CN110677983A - Press-forming method of novel material layer structure of high-frequency circuit board and product thereof - Google Patents
Press-forming method of novel material layer structure of high-frequency circuit board and product thereof Download PDFInfo
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- CN110677983A CN110677983A CN201910785118.2A CN201910785118A CN110677983A CN 110677983 A CN110677983 A CN 110677983A CN 201910785118 A CN201910785118 A CN 201910785118A CN 110677983 A CN110677983 A CN 110677983A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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Abstract
The invention discloses a press-forming method of a novel material layer structure of a high-frequency circuit board, which comprises the following steps: (1) coating a semi-cured TPI film on the film to form a TPI film; (2) putting the copper foil on the TPI film for hot pressing, and solidifying the semi-solidified TPI film to be integrated with the film to form a synthesized film; (3) and coating a layer of semi-cured high-frequency material on the other surface of the film to form a novel material layer structure of the high-frequency circuit board. The invention also discloses a novel material layer structure of the high-frequency circuit board prepared by implementing the method. The novel material layer structure of the manufactured high-frequency circuit board has the performance of high-speed transmission of high-frequency signals, can adapt to the current high-frequency and high-speed trend from a wireless network to a terminal application, and is particularly suitable for 5G scientific and technological products; the composite material can be used as a manufacturing material of a circuit board to manufacture circuit board structures such as a single-layer circuit board, a multi-layer flexible circuit board, a multi-layer rigid-flex circuit board and the like, great convenience is brought to subsequent manufacturing of the circuit board, and the process is simplified.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a press-forming method of a novel material layer structure of a high-frequency circuit board and a product thereof.
Background
At present, from a communication network to a terminal application, the communication frequency is comprehensive and high-frequency, and high-speed and high-capacity applications emerge endlessly. In recent years, as wireless networks transition from 4G to 5G, network frequencies have increased. According to the 5G development route map displayed in the related data, the communication frequency will be promoted in two stages in the future. The first stage aims to boost the communication frequency to 6GHz before 2020, and the second stage aims to further boost to 30-60GHz after 2020. In the aspect of market application, the signal frequency of terminal antennas such as smart phones is continuously improved, high-frequency applications are more and more, and the requirements for high speed and large capacity are more and more. In order to adapt to the current high-frequency and high-speed trend from wireless networks to terminal applications, the flexible board is used as an antenna and a transmission line in terminal equipment, and the technology is also upgraded.
The conventional flexible printed circuit board has a multi-layer structure composed of a copper foil, an insulating substrate, a cover layer, etc., and is processed into a PI flexible printed circuit board by using the copper foil as a conductor circuit material, a PI film as a circuit insulating substrate, and the PI film and an epoxy resin adhesive as a cover layer for protecting and isolating a circuit through a certain process. Since the final physical and electrical properties of the flexible printed circuit board are determined by the properties of the insulating substrate, the flexible printed circuit board needs to adopt substrates with various performance characteristics in order to adapt to different application scenarios and different functions. At present, the soft board substrate which is applied more is mainly Polyimide (PI), but because the PI substrate has large dielectric constant and loss factor, large moisture absorption and poor reliability, the PI soft board has serious high-frequency transmission loss and poor structural characteristics, and cannot adapt to the current high-frequency high-speed trend. Therefore, with the emergence of new 5G technology products, the signal transmission frequency and speed of the existing circuit board have been difficult to meet the requirements of the 5G technology products.
Meanwhile, in the aspect of a preparation process, no matter the traditional multilayer flexible circuit board or the multilayer rigid-flex circuit board exists, the problems of more process flows, complex manufacturing, increased power consumption and signal transmission loss and the like in the aspect of circuit board performance generally exist.
Disclosure of Invention
In view of the above disadvantages, the present invention provides a press-molding method for a novel material layer structure of a high-frequency circuit board and a product thereof, wherein the novel material layer structure of the high-frequency circuit board has high-frequency characteristics and high-speed high-frequency signal transmission performance, and is suitable for the current high-frequency and high-speed trend from wireless networks to terminal applications, and is particularly suitable for novel 5G scientific and technical products; the novel material layer structure of the high-frequency circuit board can be used as an integral structure, can be used as a manufacturing material of the circuit board in the manufacturing process of a subsequent circuit board, and can be used for manufacturing circuit board structures such as a single-layer circuit board, a multilayer flexible circuit board, a multilayer soft and hard combined board and the like, thereby bringing great convenience to the subsequent manufacturing of the circuit board, simplifying the manufacturing process, accelerating the manufacturing speed of the circuit board and reducing the production cost.
The technical scheme adopted by the invention to achieve the aim is as follows:
a press-fit molding method for a novel material layer structure of a high-frequency circuit board is characterized by comprising the following steps:
(1) coating a layer of semi-cured TPI film on one surface of the film to form the TPI film;
(2) placing the TPI film on a lower carrier plate of a pressing machine, placing a copper foil on the TPI film, and contacting the copper foil with the semi-cured TPI film; then, starting a pressing machine, and carrying out hot pressing for 10-60min at the temperature of 60-500 ℃ and under the pressure of 80-500 psi; after hot pressing, solidifying the semi-solidified TPI film, and combining the semi-solidified TPI film and the film into a whole to form a synthetic film;
(3) and coating a layer of semi-cured high-frequency material on the other surface of the film to form a novel material layer structure of the high-frequency circuit board.
As a further improvement of the present invention, the step (3) further comprises the steps of: and coating release paper or a PET release film on the back surface of the semi-solidified high-frequency material.
As a further improvement of the present invention, in the step (1), the film is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film.
As a further improvement of the present invention, in the step (3), the semi-cured high frequency material is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high frequency functional adhesive, or a mixture of an LDK high frequency functional adhesive and a copper ion migration resistant adhesive.
As a further improvement of the invention, the LDK high-frequency functional adhesive is obtained by adding Teflon or LCP material into AD adhesive, and the anti-copper ion migration adhesive is obtained by adding copper ion scavenger into AD adhesive and then highly purifying.
As a further improvement of the present invention, the step (3) further comprises the steps of: and hot-pressing a copper foil on the back surface of the semi-solidified high-frequency material, solidifying the semi-solidified high-frequency material, and combining the solidified semi-solidified high-frequency material and the synthetic film into a whole to form the novel double-sided material layer structure of the circuit board.
As a further development of the invention, the semi-cured high-frequency material is the same as the material of the film.
As a further improvement of the present invention, in the step (3), at least one of the semi-cured high-frequency material and the film is added with a color filler.
As a further improvement of the invention, the colored filler is a carbide.
The novel material layer structure of the high-frequency circuit board prepared by implementing the method is characterized by comprising an upper copper foil layer, a synthetic film layer and a semi-cured high-frequency material layer which are sequentially stacked from top to bottom.
As a further improvement of the invention, the synthetic film layer is any one of a PI film, an MPI film, an LCP film, a TFP film and a PTFE film.
As a further improvement of the invention, the semi-solidified high-frequency material layer is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high-frequency functional adhesive or a mixture of the LDK high-frequency functional adhesive and a copper ion migration resistant adhesive.
As a further improvement of the invention, a release paper or a PET release film is arranged on the back surface of the semi-solidified high-frequency material layer.
As a further improvement of the invention, a lower copper foil layer is hot-pressed on the back of the semi-solidified high-frequency material layer, the semi-solidified high-frequency material layer is the same as the synthetic film layer, and the semi-solidified high-frequency material layer and the synthetic film layer are integrated into a whole.
As a further improvement of the invention, at least one of the semi-solidified high-frequency material layer and the synthetic film layer is a colored layer.
The invention has the beneficial effects that:
(1) the novel material layer structure of the high-performance high-frequency circuit board is manufactured through a pressing process, the manufactured novel material layer structure of the high-frequency circuit board serves as an integral structure, can serve as a manufacturing material of the circuit board in the subsequent manufacturing process of the circuit board, and can be manufactured into circuit board structures such as a single-layer circuit board, a multilayer flexible circuit board, a multilayer soft and hard combined board and the like through the subsequent processes of direct hot pressing with other materials or the circuit board and the like, great convenience is brought to the subsequent manufacturing of the circuit board, the manufacturing process is simplified, the manufacturing speed of the circuit board is accelerated, the processing time of a product is shortened, the processing capacity of the manufacturing process; moreover, the product structure is optimized, and the product performance is improved.
(2) Adopt MPI film, LCP film, TFP film or PTFE film replace traditional PI film, as the required substrate of the novel material layer structure of preparation high frequency circuit board, not only can improve the stability and the dimensional stability of circuit board wholeness ability, and have the high frequency characteristic, transmissible high frequency signal, and accelerate high frequency signal's transmission rate, realize high frequency signal's high-speed transmission, power consumption and high frequency signal transmission loss are low, improve the signal transmission performance of circuit board, adaptable current high frequency high-speed trend from wireless network to terminal application, specially adapted novel 5G science and technology product.
(3) Adopt half solidification high frequency material to replace traditional half solidification AD glue, half solidification high frequency material specifically can be MPI film, LCP film, TFP film, PTFE film, LDK high frequency function glue, or the mixture of LDK high frequency function glue and anti copper ion migration glue, make the novel material layer structure of high frequency circuit board who prepares out have the high frequency characteristic, transmissible high frequency signal, and accelerate high frequency signal's transmission rate, realize high frequency signal's high-speed transmission, power consumption and high frequency signal transmission loss are low, further improve the signal transmission performance of circuit board, adaptable current high frequency high-speed trend from wireless network to terminal application, the specially adapted novel 5G science and technology product.
The above is an overview of the technical solutions of the present invention, and the present invention is further described below with reference to the accompanying drawings and the detailed description thereof.
Drawings
FIG. 1 is a cross-sectional view of a structure according to a first embodiment;
fig. 2 is a cross-sectional view of the structure in the second embodiment.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined purposes, the following detailed description of the embodiments of the present invention is provided with the accompanying drawings and the preferred embodiments.
The first embodiment is as follows:
the embodiment provides a press-fit molding method for a novel material layer structure of a high-frequency circuit board, which comprises the following steps:
(1) coating a layer of semi-cured TPI film on one surface of the film to form the TPI film;
(2) placing the TPI film on a lower carrier plate of a pressing machine, placing a copper foil on the TPI film, and contacting the copper foil with the semi-cured TPI film; then, starting a pressing machine, and carrying out hot pressing for 10-60min at the temperature of 60-500 ℃ and under the pressure of 80-500 psi; after hot pressing, solidifying the semi-solidified TPI film, and combining the semi-solidified TPI film and the film into a whole to form a synthetic film;
(3) and coating a layer of semi-cured high-frequency material on the other surface of the film to form a novel material layer structure of the high-frequency circuit board.
In this embodiment, the step (3) further includes the steps of: and coating release paper or a PET release film on the back surface of the semi-cured high-frequency material to obtain a circuit board single-sided material layer structure, and protecting the semi-cured high-frequency material by the release paper or the PET release film.
In the later process, the novel material layer structure of the high-frequency circuit board prepared by the embodiment is formed by only forming a circuit on a copper foil and then sequentially hot-pressing a layer of PI film and a layer of glue on the copper foil on which the circuit is formed, so that a single-layer circuit board can be formed.
Meanwhile, after the circuit is formed on the copper foil, a plurality of groups of stacked pressing are carried out on the novel material layer structure of the high-frequency circuit board prepared by the embodiment, and a multilayer flexible circuit board can be formed. And during specific pressing, pressing the semi-cured high-frequency material of the novel material layer structure of the first group of high-frequency circuit board and the copper foil of the formed circuit in the novel material layer structure of the second group of high-frequency circuit board together.
Simultaneously, the novel material layer structure of the high-frequency circuit board is integrally hot-pressed on the glass fiber cloth with the glue on the two sides, then a copper foil is hot-pressed on one side face of the novel material layer structure of the high-frequency circuit board far away from the glass fiber cloth, then a circuit is formed on the copper foil, a multilayer rigid-flexible board can be formed, and the glue on the glass fiber cloth double-sided tape is at least one of copper ion migration resistant glue and LDK high-frequency functional glue.
Certainly, the novel material layer structure of the high-frequency circuit board can be directly hot-pressed on other circuit boards, and the semi-cured high-frequency material on the novel material layer structure of the high-frequency circuit board is in contact hot-pressing combination with other circuit boards into a whole.
In the embodiment, the film and the copper foil are hot-pressed together by using the bonding force generated by taking the TPI film as an intermediary, and the TPI film is a thermoplastic polyimide film which has excellent heat resistance, super-strong dimensional stability, excellent mechanical property, good flame retardance, excellent electrical insulation performance and dimensional stability, excellent oil resistance and solvent resistance and good radiation resistance. And after copper foil is hot-pressed on the semi-solidified TPI film, the semi-solidified TPI film is solidified and is combined with the film into an integral structure to form the synthetic film.
Specifically, in the step (1), the film is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film. The characteristics and advantages of the PI film, the MPI film, the LCP film, the TFP film and the PTFE film are respectively as follows:
the PI film is a polyimide film (polyimide film), is a film type insulating material with good performance, and is formed by performing polycondensation and film-forming on pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a strong polar solvent and then performing imidization. The PI film has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance and medium resistance, can be used for a long time in the temperature range of-269-280 ℃, and can reach the high temperature of 400 ℃ in a short time. The glass transition temperatures were 280 ℃ (Uplix R), 385 ℃ (Kapton) and 500 ℃ or higher (Uplix S), respectively. The tensile strength is 200MPa at 20 ℃ and is more than 100MPa at 200 ℃. Is particularly suitable for being used as a substrate of a flexible circuit board.
MPI (modified PI) is modified polyimide, namely the formula of the Polyimide (PI) is improved. MPI is a noncrystalline material, so that it has a wide working temperature, is easy to work with a copper foil pressed at a low temperature, can easily bond with copper on the surface, and is inexpensive. In particular, the fluoride formulation is improved, so that the MPI film can transmit high-frequency signals of 10-15 GHz. The MPI film is used as a base material required by the novel material layer structure for preparing the high-frequency circuit board, the MPI film is particularly suitable for preparing a flexible circuit board, the purposes of high-speed and stable information receiving and transmitting are achieved, and the terminal application is 5G mobile phones, the field of high-frequency signal transmission, automatic driving, radars, cloud servers, smart homes and the like.
Through measuring the speed, the technical indexes of the MPI film are as follows:
from the above, the MPI film has the following characteristics:
(1) low Dk value, low Df value;
(2) excellent thermal aging resistance;
(3) excellent dimensional stability;
(4) excellent chemical resistance.
Therefore, adopt MPI film as the required substrate of the novel material layer structure of this embodiment preparation high frequency circuit board, not only can improve the stability and the dimensional stability of circuit board overall performance, but also transmissible high frequency signal, and accelerate high frequency signal's transmission rate, reduce power consumption and high frequency signal transmission loss, improve the signal transmission performance of circuit board, adaptable current high-speed trend of high frequency from wireless network to terminal application, the specially adapted novel 5G science and technology product.
LCP is known as Liquid Crystal Polymer (Liquid Crystal Polymer), is a novel thermoplastic organic material, and generally exhibits Liquid crystallinity in a molten state. The LCP film is a liquid crystal polymer film, has the performances of high strength, high rigidity, high temperature resistance, thermal stability, bendability, dimensional stability, good electrical insulation and the like, and has better water resistance compared with a PI film, so that the LCP film is a film type material which is more excellent than the PI film. The LCP film can realize high-frequency high-speed soft boards on the premise of ensuring higher reliability. LCP films have the following excellent electrical characteristics:
(1) the dielectric constant can be kept constant almost in the whole radio frequency range up to 110GHz, the consistency is good, and the dielectric constant Dk value is specifically 2.9;
(2) the tangent loss is very small, only 0.002, and is only increased to 0.0045 even at 110GHz, so that the method is very suitable for millimeter wave application;
(3) has very small thermal expansion characteristic and can be used as an ideal high-frequency packaging material.
Adopt the LCP film as the required substrate of the novel material layer structure of this embodiment preparation high frequency circuit board, not only can improve the stability and the dimensional stability of circuit board wholeness ability, moreover because the LCP film is whole more level and smooth, LCP film material dielectric loss and conductor loss are littleer, possess the flexibility simultaneously, the leakproofness, transmissible high frequency signal, and accelerate high frequency signal's transmission speed, improve the signal transmission performance of circuit board, adaptable current high-speed trend from wireless network to the high frequency of terminal application.
Specifically, the speed of the circuit board for transmitting the command to the central area (chip) in the working state can be effectively increased, the device (such as a mobile phone and communication base station device) can be quickly operated by quickly transmitting the command to each part, phenomena such as slowness, dead halt, jamming and the like do not exist, and the communication process is integrally smooth. Therefore, the LCP film has good application prospect in manufacturing high-frequency devices, and is particularly suitable for novel 5G technical products.
Meanwhile, the LCP soft board made of the LCP film as the base material has better flexibility, and can further improve the space utilization rate compared with the PI soft board. Flexible electronics can be further slimmed with smaller bend radii, and thus the pursuit for flexibility is also a manifestation of miniaturization. The resistance change is larger than 10% as a judgment basis, and under the same experimental condition, the LCP soft board can tolerate more bending times and smaller bending radius compared with the traditional PI soft board, so that the LCP soft board has better flexibility and product reliability. The LCP flexible board can be freely designed in shape due to the excellent flexibility, so that narrow space in the smart phone is fully utilized, and the space utilization efficiency is further improved.
Therefore, a miniaturized high-frequency high-speed LCP flexible board can be manufactured by using the LCP film as the base material.
TFP is a unique thermoplastic material with the following properties compared to conventional PI materials:
(1) low dielectric constant: low Dk value, specifically 2.55; whereas the Dk value of conventional PI is 3.2; therefore, the signal propagation speed is high, the thickness is thinner, the interval is tighter, and the power processing capability is higher;
(2) ultra-low material loss;
(3) ultra-high temperature performance, which can resist high temperature of 300 ℃;
(4) the moisture absorption rate is relatively low.
Therefore, adopt the TFP film as the required substrate of the novel material layer structure of this embodiment preparation high frequency circuit board, not only can improve the stability and the dimensional stability of circuit board overall performance, but also can transmit high frequency signal, and accelerate high frequency signal's transmission rate, reduce power consumption and high frequency signal transmission loss, improve the signal transmission performance of circuit board, adaptable current high-speed trend of high frequency from wireless network to terminal application, the specially adapted novel 5G scientific and technological product.
PTFE, chinese name: polytetrafluoroethylene, other name: teflon, taflon, teflon. Polytetrafluoroethylene (PTFE) has excellent dielectric properties, chemical resistance, heat resistance, flame retardance, low dielectric constant and dielectric loss and low variation over a high frequency range. The main properties are as follows:
1. electrical performance
(1) Dielectric constant: 2.1;
(2) dielectric loss: 5X 10-4；
(3) Volume resistance: 1018. omega. cm;
2. chemical properties: acid and alkali resistance, organic solvent resistance and oxidation resistance;
3. thermal stability: working for a long time at the temperature of-200-260 ℃;
4. flame retardancy: UL 94V-0;
5. weather resistance: there is no significant loss of mechanical properties over 20 years outdoors.
Therefore, adopt the PTFE film as the required substrate of the novel material layer structure of this embodiment preparation high frequency circuit board, not only can improve the stability and the dimensional stability of circuit board overall performance, but also transmissible high frequency signal, and accelerate high frequency signal's transmission rate, reduce power consumption and high frequency signal transmission loss, improve the signal transmission performance of circuit board, adaptable current high-speed trend of high frequency from wireless network to terminal application, the novel 5G science and technology product of specially adapted.
The demand of the high-frequency copper-clad plate is rapidly increased due to the integration of the 5G base station, and the polytetrafluoroethylene is taken as one of mainstream high-frequency base materials of the 5G high-frequency high-speed copper-clad plate, so that the 5G era can meet the great market growth.
Therefore, any one of the PI film, the MPI film, the LCP film, the TFP film and the PTFE film is adopted as a base material required by the novel material layer structure of the high-frequency circuit board prepared by the embodiment, the base material is particularly suitable for the flexible circuit board, particularly the MPI film, the LCP film, the TFP film and the PTFE film, the overall performance of the flexible circuit board can be improved, the high-frequency characteristic is also realized, the transmission of high-frequency signals can be greatly accelerated, the high-speed transmission of the high-frequency signals is realized, the power consumption and the transmission loss of the high-frequency signals are reduced, and the novel 5G technology product is particularly suitable.
Specifically, in the step (3), the semi-cured high-frequency material is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high-frequency functional adhesive, or a mixture of an LDK high-frequency functional adhesive and a copper ion migration resistant adhesive.
According to the high-frequency transmission device, the MPI film, the LCP film, the TFP film and the PTFE film are high-frequency film materials which can accelerate signal transmission frequency and speed, transmit high-frequency signals and improve signal transmission performance of a circuit board, the overall performance of the flexible circuit board can be improved, the high-frequency transmission device also has high-frequency characteristics, transmission of the high-frequency signals can be accelerated greatly, high-speed transmission of the high-frequency signals is achieved, and the high-frequency transmission device is particularly suitable for novel 5G scientific and technological products.
And for the LDK high-frequency functional adhesive, the LDK high-frequency functional adhesive is obtained by adding Teflon or LCP materials into the conventional AD adhesive. Make semi-solid preparation LDK high frequency function glue internal molecular distribution inseparabler, even, and do not consume the energy, LDK high frequency function glue has improvement signal transmission frequency, and the anti magnetic interference function, with the signal transmission performance who improves the circuit board, it is concrete, can effectively improve the circuit board and convey the speed that central zone (chip) assigned the instruction in operating condition, quick transmission is to each part, make equipment (like the cell-phone, communication base station equipment) operate fast, and phenomenon such as not slow and dead machine card die appears, make novel 5G science and technology product communication process whole smooth.
And for the anti-copper ion migration glue, the anti-copper ion migration glue is obtained by adding a reagent such as a copper ion capture agent into the AD glue and then highly purifying. Specifically, the liquid AD glue may be a conventional AD glue. The copper ion scavenger can be selected from inorganic ion exchangers (such as IXE-700F, IXE-750) which have the capability of trapping copper ions and can prevent the copper ions from migrating between circuits, and after the copper ion scavenger is added into the AD glue, the copper ion scavenger has no influence on the performance of the AD glue, but can improve the performance stability of the AD glue. The conventional AD glue contains epoxy resin, a tackifier, a plasticizer and various fillers, and after a high-purification process, the purity of the epoxy resin component in the AD glue can be improved, so that the possibility of copper ions between circuits migrating from the AD glue is obviously reduced, and the purpose of resisting copper ion migration is achieved. Specifically, a certain gap is formed between every two components in the conventional AD glue, copper ions can migrate through the gap, after the concentration of the epoxy resin for purifying the conventional AD glue is improved, the concentration of other components is obviously reduced, and the gap between the epoxy resin and the other components is greatly reduced, so that the gap for transferring the copper ions is reduced, and the purpose of resisting the transfer of the copper ions is achieved. Because the anti-copper ion migration glue has the anti-copper ion migration function of the low-particle material, the circuit can be effectively ensured to work safely and effectively in a working state, the ion migration phenomenon cannot occur between the circuit and the circuit, and the dangers of circuit short circuit, combustion, fire, explosion and the like caused by conduction collision between the circuit and the circuit in the use process of equipment are prevented, so that the circuit has good protection and protection effects.
When the semi-cured high-frequency material is a mixture of the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive, the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive are mixed, so that the semi-cured high-frequency material has high-speed high-frequency signal transmission and copper ion migration resistant performance.
In this embodiment, the thin film and the semi-cured high-frequency material may be made of the same material or different materials. For example: the film and the semi-solidified high-frequency material are both films, or the film is a film and the semi-solidified high-frequency material is a glue. When the film and the semi-cured high-frequency material are both films, the optimal mode is that the film and the semi-cured high-frequency material are both MPI films, or the film and the semi-cured high-frequency material are both LCP films, or the film and the semi-cured high-frequency material are both TFP films, or the film and the semi-cured high-frequency material are both PTFE films.
In the step (3), the semi-cured high-frequency material and the thin film may be in the color of the material itself or may be in a transparent color.
Of course, a color filler may be added to at least one of the semi-cured high-frequency material and the film. In particular, the colored filler may be a carbide or other colored filler. After the colored filler is added into the semi-solidified high-frequency material (specifically, an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high-frequency functional adhesive, or a mixture of the LDK high-frequency functional adhesive and the copper ion migration resistant adhesive) and the film (specifically, any one of a PI film, an MPI film, an LCP film, a TFP film and a PTFE film), the film can present black. No matter the circuit board material layer structure prepared by the embodiment is manufactured into a single-layer circuit board, a multi-layer flexible circuit board or a multi-layer rigid-flex board, the black semi-cured high-frequency material and the film have a shielding effect on the circuit, so that the internal circuit can be prevented from being exposed, and an outsider can be prevented from seeing the internal circuit from the outside, thereby playing a role in concealing and protecting the circuit on the circuit board; meanwhile, the function of concealing the circuit board or the circuit with impurities or defects is achieved.
The embodiment also provides a novel material layer structure of the high-frequency circuit board prepared by implementing the method, as shown in fig. 1, the novel material layer structure comprises an upper copper foil layer 1, a synthetic film layer 2 and a semi-cured high-frequency material layer 3 which are sequentially stacked from top to bottom.
Specifically, the synthetic film layer 2 is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film. Adopt arbitrary one in five of PI film, MPI film, LCP film, TFP film and PTFE film as the substrate of the novel material layer structure of this embodiment circuit board mat, all be suitable for the flexible line way board very much, especially MPI film, LCP film, TFP film and PTFE film, not only can improve the wholeness ability of flexible line way board, still have the high frequency characteristic, can accelerate the transmission of high frequency signal by a wide margin, realize high-speed transmission of high frequency signal, the specially adapted novel 5G science and technology product.
Specifically, the semi-solidified high-frequency material layer 3 is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high-frequency functional adhesive, or a mixture of an LDK high-frequency functional adhesive and a copper ion migration resistant adhesive. MPI film, LCP film, TFP film, PTFE film and LDK high frequency function glue all can accelerate signal transmission frequency and speed, and transmission high frequency signal improves circuit board signal transmission performance, not only can improve flexible line way board's wholeness ability, still has the high frequency characteristic, can accelerate high frequency signal's transmission by a wide margin, realizes high frequency signal's high-speed transmission, the specially adapted novel 5G scientific and technological product. The mixture of the LDK high-frequency functional glue and the copper ion migration resistant glue has high-speed high-frequency signal transmission and copper ion migration resistant performance.
In this embodiment, the composite thin film layer 2 and the semi-cured high-frequency material layer 3 may be made of the same material or different materials. For example: the synthetic thin film layer 2 and the semi-solidified high-frequency material layer 3 are both of thin film type, or the synthetic thin film layer 2 is of thin film type and the semi-solidified high-frequency material layer 3 is of glue type. When the synthetic thin film layer 2 and the semi-cured high-frequency material layer 3 are both films, the optimal mode is that the synthetic thin film layer 2 and the semi-cured high-frequency material layer 3 are both MPI films, or the synthetic thin film layer 2 and the semi-cured high-frequency material layer 3 are both LCP films, or the synthetic thin film layer 2 and the semi-cured high-frequency material layer 3 are both TFP films, or the synthetic thin film layer 2 and the semi-cured high-frequency material layer 3 are both PTFE films.
Specifically, at least one of the semi-solidified high-frequency material layer 3 and the synthetic thin film layer 2 is a colored layer. The color layer can be black, and the color layer plays roles of shielding, protecting, concealing and the like on the internal circuit.
The back of the semi-cured high-frequency material layer 3 is provided with a release layer 5, the release layer 5 is release paper or a PET release film, the semi-cured high-frequency material layer 3 is protected, and the release layer 5 is peeled in subsequent processing.
Example two:
the main differences between this embodiment and the first embodiment are: the step (3) further comprises the following steps: and hot-pressing a copper foil on the back surface of the semi-solidified high-frequency material, solidifying the semi-solidified high-frequency material, and combining the solidified semi-solidified high-frequency material and the synthetic film into a whole to form the novel double-sided material layer structure of the circuit board. And no release paper or PET release film is coated on the back surface of the semi-solidified high-frequency material.
Meanwhile, the semi-cured high-frequency material in this embodiment is the same as the material of the film. Therefore, when the film is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film, the semi-cured high-frequency material is also a corresponding material. For example: the film and the semi-solidified high-frequency material are both MPI films, or the film and the semi-solidified high-frequency material are both LCP films, or the film and the semi-solidified high-frequency material are both TFP films, or the film and the semi-solidified high-frequency material are both PTFE films.
Therefore, the novel double-sided material layer structure of the high-frequency circuit board can be prepared by the method, and the copper foil layer 5 is hot-pressed on the back surface of the semi-solidified high-frequency material layer 3, as shown in fig. 2, so that the novel double-sided material layer structure of the circuit board is formed. Meanwhile, the semi-solidified high-frequency material layer 3 is the same as the synthetic thin film layer 2 in material and is a thin film. Since the lower copper foil layer 5 is pressed by heat, the semi-cured high frequency material layer 3 is cured and integrated with the synthetic thin film layer 2, i.e. the synthetic thin film layer 2'.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that other structures obtained by using the same or similar technical features as the above-described embodiments of the present invention are within the protection scope of the present invention.
Claims (15)
1. A press-fit molding method for a novel material layer structure of a high-frequency circuit board is characterized by comprising the following steps:
(1) coating a layer of semi-cured TPI film on one surface of the film to form the TPI film;
(2) placing the TPI film on a lower carrier plate of a pressing machine, placing a copper foil on the TPI film, and contacting the copper foil with the semi-cured TPI film; then, starting a pressing machine, and carrying out hot pressing for 10-60min at the temperature of 60-500 ℃ and under the pressure of 80-500 psi; after hot pressing, solidifying the semi-solidified TPI film, and combining the semi-solidified TPI film and the film into a whole to form a synthetic film;
(3) and coating a layer of semi-cured high-frequency material on the other surface of the film to form a novel material layer structure of the high-frequency circuit board.
2. The press-fitting method for forming a novel material layer structure of a high-frequency circuit board according to claim 1, wherein the step (3) further comprises the steps of: and coating release paper or a PET release film on the back surface of the semi-solidified high-frequency material.
3. The press-molding method for the novel material layer structure of the high-frequency circuit board as claimed in claim 1, wherein in the step (1), the film is any one of a PI film, an MPI film, an LCP film, a TFP film and a PTFE film.
4. The press-forming method for the novel material layer structure of the high-frequency circuit board according to claim 1, wherein in the step (3), the semi-cured high-frequency material is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high-frequency functional adhesive, or a mixture of an LDK high-frequency functional adhesive and an anti-copper ion migration adhesive.
5. The press-forming method for the novel material layer structure of the high-frequency circuit board as claimed in claim 4, wherein the LDK high-frequency functional adhesive is obtained by adding Teflon or LCP material into AD adhesive, and the anti-copper ion migration adhesive is obtained by adding copper ion scavenger into AD adhesive and then highly purifying.
6. The press-fit molding method for the novel material layer structure of the high-frequency circuit board as claimed in claim 3, wherein the step (3) further comprises the steps of: and hot-pressing a copper foil on the back surface of the semi-solidified high-frequency material, solidifying the semi-solidified high-frequency material, and combining the solidified semi-solidified high-frequency material and the synthetic film into a whole to form the novel double-sided material layer structure of the circuit board.
7. The press-forming method for the novel material layer structure of the high-frequency circuit board as claimed in claim 6, wherein the semi-cured high-frequency material is the same as the material of the film.
8. The press-molding method for forming a novel material layer structure of a high-frequency circuit board according to claim 1, wherein in the step (3), at least one of the semi-cured high-frequency material and the thin film is added with a colored filler.
9. The press-molding method for the novel material layer structure of the high-frequency circuit board as claimed in claim 8, wherein the colored filler is carbide.
10. The novel material layer structure of the high-frequency circuit board prepared by implementing the method of any one of claims 1 to 9, which comprises an upper copper foil layer, a synthetic film layer and a semi-cured high-frequency material layer which are sequentially stacked from top to bottom.
11. The novel material layer structure of a high-frequency circuit board according to claim 10, wherein the synthetic thin film layer is any one of a PI film, an MPI film, an LCP film, a TFP film, and a PTFE film.
12. The novel material layer structure of the high-frequency circuit board as claimed in claim 10, wherein the semi-cured high-frequency material layer is an MPI film, an LCP film, a TFP film, a PTFE film, an LDK high-frequency functional adhesive, or a mixture of an LDK high-frequency functional adhesive and an anti-copper ion migration adhesive.
13. The novel material layer structure of a high-frequency circuit board as claimed in claim 10, wherein a release paper or a PET release film is provided on the back surface of the semi-cured high-frequency material layer.
14. The novel material layer structure for a high-frequency circuit board as claimed in claim 11, wherein a lower copper foil layer is thermally pressed on a back surface of the semi-cured high-frequency material layer, the semi-cured high-frequency material layer is the same as the synthetic film layer, and the semi-cured high-frequency material layer and the synthetic film layer are integrated.
15. The novel material layer structure for a high-frequency circuit board according to claim 10, wherein at least one of the semi-cured high-frequency material layer and the synthetic thin film layer is a colored layer.
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| CN201910785118.2A CN110677983A (en) | 2019-08-23 | 2019-08-23 | Press-forming method of novel material layer structure of high-frequency circuit board and product thereof |
| PCT/CN2019/112804 WO2021035917A1 (en) | 2019-08-23 | 2019-10-23 | Method for compression forming high-frequency circuit board material layer structure, and product thereof |
| CN202010849610.4A CN111867242A (en) | 2019-08-23 | 2020-08-21 | Press-forming method of novel material layer structure of high-frequency circuit board and product thereof |
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| CN201910785118.2A CN110677983A (en) | 2019-08-23 | 2019-08-23 | Press-forming method of novel material layer structure of high-frequency circuit board and product thereof |
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| CN114025516A (en) * | 2021-11-19 | 2022-02-08 | 深圳玛斯兰电路科技实业发展有限公司 | Method for manufacturing high-frequency mixing plate |
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| CN116321760B (en) * | 2022-12-06 | 2023-11-24 | 世大新材料(深圳)有限公司 | Compression molding method for high-frequency circuit board material layer |
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