CN207909907U - 用于镀膜的承载托盘、硅片承载装置及硅片传输系统 - Google Patents

用于镀膜的承载托盘、硅片承载装置及硅片传输系统 Download PDF

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CN207909907U
CN207909907U CN201820803855.1U CN201820803855U CN207909907U CN 207909907 U CN207909907 U CN 207909907U CN 201820803855 U CN201820803855 U CN 201820803855U CN 207909907 U CN207909907 U CN 207909907U
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张文
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Deyun Chuangxin (Beijing) Technology Co.,Ltd.
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Beijing Juntai Innovation Technology Co Ltd
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Abstract

本实用新型公开了一种用于镀膜的承载托盘、硅片承载装置及硅片传输系统，其中承载托盘包括：盖板，所述盖板设有贯通的第一沉积窗口，且所述第一沉积窗口的纵截面为矩形；底板，所述底板设有贯通的第二沉积窗口，所述第二沉积窗口的开口尺寸大于所述第一沉积窗口，且在所述第二沉积窗口的内壁上设有用于承载硅片的承托部；所述盖板与所述底板通过连接件配合。本实用新型实现了在双面镀膜过程中无需繁琐拆卸，仅需直接旋转承载托盘即可满足双面沉积工艺的需求，既节省人工成本，又简化操作流程，同时也减少操作人员直接接触硅片的机会，降低了硅片损毁率，因而能够有效提高生产效率。

Description

用于镀膜的承载托盘、硅片承载装置及硅片传输系统
技术领域
本实用新型涉及硅基光伏组件制造领域，尤其涉及一种用于镀膜的承载托盘、硅片承载装置及硅片传输系统。
背景技术
双面太阳能电池在生产过程中，由于需要在硅片两面进行镀膜工艺，通常是由操作人员将电池硅片放置于硅片传输系统中的托盘内，托盘底部为封闭结构，在完成一面沉积后必须由人工将硅片进行翻面，重新放置于托盘内并再次传输到镀膜设备进行另一面的镀膜工艺，以此完成双面镀膜。
可见，由人工进行托盘内的硅片翻转操作，既繁琐耗时，并且操作中易出现碎片现象，导致生产成本增高、但生产效率降低。
实用新型内容
鉴于上述，本实用新型的目的是提供一种用于镀膜的承载托盘、硅片承载装置及硅片传输系统，借助两个沉积窗口实现托盘的上下贯通，以解决现有技术需直接接触硅片进行手动翻转所带来的弊端。
本实用新型采用的技术方案如下：
一种用于镀膜的承载托盘，包括：
盖板，所述盖板设有贯通的第一沉积窗口，且所述第一沉积窗口的纵截面为矩形；
底板，所述底板设有贯通的第二沉积窗口，所述第二沉积窗口的开口尺寸大于所述第一沉积窗口，且在所述第二沉积窗口的内壁上设有用于承载硅片的承托部；
所述盖板与所述底板通过连接件配合。
可选地，所述承托部位于所述第二沉积窗口的内壁的中部。
可选地，所述承托部位于所述第二沉积窗口的内壁的底部。
可选地，在所述盖板上设有定位销，且在所述底板上设有与所述定位销配合的定位孔。
可选地，所述连接件包括磁吸装置、螺接装置和锁扣装置中的至少一种。
可选地，所述底板与所述承托部一体成型。
可选地，所述盖板和所述底板的材质为石墨或碳纤维或铝合金或不锈钢。
可选地，所述第二沉积窗口的各相邻内壁上的承托部相互连接。
可选地，所述承托部为沿所述第二沉积窗口的内壁的垂直方向设置的凸块。
可选地，所述承托部包括多个独立的承托件。
可选地，各相邻所述承托件的间距相等。
一种硅片承载装置，包括载板，还包括上述承载托盘，所述承载托盘放置于所述载板上，且所述底板与所述载板相接。
可选地，放置在所述载板上的多个所述承载托盘呈矩阵排列。
一种硅片传输系统，包括传输装置，还包括上述承载托盘，所述传输装置用于传输所述承载托盘。
一种硅片传输系统，包括传输装置，还包括上述硅片承载装置，所述传输装置用于传输所述硅片承载装置。
本实用新型通过设计带有上下两个沉积窗口的承载托盘，实现了在双面镀膜过程中无需繁琐拆卸，仅需直接地旋转该承载托盘即可由第一、第二沉积窗口进行双面沉积工艺，既节省人工成本，又简化操作流程，同时也减少操作人员直接接触硅片的机会，降低了硅片损毁率，因而能够有效提高生产效率。
附图说明
为使本实用新型的目的、技术方案和优点更加清楚，下面将结合附图对本实用新型作进一步描述，其中：
图1为本实用新型提供的用于镀膜的承载托盘的实施例的轴测示意图；
图2为本实用新型提供的用于镀膜的承载托盘的实施例的纵截面示意图；
图3为本实用新型提供的用于镀膜的承载托盘的另一个实施例的纵截面示意图。
附图标记说明：
1盖板 2底板 3第一沉积窗口 4第二沉积窗口 5承托部
100硅片
具体实施方式
下面详细描述本实用新型的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本实用新型，而不能解释为对本实用新型的限制。
本实用新型提供了一种用于镀膜的承载托盘的实施例，如图1～图3所示，主要包括盖板1和底板2，其中，盖板1和底板2的材质可以是石墨、碳纤维、铝合金或不锈钢等材质。具体地，在盖板1上设有贯通的第一沉积窗口3，并且第一沉积窗口3的纵截面为矩形(参见图2和图3)，此处强调沉积窗口的纵截面为矩形，意在指出只有矩形结构才能够既保证加工方便性，又能使镀膜面积最大化；再有，底板2上同样设有贯通的第二沉积窗口4，在所述第二沉积窗口4的内壁上固设有用于承载硅片100的承托部5，装配后的承载托盘中，硅片100放置在底板2的承托部5上，且盖板1与底板2通过连接件配合，本领域技术人员可以理解的是即二者形成盖扣为一体的配合方式，连接件则可以采用磁吸装置、螺接装置和锁扣装置等其中的至少一种。这里需要说明的是，为了保证承载托盘翻转时硅片100不会掉落，第二沉积窗口4的开口尺寸应大于第一沉积窗口3的开口尺寸，也即是当承载托盘翻转后，底板2在上且盖板1在下时，盖板1还用于承托硅片100。
本领域技术人员可以理解的是，两个沉积窗口的作用顾名思义，即用于对所承托的硅片100的上下两面进行沉积镀膜，也即是当盖板1和底板2相扣配合后，通过前述两个沉积窗口使承载托盘形成上下贯通的结构(在盖板1和底板2之间没有放置硅片100的状态下)。而沉积窗口的开口形状(非纵截面)可以如图1所示的矩形，也可以结合不同的待处理硅片的形状而定；另外，在其他实施例中，可以优选考虑，两个沉积窗口的开口尺寸可按照一定比例相配，能够使硅片100的两面的镀膜面积一致。
关于承托部5，结合图2和图3所示，承托部5既可以位于第二沉积窗口4其内壁的中部(参考图2示例)，也可以位于所述第二沉积窗口的内壁的底部(参考图3示例)，二者的区别是，图2实施例中的底板2可以双向使用，以备其中一面损坏；而图3实施例中的底板2则相对更为节省空间且更便于加工，因此，本领域技术人员可根据实际需求任意选用不同结构的底板2；此外，在实际操作中，承托部5可以包括多个独立的承托件，例如由多个凸台或止动结构均匀分布在第二沉积窗口4的一个或多个内壁上，这里所称均匀分布具体可以是指各相邻的所述承托件的间距相等；当然，承托部5也可以是一体结构，也即是各相邻内壁上的承托部相互连接，区别于分段设置，呈现一种连续的结构；具体而言，所述承托部5可以是图中所示沿第二沉积窗口4的内壁的垂直方向设置的凸出块状结构。在上述实施例基础上，还可以考虑承托部5的设置方式采用焊接或者底板2与承托部5为一体成型的结构，例如可由模具制备。
为了保证盖板1和底板2准确且方便的扣合，基于上述实施例，本实用新型还提供了另一种优选方案：通过定位装置使二者准确锁定位置，避免发生偏移，例如在盖板1上设置定位销，并且相应地，在底板2上还设有与该定位销配合的定位孔，当然，定位销也可以设置在底板2上，而定位孔则设置在盖板1上。
综合上述实施例及其优选方案，本实用新型还提供了一种应用上述承载托盘的硅片承载装置，其中，承载托盘放置在该硅片传输系统的载板上，且所述底板与所述载板相接；具体可以是，承载托盘在载板上按照如4×7的矩阵排列，并可借由定位销或安装孔等方式安装固定在载板上。
此外，本实用新型还提供了一种硅片传输系统，该传输系统包括传输装置，所称传输装置可以是本领域现有的多种传输装置，例如机械手、滚轮或传送带等，具体地还包括上述承载托盘，所述传输装置的作用是传输所述承载托盘，例如机械手可以通过直接加持承载托盘进行传输，而采用传送滚轮的实施方式中，承载托盘可以直接放置在滚轮上。
基于前文，本实用新型还提供了一种硅片传输系统，该传输系统包括传输装置，所称传输装置可以是本领域现有的多种传输装置，例如机械手、滚轮或传送带等，具体地还包括上述硅片承载装置，所述传输装置的作用是传输所述硅片承载装置，例如机械手可以通过加持所述载板进行传输，而采用传送滚轮的实施方式中，所述载板可以放置在滚轮上。
本实用新型结构简单，便于实施，尤其具备诸多优势：
1)减少操作员直接接触硅片的机会，降低了硅片损毁率，并且简化操作流程，有效提高生产效率同时还节约了材料成本。
2)能够保证硅片正反面两侧镀膜具有相同的延边功能，更好的满足工艺延边要求。
3)除了方便整体翻转，减少人为或机械接触硅片，同时适用于双面PVD设备，即在双面PVD进行工艺时，可一次实现正面和反面镀膜两次工艺，一次完成两面镀膜后再统一进行卸载，减少了中间的翻片环节。
4)再适用于双面PVD设备进行镀膜时，可以尽量减少上盖板的延膜距离，提高正面镀膜的有效面积，有效提高硅片的太阳能转化效率。
5)减少一套自动化翻片装置，大大降低设备成本，从而减少了单片电池片的生产成本。
以上依据图式所示的实施例详细说明了本实用新型的构造、特征及作用效果，但以上所述仅为本实用新型的较佳实施例，需要言明的是，上述实施例及其优选方式所涉及的技术特征，本领域技术人员可以在不脱离、不改变本实用新型的设计思路以及技术效果的前提下，合理地组合搭配成多种等效方案；因此，本实用新型不以图面所示限定实施范围，凡是依照本实用新型的构想所作的改变，或修改为等同变化的等效实施例，仍未超出说明书与图示所涵盖的精神时，均应在本实用新型的保护范围内。

Claims (15)

1.一种用于镀膜的承载托盘，其特征在于，包括：
盖板，所述盖板设有贯通的第一沉积窗口，且所述第一沉积窗口的纵截面为矩形；
底板，所述底板设有贯通的第二沉积窗口，所述第二沉积窗口的开口尺寸大于所述第一沉积窗口，且在所述第二沉积窗口的内壁上设有用于承载硅片的承托部；
所述盖板与所述底板通过连接件配合。
2.根据权利要求1所述的承载托盘，其特征在于，所述承托部位于所述第二沉积窗口的内壁的中部。
3.根据权利要求1所述的承载托盘，其特征在于，所述承托部位于所述第二沉积窗口的内壁的底部。
4.根据权利要求1所述的承载托盘，其特征在于，在所述盖板上设有定位销，且在所述底板上设有与所述定位销配合的定位孔。
5.根据权利要求1所述的承载托盘，其特征在于，所述连接件包括磁吸装置、螺接装置和锁扣装置中的至少一种。
6.根据权利要求1所述的承载托盘，其特征在于，所述底板与所述承托部一体成型。
7.根据权利要求1～6任一项所述的承载托盘，其特征在于，所述盖板和所述底板的材质为石墨或碳纤维或铝合金或不锈钢。
8.根据权利要求1～6任一项所述的承载托盘，其特征在于，所述第二沉积窗口的各相邻内壁上的承托部相互连接。
9.根据权利要求8所述的承载托盘，其特征在于，所述承托部为沿所述第二沉积窗口的内壁的垂直方向设置的凸块。
10.根据权利要求1～6任一项所述的承载托盘，其特征在于，所述承托部包括多个独立的承托件。
11.根据权利要求10所述的承载托盘，其特征在于，各相邻所述承托件的间距相等。
12.一种硅片承载装置，包括载板，其特征在于，还包括权利要求1～11任一项所述的承载托盘，所述承载托盘放置于所述载板上，且所述底板与所述载板相接。
13.根据权利要求12所述的硅片承载装置，其特征在于，放置在所述载板上的多个所述承载托盘呈矩阵排列。
14.一种硅片传输系统，包括传输装置，其特征在于，还包括权利要求1～11任一项所述的承载托盘，所述传输装置用于传输所述承载托盘。
15.一种硅片传输系统，包括传输装置，其特征在于，还包括权利要求12或13所述的硅片承载装置，所述传输装置用于传输所述硅片承载装置。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111471983A (zh) * 2020-05-28 2020-07-31 苏州拓升智能装备有限公司 基板载具、基板载具阵列和气相沉积装置

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Publication number Priority date Publication date Assignee Title
CN109860080A (zh) * 2018-12-28 2019-06-07 浙江中晶新能源有限公司 一种硅片的定位输送装置
CN112768386B (zh) * 2020-12-28 2024-03-19 晋能光伏技术有限责任公司 一种应用于异质结太阳能电池的拼接组装载板
CN113113306B (zh) * 2021-04-08 2024-05-28 绍兴同芯成集成电路有限公司 一种利用耐高温托盘进行化合物半导体晶圆高温回火工艺
KR102672234B1 (ko) * 2023-02-16 2024-06-04 한화엔엑스엠디 주식회사 기판 캐리어 장치

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CN1966756A (zh) * 2005-11-17 2007-05-23 鸿富锦精密工业（深圳）有限公司 镀膜夹具
JP2009114490A (ja) * 2007-11-05 2009-05-28 Nec Electronics Corp 基板ホルダおよびそれを備えた成膜装置
JP2012521075A (ja) * 2009-03-17 2012-09-10 ロート ウント ラウ アーゲー 基板処理装置および基板処理方法
CN201689205U (zh) * 2010-04-23 2010-12-29 浙江水晶光电科技股份有限公司 膜片镀膜夹具
KR20130061384A (ko) * 2011-12-01 2013-06-11 주성엔지니어링(주) 기판 지지용 트레이, 이를 이용한 태양 전지의 제조 장치 및 제조 방법
US9029737B2 (en) * 2013-01-04 2015-05-12 Tsmc Solar Ltd. Method and system for forming absorber layer on metal coated glass for photovoltaic devices
CN207572352U (zh) * 2017-12-25 2018-07-03 君泰创新（北京）科技有限公司 太阳能电池硅片承载装置以及传输系统

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