CN208227406U - A kind of high efficiency and heat radiation printed circuit board - Google Patents
A kind of high efficiency and heat radiation printed circuit board Download PDFInfo
- Publication number
- CN208227406U CN208227406U CN201721848512.9U CN201721848512U CN208227406U CN 208227406 U CN208227406 U CN 208227406U CN 201721848512 U CN201721848512 U CN 201721848512U CN 208227406 U CN208227406 U CN 208227406U
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- layer
- heat
- main body
- wiring board
- heat dissipation
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of high efficiency and heat radiation printed circuit boards, including wiring board main body, the outside of wiring board main body is provided with protecting border, protecting border is made using wood materials, the quadrangle of protecting border is provided with fixed hole, fixed hole is internally provided with internal screw thread, element installing zone is provided at left and right sides of wiring board main body, the intermediate position of wiring board main body is provided with heat dissipation patch, the surface of heat dissipation patch is provided with several contacts, contact is made of brass, contact is evenly distributed on the surface of heat dissipation patch, top layer is provided at the top of wiring board main body, the bottom of top layer is provided with copper foil layer, contact contacts with each other with copper foil layer, the bottom of copper foil layer is provided with graphite thermal layer, it is formed between graphite thermal layer and copper foil layer and top layer by high-temperature laminating, it is provided with graphite thermal layer and ceramic heat-dissipating base , while the bottom of ceramic heat-dissipating base is additionally provided with heat dissipation copper pipe, by its mutual cooperation heat is quickly scattered and disappeared.
Description
Technical field
The utility model relates to circuit board technology field, specially a kind of high efficiency and heat radiation printed circuit board.
Background technique
The benefit of printed circuit is not need to be welded again and again on circuit boards, eliminates the hand of large amount of complex
Work patching operations, and high-precision can be reached, greatly improve the production efficiency, stability and profit margin of circuit board.Printing
Industry, which can reduce big picture, makes a plate, and printed circuit, which can also equally reduce electronic-circuit diagram, makes a plate, thus for integrated electricity
The generation on road has prepared condition.Today, all computers and all electronic products, all employ printed circuit, with
The development and progress of science and technology, is integrated with more and more components, this makes the heat dissipation to circuit board on slight circuit board
Requirement with higher.
So how to design a kind of high efficiency and heat radiation printed circuit board, becoming us will currently be solved the problems, such as.
Utility model content
The purpose of this utility model is to provide a kind of high efficiency and heat radiation printed circuit boards, to solve to mention in above-mentioned background technique
Out with the development of science and technology and progress, more and more components are integrated on slight circuit board, this makes to circuit
The heat dissipation of plate the problem of requiring with higher.
To achieve the above object, the utility model provides the following technical solutions: a kind of high efficiency and heat radiation printed circuit board, including
Wiring board main body, the outside of the wiring board main body are provided with protecting border, the protecting border made of wood materials and
At the quadrangle of the protecting border is provided with fixed hole, and the fixed hole is internally provided with internal screw thread, the wiring board master
Element installing zone is provided at left and right sides of body, the intermediate position of the wiring board main body is provided with heat dissipation patch, described to dissipate
The surface of heat posted piece is provided with several contacts, and the contact is made of brass, and the contact is evenly distributed on the heat dissipation patch
The surface of piece, is provided with top layer at the top of the wiring board main body, and the bottom of the top layer is provided with copper foil layer, the contact with
The copper foil layer contacts with each other, and the bottom of the copper foil layer is provided with graphite thermal layer, the graphite thermal layer and the copper foil
It is formed between layer and the top layer by high-temperature laminating.
Further, the bottom of the graphite thermal layer is provided with ceramic heat-dissipating base, and the ceramic heat-dissipating base is in half
Bag-like.
Further, the bottom of the ceramic heat-dissipating base is provided with several heat dissipation copper pipes, the heat dissipation copper pipe and institute
It states and is welded to connect between ceramic heat-dissipating base by scolding tin.
Further, the surrounding of the graphite thermal layer is provided with card slot, and the quadrangle of the graphite thermal layer is provided with solid
Determine hole, to be connected between the graphite thermal layer and the ceramic heat-dissipating base by card slot.
Further, the graphite thermal layer is composed by several graphite crystals are horizontally arranged.
Compared with prior art, the utility model has the beneficial effects that
1. being provided with graphite thermal layer and ceramic heat-dissipating base, while the bottom of ceramic heat-dissipating base is additionally provided with heat dissipation
Copper pipe enables heat quickly to scatter and disappear by its mutual cooperation.
2. being formed between graphite thermal layer and copper foil layer and top layer by high-temperature laminating, reduces the use of viscose glue, make
Heat loss speed faster, heat dissipation effect is more preferable.
3. wiring board main body is provided with heat dissipation patch, the contact inside the patch that radiates directly is connected with copper foil layer, to reach
To the purpose of rapid cooling, whole using effect is more preferable.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the schematic diagram of internal structure of the utility model；
Fig. 3 is the structural schematic diagram of the utility model graphite thermal layer；
In figure: 1- heat dissipation patch；2- wiring board main body；3- fixed hole；4- element installing zone；5- protecting border；6- touching
Point；7- ceramic heat-dissipating base；8- top layer；9- copper foil layer；10- graphite thermal layer；11- heat dissipation copper pipe；12- fixation hole；13- card
Slot；14- graphite crystal.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of high efficiency and heat radiation printed circuit board, including line
Road plate main body 2, the outside of the wiring board main body 2 are provided with protecting border 5, and the protecting border 5 is made of wood materials
It forms, the quadrangle of the protecting border 5 is provided with fixed hole 3, and the fixed hole 3 is internally provided with internal screw thread, the line
The left and right sides of road plate main body 2 is provided with element installing zone 4, and the intermediate position of the wiring board main body 2 is provided with heat dissipation patch
The surface of piece 1, the heat dissipation patch 1 is provided with several contacts 6, and the contact 6 is made of brass, and the contact 6 is uniformly divided
For cloth on the surface of the heat dissipation patch 1, the top of the wiring board main body 2 is provided with top layer 8, the bottom setting of the top layer 8
There is copper foil layer 9, the contact 6 contacts with each other with the copper foil layer 9, and the bottom of the copper foil layer 9 is provided with graphite thermal layer 10,
It is formed between the graphite thermal layer 10 and the copper foil layer 9 and the top layer 8 by high-temperature laminating.The above composition is originally practical
Novel basic structure.
The utility model uses such structure setting, by being provided with graphite thermal layer 10 and ceramic heat-dissipating base 7,
The bottom of ceramic heat-dissipating base 7 is additionally provided with heat dissipation copper pipe 11 simultaneously, by its mutual cooperation heat is quickly scattered and disappeared.
It is formed between graphite thermal layer 10 and copper foil layer 9 and top layer 8 by high-temperature laminating, reduces the use of viscose glue, so that heat
Faster, heat dissipation effect is more preferable for lost speed.Wiring board main body 2 is provided with heat dissipation patch 1, and the contact 6 inside the patch 1 that radiates is straight
It connects and is connected with copper foil layer 9, to achieve the purpose that rapid cooling, whole using effect is more preferable.
More specifically, the bottom of the graphite thermal layer 10 is provided with ceramic heat-dissipating base 7, the ceramic heat-dissipating base
7 be in half bag-like.Preferably, package is more tight, mutually transmits convenient for heat, to achieve the purpose that rapid cooling.
More specifically, the bottom of the ceramic heat-dissipating base 7 is provided with several heat dissipation copper pipes 11, the heat dissipation copper pipe
It is welded to connect between 11 and the ceramic heat-dissipating base 7 by scolding tin.Using such structure setting, working principle: heat dissipation
It is connected between copper pipe 11 and ceramic heat-dissipating base 7 more closely, furthermore heat dissipation with outside heat sinks by that can be connected, greatly
It is big to improve whole heat dissipation effect.
More specifically, the surrounding of the graphite thermal layer 10 is provided with card slot 13, the quadrangle of the graphite thermal layer 10
It is provided with fixation hole 12, is connected between the graphite thermal layer 10 and the ceramic heat-dissipating base 7 by card slot 13.It is preferred that
, reduce the use of viscose glue, avoids the blocked up influence heat dissipation effect of viscose glue.
More specifically, graphite crystal 14 is horizontally arranged is composed by several for the graphite thermal layer 10.Preferably,
It is transmitted convenient for heat.
Working principle: firstly, by being provided with graphite thermal layer 10 and ceramic heat-dissipating base 7, while ceramic heat-dissipating bottom
The bottom of seat 7 is additionally provided with heat dissipation copper pipe 11, by its mutual cooperation heat is quickly scattered and disappeared.Graphite thermal layer 10 with
It is formed between copper foil layer 9 and top layer 8 by high-temperature laminating, reduces the use of viscose glue, so that the speed of heat loss is faster,
Heat dissipation effect is more preferable.Wiring board main body 2 be provided with heat dissipation patch 1, radiate patch 1 inside contact 6 directly with 9 phase of copper foil layer
Even, to achieve the purpose that rapid cooling, whole using effect is more preferable.It is fixed logical that screw cooperation can be used during the installation process
Hole 3 is fixed, and furthermore the protecting border 5 in 2 outside of wiring board main body there is certain protection to make entire wiring board main body 2
With.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of high efficiency and heat radiation printed circuit board, including wiring board main body (2), it is characterised in that: the wiring board main body (2)
Outside is provided with protecting border (5), and the protecting border (5) is made using wood materials, and the four of the protecting border (5)
Angle is provided with fixed hole (3), and the fixed hole (3) is internally provided with internal screw thread, the left and right two of the wiring board main body (2)
Side is provided with element installing zone (4), and the intermediate position of the wiring board main body (2) is provided with heat dissipation patch (1), the heat dissipation
The surface of patch (1) is provided with several contacts (6), and the contact (6) is made of brass, and the contact (6) is evenly distributed on
The surface of heat dissipation patch (1), is provided with top layer (8) at the top of the wiring board main body (2), the bottom of the top layer (8)
It is provided with copper foil layer (9), the contact (6) contacts with each other with the copper foil layer (9), and the bottom of the copper foil layer (9) is provided with
Graphite thermal layer (10) passes through high-temperature high-pressure between the graphite thermal layer (10) and the copper foil layer (9) and the top layer (8)
It closes.
2. a kind of high efficiency and heat radiation printed circuit board according to claim 1, it is characterised in that: the graphite thermal layer (10)
Bottom be provided with ceramic heat-dissipating base (7), the ceramic heat-dissipating base (7) be in half bag-like.
3. a kind of high efficiency and heat radiation printed circuit board according to claim 2, it is characterised in that: the ceramic heat-dissipating base
(7) bottom is provided with several heat dissipation copper pipes (11), leads between the heat dissipation copper pipe (11) and the ceramic heat-dissipating base (7)
Cross scolding tin welded connecting.
4. a kind of high efficiency and heat radiation printed circuit board according to claim 2, it is characterised in that: the graphite thermal layer (10)
Surrounding be provided with card slot (13), the quadrangle of the graphite thermal layer (10) is provided with fixation hole (12), the graphite thermal layer
(10) it is connected between the ceramic heat-dissipating base (7) by card slot (13).
5. a kind of high efficiency and heat radiation printed circuit board according to claim 1, it is characterised in that: the graphite thermal layer (10)
By several, graphite crystal (14) is horizontally arranged is composed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721848512.9U CN208227406U (en) | 2017-12-26 | 2017-12-26 | A kind of high efficiency and heat radiation printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721848512.9U CN208227406U (en) | 2017-12-26 | 2017-12-26 | A kind of high efficiency and heat radiation printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208227406U true CN208227406U (en) | 2018-12-11 |
Family
ID=64532924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721848512.9U Active CN208227406U (en) | 2017-12-26 | 2017-12-26 | A kind of high efficiency and heat radiation printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208227406U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074149A (en) * | 2020-08-17 | 2020-12-11 | 容泰半导体(江苏)有限公司 | Ceramic radiating fin convenient to install |
| CN112312645A (en) * | 2020-10-28 | 2021-02-02 | 江苏贺鸿智能科技有限公司 | Ceramic heat dissipation circuit board and manufacturing method thereof |
-
2017
- 2017-12-26 CN CN201721848512.9U patent/CN208227406U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074149A (en) * | 2020-08-17 | 2020-12-11 | 容泰半导体(江苏)有限公司 | Ceramic radiating fin convenient to install |
| CN112312645A (en) * | 2020-10-28 | 2021-02-02 | 江苏贺鸿智能科技有限公司 | Ceramic heat dissipation circuit board and manufacturing method thereof |
| CN112312645B (en) * | 2020-10-28 | 2023-06-02 | 江苏贺鸿智能科技有限公司 | Ceramic heat dissipation circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee after: Jiangxi hongban Technology Co.,Ltd. Address before: 343600 No. 281, Jingjiu Avenue, Jinggangshan National Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: RED BOARD (JIANGXI) Co.,Ltd. |
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| CP03 | Change of name, title or address |