the right top is fixed on not swingable on 106 lower surface of turntable.
One end of each backgauge manipulator 1065 is set as backgauge finger 1067, and the other end connects a spring 1068, spring
1068 one end is fixed on the lower surface of turntable 106, and the other end connects the backgauge finger 1067.Backgauge finger 1067 can be worn
It crosses the turntable 106 to extend into two turntable hoppers of 106 upper surface of turntable, for blocking half in two turntable hoppers
Conductor element 901.Under original state, four backgauge fingers 1067 are hidden in two turntable hopper left sides lower part, in release
State；After the starting of elevating mechanism 107, two backgauge fingers 1067 on the left side can be driven to protrude into around the swing of backgauge shaft 1066
The semiconductor element 901 in two turntable hoppers is blocked in two turntable hoppers, is in backgauge state；The left side is also driven simultaneously
The backgauge finger 1067 of lower part extend into the second turntable hopper 1062 around its own shaft swing and blocks semiconductor element
901, it is in backgauge state.And the backgauge finger 1067 of left upper extend into the first turntable hopper due to fixed then remain
Backgauge state is in 1061.The spring 1068 that each 1065 end of backgauge manipulator is connected to herein can guarantee in no liter
Releasing orientation is remained under the driving of descending mechanism 108, and semiconductor element 901 is allowed to be free to enter in turntable 106.
Referring to Fig. 7, the elevating mechanism 108 includes two lifting cylinders 1081, a lifter plate 1082 and three elevating levers
1083.The output end of the lifting cylinder 1081 is connected on the lifter plate 1082, and three elevating lever 1083 is fixed respectively
On the lifter plate 1082.In position, the top of elevating lever 1083 respectively with the backgauge manipulator 1065 wherein
Three correspondences.The lifter plate 1082 is a thin plate, and shape approximation is hook-shaped.The output end of the lifting cylinder 1081 distinguishes position
Between every two elevating lever 1083.It is arranged compared to single cylinder, double cylinder interval settings can make to transmit dynamical stability herein
It does not deviate, guarantees that the clamping of three backgauge manipulators 1065 and release movement synchronism are higher.
A positioning rod 1084, the locating rod 1084 and three elevating levers 1083 are also set up on lifter plate 1082
It synchronizes and moves up and down under the driving of lifting cylinder 1081.The position of the locating rod 1084 corresponds to the positioning on turntable 106
Hole 1063.When entire elevating mechanism 108 moves up, locating rod 1084 can be inserted into location hole 1063, block turntable
106 no longer rotate.
Please refer to Fig. 8, when in use, the wherein one and a half conductor element 901 of lead material frame 90 passes through third tubulature
The third track hopper 1031 of track 103 continues feeding forward, essentially identical with the single tubulature feeding structure of the prior art.
And the semiconductor element 901 of another row then can be first transported on the first track hopper 1011, elevating mechanism 108 brings up three
Three backgauge manipulators 1065 therein jack-up is at releasing orientation by elevating lever 1083, while locating rod 1084 being driven to insert
Enter into location hole 1063, turntable 106 is fixed.Being now placed in semiconductor element 901 on the first track hopper 1011 can be with
It is transported on the first turntable hopper 1061.Since the backgauge manipulator 1065 that the right end lower part of the first turntable hopper 1061 is arranged begins
Turntable 106 is passed through eventually and is in backgauge state, can play the role of backgauge at this time.
After piling semiconductor element 901 in the first turntable hopper 1061, elevating mechanism 108 starts to start and decline, to
Three elevating levers 1083 of lower drive are no longer bear against backgauge manipulator 1065, make backgauge finger 1067 by backgauge spring 1068
With reset, the semiconductor element 901 being located on the first turntable hopper 1061 is clamped.
Later, start rotary drive mechanism 107, turntable 106 is driven to rotate 180 °.Rotation and then starting elevating mechanism
108 begin to ramp up the semiconductor element 901 for withstanding backgauge manipulator 1065 and unclamping in the first turntable hopper 1061.At this moment,
Semiconductor element 901 in one turntable hopper 1061 can be transported in the second track hopper 1021, while the first track hopper
1011 can also be transported to semiconductor element 901 in second turntable hopper 1062, make two hopper loading and unloading on turntable 106
It is synchronous to carry out.
After the semiconductor element 901 in the first turntable hopper 1061 has conveyed, i.e. in the second turntable hopper 1062
Semiconductor element 901 also complete by feeding.Starting elevating mechanism 108, which is begun to decline, unclamps backgauge manipulator 1065, and makes backgauge hand
Refer to that (partly the leading in the first turntable hopper 1061 of semiconductor element 901 in the second turntable hopper 1062 is blocked in 1067 resets
Volume elements part 901 has conveyed, in without material state).Then restart rotary drive mechanism 107 and rotate 180 °, start second
Element in turntable hopper 1062 is transported in the second track hopper 1021, while repeating the step of most starting for the first track material
Semiconductor element 901 in slot 1011 is again fed in the first turntable hopper 1061.So circulation, realizes double semiconductor
The function of the double feeding of element 901.
Compared with prior art, the tubulature device 10 of the automatic Trim Molding equipment of the semiconductor integrated circuit of the utility model
Perfectly realize double semiconductor element 901 can the same direction carry out the function of double tubulature feeding, it is mutual to meet biserial pin
The rapidly and efficiently tubulature of product is inserted, tubulature efficiency is twice of existing single-line held Manifold technology.And the two rows of the utility model
Tubulature track is provided separately, and single tubulature and double tubulature flexibly can be selected voluntarily.
The rotary drive mechanism 107 of the utility model rotates sub-material, rotation with retarder 1072 using servo motor 1071
The adjustment of angle parameterisable is not influenced by tubulature track using abrasion.
In addition, three 1065 synchronization liftings of backgauge manipulator, keep the clamping of semiconductor element 901 more steady reliable.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modification within the principle of utility model, equivalent replacement and improvement etc. should all include the protection scope of the utility model
Within.
Claims (10)
1. a kind of tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit is sent into processing for double semiconductor element
On station comprising a rotating base, a rotating mechanism and at least three tubulature tracks being fixed on rotating base, feature
It is:
The rotating base includes the first supporting table and the second supporting table, wherein two tubulature tracks are separately fixed at the first support
The both ends of platform, and it is end to end by the rotating mechanism between two tubulature tracks；In addition at least a tubulature track is fixed
In second supporting table.
2. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as described in claim 1, it is characterised in that: Gu
The tubulature track for being scheduled on the second supporting table is higher than two tubulature tracks being fixed in the first supporting table.
3. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as described in claim 1, it is characterised in that: institute
It states and is respectively provided with a track hopper at least three tubulature tracks, a wherein row for double semiconductor element passes through in the second supporting table
An at least tubulature track the feeding forward one by one of track hopper；The semiconductor element of an other row is first transported to the first supporting table
In the track hopper of upper left side tubulature track, 180 ° of tracks for being transported to the right tubulature track again are then rotated by rotating mechanism
In hopper.
4. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as claimed in claim 3, it is characterised in that: institute
The rotating mechanism stated includes a turntable, a rotary drive mechanism and an elevating mechanism, and the turntable is placed on the rotation
On pedestal, left end is connect with a tubulature track, and right end is connect with another tubulature track；The rotary drive mechanism turns in described
Pan bottom and turntable are sequentially connected, and the disk peripheral is driven to rotate；In the turntable bottom, the periphery of driving mechanism is set
Set the elevating mechanism.
5. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as claimed in claim 4, it is characterised in that: institute
Stating turntable is a sheet discs, and the diametric two sides of surface perimeter are symmetrically arranged with the first track hopper and the second rail on it
Road hopper, the first turntable hopper are mutually connected with the track hopper on the left side in the first supporting table, the second turntable hopper and the first support
The track hopper on the right is mutually connected on platform.
6. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as claimed in claim 5, it is characterised in that:
A positioning hole is also set up on disk upper surface circle diameter direction, the location hole is the through-hole through turntable, is located at described
Among first turntable hopper and the second turntable hopper, at the position of turntable periphery circumference.
7. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as claimed in claim 5, it is characterised in that:
The position in the disk upper surface center of circle is arranged an axis hole, the rotary shaft of the rotary drive mechanism be inserted into the axis hole drive turntable into
Row rotation.
8. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as claimed in claim 5, it is characterised in that:
There are four backgauge manipulator, which corresponds to two turntable material of disk upper surface for the lower surface setting of turntable
The both ends of slot and be arranged, two backgauge manipulators on the left side are connected by a backgauge shaft, and pass through the backgauge shaft around
It is swung；Two backgauge manipulators on the right are arranged independently of one another, and the backgauge manipulator of the right lower part can also be inside it
Shaft swung, the backgauge manipulator on the right top is fixed on not swingable on disk lower surface.
9. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as claimed in claim 6, it is characterised in that: institute
Stating elevating mechanism includes at least two lifting cylinders, a lifter plate and multiple elevating levers, and the output end of the lifting cylinder is connected to
On the lifter plate, the multiple elevating lever is separately fixed on the lifter plate.
10. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as claimed in claim 9, it is characterised in that:
A positioning rod is also set up on lifter plate, the locating rod is synchronous upper and lower under the driving of lifting cylinder with the multiple elevating lever
Mobile, the position of the locating rod corresponds to the location hole of turntable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820723999.6U CN208643954U (en) | 2018-05-16 | 2018-05-16 | The tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820723999.6U CN208643954U (en) | 2018-05-16 | 2018-05-16 | The tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit |
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| Publication Number | Publication Date |
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| CN208643954U true CN208643954U (en) | 2019-03-26 |
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| CN201820723999.6U Active CN208643954U (en) | 2018-05-16 | 2018-05-16 | The tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114212508A (en) * | 2021-12-17 | 2022-03-22 | 东莞市踔厉智能科技有限公司 | Pipe rail bridging formula mechanism of production line |
-
2018
- 2018-05-16 CN CN201820723999.6U patent/CN208643954U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114212508A (en) * | 2021-12-17 | 2022-03-22 | 东莞市踔厉智能科技有限公司 | Pipe rail bridging formula mechanism of production line |
| CN114212508B (en) * | 2021-12-17 | 2024-01-09 | 东莞市踔厉智能科技有限公司 | Pipe rail bridging type mechanism of production line |
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