CN207939828U - Thin double-sided printed circuit board - Google Patents
Thin double-sided printed circuit board Download PDFInfo
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- CN207939828U CN207939828U CN201820085416.1U CN201820085416U CN207939828U CN 207939828 U CN207939828 U CN 207939828U CN 201820085416 U CN201820085416 U CN 201820085416U CN 207939828 U CN207939828 U CN 207939828U
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- film layers
- copper
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- solid preparation
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 55
- 239000010949 copper Substances 0.000 claims abstract description 53
- 238000002360 preparation method Methods 0.000 claims abstract description 44
- 239000007787 solid Substances 0.000 claims abstract description 44
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000002245 particle Substances 0.000 claims abstract description 15
- 238000007711 solidification Methods 0.000 claims abstract description 14
- 230000008023 solidification Effects 0.000 claims abstract description 14
- 239000011889 copper foil Substances 0.000 claims description 22
- 238000013508 migration Methods 0.000 claims description 3
- 230000005012 migration Effects 0.000 claims description 3
- 230000008054 signal transmission Effects 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 161
- 239000010408 film Substances 0.000 description 91
- 230000006872 improvement Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 238000013461 design Methods 0.000 description 7
- 230000006854 communication Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 3
- 238000004880 explosion Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011236 particulate material Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a kind of thin double-sided printed circuit boards, including copper-clad plate, the upper wiring layer set on copper-clad plate upper surface, the lower line layer set on copper-clad plate lower surface, several superstructures for being laminated in upper wiring layer upper surface and several understructures for being laminated in lower line layer lower surface, superstructure includes being set to the upper PI film layers on upper wiring layer and the upper layers of copper in upper PI film layers, and upper PI film layers include upper semi-solid preparation PI film layers and the upper solidification PI film layers between upper layers of copper and upper semi-solid preparation PI film layers；Understructure includes the lower layers of copper set on the lower PI film layers of lower line layer lower surface and set on lower PI film layers lower surface, and lower PI film layers include lower semi-solid preparation PI film layers and the lower solidification PI film layers between lower layers of copper and lower semi-solid preparation PI film layers.The utility model is substantially thinned the integral thickness of product, and signal transmission frequencies and diamagnetism interference function can be improved, and the copper particle transport phenomena between circuit connection and circuit has resistant function.
Description
Technical field
The utility model is related to field of circuit boards more particularly to a kind of thin double-sided printed circuit boards.
Background technology
Traditional four-layer circuit board and multilayer Rigid Flex, superstructure generally comprise from top to bottom set gradually it is upper thin
Film layer and glue-line, intermediate copper foil circuit layer+film layer+copper foil circuit layer, lower glue layer and film layer, then composite layer is as bonding
With single-sided structure 2FCCL (film layer+copper foil layer) carry out on double-sided wiring board two sides again it is compound, so as to form circuit board
Four-layer structure, the inside are the two-sided circuit boards to complete, are seen in addition not being fabricated to circuit surface on two sides is compound again simultaneously
Whole copper-clad surface, then carry out again drilling and showing methods, development be etched into circuit, then compound circuit surface protection is exhausted again
Edge layer CVL (glue-line+film layer) carries out the outermost layer that laminating apparatus processing pressing is directly bonded in four-layer circuit board, to see
The type four-layer circuit board is actually by structure is inside outside：Film layer+glue-line+copper foil circuit+film layer+glue-line+film
Layer+glue-line+copper foil circuit+film layer+copper foil circuit+glue-line+film layer+glue-line+film layer+copper foil circuit+glue-line+film
Layer；Such multilayered structure, the number of plies is more and complicated, and entire product thickness is made to increase, and pliability reduces and increases assembling product hardly possible
Degree, and technological process is more, and material cost is promoted, and the power consumption of circuit board aspect of performance and signal transmission attenuation increase.
The surface of double-sided PCB must have the coating of two sides insulation, structural film layer and structural adhesive layer again in addition
The structure of the film layer and glue-line that are covered on one side has to if doing four-layer circuit board structure in the double-sided circuit to complete
Plate (film layer+glue-line+copper foil circuit+film layer+copper foil circuit+glue-line+film layer) two sides is further added by the 2FCCL of two layers of one-sided
(film layer+copper foil layer), centre have to carry out bonding effect by glue, to make four-layer structure circuit board integral thickness increase
Adding, such thickness has not only significantly increased the thickness of circuit board, nor convenient for the assembling of structure, and due to thickness
Increase causes product power consumption big and signal velocity consume is larger to slow down.
During use, circuit board can be made to existing wiring board by being highly prone to radiation and electromagnetic interference, such interference
Normal operation produce serious influence, while being unfavorable for the transmission of signal.Slow down since signal is interfered and transmits, causes
Circuit board can not quickly convey the central area instruction that (chip) is assigned in working condition, and eventually leading to equipment, (such as mobile phone leads to
Interrogate base station equipment) occur blunt and crashes phenomena such as stuck, communication process is obstructed.
Usual precise circuit circuit board will appear copper particle transport phenomena between energization circuit and circuit, set
It can cause circuit burning explosion on fire etc. dangerous during standby use, between circuit and circuit because collision is connected, lead to electricity
Circuit on the plate of road can not work normally safely.
Utility model content
Against the above deficiency, the purpose of this utility model is to provide a kind of thin double-sided printed circuit boards, not only substantially
Simplify material layer structures, be substantially thinned the integral thickness of double-sided printed-circuit board, and can be improved signal transmission frequencies and
Diamagnetism interference function, the copper particle transport phenomena between circuit connection and circuit have resistant function, ensure circuit
Safety normal work.
Used technical solution is the utility model in order to achieve the above objectives：
A kind of thin double-sided printed circuit board, which is characterized in that including a copper-clad plate, be set to the one of copper-clad plate upper surface
Upper wiring layer, the line layer once for being set to copper-clad plate lower surface, several superstructures for being laminated in upper wiring layer upper surface and
It is laminated in several understructures of lower line layer lower surface, wherein the superstructure includes on one be set on upper wiring layer
PI film layers and be set in PI film layers one on layers of copper, on this PI film layers include one on semi-solid preparation PI film layers and be located at upper copper
Layer upper semi-solid preparation PI film layers between one on cure PI film layers；The understructure includes be set to lower line layer lower surface one
Lower PI film layers and the layers of copper once for being set to lower PI film layers lower surface, the lower PI film layers include semi-solid preparation PI film layers and position
The PI film layers of solidification once between lower layers of copper and lower semi-solid preparation PI film layers.
The upper semi-solid preparation PI film layers and lower semi-solid preparation PI film layers are black as a further improvement of the utility model,
PI film layers.
The upper solidification PI film layers and lower solidification PI film layers are black PI films as a further improvement of the utility model,
Layer.
The upper semi-solid preparation PI film layers are respectively with lower semi-solid preparation PI film layers as a further improvement of the utility model,
LDK high-frequency functions films.
The upper semi-solid preparation PI film layers are respectively anti-with lower semi-solid preparation PI film layers as a further improvement of the utility model,
Copper particle migrates film.
The upper layers of copper is upper copper foil layer or upper sputtered Cu layer, the lower copper as a further improvement of the utility model,
Layer is lower copper foil layer or lower sputtered Cu layer.
The thickness of the upper sputtered Cu layer and lower sputtered Cu layer is respectively 2oz as a further improvement of the utility model,
The thickness of -9oz microns of micron, the upper copper foil layer and lower copper foil layer is respectively 6oz microns -38oz microns.
The thickness of the upper PI film layers and lower PI film layers is respectively 5um- as a further improvement of the utility model,
50um。
The beneficial effects of the utility model are：
(1) superstructure and understructure with special layers structure are combined, is applied to double-sided printed-circuit board, specially
Double-side flexible printed circuit board and two-sided Rigid Flex, and the upper sputter due to being respectively set in superstructure and understructure
Layers of copper is with lower sputtered Cu layer, it can be achieved that the structure design of multilayer double-sided printed-circuit board；Meanwhile by improved superstructure under
Layer structure, only for single-layer double-side printed circuit board, compared to traditional double-sided printed-circuit board, reduce two layers of glue-line with
Two film layers have significantly simplified product material layer structure, to which the integral thickness of double-sided printed-circuit board be thinned, reduce whole
Product material cost optimizes assembling space, promotes product signal transmission speed, reduces power consumption, improve the moisture-resistant of product with it is resistance to
Hot property makes product overall performance be improved；
(2) it is optimized by the thickness to each layer of structure and performance improvement, can adjust or be thinned each layer of product
Structural thickness is reduced compared to traditional structure design on thickness, is kept integral material layer structural thickness thinning, is finally made
Product ultrathin type, product signal transmit faster, and assembling space more optimizes, for flexible printed circuit board, softness
Higher, it is more accurate；
(3) the layer structure design for using black can effectively prevent internal wiring completely sudden and violent in product structure design manufacture
Expose, and the spot occurred to bad aberration in product or in making can be covered effectively, product overall appearance is allowed to seem beautiful
It sees characteristic, and is also prevented from stranger's externally visibly internal wiring, plays the role of hidden and protection circuit plate；Meanwhile
For thering is the wiring board or circuit of impurity or flaw, black layer structure to play the role of hiding the flaw；
(4) film is migrated as upper semi-solid preparation PI film layers and lower semi-solid preparation PI film layers using anti-copper particle, anti-copper particle is moved
Moving film has the anti-copper particle shift function of low particulate material, can effectively ensure that circuit being capable of safe and effective work in working condition
Make, be not in copper particle transport phenomena between energization circuit and circuit, equipment prevents during energization use
There is copper particle transport phenomena between circuit and circuit, to prevent short circuit, circuit turn-on caused by burning it is on fire,
The danger such as battery explosion and disabler, to which circuit plays a very good protection；
(5) use LDK high-frequency functions film as upper semi-solid preparation PI film layers and lower semi-solid preparation PI film layers, LDK high-frequency functions
Film, which has, improves signal transmission frequencies and diamagnetism interference function, to improve the signal transmission performance of printed circuit board, specifically
, the speed that circuit board conveys central area (chip) to assign instruction in working condition can be effectively improved, is quickly transferred to
All parts make equipment (such as mobile phone, communication base station equipment) quick operation, occur without blunt and phenomena such as stuck of crashing,
Keep 5G products communication process whole smooth.
Above-mentioned is the general introduction of utility model technical solution, below in conjunction with attached drawing and specific implementation mode, to the utility model
It is described further.
Description of the drawings
Fig. 1 is the exploded view of the utility model；
Fig. 2 is the whole sectional view of the utility model.
Specific implementation mode
Further to illustrate that the utility model is to reach the technological means and effect that predetermined purpose is taken, below in conjunction with
Specific embodiment of the present utility model is described in detail in attached drawing and preferred embodiment.
Fig. 1 and Fig. 2 are please referred to, the utility model embodiment provides a kind of thin double-sided printed circuit board, including one covers copper
Plate 1, the line layer once 3 for being set to 1 lower surface of copper-clad plate, is laminated in the upper wiring layer 2 for being set to 1 upper surface of copper-clad plate
Several superstructures 4 of 2 upper surface of upper wiring layer and several understructures 5 for being laminated in 3 lower surface of lower line layer, wherein should
Superstructure 4 include be set on upper wiring layer 2 one on PI film layers 41 and be set in PI film layers 41 one on layers of copper
42, PI film layers 41 include semi-solid preparation PI film layers 411 and between upper layers of copper 42 and upper semi-solid preparation PI film layers 411 on one on this
One on solidification PI film layers 412；The understructure 5 includes being set to the film layers of PI once 51 and the setting of 3 lower surface of lower line layer
Layers of copper 52 once in lower 51 lower surface of PI film layers, the lower PI film layers 51 are including semi-solid preparation PI film layers 511 once and are located at lower copper
The PI of solidification once film layers 512 between layer 52 and lower semi-solid preparation PI film layers 511.
The present embodiment combines improved superstructure 4 and understructure 5, can be applied to double-sided printed-circuit board, specially
Double-side flexible printed circuit board and two-sided Rigid Flex, and since superstructure 4 is splashed with being respectively set in understructure 5
Copper plate 43 and lower sputtered Cu layer 53, can make Multilayer Structure product, such as 4 veneer structures, 6 veneer structures etc..
The present embodiment only for single-layer double-side printed circuit board, is compared by improved superstructure 4 and understructure 5
In traditional double-sided printed-circuit board, reduce two layers of glue-line and two film layers, significantly simplifies product material layer structure, from
And the integral thickness of double-sided printed-circuit board is thinned, integral product material cost is reduced, assembling space is optimized, promotes product signal
Transmission speed reduces power consumption, improves the moisture-resistant and heat resistance of product, product overall performance is made to be improved.
In the present embodiment, the upper semi-solid preparation PI film layers 411 and lower semi-solid preparation PI film layers 511 are black PI film layers,
The realization of black can be realized by directly adding black pigment to enter in 411 or lower semi-solid preparation PI film layers 511 of upper semi-solid preparation PI film layers.
The present embodiment uses the layer structure design of black, and internal upper wiring layer 2 can be prevented to be exposed with the circuit on lower line layer 3,
Stranger's externally visibly internal wiring is prevented, circuit on hidden and protection circuit plate is played the role of；Meanwhile for have impurity or
The wiring board or circuit of flaw, black layer structure play the role of hiding the flaw.
In the present embodiment, the upper solidification PI film layers 412 and lower solidification PI film layers 512 are black PI film layers, black
Realization can by directly plus black pigment realized into upper solidification PI film layers 412 with lower solidification PI film layers 512.The present embodiment
Using the layer structure design of black, internal upper wiring layer 2 can be prevented to be exposed with the circuit on lower line layer 3, prevent stranger
Externally visibly internal wiring plays the role of circuit on hidden and protection circuit plate；Meanwhile the line for having impurity or flaw
Road plate or circuit, black layer structure play the role of hiding the flaw.
In the present embodiment, the upper layers of copper 42 is upper copper foil layer or upper sputtered Cu layer, and the lower layers of copper 52 is lower copper foil
Layer or lower sputtered Cu layer.The thickness of each layer structure can be set according to specific needs, specifically, the upper sputtered Cu layer is splashed under
The thickness of copper plate is respectively 2oz microns -9oz microns, and the thickness of the upper copper foil layer and lower copper foil layer is respectively 6oz microns -
38oz microns, the thickness of the upper PI film layers and lower PI film layers is respectively 5um-50um.
It follows that being optimized by the thickness to each layer of structure and performance improvement, product can be adjusted or is thinned
Each layer of structural thickness is reduced compared to traditional structure design on thickness, keeps integral material layer structural thickness thinning,
Final that product ultrathin type, product signal is made to transmit faster, assembling space more optimizes, for flexible printed circuit board,
Its softness higher, it is more accurate.
As further improvement of this embodiment, the upper semi-solid preparation PI film layers 411 are distinguished with lower semi-solid preparation PI film layers 511
For LDK high-frequency functions films, which can be by being added the chemical materials such as iron teflon reality to traditional films
It is existing.Using LDK high-frequency functions film as upper semi-solid preparation PI film layers 411 and lower semi-solid preparation PI film layers 511, LDK high-frequency functions are thin
Film, which has, improves signal transmission frequencies and diamagnetism interference function, to improve the signal transmission performance of printed circuit board, specifically
, the speed that circuit board conveys central area (chip) to assign instruction in working condition can be effectively improved, is quickly transferred to
All parts make equipment (such as mobile phone, communication base station equipment) quick operation, occur without blunt and phenomena such as stuck of crashing,
Keep 5G products communication process whole smooth.
As further improvement of this embodiment, the upper semi-solid preparation PI film layers 411 are distinguished with lower semi-solid preparation PI film layers 511
Film is migrated for anti-copper particle, which can be by carrying out highly purified realization to conventional glue-line.Using anti-
Copper particle migrates film as upper semi-solid preparation PI film layers 411 and lower semi-solid preparation PI film layers 511, and anti-copper particle migration film has low
The anti-copper particle shift function of particulate material can effectively ensure that circuit can safely and effectively work in working condition, circuit and line
Be not in particle migration phenomenon between road, prevent from occurring being connected to collide between circuit and circuit during equipment use causing
The danger such as circuit burning explosion on fire, to which circuit plays a very good protection.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model
Any restrictions, therefore identical as the utility model above-described embodiment or approximate technical characteristic is used, and obtained other structures,
It is within the protection scope of the utility model.
Claims (8)
1. a kind of thin double-sided printed circuit board, which is characterized in that including a copper-clad plate, be set on the one of copper-clad plate upper surface
Line layer, the line layer once for being set to copper-clad plate lower surface, several superstructures and layer for being laminated in upper wiring layer upper surface
It is laminated on several understructures of lower line layer lower surface, wherein the superstructure includes PI on one be set on upper wiring layer
Film layer and be set in PI film layers one on layers of copper, on this PI film layers include one on semi-solid preparation PI film layers and be located at upper layers of copper
Between upper semi-solid preparation PI film layers one on cure PI film layers；The understructure includes being set to lower line layer lower surface once
PI film layers and the layers of copper once for being set to lower PI film layers lower surface, the lower PI film layers are including semi-solid preparation PI film layers once and are located at
The PI film layers of solidification once between lower layers of copper and lower semi-solid preparation PI film layers.
2. thin double-sided printed circuit board according to claim 1, which is characterized in that the upper semi-solid preparation PI film layers are under
Semi-solid preparation PI film layers are black PI film layers.
3. thin double-sided printed circuit board according to claim 1 or 2, which is characterized in that the upper solidification PI film layers with
Lower solidification PI film layers are black PI film layers.
4. thin double-sided printed circuit board according to claim 1, which is characterized in that the upper semi-solid preparation PI film layers are under
Semi-solid preparation PI film layers are respectively LDK high-frequency functions films.
5. thin double-sided printed circuit board according to claim 1, which is characterized in that the upper semi-solid preparation PI film layers are under
Semi-solid preparation PI film layers are respectively anti-copper particle migration film.
6. thin double-sided printed circuit board according to claim 1, which is characterized in that the upper layers of copper be upper copper foil layer or
Upper sputtered Cu layer, the lower layers of copper are lower copper foil layer or lower sputtered Cu layer.
7. thin double-sided printed circuit board according to claim 6, which is characterized in that the upper sputtered Cu layer and lower sputter
The thickness of layers of copper is respectively 2oz microns -9oz microns, and the thickness of the upper copper foil layer and lower copper foil layer is respectively 6oz microns -
38oz microns.
8. thin double-sided printed circuit board according to claim 1, which is characterized in that the upper PI film layers and lower PI film layers
Thickness be respectively 5um-50um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820085416.1U CN207939828U (en) | 2018-01-18 | 2018-01-18 | Thin double-sided printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820085416.1U CN207939828U (en) | 2018-01-18 | 2018-01-18 | Thin double-sided printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN207939828U true CN207939828U (en) | 2018-10-02 |
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ID=63649654
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820085416.1U Active CN207939828U (en) | 2018-01-18 | 2018-01-18 | Thin double-sided printed circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111844958A (en) * | 2019-08-23 | 2020-10-30 | 李龙凯 | Preparation method of novel material layer structure of circuit board and product thereof |
| WO2021035915A1 (en) * | 2019-08-23 | 2021-03-04 | 李龙凯 | Method for manufacturing multilayer double-sided rigid-flex board and product thereof |
-
2018
- 2018-01-18 CN CN201820085416.1U patent/CN207939828U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111844958A (en) * | 2019-08-23 | 2020-10-30 | 李龙凯 | Preparation method of novel material layer structure of circuit board and product thereof |
| WO2021035915A1 (en) * | 2019-08-23 | 2021-03-04 | 李龙凯 | Method for manufacturing multilayer double-sided rigid-flex board and product thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 516000 room 3202, unit 4, building 1, No.11 Huizhou Avenue, Huicheng District, Huizhou City, Guangdong Province Patentee after: Li Longkai Address before: 56, group 2, Lihua Road, Changling Town, Wanzhou District, Chongqing Patentee before: Li Longkai |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210723 Address after: 518000 3rd floor, building A1, 9 songzikeng Reservoir Road, Laokeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee after: Shida new material (Shenzhen) Co.,Ltd. Address before: 516000 room 3202, unit 4, block 1, No. 11, Huizhou Avenue, Huicheng District, Huizhou City, Guangdong Province Patentee before: Li Longkai |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: B113, Comprehensive Building, 3rd Branch of Leibai Zhongcheng Life Science Park, No. 22 Jinxiu East Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen City, Guangdong Province, 518118 Patentee after: Shida new material (Shenzhen) Co.,Ltd. Address before: 518000 3rd floor, building A1, 9 songzikeng Reservoir Road, Laokeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: Shida new material (Shenzhen) Co.,Ltd. |