CN108405765A - A kind of tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit - Google Patents
A kind of tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit Download PDFInfo
- Publication number
- CN108405765A CN108405765A CN201810465007.9A CN201810465007A CN108405765A CN 108405765 A CN108405765 A CN 108405765A CN 201810465007 A CN201810465007 A CN 201810465007A CN 108405765 A CN108405765 A CN 108405765A
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- Prior art keywords
- turntable
- tubulature
- backgauge
- track
- hopper
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Specific Conveyance Elements (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a kind of tubulature devices of the automatic Trim Molding equipment of semiconductor integrated circuit, it is sent into processing stations for double semiconductor element, it includes a rotating base, one rotating mechanism and at least two tubulature tracks being fixed on rotating base, the rotating mechanism includes a turntable, a rotary drive mechanism and an elevating mechanism, and the turntable is placed on the rotating base, left end is connect with a tubulature track, and right end is connect with another tubulature track；The rotary drive mechanism is sequentially connected in the turntable bottom and turntable, and the disk peripheral is driven to rotate；In the turntable bottom, the elevating mechanism that the periphery setting of driving mechanism is described is used to control the clamping and release for being transported to turntable semiconductor elements.The present invention perfectly realize double semiconductor element can the same direction carry out the function of double tubulature feeding, meet the rapidly and efficiently tubulature of biserial pin interfix product, tubulature efficiency is twice of existing single-line held Manifold technology.
Description
【Technical field】
The present invention relates to semiconductor processing technology field more particularly to it is a kind of can double tubulature semiconductor integrated circuit from
The tubulature device of dynamic Trim Molding equipment.
【Background technology】
The existing automatic Trim Molding equipment of semiconductor integrated circuit is mostly using the structure of single tubulature, single tubulature
Lead rack 80 as shown in Figure 1, the stitch 802 of each semiconductor element 801 is arranged side by side in the same direction, cut one by one
It has no progeny and is abreast transported in tubulature device, be then delivered on next processing stations.This single tubulature of the prior art
Mode can only single channel feeding, efficiency is very low.
It is improved with the continuous upgrading of semiconductor integrated circuit lead frame, a kind of lead frame 90 of biserial stitch interfix
To be born, as shown in Fig. 2, the 901 side by side parallel setting of two rows of semiconductor elements, the opposite connection of stitch 902 is arranged.In tubulature
When, after each semiconductor element 901 is cut one by one, stitch 902 is also cut in junction simultaneously, and keeps 902 phase of stitch
To being transported in tubulature device.
Such lead frame 90 greatly improves tubulature efficiency due to being double synchronous feeding.But it is later half by Trim Molding
The influence in the expects pipe direction that conductor element 901 is packed into, the direction differences of two rows of semiconductor elements 901 can not be put into simultaneously expects pipe into
Enter next station, can only can not fully achieve double semiconductor element 901 successively into feeding in feeding pipe and synchronize the excellent of feeding
Gesture.
In view of the above deficiency, in order to which the rapidly and efficiently tubulature of biserial stitch interfix product can be met, it is necessary to provide one
It is kind completely new can binary channels tubulature the automatic Trim Molding equipment of semiconductor integrated circuit tubulature device.
【Invention content】
For overcome the automatic Trim Molding equipment of existing semiconductor integrated circuit tubulature device problems, the present invention carries
Supplied it is a kind of it is completely new can double tubulature the automatic Trim Molding equipment of semiconductor integrated circuit tubulature device.
The scheme that the present invention solves technical problem is to provide a kind of dress of the automatic Trim Molding equipment of semiconductor integrated circuit
Pipe device is sent into processing stations for double semiconductor element comprising a rotating base and is fixed on rotation at one rotating mechanism
Turn at least two tubulature tracks on pedestal, the rotating mechanism includes a turntable, a rotary drive mechanism and an elevator
Structure, the turntable are placed on the rotating base, and left end is connect with a tubulature track, and right end connects with another tubulature track
It connects；The rotary drive mechanism is sequentially connected in the turntable bottom and turntable, and the disk peripheral is driven to rotate；Institute
The turntable bottom stated, the elevating mechanism that the periphery setting of driving mechanism is described are transported to turntable semiconductor elements for controlling
It clamps and unclamps.
Preferably, the elevating mechanism is looped around the periphery of the rotary drive mechanism, is not driven with the rotation
Mechanism is in contact.
Preferably, it is respectively provided with a track hopper on the tubulature track of the left end and the tubulature track of right end；The turntable
For a sheet discs, the diametric both sides of surface perimeter are symmetrically arranged with the first track hopper and the second track material on it
Slot, the first turntable hopper are mutually connected with the track hopper of left end, and the second turntable hopper is mutually connected with the second track hopper.
Preferably, in the setting of the lower surface of turntable there are four backgauge manipulator, which corresponds to turntable
The both ends of two turntable hoppers of upper surface and be arranged.
Preferably, two backgauge manipulators on the left side are connected by a backgauge shaft, and across the backgauge shaft around
It is swung；Two backgauge manipulators on the right are arranged independently of one another, and the backgauge manipulator of the right lower part also can be inside it
Shaft swung, the backgauge manipulator on the right top is fixed on not swingable on disk lower surface.
Preferably, one end of each backgauge manipulator is set as backgauge finger, and the other end connects a spring, one end of spring
It is fixed on the lower surface of turntable, the other end connects the backgauge finger, and the backgauge finger is extend into across the turntable
In two turntable hoppers of disk upper surface, for blocking the semiconductor element in two turntable hoppers.
Preferably, under original state, four backgauge fingers, which stretch into two turntable hoppers, is hidden in the first turntable material
The left side lower part of slot and the second turntable hopper is in releasing orientation；After elevating mechanism startup, two backgauge hands on the left side are driven
Refer to and stretch into the semiconductor element blocked in two turntable hoppers in two turntable hoppers around backgauge shaft swing, is in backgauge shape
State；The backgauge finger of also driving left side lower part is embedded in block in the second turntable hopper around its own shaft swing simultaneously partly leads
Volume elements part is in backgauge state.
Preferably, the elevating mechanism includes at least two lifting cylinders, a lifter plate and multiple elevating levers, the lifting air
The output end of cylinder is connected on the lifter plate, and the multiple elevating lever is separately fixed on the lifter plate.
Preferably, the lifter plate is a thin plate, and shape approximation is hook-shaped, and the output end of the lifting cylinder is located at often
Between two elevating levers.
Preferably, the rotary drive mechanism includes a servo motor, one speed reducer and a rotary shaft, the servo electricity
Machine, retarder, rotary shaft and the turntable are arranged concentrically vertically, and servo motor transmission connects the retarder, the rotary shaft
It is connected to the power output end of the retarder, the rotary shaft, which is connected at the center of the turntable, drives its circle rotation.
Compared with prior art, the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit of the invention is perfect
Realize double semiconductor element can the same direction carry out the function of double tubulature feeding, meet the fast of biserial pin interfix product
The efficient tubulature of speed, tubulature efficiency is twice of existing single-line held Manifold technology.And two rows of tubulature tracks of the present invention are separately set
It sets, single tubulature and double tubulature flexibly can be selected voluntarily.
The rotary drive mechanism of the present invention rotates sub-material, rotation angle parameterisable tune using servo motor with retarder
It is whole, it is not influenced using abrasion by tubulature track.
In addition, three backgauge manipulator synchronization liftings, keep the clamping of semiconductor element more steady reliable.
【Description of the drawings】
Fig. 1 is the structural schematic diagram of the lead rack of the prior art；
Fig. 2 is the structural schematic diagram for the lead rack that the present invention uses；
Fig. 3 is the dimensional structure diagram of the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit of the present invention；
Fig. 4 is the dimensional structure diagram of the rotating mechanism of tubulature device of the present invention；
Fig. 5 is turntable the first view stereo structural schematic diagram of Fig. 4 rotating mechanisms；
Fig. 6 is turntable the second view stereo structural schematic diagram of Fig. 4 rotating mechanisms；
Fig. 7 is the elevating mechanism dimensional structure diagram of Fig. 4 rotating mechanisms；
Fig. 8 is the dimensional structure diagram of Fig. 4 rotating mechanisms removed after turntable.
【Specific implementation mode】
In order to make the purpose of the present invention, technical solution and advantage be more clearly understood, below in conjunction with attached drawing and embodiment,
The present invention will be described in further detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention,
It is not intended to limit the present invention.
It should be noted that when element is referred to as " being fixed on " or " being set to " another element, it can be directly another
On one element or it may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can
To be directly to another element or may be simultaneously present centering elements.
Only it is relative concept each other it should also be noted that, the orientation term such as left and right, upper and lower in the embodiment of the present invention
Or with the normal operating condition of product be reference, and it should not be regarded as restrictive.
Referring to Fig. 3, the tubulature device 10 of the automatic Trim Molding equipment of semiconductor integrated circuit of the present invention is used for Fig. 2
Shown in each row's semiconductor element 901 of lead rack 90 be sent on next processing stations all in accordance with the same direction.Its
Including a rotating base 104, one rotating mechanism 105 and three tubulature tracks being fixed on rotating base 104.The rotation
Pedestal 104 includes the first supporting table 1041 and the second supporting table 1042, and the first tubulature track 101 and the second tubulature track 102 divide
It is not fixed on the both ends of the first supporting table 1041, and is connect with the rotating mechanism 105 between two tubulature tracks, third
Tubulature track 103 is fixed in the second supporting table 1042.The first tubulature track 101, the second tubulature track 102, third
After tubulature track 103 is mounted on rotating base 104, it is set parallel to each other, and the first tubulature track 101, the second tubulature track
102 is end to end by the rotating mechanism 105.The third tubulature track 103 being fixed in the second supporting table 1042 is slightly higher
In the first tubulature track 101 and the second tubulature track 102 that are fixed in the first supporting table.
It is respectively provided with a track hopper on first tubulature track 101, the second tubulature track 102 and third tubulature track 103.Such as
Diagram, the wherein row of double semiconductor element 901 by the third track hopper 1031 of third tubulature track 103 one by one forward
Feeding；The semiconductor element 901 of an other row is first transported in the first track hopper 1011 of the first tubulature track 101.Due to
The stitch 902 of double semiconductor element 901 is oppositely arranged, the element stitch 902 in the first track hopper 1011 and third track
The element stitch 902 of hopper 1031 can be also oppositely arranged, in order to ensure to convey the element in the first track hopper 1011
Stitch 902 towards with the element stitch 902 of third track hopper 1031 towards identical, the semiconductor in the first track hopper 1011
Element 901 can first pass through rotating mechanism 105 and rotate the second track hopper 1021 for being transported to the second tubulature track 102 after 180 ° again
Inside feeding forward.At this point, the element stitch 902 of the second track hopper 1021 towards by with the element in third track hopper 1031
Stitch 902 realizes that the double synchronous feeding of double semiconductor element 901, production efficiency are current single-line held towards keeping identical
Twice of pipe feeding.
Referring to Fig. 4, the rotating mechanism 105 includes a turntable 106, a rotary drive mechanism 107 and an elevator
Structure 108, the turntable 106 are placed in first supporting table 1041, and left end is connect with the first tubulature track 101, right
End is connect with the second tubulature track 102.The rotary drive mechanism 107 connects in 106 bottom of turntable and the transmission of turntable 106
It connects, drives 106 circle rotation of turntable.In 106 bottom of turntable, described in the periphery setting of driving mechanism 107
Elevating mechanism 108, the elevating mechanism 108 is looped around the periphery of the rotary drive mechanism 107, but does not contact,
For controlling the clamping and release that are transported to 106 semiconductor elements 901 of turntable.
The rotary drive mechanism 107 includes a servo motor 1071, one speed reducer 1072 and a rotary shaft 1073, described
Servo motor 1071, retarder 1072, rotary shaft 1073 and the turntable 106 are arranged concentrically vertically.Servo motor 1071 is driven
The retarder 1072 is connected, the rotary shaft 1073 is connected to the power output end of the retarder 1072.The rotary shaft
1073 are connected at the center of the turntable 106 and drive its circle rotation.
Referring to Fig. 5, the turntable 106 is a sheet discs, the diametric both sides of surface perimeter are symmetrically set on it
It is equipped with the first track hopper 1061 and the second track hopper 1062, the first turntable hopper 1061 and the first track hopper
1011 phases are connected, and the second turntable hopper 1062 is connected with 1021 phase of the second track hopper.First turntable hopper 1061,
The size all same of two turntable hoppers 1062 and any track hopper, and it is corresponding with the size of semiconductor element 901, it is ensured that
Semiconductor element 901 can be transmitted smoothly inside it.
A positioning hole 1063 is also set up on 106 upper surface circle diameter direction of turntable, the location hole 1063 is to pass through
The through-hole of turntable 106 is worn, is located among the first turntable hopper 1061 and the second turntable hopper 1062, close to turntable
At the position of 106 peripheral circumferentials.
In the position in the 106 upper surface center of circle of turntable, one axis hole 1064, the rotary shaft of the rotary drive mechanism 107 are set
The 1073 interior drive turntables 106 of the insertion axis hole 1064 are rotated.
Referring to Fig. 6, in the setting of the lower surface of turntable 106, there are four backgauge manipulator 1065, four backgauge manipulators
1065 are arranged corresponding to the both ends of two turntable hoppers of 106 upper surface of turntable.Wherein, two backgauge manipulators on the left side
1065 are connected by a backgauge shaft 1066, and two backgauge manipulators 1065 on the right are arranged independently of one another.Two gears on the left side
Material manipulator 1065 is swung across the backgauge shaft 1066 around it；The backgauge manipulator 1065 of the right lower part also can be around
Its internal shaft is swung, and the backgauge manipulator 1065 on the right top is fixed on not swingable on 106 lower surface of turntable.
One end of each backgauge manipulator 1065 is set as backgauge finger 1067, and the other end connects a spring 1068, spring
1068 one end is fixed on the lower surface of turntable 106, and the other end connects the backgauge finger 1067.Backgauge finger 1067 may pass through
The turntable 106 is extend into two turntable hoppers of 106 upper surface of turntable, for blocking partly leading in two turntable hoppers
Volume elements part 901.Under original state, four backgauge fingers 1067 are hidden in two turntable hopper left sides lower part, in release shape
State；After the startup of elevating mechanism 107, two backgauge fingers 1067 on the left side can be driven to be stretched into two around the swing of backgauge shaft 1066
The semiconductor element 901 in two turntable hoppers is blocked in a turntable hopper, is in backgauge state；It also drives under the left side simultaneously
The backgauge finger 1067 in portion extend into the second turntable hopper 1062 around its own shaft swing and blocks semiconductor element
901, it is in backgauge state.And the backgauge finger 1067 of left upper extend into the first turntable hopper due to fixed then remain
Backgauge state is in 1061.The spring 1068 that each 1065 end of backgauge manipulator is connected to herein, which can guarantee, not to be lifted
Releasing orientation is remained under the driving of mechanism 108, and semiconductor element 901 is allowed to be free to enter in turntable 106.
Referring to Fig. 7, the elevating mechanism 108 includes two lifting cylinders 1081, a lifter plate 1082 and three elevating levers
1083.The output end of the lifting cylinder 1081 is connected on the lifter plate 1082, and three elevating lever 1083 is fixed respectively
On the lifter plate 1082.In position, the top of elevating lever 1083 respectively with the backgauge manipulator 1065 wherein
Three correspondences.The lifter plate 1082 is a thin plate, and shape approximation is hook-shaped.The output end of the lifting cylinder 1081 is located at
Between each two elevating lever 1083.It is arranged compared to single cylinder, double cylinder interval settings herein can make transmission dynamical stability not
Offset ensures that the clamping of three backgauge manipulators 1065 acts synchronism higher with release.
A positioning rod 1084 is also set up on lifter plate 1082, the locating rod 1084 exists with three elevating levers 1083
It synchronizes and moves up and down under the driving of lifting cylinder 1081.The position of the locating rod 1084 corresponds to the location hole on turntable 106
1063.When entire elevating mechanism 108 moves up, locating rod 1084 can be inserted into location hole 1063, block turntable 106 not
It is rotated further by.
Please refer to Fig. 8, when in use, the wherein one and a half conductor element 901 of lead rack 90 passes through third tubulature
The third track hopper 1031 of track 103 continues feeding forward, essentially identical with the single tubulature feeding structure of the prior art.And
The semiconductor element 901 of another row then can be first transported on the first track hopper 1011, and elevating mechanism 108 brings up three and rises
Three backgauge manipulators 1065 therein jack-up is at releasing orientation by drop bar 1083, while locating rod 1084 being driven to be inserted into
Into location hole 1063, turntable 106 is fixed.The semiconductor element 901 being now placed on the first track hopper 1011 can be defeated
It is sent on the first turntable hopper 1061.Due to the first turntable hopper 1061 right end lower part be arranged backgauge manipulator 1065 always
It is in backgauge state across turntable 106, backgauge can be played the role of at this time.
After piling semiconductor element 901 in the first turntable hopper 1061, elevating mechanism 108 starts to start and decline, to
Three elevating levers 1083 of lower drive are no longer bear against backgauge manipulator 1065, and backgauge finger 1067 is made to be acted on by backgauge spring 1068
It resets, clamps the semiconductor element 901 being located on the first turntable hopper 1061.
Later, start rotary drive mechanism 107, turntable 106 is driven to rotate 180 °.Rotation and then startup elevating mechanism
108 begin to ramp up the semiconductor element 901 for withstanding backgauge manipulator 1065 and unclamping in the first turntable hopper 1061.At this moment,
Semiconductor element 901 in one turntable hopper 1061 can be transported in the second track hopper 1021, while the first track hopper
1011 can also be transported to semiconductor element 901 in second turntable hopper 1062, keep two hopper loading and unloading on turntable 106 same
Step carries out.
After the semiconductor element 901 in the first turntable hopper 1061 has conveyed, i.e. in the second turntable hopper 1062
Semiconductor element 901 also complete by feeding.Start elevating mechanism 108 and begin to decline release backgauge manipulator 1065, and makes backgauge hand
Refer to 1067 and blocks (the semiconductor element in the first turntable hopper 1061 of semiconductor element 901 in the second turntable hopper 1062
Part 901 has conveyed, in without material state).Then restart rotary drive mechanism 107 and rotate 180 °, start the second turntable
Element in hopper 1062 is transported in the second track hopper 1021, while repeating the step of most starting by the first track hopper
Semiconductor element 901 in 1011 is again fed in the first turntable hopper 1061.So cycle, realizes double semiconductor element
The function of 901 double feedings.
Compared with prior art, the tubulature device 10 of the automatic Trim Molding equipment of semiconductor integrated circuit of the invention is perfect
Realize double semiconductor element 901 can the same direction carry out the function of double tubulature feeding, meet the production of biserial pin interfix
The rapidly and efficiently tubulature of product, tubulature efficiency are twice of existing single-line held Manifold technology.And two rows of tubulature tracks of the present invention
It is provided separately, single tubulature and double tubulature flexibly can be selected voluntarily.
The rotary drive mechanism 107 of the present invention rotates sub-material, rotation angle using servo motor 1071 with retarder 1072
Parameterisable adjusts, and is not influenced using abrasion by tubulature track.
In addition, three 1065 synchronization liftings of backgauge manipulator, keep the clamping of semiconductor element 901 more steady reliable.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all originals in the present invention
Any modification made by within then, equivalent replacement and improvement etc. should all include within protection scope of the present invention.
Claims (10)
1. a kind of tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit is sent into processing for double semiconductor element
On station comprising a rotating base, a rotating mechanism and at least two tubulature tracks being fixed on rotating base, feature
It is：
The rotating mechanism includes a turntable, a rotary drive mechanism and an elevating mechanism, and the turntable is placed on described
Rotating base on, left end is connect with a tubulature track, and right end is connect with another tubulature track；
The rotary drive mechanism is sequentially connected in the turntable bottom and turntable, and the disk peripheral is driven to rotate；
In the turntable bottom, the elevating mechanism described in the periphery setting of driving mechanism is transported to turntable upper half for control and leads
The clamping and release of volume elements part.
2. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as described in claim 1, it is characterised in that：Institute
The elevating mechanism stated is looped around the periphery of the rotary drive mechanism, is not in contact with the rotary drive mechanism.
3. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as described in claim 1, it is characterised in that：Institute
It states and is respectively provided with a track hopper on the tubulature track of left end and the tubulature track of right end；The turntable is a sheet discs, at it
The both sides in upper surface circle diameter direction are symmetrically arranged with the first track hopper and the second track hopper, the first turntable hopper and a left side
The track hopper at end is mutually connected, and the second turntable hopper is mutually connected with the second track hopper.
4. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as described in claim 1, it is characterised in that：
There are four backgauge manipulator, which corresponds to two turntable material of disk upper surface for the lower surface setting of turntable
The both ends of slot and be arranged.
5. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as claimed in claim 4, it is characterised in that：It is left
Two backgauge manipulators on side are connected by a backgauge shaft, and are swung around it across the backgauge shaft；The right
Two backgauge manipulators are arranged independently of one another, and the backgauge manipulator of the right lower part can also be swung around its internal shaft, right
The backgauge manipulator on side top is fixed on not swingable on disk lower surface.
6. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as claimed in claim 4, it is characterised in that：Often
One end of one backgauge manipulator is set as backgauge finger, and the other end connects a spring, and one end of spring is fixed on the following table of turntable
On face, the other end connects the backgauge finger, and the backgauge finger extend into two of disk upper surface across the turntable
In turntable hopper, for blocking the semiconductor element in two turntable hoppers.
7. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as claimed in claim 6, it is characterised in that：Just
Under beginning state, four backgauge fingers are hidden in the left side lower part of the first turntable hopper and the second turntable hopper, in release shape
State；After elevating mechanism startup, two backgauge fingers on the left side is driven to be stretched into two turntable hoppers around backgauge shaft swing
The semiconductor element in two turntable hoppers is blocked, backgauge state is in；The also backgauge finger of driving left side lower part is around it simultaneously
Own torque swings and stretches into the second turntable hopper and block semiconductor element, is in backgauge state.
8. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as described in claim 1, it is characterised in that：Institute
It includes at least two lifting cylinders, a lifter plate and multiple elevating levers to state elevating mechanism, and the output end of the lifting cylinder is connected to
On the lifter plate, the multiple elevating lever is separately fixed on the lifter plate.
9. the tubulature device of the automatic Trim Molding equipment of semiconductor integrated circuit as claimed in claim 8, it is characterised in that：Institute
It is a thin plate to state lifter plate, and shape approximation is hook-shaped, and the output end of the lifting cylinder is located between each two elevating lever.
10. special such as the tubulature device of the automatic Trim Molding equipment of claim 1-9 any one of them semiconductor integrated circuit
Sign is：The rotary drive mechanism include a servo motor, one speed reducer and a rotary shaft, the servo motor, retarder,
Rotary shaft and the turntable are arranged concentrically vertically, and servo motor transmission connects the retarder, and the rotary shaft is connected to described
The power output end of retarder, the rotary shaft, which is connected at the center of the turntable, drives its circle rotation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810465007.9A CN108405765B (en) | 2018-05-16 | 2018-05-16 | Tubing device of automatic rib cutting and forming equipment for semiconductor integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810465007.9A CN108405765B (en) | 2018-05-16 | 2018-05-16 | Tubing device of automatic rib cutting and forming equipment for semiconductor integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108405765A true CN108405765A (en) | 2018-08-17 |
| CN108405765B CN108405765B (en) | 2023-08-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810465007.9A Active CN108405765B (en) | 2018-05-16 | 2018-05-16 | Tubing device of automatic rib cutting and forming equipment for semiconductor integrated circuit |
Country Status (1)
| Country | Link |
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| CN (1) | CN108405765B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112660766A (en) * | 2020-12-29 | 2021-04-16 | 安徽耐科装备科技股份有限公司 | Turnover mechanism for semiconductor chip strip bar cutting forming equipment |
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| CN108405765B (en) | 2023-08-08 |
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