CN2075655U - Double cavity rotary magnetic control splashing film plating machine - Google Patents
Double cavity rotary magnetic control splashing film plating machine Download PDFInfo
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- CN2075655U CN2075655U CN 89215781 CN89215781U CN2075655U CN 2075655 U CN2075655 U CN 2075655U CN 89215781 CN89215781 CN 89215781 CN 89215781 U CN89215781 U CN 89215781U CN 2075655 U CN2075655 U CN 2075655U
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- chamber
- coating chamber
- target
- film plating
- magnetic control
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Abstract
The existing film plating machines sold in the market are all single-chamber machines. The double-chamber rotary magnetic control sputtering film plating machine of the utility model is an improvement of a single-chamber magnetic control sputtering film plating machine. Two film plating chambers are formed into a whole via a forvacuum pipeline, a butterfly valve, a high-vacuum three-way pipeline and a gate valve. A set of vacuum air sucking machine groups and a set of power supply control systems are alternately utilized by the two chambers, and the utility model has work efficiency which is equivalent to two single-chamber machines, high electric energy saving which is 40 % more than that of the two single-chamber machines and manufacturing cost which is 30 % lower than that of the two single-chamber machines. Due to a rotary magnetic control sputtering target system, the surface of a target can be uniformly sputtered and etched, and the utilization rate of the target is increased by 74 % at present from original 20 %.
Description
The invention belongs to physical vapor deposition device, being mainly used at matrix is that metal and nonmetallic workpiece surface are coated with the decorative metals film.
Magnetron sputtering coater mainly is made of several parts such as coating chamber, magnetron sputtering origin system, power control system and vacuum systems.When coating chamber is extracted into certain vacuum and spends, charge into an amount of working gas (being generally argon gas), and after imposing the volts DS of appropriate value between negative electrode (target) and the anode (plated film wall), just in coating chamber, produce two utmost point direct current glow discharges of magnetic control operational mode, working gas is ionized, positive ion is quickened and bombarding cathode (target) surface by negative electrode, makes the atom sputtering on negative electrode (target) surface deposit film forming to the surface of plating piece.Change negative electrode (target) sputtering time different of unlike material, just can on the plating piece surface, obtain unlike material and ornamental rete different thickness with control cathode.
The magnetron sputtering coater of Xiao Shouing in the market, the JT-900 magnetron sputtering coater produced of Beijing instrument plant for example, without exception all is Style Columu Talget single chamber machine.
This class device has only a coating chamber, because during getting the dress plating piece, the vacuum suction unit still is in the running light state, so inefficiency, power consumption is big, and the capacity of single chamber is all less, is not suitable for the industrial plating piece of producing on a large scale.
This class device, the magnet in its coating chamber cylindrical target is several equirotal coaxial circles ring-type magnet steel, produces several ringlike magnetic field configuration (seeing accompanying drawing 3 Style Columu Talget structural representations) on the Style Columu Talget surface, has caused target as sputter and etching all inhomogeneous.Although can make the ring-type magnet steel in Style Columu Talget along axially moving back and forth, be subjected to the restriction of translational speed and amplitude, the effective rate of utilization of target also has only 20～25%.
And this class device, generally can only plate ABS level engineering plastics, body materials such as pottery and glass can not plate non-ABS level plastics such as polyethylene, polypropylene, and use range is very limited.
The objective of the invention is to improve the working efficiency of coating equipment, economize on electricity improves target utilization, reduces the coating cost of plating piece, and the kind of expansion coating material, to be suitable for the needs of large-scale commercial production.
The present invention is a kind of two chambers rotary magnetron sputtering film coating apparatus of being made up of coating chamber, coating chamber base, magnetron sputtering origin system, vacuum system and power control system, and its characteristic is that coating chamber is the double-chamber structure of a shared cover vacuum suction unit and a cover power control system; The controlled sputtering source of coating chamber is the rotary magnetron sputtering source, and it is a kind of cylindrical tubular target, is settling several bar magnets abreast with axle within it, and whole magnet has rotating mechanism, its rotating speed＞1 rev/min.
Feature of the present invention also is, has discarded the annular magnet steel in the Style Columu Talget, replaces and adopts several bar magnets parallel with axis of a cylinder, has formed runway shape magnetic field configuration on the Style Columu Talget surface.When the magnet of being made up of bar magnet rotates with 1 revolutions per second speed at least, form rotatingfield with regard to making runway shape magnetic field along target material surface continuous sweep, cause target material surface to produce sputter equably and etching, improved the utilization ratio of target widely.
The present invention also can apply 0～3000 volt of negative bias to plating piece workpiece metal pivoted frame; make between plating piece pivoted frame and the coating chamber and form normal glow discharge; before plated film, plating piece is carried out surface treatment, can strengthen the sticking power between rete and plating piece matrix with this plasma body.Particularly, can carry out surface modification well to non-ABS engineering plastics such as polyethylene, polypropylene.
Experiment shows, the working efficiency of two chambers rotary magnetron sputtering coating equipment is equivalent to the single chamber coating equipment of two equal specifications.Because saved a cover vacuum suction unit and a cover power control system, this machine cost reduces by 30% than two single chamber machines, saves energy 40%.Owing to adopt rotary magnetron, make target as sputter and etching even again, target utilization can reach 74%, is three times of existing magnetic control target (for example JT-900 Style Columu Talget magnetron sputtering coater target) utilization ratio, and this just makes the cost of plating piece product greatly reduce.
And non-ABS engineering plastics such as polyethylene, polypropylene are carried out surface modification, plastic substrate after the processing and film adhesion significantly strengthen, and have reached actual application level, have expanded the plating piece kind.
In addition, rotatingfield makes the plating piece coating even along target surface continuous sweep, can not need the revolution of plating piece pivoted frame, and simplify the pivoted frame structure.
The present invention is mainly used in ornamental plated film, can be that metal and nonmetallic workpiece surface are coated with the decorative metals film at matrix, as aluminium, copper, titanium, stainless steel (1Cr18Ni9Ti) film (comprising alloy film).Its coatings is even, fine and close, and bonding force is strong.And it is good to have diffraction, advantage such as the workpiece temperature rise is low.Can be widely used in each side decoration film coatings such as tame electrical equipment, horological industry, workmanship, plastics daily necessities, toy for children, light fixture, automobile and instrument.
The present invention mainly is made of main frame and electrical control system two parts.
Host machine part: mainly form by coating chamber, vacuum system and main frame base.
Coating chamber is that two chambers tubular is vertical, but in the plating chamber magnetron sputtering target system and rotation is housed
The required vacuum tightness of coating chamber is obtained and is kept by vacuum-pumping system.Vacuum system by fine pumping unit, three-way pipeline, slide valve, give and take out mechanical pump, give and take out pipeline and butterfly valve etc. and form.
Two coating chambers are installed in respectively on two supports, and cage type workpiece metal pivoted frame rotation tractor (dragging buncher and speed reduction unit) is housed in support.
Electrical control system part: mainly partly form by complete machine electrical control cubicles, high-pressure electric control cabinet, magnetic control source electrical control system and measurement demonstration etc.
The complete machine electrical control cubicles is used for realizing the whole process of film coating apparatus working procedure control, the automatically controlled cabinet of high direct voltage is mainly used in the surface-discharge of some workpiece to be plated and handles, to improve the coating quality of workpiece to be plated, magnetic control source current system provides the controllable dc power source for the sputter of target, the vacuum Monitoring systems mainly is made up of vacuumometer, vacuum probe (regulating), inflation system and coating chamber blow-off system etc., and the coating chamber temperature is shown by the electric thermo-couple temperature indicating system.
Accompanying drawing 1 is two chambers rotary magnetron sputtering coating equipment overall structure synoptic diagram.
Index among the figure (1) is represented two coating chambers respectively with (2); Index (3) is taken out mechanical pump for giving; (4) take out pipeline for connecting two giving of chamber of plating; (5) be the fine pumping unit; (6) for connecting the three-way pipeline of fine pumping unit and two plating chambers; (7) be to give the butterfly valve of taking out pipe ends with (8); (9) be two slide valves on the three-way pipeline with (10); (11) be the column sputtering target; (12) be the interior bar magnet of column sputtering target, the present invention provides eight; (13) for the rotating mechanism that drags the target inner magnet makes magnet rotating speed＞1 revolutions per second, the rotary magnetron sputtering target system is formed with (13) in (11), (12); (14) for having the cage type workpiece pivoted frame mechanism of manual revolution and electronic rotation; (15) be the magnetic control source current; (16) be the negative direct current high voltage power supply, can execute the dc negative bias voltage of 0-3000 volt plating indoor metal plated part rack; (17) be the electronic rotation coupling shaft of plating piece pivoted frame; (18) take out the mechanical pump purging valve for giving; (19) be the coating chamber base; (20) be vacuum gauge.
Working process of the present invention is:
Coating chamber (1) is at first taken out pipeline (4) and is taken out rough vacuum to 1 * 10 by giving
-2Holder (2.6Pa) is then by three-way pipeline (6) pumping high vacuum to 2 * 10
-4Holder (1.3 * 10
-2Pa), charge into argon gas to 4 * 10
-2Holder (5.3 * 10
-1Pa), start magnetic control source current (15), regulating voltage to 600 volt, electric current is 20 amperes, produces anomalous glow discharge in coating chamber, ar atmo is ionized to argon ion (Ar
4), and by electric field acceleration bombardment target, the target atom that sputters is deposited on the plating piece surface and forms film.If plating piece needs surface treatment, before plated film, start negative bias power supply (16), in coating chamber, form normal glow discharge, carry out plated film behind the processed several minutes of unplated piece again.
Accompanying drawing 2 is a double room filming machine working curve.
Upper curve is the working curve of coating chamber (1), and lower curve is the working curve of coating chamber (2).Find out by curve among the figure: vacuumized for coating chamber (1) in 0-15 minute, applying argon gas and plated film stage; Got the dress plating piece stage for coating chamber (1) in 15-30 minute, and also be that coating chamber (2) began to vacuumize, applying argon gas and plated film stage; 30-45 minute also is that coating chamber (2) is got the dress plating piece stage, with this two Room alternation for coating chamber (1) vacuumizes for the second time, applying argon gas and plated film stage.
Before accompanying drawing 3 was the present invention, existing column sputtering target structure was faced sectional elevation figure.(11) are the column target among the figure, and (19) are the annular magnetic steel in the target; (20) be backwater channel; (21) be the matrix of stationary annular magnet steel; (22) be water entry.
Embodiment: two chambers rotary magnetron sputtering coating equipment structure and technical parameter
Plating chamber pattern: the vertical cartridge type in two chambers
Plating chamber vol: the every chamber of φ 850 * 1200mm/
Vacuum unit: rough vacuum unit 2X-70 mechanical pump
The high vacuum unit: the JK-400 diffusion pump is joined the 2X-30 mechanical pump
Final vacuum: 6.5 * 10
-3Pa
Working vacuum degree: 10
0～10
-2Pa
Bleed the time by (cleaning empty receptacle):
Be evacuated to 5 * 10 from atmosphere
-2Required time is not more than 10 minutes during Pa.
Magnetic control source: cylindrical tubular target φ 72 * 1070mm
8 of interior dress bar magnets,
1-6 revolutions per second of magnet rotating speed
Magneticstrength: 2.5 * 10
-2-3.8 * 10
-2Tesla
Sputtering rate＞1500A
0/ minute
Direct supply: voltage 0--900 volt is adjustable continuously
Electric current 0-25 ampere
Power 20KW.
Cage type workpiece pivoted frame: can manually revolve round the sun, but and have the six roots of sensation fastener rotating shaft of rotation, rotating speed 0-30 rev/min, adjustable.
Work rest bias voltage: 0--3000 volt
Maximum plating piece size: φ 250 * 870mm
Complete machine power: three-phase 380V, 50Hz, 40KW.
Water coolant: hydraulic pressure 2-3kg/cm
2, inflow temperature: 20-25 ℃, flow: 30 liters/minute
Physical dimension: main frame: 3500 * 3500 * 2500mm
Electrical control cubicles: 800 * 700 * 2000mm
Example one is coated with electric wind covering of the fan ring (ABS engineering plastics)
(1) film material brass (H68)
(2) take out rough vacuum 2 * 10
-2Holder (2.6Pa)
(3) pumping high vacuum 1 * 10
-4Holder (1.3 * 10
-2Pa)
(4) applying argon gas 4 * 10
-3Holder (5.3 * 10
-1Pa)
(5) sputtering voltage is 600 volts
(6) sputtering current is 20 amperes
(7) stove/hour 4 stoves/hour (single chamber 2 stoves/hour)
(8) 11.05 kilowatts of power consumptions (9.85 kilowatts of single chambers)
(9) target utilization 74%(magnet ring Style Columu Talget 20-25%)
Example two plating light fixtures (polypropylene)
(1) film material stainless steel (1Cr18Ni9Ti)
(2) take out rough vacuum 2 * 10
-2Holder (2.6Pa)
(3) pumping high vacuum 1 * 10
-4Holder (1.3 * 10
-2Pa)
(4) applying argon gas 8 * 10
-3Holder (1.1Pa)
(5) discharge process voltage is 2000 volts
(6) discharging current is 5 amperes
(7) 5 minutes treatment times
(8) film adhesion good (do not have treated film adhesion bad)
Claims (4)
1, a kind of two chambers rotary magnetron sputtering film coating apparatus of being made up of coating chamber, coating chamber base, magnetron sputtering origin system, vacuum system and power control system is characterized in that coating chamber is the double-chamber structure of a shared cover vacuum suction unit and a cover power control system; The controlled sputtering source of coating chamber is the rotary magnetron sputtering source, and it is a kind of cylindrical tubular target, is settling several bar magnets abreast with axle within it, and whole magnet has rotating mechanism, its rotating speed＞1 rev/min.
2,, it is characterized in that to apply the dc negative bias voltage of 0-3000 volt to the metal plated part rack of coating chamber by the described film coating apparatus of claim 1.
3, by the described film coating apparatus of claim 2, it is characterized in that the bar magnet in the rotary magnetron sputtering source is eight.
4, by the described film coating apparatus of claim 3, it is characterized in that the plated part rack in the coating chamber, be the cage type work rest, and have manual revolution and electronic free-wheeling system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89215781 CN2075655U (en) | 1989-09-05 | 1989-09-05 | Double cavity rotary magnetic control splashing film plating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89215781 CN2075655U (en) | 1989-09-05 | 1989-09-05 | Double cavity rotary magnetic control splashing film plating machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2075655U true CN2075655U (en) | 1991-04-24 |
Family
ID=4871306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 89215781 Expired - Lifetime CN2075655U (en) | 1989-09-05 | 1989-09-05 | Double cavity rotary magnetic control splashing film plating machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2075655U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1040236C (en) * | 1994-08-18 | 1998-10-14 | 王福贞 | Cylindrical helix magnetic control sputtering source |
| CN1040234C (en) * | 1994-03-26 | 1998-10-14 | 王福贞 | Arc source with rotary magneitcally-controlled columnar cathode |
| CN101243203B (en) * | 2005-07-12 | 2010-11-24 | 普莱克斯S.T.技术有限公司 | Fixture for use in a coating operation |
| CN101130452B (en) * | 2006-08-25 | 2011-05-11 | 深圳豪威真空光电子股份有限公司 | Star type double-turn magnetron sputtering conducting glass plated film product line and processing technique thereof |
| CN101994093B (en) * | 2009-08-14 | 2013-08-21 | 鸿富锦精密工业（深圳）有限公司 | Magnetron sputtering device |
| CN103741098A (en) * | 2014-01-19 | 2014-04-23 | 遵化市超越钛金设备有限公司 | Dual-body double-faced vacuum coating equipment |
| CN111286705A (en) * | 2018-12-06 | 2020-06-16 | 北京华业阳光新能源有限公司 | Double-chamber three-station multi-target co-sputtering magnetron sputtering coating equipment |
| CN113186502A (en) * | 2020-06-30 | 2021-07-30 | 南京三乐集团有限公司 | Method for uniformly plating copper on surfaces of multiple spiral lines through magnetron sputtering |
-
1989
- 1989-09-05 CN CN 89215781 patent/CN2075655U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1040234C (en) * | 1994-03-26 | 1998-10-14 | 王福贞 | Arc source with rotary magneitcally-controlled columnar cathode |
| CN1040236C (en) * | 1994-08-18 | 1998-10-14 | 王福贞 | Cylindrical helix magnetic control sputtering source |
| CN101243203B (en) * | 2005-07-12 | 2010-11-24 | 普莱克斯S.T.技术有限公司 | Fixture for use in a coating operation |
| CN101130452B (en) * | 2006-08-25 | 2011-05-11 | 深圳豪威真空光电子股份有限公司 | Star type double-turn magnetron sputtering conducting glass plated film product line and processing technique thereof |
| CN101994093B (en) * | 2009-08-14 | 2013-08-21 | 鸿富锦精密工业（深圳）有限公司 | Magnetron sputtering device |
| CN103741098A (en) * | 2014-01-19 | 2014-04-23 | 遵化市超越钛金设备有限公司 | Dual-body double-faced vacuum coating equipment |
| CN111286705A (en) * | 2018-12-06 | 2020-06-16 | 北京华业阳光新能源有限公司 | Double-chamber three-station multi-target co-sputtering magnetron sputtering coating equipment |
| CN111286705B (en) * | 2018-12-06 | 2024-05-03 | 北京华业阳光新能源有限公司 | Double-chamber three-station multi-target co-sputtering magnetron sputtering coating equipment |
| CN113186502A (en) * | 2020-06-30 | 2021-07-30 | 南京三乐集团有限公司 | Method for uniformly plating copper on surfaces of multiple spiral lines through magnetron sputtering |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |