WO2019227692A1 - 用于镀膜的承载托盘、硅片承载装置及硅片传输系统 - Google Patents

用于镀膜的承载托盘、硅片承载装置及硅片传输系统 Download PDF

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Publication number
WO2019227692A1
WO2019227692A1 PCT/CN2018/101370 CN2018101370W WO2019227692A1 WO 2019227692 A1 WO2019227692 A1 WO 2019227692A1 CN 2018101370 W CN2018101370 W CN 2018101370W WO 2019227692 A1 WO2019227692 A1 WO 2019227692A1
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Prior art keywords
carrying
silicon wafer
tray according
bottom plate
deposition window
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PCT/CN2018/101370
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English (en)
French (fr)
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张文
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君泰创新（北京）科技有限公司
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Publication of WO2019227692A1 publication Critical patent/WO2019227692A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells

Definitions

  • the present disclosure relates to, but is not limited to, the field of manufacturing silicon-based photovoltaic modules, and in particular, to a carrier tray for coating, a wafer carrier, and a wafer transfer system.
  • At least one embodiment of the present disclosure provides a carrier tray for coating, including a cover plate, the cover plate is provided with a through first deposition window; the bottom plate is provided with a through second deposition window, and The opening size of the second deposition window is larger than the first deposition window, and a supporting portion for carrying a silicon wafer is provided on an inner wall of the second deposition window; the cover plate is cooperatively connected with the bottom plate.
  • At least one embodiment of the present disclosure provides a silicon wafer carrying device including a carrier board and the carrier tray described above, the carrier tray is placed on the carrier board, and the bottom plate is in phase with the carrier board. Pick up.
  • At least one embodiment of the present disclosure provides a silicon wafer transfer system, which includes a transfer device and a carrying tray described above, and the transferring device is configured to transfer the carrying tray.
  • At least one embodiment of the present disclosure provides a silicon wafer transmission system including a transmission device and the silicon wafer carrying device described above, and the transmission device is configured to transmit the silicon wafer carrying device.
  • FIG. 1 is a schematic isometric view of a carrying tray according to an embodiment of the present disclosure
  • FIG. 2 is a schematic longitudinal sectional view of a carrying tray according to an embodiment of the present disclosure
  • FIG. 3 is a schematic isometric view of a bottom plate according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic isometric view of a bottom plate according to another embodiment of the present disclosure.
  • FIG. 5 is a schematic longitudinal sectional view of a carrier tray according to another embodiment of the present disclosure.
  • an embodiment of the present disclosure provides a carrier tray.
  • a silicon wafer is held in the carrier tray, and there is no need to flip the silicon wafer therein during the double-sided coating process, and only the carrier needs to be directly rotated.
  • the tray can be subjected to the double-sided deposition process from the first and second deposition windows, which not only saves labor costs, but also simplifies the operation process. In addition, it also reduces the opportunity for the operator to directly contact the silicon wafer, reduces the silicon wafer damage rate, and effectively improves production efficiency. .
  • an embodiment of the present disclosure provides a carrier tray, which mainly includes a cover plate 1 and a bottom plate 2, wherein the material of the cover plate 1 and the bottom plate 2 may be graphite, carbon fiber, aluminum alloy, or stainless steel. Material.
  • the cover plate 1 is provided with a through first deposition window 3, and the longitudinal section of the first deposition window 3 is rectangular, which can ensure processing convenience and maximize the coating area; further, the bottom plate 2
  • a second deposition window 4 is also formed therethrough, and a supporting portion 5 for carrying the silicon wafer 100 is fixed on the inner wall of the second deposition window 4.
  • the silicon wafer 100 is placed on the supporting portion 5 of the bottom plate 2 and the cover plate 1 and the bottom plate 2 are mated through a connecting member.
  • the connecting member may use at least one of a magnetic suction device, a screw connection device, and a locking device.
  • the opening size of the second deposition window 4 should be larger than the opening size of the first deposition window 3. Even when the loading tray is turned over, the bottom plate 2 is When the cover 1 is up and the cover 1 is down, the cover 1 can be used to support the silicon wafer 100.
  • the role of the two deposition windows is as the name implies, that is, it is used to deposit and coat the upper and lower sides of the supported silicon wafer 100, that is, after the cover plate 1 and the bottom plate 2 are mated and matched.
  • the carrier tray is formed into a vertical structure (that is, in a state where the silicon wafer 100 is not placed between the cover plate 1 and the bottom plate 2).
  • the opening shape (non-longitudinal section) of the deposition window may be rectangular as shown in FIG. 1, or may be determined by combining different shapes of silicon wafers to be processed.
  • the opening sizes of the two deposition windows can be matched according to a certain ratio, so that the exposed areas of the upper and lower end surfaces of the silicon wafer 100 are the same, and the areas of the plating films on the two sides of the silicon wafer 100 can be consistent.
  • the supporting portion 5 is located in the middle of the inner wall of the second deposition window 4, so that the bottom plate 2 can be used in both directions, that is, both the upper end and the lower end thereof can be used. Used in conjunction with the cover plate 1 in case one side of the bottom plate 2 is damaged.
  • the supporting portion 5 includes a plurality of independent supporting members 6, and the supporting members 6 are projections protruding from the inner wall of the second deposition window 4.
  • the supporting members 6 may be uniformly distributed on one or more inner walls of the second deposition window 4. The uniform distribution referred to herein specifically means that the distance between each adjacent supporting member 6 is equal.
  • Another embodiment of the present disclosure provides a carrying tray.
  • the carrying tray is provided with a positioning device.
  • the carrying tray uses the positioning device to lock the two positions accurately to avoid displacement.
  • a positioning hole 7 is also provided on the bottom plate 2, and a positioning pin matching the positioning hole 7 is provided on the cover plate 1.
  • the positioning pin may be provided on the bottom plate 2, and the positioning hole 7 is provided on the cover.
  • the supporting portions 5 are an integrated structure, that is, the supporting portions 5 on each adjacent inner wall are connected to each other, which is different from the segmented arrangement and presents a continuous structure.
  • the supporting portion 5 is a protruding block structure provided along the vertical direction of the inner wall of the second deposition window 4 as shown in the figure.
  • the supporting portion 5 may be installed by welding or a structure in which the bottom plate 2 and the supporting portion 5 are integrally formed.
  • the supporting portion 5 may be prepared by a mold.
  • Another embodiment of the present disclosure provides a carrying tray.
  • the supporting portion is located at the bottom of the inner wall of the second deposition window.
  • the supporting portion 5 is disposed on the bottom of the inner wall of the second deposition window 4, and the silicon wafer 100 is sandwiched between the supporting portion 5 and the upper cover 1.
  • the base plate 2 has a small thickness, which is relatively more space-saving and easier to process.
  • An embodiment of the present disclosure provides a silicon wafer carrying device including a carrier board and a carrier tray described in at least one of the above embodiments.
  • the carrier tray is placed on the carrier board, and the bottom plate is connected to the carrier board.
  • the silicon wafer carrying device may include only the carrying tray described in any one of the above embodiments, or the carrying tray described in any two embodiments, or the carrying tray described in the three embodiments.
  • the carrier trays are arranged in a matrix such as 4 ⁇ 7 on the carrier board, and can be fixed on the carrier board by means of positioning pins or mounting holes.
  • An embodiment of the present disclosure provides a silicon wafer transfer system, including a transfer device and a carrier tray described in at least one of the above embodiments.
  • the transfer device may be a variety of transfer devices, such as a robot, a roller, or a conveyor belt.
  • the transfer device is connected to the transfer device for transferring silicon wafers.
  • the robot can directly transfer the load by holding the carrier tray.
  • the carrier tray can be directly placed on the roller.
  • An embodiment of the present disclosure further provides a silicon wafer transmission system, which includes a transmission device and the silicon wafer carrying device described above, and the silicon wafer carrying device is placed on the transmission device.
  • the transmission device can be a variety of transmission devices, such as a robot, a roller, or a conveyor belt. Among them, the robot can transfer by holding the carrier plate. In the method of using the transport roller, the carrier plate can be placed on the roller.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种用于镀膜的承载托盘、硅片承载装置及硅片传输系统，其中，承载托盘包括：盖板，所述盖板设有贯通的第一沉积窗口；底板，所述底板设有贯通的第二沉积窗口，所述第二沉积窗口的开口尺寸大于所述第一沉积窗口，且在所述第二沉积窗口的内壁上设有用于承载硅片的承托部；所述盖板与所述底板配合连接。硅片承载装置包括载板和上述承载托盘，所述承载托盘放置于所述载板上，且所述底板与所述载板相接。硅片传输系统包括传输装置和上述承载托盘或硅片承载装置。

Description

用于镀膜的承载托盘、硅片承载装置及硅片传输系统
本申请基于申请号为201820803855.1、申请日为2018年5月28日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本公开涉及但不局限于硅基光伏组件制造领域，尤其涉及一种用于镀膜的承载托盘、硅片承载装置及硅片传输系统。
背景技术
双面太阳能电池在生产过程中，由于需要在硅片两面进行镀膜工艺，通常需要由操作人员将电池硅片放置于硅片传输系统中的托盘内。而托盘底部为封闭结构，在完成一面沉积后必须由人工将硅片进行翻面，重新放置于托盘内并再次传输到镀膜设备进行另一面的镀膜工艺，以此完成双面镀膜。
可见，由人工进行托盘内的硅片翻转操作，既繁琐耗时，又容易在操作中出现碎片现象，导致生产成本增高，生产效率降低。
发明概述
本公开至少一实施例提供了一种用于镀膜的承载托盘，包括盖板，所述盖板设有贯通的第一沉积窗口；底板，所述底板设有贯通的第二沉积窗口，所述第二沉积窗口的开口尺寸大于所述第一沉积窗口，且在所述第二沉积窗口的内壁上设有用于承载硅片的承托部；所述盖板与所述底板配合连接。
本公开至少一实施例提供了一种硅片承载装置，包括载板，和上文所述的承载托盘，所述承载托盘放置于所述载板上，且所述底板与所述载板相接。
本公开至少一实施例提供了一种硅片传输系统，包括传输装置和上文所述的承载托盘，所述传输装置设置为传输所述承载托盘。
本公开至少一实施例提供了一种硅片传输系统，包括传输装置和上文所述的硅片承载装置，所述传输装置设置为传输所述硅片承载装置。
附图说明
图1为根据本公开一实施例的承载托盘的轴测示意图；
图2为本公开一实施例的承载托盘的纵截面示意图；
图3为本公开一实施例的底板的轴测示意图；
图4为根据本公开又一实施例的底板的轴测示意图
图5为根据本公开又一实施例的承载托盘的纵截面示意图。
图1至图5中附图标记与部件之间的对应关系为：
1盖板，2底板，3第一沉积窗口，4第二沉积窗口，5承托部，6承托件，7定位孔，100硅片
具体实施方式
下文中将结合附图对本公开的实施例进行详细说明。需要说明的是，在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互任意组合。
针对常规承载托盘的缺陷，本公开实施例提供了一种承载托盘，硅片夹持在承载托盘内，且在双面镀膜过程中无需翻转在其内的硅片，仅需直接地旋转该承载托盘即可由第一、第二沉积窗口进行双面沉积工艺，既节省人工成本，又简化了操作流程，此外还可减少操作人员直接接触硅片的机会，降低硅片损毁率，有效提高生产效率。
下面结合实施例阐述本公开的承载托盘、硅片承载装置及硅片传输系统。
如图1和图2所示，本公开实施例提供了一种承载托盘，主要包括盖板1和底板2，其中，盖板1和底板2的材质可以是石墨、碳纤维、铝合金或不锈钢等材质。具体地，在盖板1上设有贯通的第一沉积窗口3，并且第一沉积窗口3的纵截面为矩形，既可保证加工方便性，又能使镀膜面 积最大化；再者，底板2上同样设有贯通的第二沉积窗口4，且在第二沉积窗口4的内壁上固设有用于承载硅片100的承托部5。装配后的承载托盘中，硅片100放置在底板2的承托部5上，且盖板1与底板2通过连接件配合，本领域技术人员可以理解的是即二者形成盖扣为一体的配合方式，连接件则可以采用磁吸装置、螺接装置和锁扣装置等其中的至少一种。这里需要说明的是，为了保证承载托盘翻转时硅片100不会掉落，第二沉积窗口4的开口尺寸应大于第一沉积窗口3的开口尺寸，也即使当承载托盘翻转后，底板2在上且盖板1在下时，盖板1可用于承托硅片100。
本领域技术人员可以理解的是，两个沉积窗口的作用顾名思义，即用于对所承托的硅片100的上下两面进行沉积镀膜，也即是当盖板1和底板2相扣配合后，通过前述两个沉积窗口使承载托盘形成上下贯通的结构(即在盖板1和底板2之间未放置硅片100的状态下)。而沉积窗口的开口形状(非纵截面)可以如图1所示的矩形，也可以结合不同的待处理硅片的形状而定。另外，两个沉积窗口的开口尺寸可按照一定比例相配，使得硅片100上下端面裸露的面积相同，进而能够使硅片100的两面的镀膜面积一致。
在本公开一个示例性实施例中，如图2和图3所示，承托部5位于第二沉积窗口4其内壁的中部，使得该底板2可以上下双向使用，即其上端和下端都可与盖板1配合使用，以备其中底板2一面损坏。
另外，在本公开一个示例性实施例中，如图3所示，承托部5包括多个独立的承托件6，承托件6为突出第二沉积窗口4内壁的凸台，多个承托件6可以是均匀分布在第二沉积窗口4的一个或多个内壁上，这里所称均匀分布具体为每个相邻承托件6的间距相等。
本公开另一实施例提供了一种承载托盘。在本实施例中，承载托盘设置定位装置。
如图4所示，为了保证盖板1和底板2准确且方便的扣合，该承载托盘通过定位装置使二者准确锁定位置，避免发生偏移。具体地，在底板2上还设有定位孔7，在盖板1上设置与该定位孔7配合的定位销，或者， 定位销也可以设置在底板2上，而定位孔7则设置在盖板1上。
在本公开一个示例性实施例中，承托部5为一体结构，也即是每个相邻内壁上的承托部5相互连接，区别于分段设置，呈现一种连续的结构。具体而言，该承托部5是图中所示沿第二沉积窗口4的内壁的垂直方向设置的凸出块状结构。而承托部5的设置方式可采用焊接或者底板2与承托部5为一体成型的结构，例如可由模具制备。
本公开另一实施例提供了一种承载托盘。在本实施例中，承托部位于第二沉积窗口的内壁底部。
如图5所示，该承托部5设置在第二沉积窗口4的内壁的底部，硅片100夹在承托部5与上盖1之间。该底板2厚度小，相对更为节省空间且更便于加工。
本公开实施例提供了一种硅片承载装置，包括载板和以上至少一个实施例所描述的承载托盘，承载托盘放置在载板上，且底板与载板相接。如：硅片承载装置可以仅包括以上任一个实施例所描述的承载托盘，或者包括任两个实施例所描述的承载托盘，或者包括三个实施例所描述的承载托盘等。具体地，承载托盘在载板上按照如4×7的矩阵排列，并可借由定位销或安装孔等方式安装固定在载板上。
本公开实施例提供了一种硅片传输系统，包括传输装置和以上至少一个实施例所描述的承载托盘，该传输装置可以是多种传输装置，例如机械手、滚轮或传送带等，承载托盘放置在传输装置上，且底板与传输装置相接，用于传输硅片，例如机械手可以通过直接加持承载托盘进行传输，而采用传送滚轮的实施方式中，承载托盘可以直接放置在滚轮上。
本公开实施例又提供了一种硅片传输系统，包括传输装置和上文所描述的硅片承载装置，硅片承载装置放置在传输装置上。该传输装置可以是 多种传输装置，例如机械手、滚轮或传送带等，其中，机械手可以通过加持载板进行传输，而采用传送滚轮的方式中，载板可以放置在滚轮上。
本公开中，术语“多”指两或两以上。
以上所述实施方式仅表达了本公开的几种实施方式，其描述较为具体和详细，但所述的内容仅为便于理解本公开而采用的实施方式，并非用以限定本公开。任何本公开所属领域内的技术人员，在不脱离本公开所揭露的精神和范围的前提下，可以在实施的形式及细节上进行任何的修改与变化，但本公开的专利保护范围，仍须以所附的权利要求书所界定为准。

Claims (16)

  1. 一种用于镀膜的承载托盘，包括：
    盖板，所述盖板设有贯通的第一沉积窗口；
    底板，所述底板设有贯通的第二沉积窗口，所述第二沉积窗口的开口尺寸大于所述第一沉积窗口，且在所述第二沉积窗口的内壁上设有用于承载硅片的承托部；
    所述盖板与所述底板配合连接。
  2. 根据权利要求1所述的承载托盘，其中：所述第一沉积窗口的纵截面为矩形。
  3. 根据权利要求2所述的承载托盘，其中：所述盖板与所述底板通过连接件配合连接。
  4. 根据权利要求1所述的承载托盘，其中：所述承托部位于所述第二沉积窗口的内壁的中部或底部。
  5. 根据权利要求3所述的承载托盘，其中：在所述盖板上设有定位销，且在所述底板上设有与所述定位销配合的定位孔。
  6. 根据权利要求3所述的承载托盘，其中：所述连接件包括磁吸装置、螺接装置和锁扣装置中的至少一种。
  7. 根据权利要求1所述的承载托盘，其中：所述底板与所述承托部一体成型。
  8. 根据权利要求1～7任一所述的承载托盘，其中：所述盖板和所述底板的材质为石墨或碳纤维或铝合金或不锈钢。
  9. 根据权利要求2～7任一所述的承载托盘，其中：所述第二沉积窗口的每个相邻内壁上的承托部相互连接。
  10. 根据权利要求9所述的承载托盘，其中：所述承托部为沿所述第二沉积窗口的内壁的垂直方向设置的凸块。
  11. 根据权利要求1～7任一所述的承载托盘，其中：所述承托部包括多个独立的承托件。
  12. 根据权利要求11所述的承载托盘，其中：相邻所述承托件的间 距相等。
  13. 一种硅片承载装置，包括载板，和权利要求1～12任一所述的承载托盘，所述承载托盘放置于所述载板上，且所述底板与所述载板相接。
  14. 根据权利要求13所述的硅片承载装置，其中：放置在所述载板上的多个所述承载托盘呈矩阵排列。
  15. 一种硅片传输系统，包括传输装置，和权利要求1～12任一项所述的承载托盘，所述传输装置用于传输所述承载托盘。
  16. 一种硅片传输系统，包括传输装置，和权利要求13或14所述的硅片承载装置，所述传输装置用于传输所述硅片承载装置。
PCT/CN2018/101370 2018-05-28 2018-08-20 用于镀膜的承载托盘、硅片承载装置及硅片传输系统 WO2019227692A1 (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1966756A (zh) * 2005-11-17 2007-05-23 鸿富锦精密工业（深圳）有限公司 镀膜夹具
JP2009114490A (ja) * 2007-11-05 2009-05-28 Nec Electronics Corp 基板ホルダおよびそれを備えた成膜装置
CN201689205U (zh) * 2010-04-23 2010-12-29 浙江水晶光电科技股份有限公司 膜片镀膜夹具

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102007565A (zh) * 2009-03-17 2011-04-06 德国罗特·劳股份有限公司 基片处理系统和基片处理方法
KR20130061384A (ko) * 2011-12-01 2013-06-11 주성엔지니어링(주) 기판 지지용 트레이, 이를 이용한 태양 전지의 제조 장치 및 제조 방법
US9029737B2 (en) * 2013-01-04 2015-05-12 Tsmc Solar Ltd. Method and system for forming absorber layer on metal coated glass for photovoltaic devices
CN207572352U (zh) * 2017-12-25 2018-07-03 君泰创新（北京）科技有限公司 太阳能电池硅片承载装置以及传输系统

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1966756A (zh) * 2005-11-17 2007-05-23 鸿富锦精密工业（深圳）有限公司 镀膜夹具
JP2009114490A (ja) * 2007-11-05 2009-05-28 Nec Electronics Corp 基板ホルダおよびそれを備えた成膜装置
CN201689205U (zh) * 2010-04-23 2010-12-29 浙江水晶光电科技股份有限公司 膜片镀膜夹具

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