CN207764431U - The light emitting devices of high heat-sinking capability - Google Patents

The light emitting devices of high heat-sinking capability Download PDF

Info

Publication number
CN207764431U
CN207764431U CN201820108942.5U CN201820108942U CN207764431U CN 207764431 U CN207764431 U CN 207764431U CN 201820108942 U CN201820108942 U CN 201820108942U CN 207764431 U CN207764431 U CN 207764431U
Authority
CN
China
Prior art keywords
light emitting
emitting devices
sinking capability
radiating shell
high heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201820108942.5U
Other languages
Chinese (zh)
Inventor
赵佳生
何建军
熊孝海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Rand Puguang Electronic Technology Co Ltd
Original Assignee
Hangzhou Rand Puguang Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Rand Puguang Electronic Technology Co Ltd filed Critical Hangzhou Rand Puguang Electronic Technology Co Ltd
Priority to CN201820108942.5U priority Critical patent/CN207764431U/en
Application granted granted Critical
Publication of CN207764431U publication Critical patent/CN207764431U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model is related to a kind of light emitting devices of high heat-sinking capability.The purpose of this utility model be to provide it is a kind of it is simple in structure, cost is relatively low, the light emitting devices of the high heat-sinking capability of perfect heat-dissipating.The technical solution of the utility model is:A kind of light emitting devices of high heat-sinking capability, it is characterised in that:Light emitting devices with TO encapsulation, the light emitting devices is placed in radiating shell, the pin of light emitting devices is corresponded on radiating shell and optical fiber joint end offers through-hole and notch respectively, and the pin of light emitting devices exposes after the through-hole on radiating shell outside radiating shell.The utility model is suitable for fields of light devices.

Description

The light emitting devices of high heat-sinking capability
Technical field
The utility model is related to a kind of light emitting devices of high heat-sinking capability.Suitable for fields of light devices.
Background technology
The existing optical device predominant package pattern with refrigerator is XMD, butterfly, has preferable heat dissipation effect, but seals Tubulature shell material by ceramics, can cut down, that copper tungsten etc. forms price is expensive.TO coaxial packagings mainly have stainless steel, aluminium and can cut down on a small quantity Composition, it is cheap, but heat dissipation performance is poor.
Invention content
The technical problems to be solved in the utility model is:In view of the above problems, a kind of simple in structure, cost is provided The light emitting devices of relatively low, perfect heat-dissipating high heat-sinking capability.
Technical solution used by the utility model is:A kind of light emitting devices of high heat-sinking capability, it is characterised in that:Tool There are the light emitting devices that TO is encapsulated, the light emitting devices to be placed in radiating shell, drawing for light emitting devices is corresponded on radiating shell Foot and optical fiber joint end offer through-hole and notch respectively, and the pin of light emitting devices exposes after the through-hole on radiating shell Outside radiating shell.
The radiating shell includes cooling base and heat dissipation tabletting, and cooling base is equipped with blind hole, and blind via bottom offers The through-hole offers the notch in the heat dissipation tabletting;The light emitting devices is placed in cooling base and is equipped with blind hole simultaneously Through radiating, tabletting is fixed on cooling base.
The heat dissipation tabletting is fixed on by screw on the cooling base.
The radiating shell is made of inexpensive high cooling efficiency material.
The radiating shell uses aluminium alloy.
The utility model has the beneficial effects that:The utility model encapsulates light emitting devices using cheap TO, while external The radiating shell of cheap high thermal conductivity is coordinated to realize high efficiency and heat radiation.Radiating shell is by cooling base and heat dissipation in the utility model Tabletting is connected by screw to be formed, simple in structure, easy for installation.
Description of the drawings
Fig. 1 is the structural schematic diagram of embodiment.
Fig. 2 is the schematic diagram of radiating shell in embodiment.
Fig. 3 is the schematic diagram of cooling base in embodiment.
Fig. 4 is the schematic diagram of heat dissipation tabletting in embodiment.
Specific implementation mode
As shown in Figure 1 and Figure 2, the present embodiment is a kind of light emitting devices of high heat-sinking capability, the light emitting with TO encapsulation Device 1, the light emitting devices are placed in radiating shell, and radiating shell corresponds to the pin 11 of light emitting devices 1 and connected with optical fiber End offers through-hole 22 and notch 31 respectively, which is made of cooling base 2 and heat dissipation tabletting 3.Radiate base in this example Seat 2 and heat dissipation tabletting 3 are made of inexpensive high cooling efficiency material, such as aluminium alloy, and are not limited to aluminium alloy.
As shown in figure 3, it is suitable with 1 phase of light emitting devices to offer size in the present embodiment on one end end face of cooling base 2 The blind hole 21 matched, 21 bottom of blind hole offer the through-hole 22 of connection blind hole 21 and 2 the other end face of cooling base, and the through-hole 22 Pin 11 on corresponding light emitting devices 1 is arranged.Threaded hole there are two being opened up on the 21 orifice end end face of blind hole of cooling base 2 23, two threaded holes 23 are symmetrically arranged in 21 both sides of blind hole.
As shown in figure 4, in this example radiate tabletting 3 on open up jagged 31, in the heat dissipation tabletting, the both sides of notch 31 it is symmetrical Equipped with circular hole 32.
Light emitting devices 1 is placed in the blind hole 21 of cooling base 2 in the present embodiment, and the pin 11 of light emitting devices 1 It is pierced by, exposes outside cooling base 2 from the through-hole 22 of 21 bottom of blind hole;Heat dissipation tabletting 3 is matched through the screw across circular hole 32 thereon It closes the screw hole on cooling base 2 heat dissipation tabletting 3 is fixed on cooling base 2, light emitting devices 1 is fixed on by heat dissipation tabletting 3 On cooling base 2.
Certainly, above description is not limitation of the utility model, and the utility model is also not limited to the example above, this skill The those of ordinary skill in art field, in the scope of the utility model, variation, addition or the replacement made should all belong to this reality With novel protection domain.

Claims (5)

1. a kind of light emitting devices of high heat-sinking capability, it is characterised in that:Light emitting devices (1) with TO encapsulation, light hair Emitter part is placed in radiating shell, and the pin (11) and optical fiber joint end that light emitting devices (1) is corresponded on radiating shell are opened respectively Equipped with through-hole (22) and notch (31), the pin (11) of light emitting devices (1) passes through the through-hole (22) on radiating shell to expose afterwards Outside radiating shell.
2. the light emitting devices of high heat-sinking capability according to claim 1, it is characterised in that:The radiating shell includes dissipating Hot radical seat (2) and heat dissipation tabletting (3), cooling base (2) are equipped with blind hole (21), and blind hole (21) bottom offers the through-hole (22), the notch (31) is offered on the heat dissipation tabletting (3);The light emitting devices (1), which is placed on cooling base (2), to be set There is blind hole (21) and is fixed on cooling base (2) through tabletting (3) of radiating.
3. the light emitting devices of high heat-sinking capability according to claim 2, it is characterised in that:The heat dissipation tabletting (3) is logical Screw is crossed to be fixed on the cooling base (2).
4. the light emitting devices of the high heat-sinking capability according to claims 1 to 3 any one, it is characterised in that:It is described to dissipate Hot shell is made of inexpensive high cooling efficiency material.
5. the light emitting devices of high heat-sinking capability according to claim 4, it is characterised in that:The radiating shell uses aluminium Alloy.
CN201820108942.5U 2018-01-23 2018-01-23 The light emitting devices of high heat-sinking capability Active CN207764431U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820108942.5U CN207764431U (en) 2018-01-23 2018-01-23 The light emitting devices of high heat-sinking capability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820108942.5U CN207764431U (en) 2018-01-23 2018-01-23 The light emitting devices of high heat-sinking capability

Publications (1)

Publication Number Publication Date
CN207764431U true CN207764431U (en) 2018-08-24

Family

ID=63181556

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820108942.5U Active CN207764431U (en) 2018-01-23 2018-01-23 The light emitting devices of high heat-sinking capability

Country Status (1)

Country Link
CN (1) CN207764431U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109471228A (en) * 2018-11-27 2019-03-15 武汉光迅科技股份有限公司 A kind of radiator structure of coaxial packaging optical device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109471228A (en) * 2018-11-27 2019-03-15 武汉光迅科技股份有限公司 A kind of radiator structure of coaxial packaging optical device

Similar Documents

Publication Publication Date Title
Wu et al. A study on the heat dissipation of high power multi-chip COB LEDs
US20150285562A1 (en) Vapor chamber heat sink and method for making the same
CN207764431U (en) The light emitting devices of high heat-sinking capability
JP6360180B2 (en) LED lighting device
CN206864500U (en) It is a kind of based on heat-conducting plate and heat sink cooling LED packaged light source structure
CN202473912U (en) LED array light source without circuit substrate
CN209461796U (en) Butterfly device based on coaxial packaging laser
WO2014127584A1 (en) Light-emitting device, backlight module, and display device
CN207587764U (en) Light emitting diode with radiator structure
CN105899043A (en) Heat dissipation device with electromagnetic shielding function
CN206040701U (en) Heat dissipation LED packaging structure
TWM353309U (en) Improved tight fitting structure for annular heat dissipating device
CN105611810A (en) Artificial/local thermal insulation composite heat sink
CN203659935U (en) Liquid cooling heat radiating device for high-power LED (light emitting diode)
CN210470096U (en) Power electronic radiator
CN205376582U (en) Encapsulation of heat dissipation type LED
CN219300690U (en) Bionic honeycomb type LED radiator
CN203521476U (en) LED packaging structure with high heat conduction performance
CN206600627U (en) A kind of LED for having a LED heat dissipation structure
CN206322689U (en) Liquid metal heat loss through convection system
CN207834354U (en) A kind of chip on board encapsulating structure
CN209977736U (en) High-power LED lamp packaging structure
CN207762600U (en) A kind of LED light component single body
CN208735593U (en) A kind of radiator structure of rapidly and efficiently rate LDD lamp bead
CN207381389U (en) A kind of integrated circuit heat dissipation device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant