CN207939825U - Flexible printed-circuit board - Google Patents
Flexible printed-circuit board Download PDFInfo
- Publication number
- CN207939825U CN207939825U CN201820084801.4U CN201820084801U CN207939825U CN 207939825 U CN207939825 U CN 207939825U CN 201820084801 U CN201820084801 U CN 201820084801U CN 207939825 U CN207939825 U CN 207939825U
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- China
- Prior art keywords
- pure glue
- lines
- circuit board
- flexible printed
- layer
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 239000002245 particle Substances 0.000 claims abstract description 14
- 238000013508 migration Methods 0.000 claims description 4
- 230000005012 migration Effects 0.000 claims description 4
- 230000004224 protection Effects 0.000 abstract description 13
- 230000008054 signal transmission Effects 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 63
- 239000010408 film Substances 0.000 description 23
- 239000011889 copper foil Substances 0.000 description 10
- 230000006872 improvement Effects 0.000 description 7
- 239000003292 glue Substances 0.000 description 5
- 230000006854 communication Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011236 particulate material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of flexible printed-circuit board, including a flexibility coat copper plate, be set to a upper wiring layer of flexibility coat copper plate upper surface and be laminated in upper wiring layer upper surface one on the pure glue-lines of PI.Flexible printed-circuit board provided by the utility model, material layer structures are not only significantly simplified, it is thinned the integral thickness of flexible printed-circuit board, and signal transmission frequencies and diamagnetism interference function can be improved, copper particle transport phenomena between circuit connection and circuit has protection and resistant function, ensures line security normal work.
Description
Technical field
The utility model is related to field of circuit boards more particularly to a kind of flexible printed-circuit boards.
Background technology
Traditional four-layer circuit board and multilayer Rigid Flex, superstructure generally comprise from top to bottom set gradually it is upper thin
Film layer and glue-line, intermediate copper foil circuit layer+film layer+copper foil circuit layer, lower glue layer and film layer, then composite layer is as bonding
With single-sided structure 2FCCL (film layer+copper foil layer) carry out on double-sided wiring board two sides again it is compound, so as to form circuit board
Four-layer structure, the inside are the two-sided circuit boards to complete, are seen in addition not being fabricated to circuit surface on two sides is compound again simultaneously
Whole copper-clad surface, then carry out again drilling and showing methods, development be etched into circuit, then compound circuit surface protection is exhausted again
Edge layer CVL (glue-line+film layer) carries out the outermost layer that laminating apparatus processing pressing is directly bonded in four-layer circuit board, to see
The type four-layer circuit board is actually by structure is inside outside：Film layer+glue-line+copper foil circuit+film layer+glue-line+film
Layer+glue-line+copper foil circuit+film layer+copper foil circuit+glue-line+film layer+glue-line+film layer+copper foil circuit+glue-line+film
Layer；Such multilayered structure, the number of plies is more and complicated, and entire product thickness is made to increase, and pliability reduces and increases assembling product hardly possible
Degree, and technological process is more, and material cost is promoted, and the power consumption of circuit board aspect of performance and signal transmission attenuation increase.
The surface of double-sided PCB must have the coating of two sides insulation, structural film layer and structural adhesive layer again in addition
The structure of the film layer and glue-line that are covered on one side has to if doing four-layer circuit board structure in the double-sided circuit to complete
Plate (film layer+glue-line+copper foil circuit+film layer+copper foil circuit+glue-line+film layer) two sides is further added by the 2FCCL of two layers of one-sided
(film layer+copper foil layer), centre have to carry out bonding effect by glue, to make four-layer structure circuit board integral thickness increase
Adding, such thickness has not only significantly increased the thickness of circuit board, nor convenient for the assembling of structure, and due to thickness
Increase causes product power consumption big and signal velocity consume is larger to slow down.
During use, circuit board can be made to existing wiring board by being highly prone to radiation and electromagnetic interference, such interference
Normal operation produce serious influence, while being unfavorable for the transmission of signal.Slow down since signal is interfered and transmits, causes
Circuit board can not quickly convey the central area instruction that (chip) is assigned in working condition, and eventually leading to equipment, (such as mobile phone leads to
Interrogate base station equipment) occur blunt and crashes phenomena such as stuck, communication process is obstructed.
Usual precise circuit circuit board will appear copper particle transport phenomena between energization circuit and circuit, set
It can cause circuit burning explosion on fire etc. dangerous during standby use, between circuit and circuit because collision is connected, lead to electricity
Circuit on the plate of road can not work normally safely.
Utility model content
Against the above deficiency, it the purpose of this utility model is to provide a kind of flexible printed-circuit board, not only significantly simplifies
Material layer structures, are thinned the integral thickness of flexible printed-circuit board, and signal transmission frequencies can be improved and diamagnetism is dry
Function is disturbed, the copper particle transport phenomena between circuit connection and circuit has protection and resistant function, ensures circuit peace
Full normal work.
Used technical solution is the utility model in order to achieve the above objectives：
A kind of flexible printed-circuit board, which is characterized in that including a flexibility coat copper plate, be set to flexibility coat copper plate upper surface
A upper wiring layer and be laminated in upper wiring layer upper surface one on the pure glue-lines of PI.
Further include as a further improvement of the utility model, the line layer once for being set to flexibility coat copper plate lower surface,
And it is laminated in the pure glue-lines of PI once of lower line layer lower surface.
The pure glue-lines of upper PI are that anti-copper particle migrates with the lower pure glue-lines of PI as a further improvement of the utility model,
The pure glue-lines of PI.
The pure glue-lines of upper PI and the lower pure glue-lines of PI are LDK high-frequency functions as a further improvement of the utility model,
The pure glue-lines of PI.
The pure glue-lines of upper PI and the lower pure glue-lines of PI are the pure glue of black PI as a further improvement of the utility model,
Layer.
Further include PET protections on one coated on the pure glue-line upper surfaces upper PI as a further improvement of the utility model,
High temperature resistant PET release films and the protection release layers or once of PET once coated on the pure glue-line lower surfaces lower PI on release layer or one
High temperature resistant PET release films.
The beneficial effects of the utility model are：
(1) one layer of upper pure glue-line of PI and one layer of lower pure glue-line of PI is used directly to replace traditional PI film+AD plastic structures, substantially
Simplify product material layer structure, to which the integral thickness of double-faced flexible printed circuit board be thinned, reduce integral product material at
This, optimizes assembling space, promotes product signal transmission speed, reduces power consumption, improves the moisture-resistant and heat resistance of product, make production
Product overall performance is improved；
(2) using the anti-copper particle migration pure glue-lines of PI as the pure glue-lines of upper PI and the lower pure glue-lines of PI, anti-copper particle migrates PI
Pure glue-line has the anti-copper particle shift function of low particulate material, can effectively ensure that circuit being capable of safe and effective work in working condition
Make, be not in copper particle transport phenomena between circuit and circuit, prevent from occurring during equipment use circuit and circuit it
Between conducting collision cause the danger such as circuit burning explosion on fire, play a very good protection to circuit；
(3) use the pure glue-lines of LDK high-frequency functions PI as the pure glue-lines of upper PI and the lower pure glue-lines of PI, LDK high-frequency functions PI is pure
Glue-line, which has, improves signal transmission frequencies and diamagnetism interference function, to improve the signal transmission performance of flexible printed circuit board,
Specifically, the speed that circuit board conveys central area (chip) to assign instruction in working condition can be effectively improved, quickly pass
All parts are handed to, equipment (such as mobile phone, communication base station equipment) quick operation is made, are gone out without blunt and phenomena such as stuck of crashing
It is existing, keep 5G products communication process whole smooth；
(4) the layer structure design for using black can effectively prevent internal wiring completely sudden and violent in product structure design manufacture
Expose, and the spot occurred to bad aberration in product or in making can be covered effectively, product overall appearance is allowed to seem beautiful
It sees characteristic, and is also prevented from stranger's externally visibly internal wiring, plays the role of hidden and protection circuit plate；Meanwhile
For thering is the wiring board or circuit of impurity or flaw, black layer structure to play the role of hiding the flaw.
Above-mentioned is the general introduction of utility model technical solution, below in conjunction with attached drawing and specific implementation mode, to the utility model
It is described further.
Description of the drawings
Fig. 1 is the sectional view of the utility model.
Specific implementation mode
Further to illustrate that the utility model is to reach the technological means and effect that predetermined purpose is taken, below in conjunction with
Specific embodiment of the present utility model is described in detail in attached drawing and preferred embodiment.
Please refer to Fig. 1, the utility model embodiment provides a kind of flexible printed-circuit board, including a flexibility coat copper plate 1, sets
Be placed in a upper wiring layer 2 of 1 upper surface of flexibility coat copper plate and be laminated in 2 upper surface of upper wiring layer one on the pure glue-lines of PI 4.
The present embodiment flexible printed-circuit board further includes the line layer once 3 and layer for being set to 1 lower surface of flexibility coat copper plate
The pure glue-lines 5 of PI once of 3 lower surface of lower line layer are laminated on, to form double-faced flexible printed circuit board.
The present embodiment is directly cementing instead of traditional PI films+AD using the pure glue-line of one layer of upper pure glue-line 4 of PI and one layer of lower PI 5
Structure has significantly simplified product material layer structure, to which the integral thickness of double-faced flexible printed circuit board be thinned, reduces integral product
Material cost optimizes assembling space, promotes product signal transmission speed, reduces power consumption, improves the moisture-resistant and heat resistance of product
Can, so that product overall performance is improved.
Certainly, double-faced flexible printed circuit board provided in this embodiment can also make Multilayer Structure product, such as 4 layers
Harden structure, 6 veneer structures etc..
As further improvement of this embodiment, the pure glue-line of the pure glue-line 4 and lower PI of upper PI 5 is that anti-copper particle migrates
The pure glue-lines of PI, which can be by carrying out highly purified realization to the pure glue of PI.It is moved using anti-copper particle
The pure glue-lines of PI are moved as the pure glue-lines 4 of upper PI and the pure glue-lines 5 of lower PI, the anti-copper particle migration pure glue-lines of PI have the anti-copper of low particulate material
Particle migration function can effectively ensure that circuit can safely and effectively work in working condition, will not go out between circuit and circuit
Existing copper particle transport phenomena prevents from occurring being connected to collide between circuit and circuit during equipment use that circuit is caused to burn
Hot fried equal danger, to which circuit plays a very good protection.
As further improvement of this embodiment, the pure glue-line of the pure glue-line 4 and lower PI of upper PI 5 is LDK high-frequency functions
The pure glue-lines of PI, the pure glue-lines of LDK high-frequency functions PI can be realized by being added the chemical materials such as iron teflon to the pure glue of PI.Using
As the pure glue-lines 4 of upper PI and the pure glue-lines 5 of lower PI, the pure glue-lines of LDK high-frequency functions PI have to improve to be believed the pure glue-lines of LDK high-frequency functions PI
Number transmission frequency and diamagnetism interference function, to improve the signal transmission performance of flexible printed circuit board, specifically, can be effective
It improves circuit board and conveys the speed that instruction is assigned in central area (chip) in working condition, be quickly transferred to all parts,
Make equipment (such as mobile phone, communication base station equipment) quick operation, occurs without blunt and phenomena such as stuck of crashing, keep 5G products logical
News process is whole smooth.
Meanwhile in the present embodiment, the pure glue-lines of the pure glue-lines of the upper PI 4 and lower PI 5 are the pure glue-lines of black PI, black
Realizing can be by the way that directly plus black pigment enters in the pure glue-lines of pure glue-line 4 and the lower PI of upper PI 5 and realizes, the present embodiment uses black
Layer structure design, can prevent internal upper wiring layer 2 to be exposed with the circuit on lower line layer 3, prevent stranger externally visibly
Internal wiring plays the role of circuit on hidden and protection circuit plate；Meanwhile wiring board or line for having impurity or flaw
Road, black layer structure play the role of hiding the flaw.
Meanwhile the present embodiment further include coated on pure 4 upper surfaces of glue-line upper PI one on PET protection release layer 6 or one on
High temperature resistant PET release films and the protection release layers 7 of PET once coated on pure 5 lower surfaces of glue-line lower PI or once high temperature resistant PET
Release film plays protection to the pure glue-line of flexibility coat copper plate 1, upper wiring layer 2, the pure glue-line 4 and lower PI of lower line layer 3, upper PI 5 and makees
With.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model
Any restrictions, therefore identical as the utility model above-described embodiment or approximate technical characteristic is used, and obtained other structures,
It is within the protection scope of the utility model.
Claims (6)
1. a kind of flexible printed-circuit board, which is characterized in that including a flexibility coat copper plate, be set to flexibility coat copper plate upper surface
One upper wiring layer and be laminated in upper wiring layer upper surface one on the pure glue-lines of PI.
2. flexible printed-circuit board according to claim 1, which is characterized in that further include being set to flexibility coat copper plate following table
The line layer once in face and the pure glue-lines of PI once for being laminated in lower line layer lower surface.
3. flexible printed-circuit board according to claim 2, which is characterized in that the upper pure glue-lines of PI and the lower pure glue-lines of PI
It is the anti-copper particle migration pure glue-lines of PI.
4. flexible printed-circuit board according to claim 2 or 3, which is characterized in that the upper pure glue-lines of PI and lower PI are pure
Glue-line is the pure glue-lines of LDK high-frequency functions PI.
5. flexible printed-circuit board according to claim 2 or 3, which is characterized in that the upper pure glue-lines of PI and lower PI are pure
Glue-line is the pure glue-lines of black PI.
6. flexible printed-circuit board according to claim 2 or 3, which is characterized in that further include being coated on the pure glue-lines of upper PI
On the one of upper surface PET protect release layer or one on high temperature resistant PET release films and coated on the pure glue-line lower surfaces lower PI once
PET protects release layer or once high temperature resistant PET release films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820084801.4U CN207939825U (en) | 2018-01-18 | 2018-01-18 | Flexible printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820084801.4U CN207939825U (en) | 2018-01-18 | 2018-01-18 | Flexible printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207939825U true CN207939825U (en) | 2018-10-02 |
Family
ID=63649606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820084801.4U Active CN207939825U (en) | 2018-01-18 | 2018-01-18 | Flexible printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207939825U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490344A (en) * | 2021-07-08 | 2021-10-08 | 江西柔顺科技有限公司 | Flexible circuit board and preparation method thereof |
-
2018
- 2018-01-18 CN CN201820084801.4U patent/CN207939825U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490344A (en) * | 2021-07-08 | 2021-10-08 | 江西柔顺科技有限公司 | Flexible circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 516000 room 3202, unit 4, building 1, No.11 Huizhou Avenue, Huicheng District, Huizhou City, Guangdong Province Patentee after: Li Longkai Address before: 56, group 2, Lihua Road, Changling Town, Wanzhou District, Chongqing Patentee before: Li Longkai |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210728 Address after: 518000 3rd floor, building A1, 9 songzikeng Reservoir Road, Laokeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee after: Shida new material (Shenzhen) Co.,Ltd. Address before: 516000 room 3202, unit 4, block 1, No. 11, Huizhou Avenue, Huicheng District, Huizhou City, Guangdong Province Patentee before: Li Longkai |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: B113, Comprehensive Building, 3rd Branch of Leibai Zhongcheng Life Science Park, No. 22 Jinxiu East Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen City, Guangdong Province, 518118 Patentee after: Shida new material (Shenzhen) Co.,Ltd. Address before: 518000 3rd floor, building A1, 9 songzikeng Reservoir Road, Laokeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: Shida new material (Shenzhen) Co.,Ltd. |