CN208273347U - Material layer structures with anti-copper particle shift function - Google Patents
Material layer structures with anti-copper particle shift function Download PDFInfo
- Publication number
- CN208273347U CN208273347U CN201820084052.5U CN201820084052U CN208273347U CN 208273347 U CN208273347 U CN 208273347U CN 201820084052 U CN201820084052 U CN 201820084052U CN 208273347 U CN208273347 U CN 208273347U
- Authority
- CN
- China
- Prior art keywords
- glue
- line
- copper
- layer
- copper particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010949 copper Substances 0.000 title claims abstract description 52
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 45
- 239000002245 particle Substances 0.000 title claims abstract description 33
- 239000000463 material Substances 0.000 title claims abstract description 31
- 239000007787 solid Substances 0.000 claims abstract description 38
- 238000002360 preparation method Methods 0.000 claims abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011889 copper foil Substances 0.000 claims description 15
- 229920006335 epoxy glue Polymers 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 239000011236 particulate material Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 103
- 239000010408 film Substances 0.000 description 44
- 230000006872 improvement Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000013508 migration Methods 0.000 description 7
- 230000005012 migration Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004880 explosion Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000006854 communication Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of material layer structures with anti-copper particle shift function, including the layers of copper, a PI film layer and a semi-solid preparation AD glue-line being from top to bottom cascading, wherein semi-solid preparation AD glue-line is that anti-copper particle migrates glue-line.Material layer structures provided by the utility model with the anti-copper particle shift function of low particulate material, material layer structures are not only significantly simplified, it is thinned a layer structural thickness, and it improves pliability and can adjust assembling product three-dimensional space, final products signal velocity is improved, is enhanced product performance, and during the energization, there is protection resistant function to the copper particle transport phenomena between circuit connection and route, guarantee that line security works normally.
Description
Technical field
The utility model relates to a kind of field of circuit boards more particularly to a kind of material layers with anti-copper particle shift function
Structure.
Background technique
Traditional four-layer circuit board and multilayer Rigid Flex, superstructure generally comprise from top to bottom set gradually it is upper thin
Film layer and glue-line, intermediate copper foil circuit layer+film layer+copper foil circuit layer, lower glue layer and film layer, then composite layer is as bonding
Carry out on double-sided wiring board two sides again with single-sided structure 2FCCL (film layer+copper foil layer) it is compound, so as to form circuit board
Four-layer structure, the inside are the two-sided circuit boards to complete, are seen in addition not being fabricated to circuit surface on two sides is compound again simultaneously
Whole copper-clad surface, then carry out again drilling and showing methods, development be etched into route, then compound circuit surface protection is exhausted again
Edge layer CVL (glue-line+film layer) carry out laminating apparatus processing pressing be directly bonded in the outer layer of double-sided PCB so as to form
The outermost layer of four-layer circuit board, to see that the type four-layer circuit board is actually by structure inside outside are as follows: film layer+glue-line
+ copper foil circuit+film layer+glue-line+film layer+glue-line+copper foil circuit+film layer+copper foil circuit+glue-line+film layer+glue-line+
Film layer+copper foil circuit+glue-line+film layer；Such multilayered structure, the number of plies is more and complicated, increases entire product thickness, soft
Softness reduces and increases assembling product difficulty, and process flow is more, and material cost is promoted, the power consumption of circuit board aspect of performance and letter
Number transmission loss increases.
Again and in addition the surface of double-sided PCB must have the coating of two sides insulation, and structural film layer and structural adhesive layer
The structure of the film layer and glue-line that are covered on one side has to if doing four-layer circuit board structure in the double-sided circuit to complete
Plate (film layer+glue-line+copper foil circuit+film layer+copper foil circuit+glue-line+film layer) two sides is further added by the 2FCCL of two layers of one-sided
(film layer+copper foil layer), centre has to carry out bonding effect by glue, so that four-layer structure circuit board integral thickness be made to increase
Add, such thickness has not only significantly increased the thickness of circuit board, nor is convenient for the assembling of structure, and due to thickness
Increase causes product power consumption big and signal velocity consume is larger to slow down.
Meanwhile usual precise circuit circuit board will appear copper particle migration in energization now between route and route
As, circuit burning explosion on fire etc. can be caused dangerous because collision is connected in equipment use process, between route and route,
The route on circuit board is caused not work normally safely.
Utility model content
In view of the above deficiencies, the purpose of this utility model is to provide a kind of material layers with anti-copper particle shift function
Structure has not only significantly simplified material layer structures, is thinned a layer structural thickness, and reduce process flow, reduces material cost, tool
There is good pliability, improves the efficiency of three-dimensional assembling space, promote the speed of 5G circuitry partitioned signal transmission, and reduce consumption
Electricity, and there is protection well and resist to copper particle transport phenomena when being powered between circuit connection and route and make
With guarantee line security works normally.
Used technical solution is the utility model in order to achieve the above objectives:
A kind of material layer structures with anti-copper particle shift function, which is characterized in that including from top to bottom stacking gradually
A layers of copper, a PI film layer and the semi-solid preparation AD glue-line being arranged, wherein semi-solid preparation AD glue-line is that anti-copper particle migrates glue-line.
The semi-solid preparation AD glue-line is LDK high-frequency functions glue-line as a further improvement of the utility model,.
At least one is in both the PI film layer and semi-solid preparation AD glue-line as a further improvement of the utility model,
Black layer.
The layers of copper is sputtered Cu layer or copper foil layer as a further improvement of the utility model,.
As a further improvement of the utility model, further include coated on layers of copper upper surface a PET protection release layer or
One high temperature resistant PET release film.
Further include as a further improvement of the utility model, be set to semi-solid preparation AD glue-line lower surface a PET it is release
Film or a release paper.
The semi-solid preparation AD glue-line is epoxy glue layer as a further improvement of the utility model,.
As a further improvement of the utility model, the sputtered Cu layer with a thickness of 2oz microns -9oz microns, the copper
Layers of foil with a thickness of 6oz microns -38oz microns, the PI film layer with a thickness of 5um-50um, the thickness of the semi-solid preparation AD glue-line
Degree is 10um-60um.
The utility model has the following beneficial effects:
(1) novel material layer structures are used, multi-layer flexible printed circuit board and Rigid Flex are used for, compared to tradition
Layer structure, reduce a glue-line and a film layer, significantly simplified product material layer structure, reduce manufacturing process flow and people
Work reduces integral product material cost, optimizes assembling space, promotes product signal transmission speed, reduces power consumption, improves whole
Properties of product；
(2) using anti-copper particle migration glue-line as semi-solid preparation AD glue-line, anti-copper particle migration glue-line has low particle material
Expect anti-copper particle shift function, can effectively ensure that route can safely and effectively work in working condition, it is offline in energization situation
Be not in copper particle transport phenomena between road and route, equipment in energization use process, prevent route and route it
Between copper particle transport phenomena, to prevent burn caused by short circuit, circuit conducting on fire, battery explosion and function
The danger such as failure, so that route plays a very good protection；
(3) thickness of each layer of structure is optimized and performance improvement, each layer of structure of adjustable or thinned product
Thickness designs compared to traditional structure, reduces on thickness, keep integral material layer structural thickness thinning, finally make product
Ultrathin typeization, so that the softness of product flexibility printed circuit board is higher, more accurate, signal is transmitted faster, and assembling space is more excellent
Change；
(4) use in both PI film layer and semi-solid preparation AD glue-line that at least one is the improvement of black layer, in product structure
In design and manufacture, internal wiring can be effectively prevent to be fully exposed, and the dirt to occurring in color difference bad in product or production
Stain can be covered effectively, allow product overall appearance to seem beautiful characteristic, and can also prevent stranger's externally visibly inner wire
Hidden and protection circuit plate is played the role of on road；Meanwhile wiring board or route for having impurity or flaw, black layer structure
Play the role of concealing.
Above-mentioned is the general introduction of utility model technical solution, below in conjunction with attached drawing and specific embodiment, to the utility model
It is described further.
Detailed description of the invention
Fig. 1 is the sectional view of embodiment one；
Fig. 2 is the sectional view of embodiment two.
Specific embodiment
Further to illustrate that the utility model is the technical means and efficacy for reaching predetermined purpose and being taken, below in conjunction with
Specific embodiment of the present utility model is described in detail in attached drawing and preferred embodiment.
Embodiment one:
Please refer to Fig. 1, the present embodiment provides a kind of material layer structures with anti-copper particle shift function, including by up to
Under the layers of copper 1, a PI film layer 2 and the semi-solid preparation AD glue-line 3 that are cascading, wherein semi-solid preparation AD glue-line 3 is anti-copper
Particle migration glue-line, which can be by carrying out highly purified realization to conventional AD glue-line.
In the present embodiment, which is sputtered Cu layer or copper foil layer, if layers of copper 1 is sputtered Cu layer, sputtered Cu layer is
It is base with PI film layer 2, sputter is carried out in PI film layer 2 and is formed.
Material layer structures provided in this embodiment reduce a glue-line and a film compared to traditional gas producing formation structure
Layer has significantly simplified material layer structures, reduces process flow, reduces cost, enhances product performance.It is provided in this embodiment novel
Material layer structures, especially suitable on flexible printed circuit board and Rigid Flex, i.e., entire novel-section bed structure is covered in
In copper-clad plate with route, using anti-copper particle migration glue-line as semi-solid preparation AD glue-line 3, anti-copper particle migration glue-line has
The low anti-copper particle shift function of particulate material, can effectively ensure that route can safely and effectively work in working condition, route with
Be not in particle migration phenomenon between route, prevent from occurring being connected to collide between route and route in equipment use process making
At the danger such as short circuit and burning explosion on fire, so that route plays protection and protective effect well.
In the present embodiment, the semi-solid preparation AD glue-line 3 is LDK high-frequency functions glue-line, which can lead to
It crosses and the realization of the chemical materials such as iron teflon is added to conventional glue-line.Using LDK high-frequency functions glue-line as semi-solid preparation AD glue-line
3, LDK high-frequency functions glue-lines, which have, improves signal transmission frequencies and diamagnetism interference function, to improve flexible printed circuit board
Signal transmission performance conveys central area (chip) to assign instruction specifically, circuit board can be effectively improved in working condition
Speed is quickly transferred to all parts, makes equipment (such as mobile phone, communication base station equipment) quick operation, without blunt and dead
Phenomena such as machine is stuck occurs, and keeps 5G product communication process whole smooth.
In the present embodiment, the PI film layer 2 and at least one in 3 the two of semi-solid preparation AD glue-line are black layer, black
Realization can be by directly plus black pigment enters in PI film layer 2 or semi-solid preparation AD glue-line 3 and realize.Specifically, there are three types of possible:
(1) semi-solid preparation AD glue-line 3 is black, forms black semi-solid preparation AD glue-line, and PI film layer 2 is other colors, and PI film layer 2 is concretely
Yellow；(2) PI film layer 2 is black, forms black PI film layer, and semi-solid preparation AD glue-line 3 is other colors, and semi-solid preparation AD glue-line 3 has
Body can be milky；(3) PI film layer 2 and semi-solid preparation AD glue-line 3 are black, form black semi-solid preparation AD glue-line and black PI film
Layer.It follows that as long as at least one is black in PI film layer 2 and semi-solid preparation AD glue-line 3.The present embodiment uses black
Layer structure design, internal wiring can be prevented to be exposed, prevent stranger's externally visibly internal wiring, play it is hidden and protection
The effect of route on wiring board；Meanwhile wiring board or route for having impurity or flaw, black layer structure play the work of concealing
With.
In the present embodiment, the semi-solid preparation AD glue-line 3 is epoxy glue layer.
In the present embodiment, the thickness of each layer structure is set according to specific needs, specifically, the sputtered Cu layer
With a thickness of 2oz microns -9oz microns, the copper foil layer with a thickness of 6oz microns -38oz microns, the PI film layer with a thickness of
5um-50um, the semi-solid preparation AD glue-line with a thickness of 10um-60um.
It follows that the thickness after the PI film layer 2 after optimization is combined with semi-solid preparation AD glue-line 3 can be according to the whole need of product
It asks and adjusts, designed compared to traditional structure, done on entire product thickness thinned, i.e., each layer structural thickness can phase intermodulation
It is whole to be thinned, keep entire novel-section bed of material structural thickness thin, finally makes flexible printed circuit board and Rigid Flex product whole thick
Degree is thinned, to optimize assembling space, accelerates signal velocity, promotes properties of product.
Embodiment two:
Referring to figure 2., the present embodiment and the main distinction of embodiment one are: novel-section bed structure further includes being coated on
One PET of 1 upper surface of layers of copper protects release layer 4 or a high temperature resistant PET release film and is set to 3 lower surface of semi-solid preparation AD glue-line
A PET release film 5 or a release paper 5 '.
The present embodiment by be arranged in layers of copper 1 PET protect release layer 4, or have 200 ° of heat resistances PET it is release
Film plays a protective role to layers of copper 1 and entire novel-section bed structure；By 3 lower surface of semi-solid preparation AD glue-line be arranged PET from
Type film 5 or release paper 5 ' prevent layer structure occur in production and handling process convenient for protecting to semi-solid preparation AD glue-line 3
The phenomenon that damaged surfaces, by novel-section bed of material structure setting before in copper-clad plate, as long as removing PET release film 5 or release
Paper 5 '.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model
Any restrictions, therefore technical characteristic identical or approximate with the utility model above-described embodiment is used, and obtained other structures,
It is within the protection scope of the utility model.
Claims (8)
1. a kind of material layer structures with anti-copper particle shift function, which is characterized in that set including from top to bottom stacking gradually
A layers of copper, a PI film layer and the semi-solid preparation AD glue-line set, wherein semi-solid preparation AD glue-line is that anti-copper particle migrates glue-line.
2. the material layer structures according to claim 1 with anti-copper particle shift function, which is characterized in that described half is solid
Change AD glue-line is LDK high-frequency functions glue-line.
3. the material layer structures according to claim 1 with anti-copper particle shift function, which is characterized in that the PI film
At least one is black layer in both layer and semi-solid preparation AD glue-line.
4. the material layer structures according to any one of claims 1 to 3 with anti-copper particle shift function, feature exist
In the layers of copper is sputtered Cu layer or copper foil layer.
5. the material layer structures according to any one of claims 1 to 3 with anti-copper particle shift function, feature exist
In further including a PET protection release layer or high temperature resistant PET release film coated on layers of copper upper surface.
6. the material layer structures according to any one of claims 1 to 3 with anti-copper particle shift function, feature exist
In further including the PET release film or a release paper for being set to semi-solid preparation AD glue-line lower surface.
7. the material layer structures according to any one of claims 1 to 3 with anti-copper particle shift function, feature exist
In the semi-solid preparation AD glue-line is epoxy glue layer.
8. the material layer structures according to claim 4 with anti-copper particle shift function, which is characterized in that the sputter
Layers of copper with a thickness of 2oz microns -9oz microns, the copper foil layer with a thickness of 6oz microns -38oz microns, the thickness of the PI film layer
Degree be 5um-50um, the semi-solid preparation AD glue-line with a thickness of 10um-60um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820084052.5U CN208273347U (en) | 2018-01-18 | 2018-01-18 | Material layer structures with anti-copper particle shift function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820084052.5U CN208273347U (en) | 2018-01-18 | 2018-01-18 | Material layer structures with anti-copper particle shift function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208273347U true CN208273347U (en) | 2018-12-21 |
Family
ID=64673729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820084052.5U Active CN208273347U (en) | 2018-01-18 | 2018-01-18 | Material layer structures with anti-copper particle shift function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208273347U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110677983A (en) * | 2019-08-23 | 2020-01-10 | 李龙凯 | Press-forming method of novel material layer structure of high-frequency circuit board and product thereof |
| CN110682631A (en) * | 2019-08-23 | 2020-01-14 | 李龙凯 | Preparation method of novel material layer structure of circuit board and product thereof |
| CN110691469A (en) * | 2019-08-23 | 2020-01-14 | 李龙凯 | Coating forming method of novel material layer structure of high-frequency circuit board and product thereof |
| CN111867279A (en) * | 2019-08-23 | 2020-10-30 | 李龙凯 | Manufacturing method of multilayer double-sided rigid-flex board and product thereof |
| CN112867291A (en) * | 2019-08-23 | 2021-05-28 | 李龙凯 | Novel material layer structure |
-
2018
- 2018-01-18 CN CN201820084052.5U patent/CN208273347U/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110677983A (en) * | 2019-08-23 | 2020-01-10 | 李龙凯 | Press-forming method of novel material layer structure of high-frequency circuit board and product thereof |
| CN110682631A (en) * | 2019-08-23 | 2020-01-14 | 李龙凯 | Preparation method of novel material layer structure of circuit board and product thereof |
| CN110691469A (en) * | 2019-08-23 | 2020-01-14 | 李龙凯 | Coating forming method of novel material layer structure of high-frequency circuit board and product thereof |
| CN111867260A (en) * | 2019-08-23 | 2020-10-30 | 李龙凯 | Coating forming method of novel material layer structure of high-frequency circuit board and product thereof |
| CN111844958A (en) * | 2019-08-23 | 2020-10-30 | 李龙凯 | Preparation method of novel material layer structure of circuit board and product thereof |
| CN111867242A (en) * | 2019-08-23 | 2020-10-30 | 李龙凯 | Press-forming method of novel material layer structure of high-frequency circuit board and product thereof |
| CN111867279A (en) * | 2019-08-23 | 2020-10-30 | 李龙凯 | Manufacturing method of multilayer double-sided rigid-flex board and product thereof |
| CN112356535A (en) * | 2019-08-23 | 2021-02-12 | 李龙凯 | Novel material layer structure of circuit board |
| WO2021035919A1 (en) * | 2019-08-23 | 2021-03-04 | 李龙凯 | Method for preparing circuit board material layer structure, and product thereof |
| WO2021035917A1 (en) * | 2019-08-23 | 2021-03-04 | 李龙凯 | Method for compression forming high-frequency circuit board material layer structure, and product thereof |
| CN112867291A (en) * | 2019-08-23 | 2021-05-28 | 李龙凯 | Novel material layer structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208273347U (en) | Material layer structures with anti-copper particle shift function | |
| CN102946687B (en) | Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof | |
| CN208273334U (en) | Improve the material layer structures of signal transmission frequencies | |
| TWI396477B (en) | A composite circuit board with easy breakage | |
| JPH0221672B2 (en) | ||
| CN106535508A (en) | Multi-layer board flexible circuit board built-in golden finger exposure process | |
| CN207939826U (en) | Thin material layer structure for multi-layer flexible printed circuit board and Rigid Flex | |
| CN106804092A (en) | A kind of FPC and preparation method thereof | |
| CN207939828U (en) | Thin double-sided printed circuit board | |
| CN202679786U (en) | Multilayer printed circuit board stitching structure | |
| CN205005345U (en) | Circuit board that epoxy and metal base combine | |
| CN103179785B (en) | A kind of wiring board and preparation method thereof | |
| CN207939827U (en) | For multi-layer flexible printed circuit board and the novel-section bed structure of Rigid Flex | |
| CN206525089U (en) | A kind of FCCL materials of ferrite base material | |
| CN207939825U (en) | Flexible printed-circuit board | |
| CN208113048U (en) | Multilayer double-sided printed-circuit board | |
| CN105307387B (en) | A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof | |
| CN101193503A (en) | A making method for multi-layer flexible circuit board | |
| CN107454761A (en) | High density increasing layer multi-layer board manufacturing method | |
| CN203282784U (en) | Universal high temperature release cover film of PCB circuit board and FPC circuit board | |
| CN211240255U (en) | High-frequency low-loss glue-layer-free FPC | |
| CN108990321B (en) | A kind of random layer pcb board and preparation method thereof | |
| CN102958290A (en) | PCB (printed circuit board) manufacturing method capable of improving PCB large copper surface upwarp | |
| CN204090296U (en) | Blind buried via hole printed circuit board (PCB) | |
| CN202213248U (en) | Three-layer double-sided copper foil FCCL (Flexible Copper Clad Laminates) structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 516000 room 3202, unit 4, building 1, No.11 Huizhou Avenue, Huicheng District, Huizhou City, Guangdong Province Patentee after: Li Longkai Address before: 56, group 2, Lihua Road, Changling Town, Wanzhou District, Chongqing Patentee before: Li Longkai |
|
| CP02 | Change in the address of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210722 Address after: 518000 3rd floor, building A1, 9 songzikeng Reservoir Road, Laokeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee after: Shida new material (Shenzhen) Co.,Ltd. Address before: 516000 room 3202, unit 4, block 1, No. 11, Huizhou Avenue, Huicheng District, Huizhou City, Guangdong Province Patentee before: Li Longkai |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: B113, Comprehensive Building, 3rd Branch of Leibai Zhongcheng Life Science Park, No. 22 Jinxiu East Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen City, Guangdong Province, 518118 Patentee after: Shida new material (Shenzhen) Co.,Ltd. Country or region after: China Address before: 518000 3rd floor, building A1, 9 songzikeng Reservoir Road, Laokeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: Shida new material (Shenzhen) Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |