CN208227406U - A kind of high efficiency and heat radiation printed circuit board - Google Patents
A kind of high efficiency and heat radiation printed circuit board Download PDFInfo
- Publication number
- CN208227406U CN208227406U CN201721848512.9U CN201721848512U CN208227406U CN 208227406 U CN208227406 U CN 208227406U CN 201721848512 U CN201721848512 U CN 201721848512U CN 208227406 U CN208227406 U CN 208227406U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- circuit board
- layer
- main body
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型公开了一种高效散热印刷电路板，包括线路板主体，线路板主体的外部设置有保护边框，保护边框采用木质材料制作而成，保护边框的四角设置有固定通孔，固定通孔内部设置有内螺纹，线路板主体的左右两侧均设置有元件安装区，线路板主体的中间部位设置有散热贴片，散热贴片的表面设置有若干个触点，触点由黄铜制成，触点均匀分布在散热贴片的表面，线路板主体的顶部设置有顶层，顶层的底部设置有铜箔层，触点与铜箔层相互接触，铜箔层的底部设置有石墨散热层，石墨散热层与铜箔层以及顶层之间通过高温压合而成，设置有石墨散热层以及陶瓷散热底座，同时陶瓷散热底座的底部还设置有散热铜管，通过其相互配合使得热量能够快速散失。
The utility model discloses a high-efficiency heat dissipation printed circuit board, which comprises a main body of the circuit board. A protective frame is arranged on the outside of the main body of the circuit board. The protective frame is made of wooden materials. There are internal threads inside, the left and right sides of the main body of the circuit board are provided with component mounting areas, the middle part of the main body of the circuit board is provided with a heat dissipation patch, the surface of the heat dissipation patch is provided with several contacts, and the contacts are made of brass The contacts are evenly distributed on the surface of the heat dissipation patch, the top of the main body of the circuit board is provided with a top layer, the bottom of the top layer is provided with a copper foil layer, the contacts and the copper foil layer are in contact with each other, and the bottom of the copper foil layer is provided with a graphite heat dissipation layer , the graphite heat dissipation layer, the copper foil layer and the top layer are formed by high-temperature pressing, and a graphite heat dissipation layer and a ceramic heat dissipation base are provided. lost.
Description
Technical field
The utility model relates to circuit board technology field, specially a kind of high efficiency and heat radiation printed circuit board.
Background technique
The benefit of printed circuit is not need to be welded again and again on circuit boards, eliminates the hand of large amount of complex
Work patching operations, and high-precision can be reached, greatly improve the production efficiency, stability and profit margin of circuit board.Printing
Industry, which can reduce big picture, makes a plate, and printed circuit, which can also equally reduce electronic-circuit diagram, makes a plate, thus for integrated electricity
The generation on road has prepared condition.Today, all computers and all electronic products, all employ printed circuit, with
The development and progress of science and technology, is integrated with more and more components, this makes the heat dissipation to circuit board on slight circuit board
Requirement with higher.
So how to design a kind of high efficiency and heat radiation printed circuit board, becoming us will currently be solved the problems, such as.
Utility model content
The purpose of this utility model is to provide a kind of high efficiency and heat radiation printed circuit boards, to solve to mention in above-mentioned background technique
Out with the development of science and technology and progress, more and more components are integrated on slight circuit board, this makes to circuit
The heat dissipation of plate the problem of requiring with higher.
To achieve the above object, the utility model provides the following technical solutions: a kind of high efficiency and heat radiation printed circuit board, including
Wiring board main body, the outside of the wiring board main body are provided with protecting border, the protecting border made of wood materials and
At the quadrangle of the protecting border is provided with fixed hole, and the fixed hole is internally provided with internal screw thread, the wiring board master
Element installing zone is provided at left and right sides of body, the intermediate position of the wiring board main body is provided with heat dissipation patch, described to dissipate
The surface of heat posted piece is provided with several contacts, and the contact is made of brass, and the contact is evenly distributed on the heat dissipation patch
The surface of piece, is provided with top layer at the top of the wiring board main body, and the bottom of the top layer is provided with copper foil layer, the contact with
The copper foil layer contacts with each other, and the bottom of the copper foil layer is provided with graphite thermal layer, the graphite thermal layer and the copper foil
It is formed between layer and the top layer by high-temperature laminating.
Further, the bottom of the graphite thermal layer is provided with ceramic heat-dissipating base, and the ceramic heat-dissipating base is in half
Bag-like.
Further, the bottom of the ceramic heat-dissipating base is provided with several heat dissipation copper pipes, the heat dissipation copper pipe and institute
It states and is welded to connect between ceramic heat-dissipating base by scolding tin.
Further, the surrounding of the graphite thermal layer is provided with card slot, and the quadrangle of the graphite thermal layer is provided with solid
Determine hole, to be connected between the graphite thermal layer and the ceramic heat-dissipating base by card slot.
Further, the graphite thermal layer is composed by several graphite crystals are horizontally arranged.
Compared with prior art, the utility model has the beneficial effects that
1. being provided with graphite thermal layer and ceramic heat-dissipating base, while the bottom of ceramic heat-dissipating base is additionally provided with heat dissipation
Copper pipe enables heat quickly to scatter and disappear by its mutual cooperation.
2. being formed between graphite thermal layer and copper foil layer and top layer by high-temperature laminating, reduces the use of viscose glue, make
Heat loss speed faster, heat dissipation effect is more preferable.
3. wiring board main body is provided with heat dissipation patch, the contact inside the patch that radiates directly is connected with copper foil layer, to reach
To the purpose of rapid cooling, whole using effect is more preferable.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the schematic diagram of internal structure of the utility model；
Fig. 3 is the structural schematic diagram of the utility model graphite thermal layer；
In figure: 1- heat dissipation patch；2- wiring board main body；3- fixed hole；4- element installing zone；5- protecting border；6- touching
Point；7- ceramic heat-dissipating base；8- top layer；9- copper foil layer；10- graphite thermal layer；11- heat dissipation copper pipe；12- fixation hole；13- card
Slot；14- graphite crystal.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of high efficiency and heat radiation printed circuit board, including line
Road plate main body 2, the outside of the wiring board main body 2 are provided with protecting border 5, and the protecting border 5 is made of wood materials
It forms, the quadrangle of the protecting border 5 is provided with fixed hole 3, and the fixed hole 3 is internally provided with internal screw thread, the line
The left and right sides of road plate main body 2 is provided with element installing zone 4, and the intermediate position of the wiring board main body 2 is provided with heat dissipation patch
The surface of piece 1, the heat dissipation patch 1 is provided with several contacts 6, and the contact 6 is made of brass, and the contact 6 is uniformly divided
For cloth on the surface of the heat dissipation patch 1, the top of the wiring board main body 2 is provided with top layer 8, the bottom setting of the top layer 8
There is copper foil layer 9, the contact 6 contacts with each other with the copper foil layer 9, and the bottom of the copper foil layer 9 is provided with graphite thermal layer 10,
It is formed between the graphite thermal layer 10 and the copper foil layer 9 and the top layer 8 by high-temperature laminating.The above composition is originally practical
Novel basic structure.
The utility model uses such structure setting, by being provided with graphite thermal layer 10 and ceramic heat-dissipating base 7,
The bottom of ceramic heat-dissipating base 7 is additionally provided with heat dissipation copper pipe 11 simultaneously, by its mutual cooperation heat is quickly scattered and disappeared.
It is formed between graphite thermal layer 10 and copper foil layer 9 and top layer 8 by high-temperature laminating, reduces the use of viscose glue, so that heat
Faster, heat dissipation effect is more preferable for lost speed.Wiring board main body 2 is provided with heat dissipation patch 1, and the contact 6 inside the patch 1 that radiates is straight
It connects and is connected with copper foil layer 9, to achieve the purpose that rapid cooling, whole using effect is more preferable.
More specifically, the bottom of the graphite thermal layer 10 is provided with ceramic heat-dissipating base 7, the ceramic heat-dissipating base
7 be in half bag-like.Preferably, package is more tight, mutually transmits convenient for heat, to achieve the purpose that rapid cooling.
More specifically, the bottom of the ceramic heat-dissipating base 7 is provided with several heat dissipation copper pipes 11, the heat dissipation copper pipe
It is welded to connect between 11 and the ceramic heat-dissipating base 7 by scolding tin.Using such structure setting, working principle: heat dissipation
It is connected between copper pipe 11 and ceramic heat-dissipating base 7 more closely, furthermore heat dissipation with outside heat sinks by that can be connected, greatly
It is big to improve whole heat dissipation effect.
More specifically, the surrounding of the graphite thermal layer 10 is provided with card slot 13, the quadrangle of the graphite thermal layer 10
It is provided with fixation hole 12, is connected between the graphite thermal layer 10 and the ceramic heat-dissipating base 7 by card slot 13.It is preferred that
, reduce the use of viscose glue, avoids the blocked up influence heat dissipation effect of viscose glue.
More specifically, graphite crystal 14 is horizontally arranged is composed by several for the graphite thermal layer 10.Preferably,
It is transmitted convenient for heat.
Working principle: firstly, by being provided with graphite thermal layer 10 and ceramic heat-dissipating base 7, while ceramic heat-dissipating bottom
The bottom of seat 7 is additionally provided with heat dissipation copper pipe 11, by its mutual cooperation heat is quickly scattered and disappeared.Graphite thermal layer 10 with
It is formed between copper foil layer 9 and top layer 8 by high-temperature laminating, reduces the use of viscose glue, so that the speed of heat loss is faster,
Heat dissipation effect is more preferable.Wiring board main body 2 be provided with heat dissipation patch 1, radiate patch 1 inside contact 6 directly with 9 phase of copper foil layer
Even, to achieve the purpose that rapid cooling, whole using effect is more preferable.It is fixed logical that screw cooperation can be used during the installation process
Hole 3 is fixed, and furthermore the protecting border 5 in 2 outside of wiring board main body there is certain protection to make entire wiring board main body 2
With.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721848512.9U CN208227406U (en) | 2017-12-26 | 2017-12-26 | A kind of high efficiency and heat radiation printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721848512.9U CN208227406U (en) | 2017-12-26 | 2017-12-26 | A kind of high efficiency and heat radiation printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208227406U true CN208227406U (en) | 2018-12-11 |
Family
ID=64532924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721848512.9U Expired - Fee Related CN208227406U (en) | 2017-12-26 | 2017-12-26 | A kind of high efficiency and heat radiation printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208227406U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074149A (en) * | 2020-08-17 | 2020-12-11 | 容泰半导体(江苏)有限公司 | Ceramic radiating fin convenient to install |
| CN112312645A (en) * | 2020-10-28 | 2021-02-02 | 江苏贺鸿智能科技有限公司 | Ceramic heat dissipation circuit board and manufacturing method thereof |
-
2017
- 2017-12-26 CN CN201721848512.9U patent/CN208227406U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074149A (en) * | 2020-08-17 | 2020-12-11 | 容泰半导体(江苏)有限公司 | Ceramic radiating fin convenient to install |
| CN112312645A (en) * | 2020-10-28 | 2021-02-02 | 江苏贺鸿智能科技有限公司 | Ceramic heat dissipation circuit board and manufacturing method thereof |
| CN112312645B (en) * | 2020-10-28 | 2023-06-02 | 江苏贺鸿智能科技有限公司 | Ceramic heat dissipation circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee after: Jiangxi hongban Technology Co.,Ltd. Address before: 343600 No. 281, Jingjiu Avenue, Jinggangshan National Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: RED BOARD (JIANGXI) Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181211 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |