CN208367620U - A kind of cpu heat - Google Patents
A kind of cpu heat Download PDFInfo
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- CN208367620U CN208367620U CN201821102847.0U CN201821102847U CN208367620U CN 208367620 U CN208367620 U CN 208367620U CN 201821102847 U CN201821102847 U CN 201821102847U CN 208367620 U CN208367620 U CN 208367620U
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Abstract
The utility model provides a kind of cpu heat, and the utility model solves the technical problem that existing cpu heat heat dissipation effect is bad, heat transfer efficiency is low；By the pressure difference between the first allobar, the second allobar, third allobar, the flow velocity speed for forming cold air interlocks, and enhances mobility of the cold air in heat dissipation group, to effectively improve the heat dissipation effect of heat dissipation group；By using it is multiple by main heat-transfer pipe, divide heat transfer tube group at heat pipe, increase with the area of air heat exchange, accelerate heat dissipating fluid condensation rate in heat pipe and achieve the purpose that further increase radiating efficiency to CPU fast cooling.
Description
Technical field
The utility model relates to oil conditioner fields, and in particular to a kind of cpu heat.
Background technique
CPU is also known as central processing unit, is one piece of ultra-large integrated circuit, is the arithmetic core and control of a computer
Core processed, its function are mainly the data in interpretive machine instruction and processing computer software.CPU is during the work time
A large amount of heat can be generated, if these heats are not distributed in time, gently if cause to crash, it is heavy then CPU may be burnt,
For cpu heat for radiating for CPU, radiator plays conclusive effect to the stable operation of CPU.
With the continuous improvement of computer technology, the operational capability of CPU constantly enhances, and the heat of generation is also more and more, because
This requirement to CPU radiating efficiency is also higher and higher.But the cpu heat of existing desktop computer mainly uses air-cooled form, wind
The size and quantity of the heat dissipation effect of cold heat sink and the area of cooling fin and fan are closely related, but due to desktop computer
The reasons such as overall dimensions limitation, require the full-size of air-cooled radiator, therefore radiating efficiency is not still high, so now
It is badly in need of the high cpu heat of a kind of good heat dissipation effect, heat transfer efficiency.
Utility model content
In order to solve the problems in the existing technology, the utility model provides a kind of cpu heat, has heat dissipation effect
The feature that fruit is good, radiating efficiency is high.
The technical solution that the utility model solves the above problems are as follows: a kind of cpu heat, including heat-conducting seat, heat pipe, heat dissipation
Group, fan；
Heat-conducting seat upper surface is equipped with multiple thermal troughs, and heat dissipation group is located above heat-conducting seat, and heat pipe bottom end is chimeric with heat-conducting seat
Setting, heat pipe upper end are pierced by heat dissipation group, chimeric setting between heat pipe and heat dissipation group；Fan is fixed on the left of heat dissipation group；
Heat dissipation group includes the first cooling fin, the second cooling fin, and two the first cooling fins up and down place by mirror image, and two first dissipate
Multiple second cooling fins are equipped between backing, the second cooling fin is uniformly distributed along Y-direction, and the first cooling fin, the second cooling fin are equal
It is parallel with heat-conducting seat；
Multiple circular through holes chimeric with heat pipe are equipped on first cooling fin, the second cooling fin；
First cooling fin lower end surface is equipped with multiple first transformation slots, and the first transformation slot is uniformly distributed in X direction；It is two neighboring
A second transformation slot is equipped between first transformation slot, the second transformation slot is uniformly distributed in X direction,
Second cooling fin upper surface and lower end surface are equipped with multiple first transformation slots, and the first transformation slot uniformly divides in X direction
Cloth；A second transformation slot is equipped between two neighboring first transformation slot, the second transformation slot is uniformly distributed in X direction；
Heat pipe is hollow closed structure, and heat pipe includes heat conducting disk, main heat-transfer pipe, and heat conducting disk is hollow cylinder structure, is led
Hot plate upper surface is equipped with multiple radiating fins,
More main heat-transfer pipes surround heat conducting disk cylindrical surface annular array, and main heat-transfer pipe is hollow structure, main heat transfer tube section
Shape is L shape；Main heat-transfer pipe is connected into a single integrated structure with heat conducting disk；Heat dissipating fluid, sink flows position are equipped in main heat-transfer pipe
In main heat transfer bottom of the tube；
Each main heat-transfer pipe is equipped with more point heat-transfer pipes, divides heat-transfer pipe around main heat-transfer pipe annular array, divides heat-transfer pipe
For hollow structure, dispersion heat pipe cross sectional shape is L shape；Heat-transfer pipe is divided to be connected to main heat-transfer pipe.
Further, dividing the distance between heat-transfer pipe and heat-conducting seat is H1, and the distance between heat dissipation group and heat-conducting seat are H2,
H1>H2。
Further, radiating fin is symmetrical structure, and radiating fin includes two radiating fins, and radiating fin section is circle
Arc, radiating fin inner arc surface are equipped with multiple heat transfer sheets.
Further, thermally conductive groove shape is identical in the projection of shape of horizontal plane as heat pipe.
Further, the first transformation slot cross-section is semicircle, and the first transformation groove radius is R1；Second transformation slot cross-section is half
Circle, the second transformation groove radius are R2, R1 > R2.
The utility model is with the utility model has the advantages that the utility model solves, existing cpu heat heat dissipation effect is bad, conducts heat
The technical issues of low efficiency；By the pressure difference between the first allobar, the second allobar, third allobar, cold air is formed
Flow velocity speed interlocks, and enhances mobility of the cold air in heat dissipation group, to effectively improve the heat dissipation effect of heat dissipation group；Pass through benefit
With it is multiple by main heat-transfer pipe, divide heat transfer tube group at heat pipe, increase with the area of air heat exchange, accelerate heat dissipating fluid in heat pipe
Condensation rate achievees the purpose that further increase radiating efficiency to CPU fast cooling.
Detailed description of the invention
Fig. 1 is the utility model perspective view.
Fig. 2 is the utility model main view.
Fig. 3 is the utility model heat dissipation group perspective view.
Fig. 4 is the utility model heat dissipation group main view.
Fig. 5 is the first heat sink structure illustration of the utility model.
Fig. 6 is the second heat sink structure illustration of the utility model.
Fig. 7 is the utility model heat pipe structure schematic diagram.
Fig. 8 is part A enlarged drawing in Fig. 7.
Fig. 9 is the utility model heat-conducting seat top view.
In figure: 1- heat-conducting seat, 2- heat pipe, 3- heat dissipation group, 4- fan, 5- thermal trough, the first cooling fin of 6-, 7- second radiate
Piece, 8- the first transformation slot, 9- the second transformation slot, the first allobar of 10-, the second allobar of 11-, 12- third allobar, 13- are led
Hot plate, the main heat-transfer pipe of 14-, 15- radiating fin, 16- radiating fin, 17- heat transfer sheet, 18- divide heat-transfer pipe.
Specific embodiment
With reference to the accompanying drawing and specific embodiment is further described the utility model.
A kind of cpu heat, including heat-conducting seat 1, heat pipe 2, heat dissipation group 3, fan 4；
1 upper surface of heat-conducting seat is equipped with multiple thermal troughs 5, and heat dissipation group 3 is located at 1 top of heat-conducting seat, 2 bottom end of heat pipe and heat-conducting seat
1 chimeric setting, 5 shape of thermal trough are identical in the projection of shape of horizontal plane as heat pipe 2；2 upper end of heat pipe is pierced by heat dissipation group 3, heat pipe 2
The chimeric setting between heat dissipation group 3；Fan 4 is fixed on 3 left side of heat dissipation group；
Heat dissipation group 3 includes the first cooling fin 6, the second cooling fin 7, the placements of two about 6 mirror images of the first cooling fin, and two the
Multiple second cooling fins 7 are equipped between one cooling fin 6, the second cooling fin 7 is uniformly distributed along Y-direction, the first cooling fin 6, second
Cooling fin 7 is parallel with heat-conducting seat 1；
Multiple circular through holes chimeric with heat pipe 2 are equipped on first cooling fin 6, the second cooling fin 7；
First cooling fin, 6 lower end surface is equipped with multiple first transformation slots 8, and the first transformation slot 8 is uniformly distributed in X direction, and first
8 section of transformation slot is semicircle, and 8 radius of the first transformation slot is R1；One second change is equipped between two neighboring first transformation slot 8
Indent 9, the second transformation slot 9 are uniformly distributed in X direction, and 9 section of the second transformation slot is semicircle, and 9 radius of the second transformation slot is R2,
R1>R2；
Second cooling fin, 7 upper surface and lower end surface are equipped with multiple first transformation slots 8, and the first transformation slot 8 is uniform in X direction
Distribution, 8 section of the first transformation slot are semicircle, and 8 radius of the first transformation slot is R1；It is equipped between two neighboring first transformation slot 8
One the second transformation slot 9, the second transformation slot 9 are uniformly distributed in X direction, and 9 section of the second transformation slot is semicircle, the second transformation slot
9 radiuses are R2, R1 > R2；
Form the first allobar 10 between upper and lower the first opposite transformation slot 8 of mirror image, the second transformation slot 9 of upper and lower mirror image it
Between form the second allobar 11, between the first allobar 10 and the second allobar 11 formed third allobar 12；Fan 4 is accelerated to dissipate
Air flowing in heat group 3, cold air is brought into heat dissipation group 3, because the first allobar 10, the second allobar 11, third become
The volume of pressure area 12 is different, so there are pressure difference, cold skies between the first allobar 10, the second allobar 11, third allobar 12
The flow velocity speed of gas interlocks, and enhances mobility of the cold air in heat dissipation group 3, to effectively improve the heat dissipation effect of heat dissipation group 3；
Heat pipe 2 is hollow closed structure, and heat pipe 2 includes heat conducting disk 13, main heat-transfer pipe 142, and heat conducting disk 13 is hollow circuit cylinder
Body structure, 13 upper surface of heat conducting disk are equipped with multiple radiating fins 15, and radiating fin 15 is symmetrical structure, and radiating fin 15 includes two
A radiating fin 16,16 section of radiating fin be it is arc-shaped, 16 inner arc surface of radiating fin be equipped with multiple heat transfer sheets 17, heat transfer
Piece 17 is rectangle；Radiating fin 15 increases heat dissipation area, can accelerate the radiating rate of CPU；
Four main heat-transfer pipes 14 surround 13 cylindrical surface annular array of heat conducting disk, and main heat-transfer pipe 14 is hollow structure, main heat transfer
14 cross sectional shape of pipe is L shape；Main heat-transfer pipe 14 is connected into a single integrated structure with heat conducting disk 13；
It is set on each main heat-transfer pipe 14 there are three heat-transfer pipe 18 is divided, heat-transfer pipe 18 is divided to surround main 14 annular array of heat-transfer pipe,
Dividing heat-transfer pipe 18 is hollow structure, divides heat-transfer pipe 18 to be connected to main heat-transfer pipe 14 into a single integrated structure；Divide heat-transfer pipe 18 and heat-conducting seat 1
The distance between be H1, the distance between heat dissipation group 3 and heat-conducting seat 1 be H2, H1 > H2；
It is equipped with heat dissipating fluid in main heat-transfer pipe 14, heat dissipating fluid is located at main 14 bottom of heat-transfer pipe, is under heat dissipating fluid room temperature
Liquid can become gaseous state and rise to main heat-transfer pipe 14, point biography after heat dissipating fluid absorbs the CPU heat transmitted by heat-conducting seat 1
18 top of heat pipe returns to main 14 bottom of heat-transfer pipe until can just fall after top is condensed into liquid；
The area with air heat exchange is increased by main heat-transfer pipe 14, the heat pipe 2 for dividing heat-transfer pipe 18 to form using multiple,
It can accelerate heat dissipating fluid condensation rate in heat pipe 2, to further increase radiating efficiency.
Many other changes and modifications may be made without departing from the spirit and scope of the utility model.It should be appreciated that this reality
It is not limited to specific embodiment with novel, the scope of the utility model is defined by the following claims.
Claims (9)
1. a kind of cpu heat, which is characterized in that including heat-conducting seat, heat pipe, heat dissipation group, fan；
Heat-conducting seat upper surface is equipped with multiple thermal troughs, and heat dissipation group is located above heat-conducting seat, the setting chimeric with heat-conducting seat of heat pipe bottom end,
Heat pipe upper end is pierced by heat dissipation group, chimeric setting between heat pipe and heat dissipation group；Fan is fixed on the left of heat dissipation group；
Heat dissipation group includes the first cooling fin, the second cooling fin, and two the first cooling fins up and down place by mirror image, two the first cooling fins
Between be equipped with multiple second cooling fins, the second cooling fin is uniformly distributed along Y-direction, the first cooling fin, the second cooling fin with lead
Hot seat is parallel；
Multiple circular through holes chimeric with heat pipe are equipped on first cooling fin, the second cooling fin；
First cooling fin lower end surface is equipped with multiple first transformation slots, and the first transformation slot is uniformly distributed in X direction；Two neighboring first
A second transformation slot is equipped between transformation slot, the second transformation slot is uniformly distributed in X direction,
Second cooling fin upper surface and lower end surface are equipped with multiple first transformation slots, and the first transformation slot is uniformly distributed in X direction；Phase
It is equipped with a second transformation slot between adjacent two the first transformation slots, the second transformation slot is uniformly distributed in X direction；
Heat pipe is hollow closed structure, and heat pipe includes heat conducting disk, main heat-transfer pipe, and heat conducting disk is hollow cylinder structure, heat conducting disk
Upper surface is equipped with multiple radiating fins,
More main heat-transfer pipes surround heat conducting disk cylindrical surface annular array, and main heat-transfer pipe is hollow structure, main heat-transfer pipe cross sectional shape
For L shape；Main heat-transfer pipe is connected into a single integrated structure with heat conducting disk；Heat dissipating fluid is equipped in main heat-transfer pipe, heat dissipating fluid is located at master
Heat transfer bottom of the tube；
Each main heat-transfer pipe is equipped with more point heat-transfer pipes, divides heat-transfer pipe around main heat-transfer pipe annular array, divides during heat-transfer pipe is
Hollow structure, dispersion heat pipe cross sectional shape are L shape；Heat-transfer pipe is divided to be connected to main heat-transfer pipe.
2. a kind of cpu heat as described in claim 1, which is characterized in that the first transformation slot cross-section is semicircle, the
One transformation groove radius is R1；Second transformation slot cross-section is semicircle, and the second transformation groove radius is R2, R1 > R2.
3. a kind of cpu heat as claimed in claim 1 or 2, which is characterized in that the radiating fin is symmetrical structure, is dissipated
Hot fin include two radiating fins, radiating fin section be it is arc-shaped, radiating fin inner arc surface be equipped with multiple heat transfer sheets.
4. a kind of cpu heat as claimed in claim 1 or 2, which is characterized in that the thermally conductive groove shape and heat pipe are in level
The projection of shape in face is identical.
5. a kind of cpu heat as claimed in claim 3, which is characterized in that the thermally conductive groove shape and heat pipe are in horizontal plane
Projection of shape it is identical.
6. a kind of cpu heat as claimed in claim 1 or 2, which is characterized in that described to divide between heat-transfer pipe and heat-conducting seat
Distance is H1, and the distance between heat dissipation group and heat-conducting seat are H2, H1 > H2.
7. a kind of cpu heat as claimed in claim 3, which is characterized in that it is described divide between heat-transfer pipe and heat-conducting seat away from
From for H1, the distance between heat dissipation group and heat-conducting seat are H2, H1 > H2.
8. a kind of cpu heat as claimed in claim 4, which is characterized in that it is described divide between heat-transfer pipe and heat-conducting seat away from
From for H1, the distance between heat dissipation group and heat-conducting seat are H2, H1 > H2.
9. a kind of cpu heat as claimed in claim 5, which is characterized in that it is described divide between heat-transfer pipe and heat-conducting seat away from
From for H1, the distance between heat dissipation group and heat-conducting seat are H2, H1 > H2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821102847.0U CN208367620U (en) | 2018-07-12 | 2018-07-12 | A kind of cpu heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821102847.0U CN208367620U (en) | 2018-07-12 | 2018-07-12 | A kind of cpu heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208367620U true CN208367620U (en) | 2019-01-11 |
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ID=64925093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821102847.0U Active CN208367620U (en) | 2018-07-12 | 2018-07-12 | A kind of cpu heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208367620U (en) |
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2018
- 2018-07-12 CN CN201821102847.0U patent/CN208367620U/en active Active
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