CN208128376U - The radiator structure of high-definition camera - Google Patents
The radiator structure of high-definition camera Download PDFInfo
- Publication number
- CN208128376U CN208128376U CN201820396959.5U CN201820396959U CN208128376U CN 208128376 U CN208128376 U CN 208128376U CN 201820396959 U CN201820396959 U CN 201820396959U CN 208128376 U CN208128376 U CN 208128376U
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- China
- Prior art keywords
- insulating layer
- definition camera
- circuit board
- aluminum substrate
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Studio Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of radiator structures of high-definition camera, including the forward and backward shell for accommodating circuit board, the forward and backward shell uses plastic material, and the circuit board includes aluminum substrate, and the plate face of aluminum substrate is successively covered with insulating layer, circuit layer outward.The forward and backward shell parts of high-definition camera all use plastic material, cost is relatively low and avoids the getting rusty of metal material, processing technology challenge, the substrate of circuit board is stronger using aluminum substrate thermal diffusivity, equipped with insulating layer for arranging circuit layer, and insulating layer is using insulation, the good material of heating conduction, it is ensured that the high heat dispersion of camera.
Description
Technical field
The utility model belongs to camera shooting acquisition field, in particular to a kind of radiator structure of high-definition camera.
Background technique
The backup camera that automobile is equipped at present predominantly simulates camera, and simulation camera pixel is low, reverse image
Poor definition, driver often generates erroneous judgement because not seeing the image after vehicle, to cause accident, therefore, user is to high definition
The demand of backup camera is higher and higher.In the prior art, high-definition camera simulates camera gradually instead of simulation camera
It is formed using the pcb board and plastic shell of FR-4 material, since process image data amount is few, chip calorific value is relatively also smaller,
Product radiating requirements are just directly able to satisfy by air heat dissipation.And high-definition camera pixel to be treated is more, on pcb board
Euthermic chip is also more than simulation camera, and a large amount of image data overheats of chip processing will lead to system in case of system halt, frequency reducing, camera lens mould
The problems such as paste.Therefore the radiator structure of simulation camera cannot meet the needs of high-definition camera, in the market existing high definition
Camera radiator structure is all that metal shell is directly connected to euthermic chip by heat-conducting silicone grease or silica gel, to play heat dissipation
Effect.But metal shell processing cost is higher, production technology is also complex, and using heat-conducting silicone grease or silica gel arrangement knot
Structure is also relatively cumbersome.
Utility model content
The purpose of this utility model is to provide a kind of radiator structures of high-definition camera, and structure is simple, while ensuring to take the photograph
As the high heat dispersion of head.
To achieve the goals above, the utility model takes following technical scheme：A kind of radiator structure of high-definition camera,
Including the forward and backward shell for accommodating circuit board, the forward and backward shell uses plastic material, and the circuit board includes aluminum substrate,
The plate face of aluminum substrate is successively covered with insulating layer, circuit layer outward.
In above-mentioned technical proposal, the forward and backward shell parts of high-definition camera all use plastic material, and cost is relatively low and avoids
The substrate of the getting rusty of metal material, processing technology challenge, circuit board is stronger using aluminum substrate thermal diffusivity, is equipped with insulating layer and uses
In arrangement circuit layer, and insulating layer is using insulation, the good material of heating conduction, it is ensured that the high heat dispersion of camera.
Detailed description of the invention
Fig. 1 is that the utility model decomposes main view；
Fig. 2 is circuit board hierarchical diagram.
Specific embodiment
It is made further instructions in conjunction with 1,2 pair of the utility model of attached drawing：
A kind of radiator structure of high-definition camera, including the forward and backward shell 10,20 for accommodating circuit board 30, before described,
Rear shell 10,20 uses plastic material, and the circuit board 30 includes aluminum substrate 31, and the plate face of aluminum substrate 31 is successively covered with outward
Insulating layer 32, circuit layer 33.The forward and backward shell 10 of high-definition camera, 20 parts all use plastic material, and cost is relatively low and avoids
The substrate of the getting rusty of metal material, processing technology challenge, circuit board 30 is stronger using 31 thermal diffusivity of aluminum substrate, is equipped with insulation
Layer 32 is for arranging circuit layer 33, and insulating layer 32 is using insulation, the good material of heating conduction, it is ensured that the high heat dissipation of camera
Performance, and can be needed the two sides plate face of aluminum substrate 31 that can all arrange insulating layer 32, circuit layer according to circuit in actual arrangement
33。
The upper surface side of the insulating layer 32 extends internally coated with cricoid layers of copper 34, and circuit layer 33 is arranged in absolutely
The center position of edge layer 32.In order to further enhance the heat-sinking capability of circuit board 30, in the place plane four of circuit layer 33
Week is coated with layers of copper 34, reinforces the capacity of heat transmission.
Through-hole 35 is offered on the circuit board 30, through-hole 35 runs through layers of copper 34, insulating layer 32, aluminum substrate 31.Through-hole
35 setting a part can be used as process Installation hole, and another part can increase the capacity of heat transmission.
Heat-conducting glue is filled in the through-hole 35.In the through-hole 35 not as process Installation hole fill heat-conducting glue again into
One step increases the capacity of heat transmission.
Claims (4)
1. a kind of radiator structure of high-definition camera, including the forward and backward shell (10,20) for accommodating circuit board (30), feature
It is：The forward and backward shell (10,20) uses plastic material, and the circuit board (30) includes aluminum substrate (31), aluminum substrate
(31) plate face is successively covered with insulating layer (32), circuit layer (33) outward.
2. the radiator structure of high-definition camera according to claim 1, it is characterised in that：The insulating layer (32) it is upper
Surface side extends internally coated with cricoid layers of copper (34), and circuit layer (33) is arranged in the center position of insulating layer (32).
3. the radiator structure of high-definition camera according to claim 1, it is characterised in that：It is opened on the circuit board (30)
Equipped with through-hole (35), through-hole (35) runs through layers of copper (34), insulating layer (32), aluminum substrate (31).
4. the radiator structure of high-definition camera according to claim 3, it is characterised in that：Filling in the through-hole (35)
There is heat-conducting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820396959.5U CN208128376U (en) | 2018-03-22 | 2018-03-22 | The radiator structure of high-definition camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820396959.5U CN208128376U (en) | 2018-03-22 | 2018-03-22 | The radiator structure of high-definition camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208128376U true CN208128376U (en) | 2018-11-20 |
Family
ID=64198085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820396959.5U Active CN208128376U (en) | 2018-03-22 | 2018-03-22 | The radiator structure of high-definition camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208128376U (en) |
-
2018
- 2018-03-22 CN CN201820396959.5U patent/CN208128376U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |