CN207753001U - Pcb board LED wafer plug in component - Google Patents
Pcb board LED wafer plug in component Download PDFInfo
- Publication number
- CN207753001U CN207753001U CN201721797390.5U CN201721797390U CN207753001U CN 207753001 U CN207753001 U CN 207753001U CN 201721797390 U CN201721797390 U CN 201721797390U CN 207753001 U CN207753001 U CN 207753001U
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- CN
- China
- Prior art keywords
- pcb board
- hole
- led wafer
- pin
- pad
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of pcb board LED wafer plug in component, including LED wafer, the first pad, the second pad, the first pin, second pin, gold thread, pcb board and pedestal, first pad and the second pad are fixed on pcb board, LED wafer is fixedly connected with the first pad, LED wafer is connect by gold thread with the second pad, first pad is connect with the first pin, second pad is connect with second pin, pedestal is provided with the groove coordinated with pcb board, pcb board is placed in groove, and the first pin, second pin are each passed through pcb board and pedestal.Two pins of the utility model are passed through from pcb board respectively, and when two pins are carried out bending, folding stress will act on pcb board, will not act power to gold thread, and there is a phenomenon where be broken for gold thread when avoiding pin bending during following process.
Description
Technical field
The utility model is related to LED fields, and being related to LED wafer and pcb board connection structure technical field is specifically
It is related to a kind of pcb board LED wafer plug in component.
Background technology
As shown in Fig. 1, existing LED wafer plug in component, including chip 101, gold thread a121, gold thread b122, pin
A131, pin b132, holder 104, pedestal 105 and transparent colloid 106, chip 101 are connect by gold thread a121 with pin a131,
Chip 101 is connect by gold thread b122 with pin b132, and pin a131 and pin b132 are mutually parallel, 101 rounded knot of chip
Structure, chip 101 are connect with holder 104, and 104 lower end of holder is connect with pedestal 105, and pedestal 105 is hollow cavity circular configuration, is drawn
Foot a131 and pin b132 is each passed through pedestal 105, transparent colloid 106 be coated on chip 101, gold thread a121, gold thread b122 and
On 104 face of holder.It needs the pin a131 that will be mutually parallel and pin b132 to be drawn into process horizontal, works as pin
Pin a131 and the junctions pin b132 stress are very big when a131 and pin b132 are bent into level, since single LED chip does not have
There are supporting surface, stress that will all be applied on the transparent colloid 106 outside pin a131 and the junctions pin b132, crosses high temperature
When, transparent colloid 106 expands with heat and contract with cold, and stress is released, the connection gold thread a121 of pin a131 and the junctions pin b132 and
Gold thread b122 will be easy to happen the phenomenon that fracture.
Utility model content
In order to overcome the shortcomings of above-mentioned existing LED wafer plug in component, the utility model provides gold in a kind of process
Line pcb board LED wafer plug in component not easy to break.
A kind of technical solution that in order to achieve the above object, the utility model provides：A kind of pcb board LED wafer plug in component,
Including LED wafer, the first pad, the second pad, the first pin, second pin, gold thread, pcb board and pedestal, the first pad and
Two pads are fixed on pcb board, and LED wafer is fixedly connected with the first pad, and LED wafer is connected by gold thread and the second pad
It connecing, the first pad is connect with the first pin, and the second pad is connect with second pin, and pedestal is provided with the groove coordinated with pcb board,
Pcb board is placed in groove, and the first pin, second pin are each passed through pcb board and pedestal.The utility model has the beneficial effect that：
Now standoff mode is not used, makes a pcb board, and chip is also set up by being fixed on pcb board on pcb board
Two pads, chip are fixedly connected on one of pad, and chip is connect by gold thread with another pad again, two welderings
Disk is connect with two pins respectively, and two pins are passed through from pcb board respectively, when will be passed through from pcb board two pins from flat
When row shape is bent into horizontal, stress will act on pcb board, will not generate stress to gold thread, in this way can be to avoid rear
There is a phenomenon where be broken for gold thread when pin bending in continuous process.
PC plate is equipped with first through hole and the second through-hole as a further improvement of the utility model, and pedestal is equipped with base
Seat first through hole and the second through-hole of pedestal, the first pin pass through first through hole and pedestal first through hole, second pin to pass through second
The second through-hole of through-hole and pedestal, the first pin, second pin are contacted with the inner wall of first through hole, the second through-hole respectively.When will be from
When being bent into horizontal from parallel shape across two pins in pcb board, stress will act at PCB plate through hole, will not be to pcb board
The pad of connection pin acts power, reduces the case where LED wafer fails.
First through hole and pedestal first through hole are corresponding up and down as a further improvement of the utility model, first through hole and
The extension line of pedestal first through hole is vertical with PC plate；Second through-hole and the second through-hole of pedestal are corresponding up and down, the second through-hole and pedestal
The extension line of second through-hole is vertical with PC plate.Two pins are parallel across pcb board and substrate through-hole and normal thereto, Ke Yishi
Existing two pins are bent into 180 degree.
Further include transparent colloid as a further improvement of the utility model, transparent colloid coats LED wafer, pad, gold
Line, transparent colloid is by LED wafer, pad and gold thread sealing in PC plate, and transparent colloid is by PC plate sealing in base recess.It will
Pcb board is fixed with pedestal, and LED wafer, pad and gold thread on fixed pcb board, reduces the case where LED wafer fails.
Gold thread uses heat-conducting, gold thread to be set as two or four as a further improvement of the utility model,.LED
The heat that chip generates can be transmitted to by the gold thread with good thermal conductivity on pad respectively, then dissipated and passed by pad
It is delivered on pcb board, the heat dissipation effect of LED wafer is improved to make heat spread out well, when 2 or 4 radicals are arranged
When measuring gold thread, heat dissipation performance is more preferable.
Gold thread forms " V " font as a further improvement of the utility model,." V " font heat dissipation performance is more preferable.
Solder layer is provided between LED wafer and the first pad as a further improvement of the utility model, solder layer
Area is more than or equal to the area of the lower surface of LED wafer, and less than or equal to the area of the first pad.LED wafer is set to be welded with first
Connection between disk is relatively reliable, to make LED wafer more stablize using process.
Further include radiating gasket as a further improvement of the utility model, radiating gasket is arranged in LED wafer and solder
Between layer.Radiating gasket is arranged between LED wafer and solder layer, plays the cooling effect to LED wafer, extends LED wafer
Service life and improve light efficiency, reduce LED wafer failure the case where.
PC plate is in cylindrical structure as a further improvement of the utility model, and the setting of the first pad is round in PC plate
At the heart, first through hole and the second through-hole are symmetricly set in PC plate on circle, in first through hole and the second through-hole extension line and PC plate
Circular diameter overlaps.When that will be bent into horizontal from parallel shape across two pins from pcb board, it is logical to act on pcb board two
Stress at hole is equal, pcb board uniform force, pcb board LED wafer plug in component the operation is stable.
Description of the drawings
Fig. 1 is the structural schematic diagram of existing LED wafer plug in component；
Fig. 2 is the explosive view of the utility model pcb board LED wafer plug in component；
Fig. 3 is the front view of the utility model pcb board LED wafer plug in component；
Fig. 4 is the vertical view of the utility model pcb board LED wafer plug in component；
Fig. 5 is the structural schematic diagram of each component connection relation on the utility model pcb board；
In Fig. 1：101- chips, 121- gold thread a, 122- gold thread b, 131- pin a, 132- pin b, 104- branch
Frame, 105- pedestals, 106- transparent colloids；
In Fig. 2, Fig. 3, Fig. 4, Fig. 5：1-LED chips, the first pads of 2a-, the second pads of 2b-, the first pins of 3a-,
3b- second pins, 4- gold threads, 5-PCB plates, 6- pedestals, 7a- first through hole, the second through-holes of 7b-, 8a- pedestals first
Through-hole, the second through-hole of 8b- pedestals, 9- solder layers, 10- radiating gaskets, 11- transparent colloids.
Specific implementation mode
The explanation of following embodiment is to refer to additional schema, can be used to the specific of implementation to illustrate the utility model
Embodiment.The direction term that the utility model is previously mentioned, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "
Outside ", " side " etc. is only the direction with reference to annexed drawings.Therefore, the direction term used is to illustrate and understand this practicality
It is novel, rather than to limit the utility model.
As shown in Fig. 1, existing LED wafer plug in component, including chip 101, gold thread a121, gold thread b122, pin
A131, pin b132, holder 104, pedestal 105 and transparent colloid 106, chip 101 are connect by gold thread a121 with pin a131,
Chip 101 is connect by gold thread b122 with pin b132, and pin a131 and pin b132 are mutually parallel, 101 rounded knot of chip
Structure, chip 101 are connect with holder 104, and 104 lower end of holder is connect with pedestal 105, and pedestal 105 is hollow cavity circular configuration, is drawn
Foot a131 and pin b132 is each passed through pedestal 105, transparent colloid 106 be coated on chip 101, gold thread a121, gold thread b122 and
On 104 face of holder.It needs the pin a131 that will be mutually parallel and pin b132 to be drawn into process horizontal, works as pin
Pin a131 and the junctions pin b132 stress are very big when a131 and pin b132 are bent into level, since single LED chip does not have
There are supporting surface, stress that will all be applied on the transparent colloid 106 outside pin a131 and the junctions pin b132, crosses high temperature
When, transparent colloid 106 expands with heat and contract with cold, and stress is released, the connection gold thread a121 of pin a131 and the junctions pin b132 and
Gold thread b122 will be easy to happen the phenomenon that fracture.
In conjunction with shown in attached drawing 2, attached drawing 3, attached drawing 4, attached drawing 5, to the utility model embodiment pcb board LED wafer plug-in unit
Component is further described.The utility model pcb board LED wafer plug in component includes LED wafer 1, the first pad 2a, second
Pad 2b, the first pin 3a, second pin 3b, gold thread 4, pcb board 5 and pedestal 6, the first pad 2a and the second pad 2b fixations are set
It sets on pcb board 5, LED wafer 1 is fixedly connected with the first pad 2a, and LED wafer 1 is connect by gold thread 4 with the second pad 2b,
First pad 2a is connect with the first pin 3a, and the second pad 2b is connect with second pin 3b, and pedestal 6 is provided with to be coordinated with pcb board 5
Groove, pcb board 5 is placed in groove, and the first pin 3a, second pin 3b are each passed through pcb board 5 and pedestal 6.Use process
In, 6 top of pedestal can be arranged LED wafer diffuser and match, and pedestal 6 passes through detachable company with LED wafer diffuser
The mode such as mode of clamping is connect to be attached.
In conjunction with shown in attached drawing 2, attached drawing 3, attached drawing 4, pcb board 5 is equipped with first through hole 7a and the second through-hole 7b, on pedestal 6
First through hole 7a and pedestal first through hole 8a is passed through equipped with pedestal first through hole 8a and the second through-hole of pedestal 8b, the first pin 3a,
Second pin 3b pass through the second through-hole 7b and the second through-hole of pedestal 8b, the first pin 3a, second pin 3b respectively with first through hole
The inner wall contact of 7a, the second through-hole 7b；First through hole 7a and pedestal first through hole 8a or more is corresponding on pcb board 5, first through hole 7a
It is vertical with pcb board 5 with the extension line of pedestal first through hole 8a；Second through-hole 7b and the second through-hole of pedestal 8b or more is corresponding, and second
The extension line of through-hole 7b and the second through-hole of pedestal 8b are vertical with pcb board 5；Pcb board 5 is in cylindrical structure, the first pad 2a settings
The circle circle centre position on pcb board 5, first through hole 7a and the second through-hole 7b are symmetricly set on pcb board 5 on circle, first through hole 7a and
Second through-hole 7b extension lines are overlapped with circular diameter on pcb board 5.
As shown in Fig. 5, further include transparent colloid 11, transparent colloid 11 coats LED wafer 1, pad 2, gold thread 4, transparent
Colloid 11 is by LED wafer 1, pad 2 and 4 sealing of gold thread on pcb board 5, and transparent colloid 11 is by 5 sealing of pcb board in 6 groove of pedestal
It is interior；Gold thread 4 uses heat-conducting, gold thread 4 to be set as two or four；When gold thread 4 is set as two, gold thread about 4 each one
Root forms " V " font；When gold thread 4 is set as four, each two formation " V " fonts of about 4 gold thread；LED wafer 1 and first is welded
Solder layer 9 is provided between disk 2a, the area of solder layer 9 is more than or equal to the area of the lower surface of LED wafer 1, and is less than or equal to
The area of first pad 2a；Further include radiating gasket 10, radiating gasket 10 is arranged between LED wafer 1 and solder layer 9.
Embodiment of above is only the technical concepts and features for illustrating the utility model, and its object is to allow be familiar with this skill
The people of art understands the content of the utility model and is implemented, and can not limit the scope of protection of the utility model with this, all
According to the equivalent change or modification that the spirit of the present invention is substantially done, should all cover within the protection scope of the present utility model.
Claims (9)
1. a kind of pcb board LED wafer plug in component, it is characterised in that：Including LED wafer (1), the first pad (2a), the second weldering
Disk (2b), the first pin (3a), second pin (3b), gold thread (4), pcb board (5) and pedestal (6), first pad (2a) and
Second pad (2b) is fixed on the pcb board (5), and the LED wafer (1) is fixed with first pad (2a)
Connection, the LED wafer (1) connect by gold thread (4) with second pad (2b), first pad (2a) and described the
One pin (3a) connects, and second pad (2b) connect with the second pin (3b), the pedestal (6) be provided with it is described
The groove of pcb board (5) cooperation, the pcb board (5) are placed in the groove, first pin (3a), the second pin
(3b) is each passed through the pcb board (5) and the pedestal (6).
2. pcb board LED wafer plug in component according to claim 1, it is characterised in that：The pcb board (5) is equipped with the
One through-hole (7a) and the second through-hole (7b), the pedestal (6) are equipped with pedestal first through hole (8a) and the second through-hole of pedestal (8b),
First pin (3a) passes through the first through hole (7a) and the pedestal first through hole (8a), the second pin (3b) to wear
Cross second through-hole (7b) and the second through-hole of the pedestal (8b), first pin (3a), the second pin (3b) point
It is not contacted with the inner wall of the first through hole (7a), second through-hole (7b).
3. pcb board LED wafer plug in component according to claim 2, it is characterised in that：The first through hole (7a) and institute
It states pedestal first through hole (8a) to correspond to up and down, extension line and the institute of the first through hole (7a) and the pedestal first through hole (8a)
It is vertical to state pcb board (5)；Second through-hole (7b) and the second through-hole of the pedestal (8b) correspond to up and down, second through-hole
The extension line of (7b) and the second through-hole of the pedestal (8b) is vertical with the pcb board (5).
4. the pcb board LED wafer plug in component according to any one of claim 1-3, it is characterised in that：Further include
Gelatin body (11), transparent colloid (11) the cladding LED wafer (1), pad (2), gold thread (4), the transparent colloid (11) will
On the pcb board (5), the transparent colloid (11) is solid by pcb board (5) for LED wafer (1), pad (2) and gold thread (4) sealing
It is enclosed in the pedestal (6) groove.
5. pcb board LED wafer plug in component according to claim 4, it is characterised in that：The gold thread (4) uses heat conduction
Material, the gold thread (4) are set as two or four.
6. pcb board LED wafer plug in component according to claim 5, it is characterised in that：The gold thread (4) forms " V " word
Type.
7. pcb board LED wafer plug in component according to claim 6, it is characterised in that：The LED wafer (1) with it is described
Solder layer (9) is provided between first pad (2a), the area of the solder layer (9) is more than or equal under the LED wafer (1)
The area on surface, and less than or equal to the area of first pad (2a).
8. pcb board LED wafer plug in component according to claim 7, it is characterised in that：Further include radiating gasket (10),
The radiating gasket (10) is arranged between the LED wafer (1) and the solder layer (9).
9. the pcb board LED wafer plug in component according to any one of Claims 2 or 3, it is characterised in that：The PCB
Plate (5) is in cylindrical structure, and circle circle centre position, the first through hole is arranged on the pcb board (5) in first pad (2a)
(7a) and second through-hole (7b) are symmetricly set on the pcb board (5) on circle, the first through hole (7a) and described second
Through-hole (7b) extension line is overlapped with circular diameter on the pcb board (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721797390.5U CN207753001U (en) | 2017-12-20 | 2017-12-20 | Pcb board LED wafer plug in component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721797390.5U CN207753001U (en) | 2017-12-20 | 2017-12-20 | Pcb board LED wafer plug in component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207753001U true CN207753001U (en) | 2018-08-21 |
Family
ID=63149406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721797390.5U Active CN207753001U (en) | 2017-12-20 | 2017-12-20 | Pcb board LED wafer plug in component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207753001U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107919338A (en) * | 2017-12-20 | 2018-04-17 | 苏州市悠文电子有限公司 | Pcb board LED wafer plug in component |
-
2017
- 2017-12-20 CN CN201721797390.5U patent/CN207753001U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107919338A (en) * | 2017-12-20 | 2018-04-17 | 苏州市悠文电子有限公司 | Pcb board LED wafer plug in component |
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