CN207353228U - The encapsulating structure of fingerprint recognition chip - Google Patents
The encapsulating structure of fingerprint recognition chip Download PDFInfo
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- CN207353228U CN207353228U CN201720781880.XU CN201720781880U CN207353228U CN 207353228 U CN207353228 U CN 207353228U CN 201720781880 U CN201720781880 U CN 201720781880U CN 207353228 U CN207353228 U CN 207353228U
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- fingerprint recognition
- recognition chip
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- metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The utility model provides a kind of encapsulating structure of fingerprint recognition chip, and the encapsulating structure includes：Re-wiring layer；Metal coupling, is formed on the re-wiring layer；Fingerprint recognition chip, is installed on the re-wiring layer by metal solder joints, wherein, the front of the fingerprint recognition chip is toward the re-wiring layer；And encapsulating material, the fingerprint recognition chip is covered in, and the metal coupling is exposed to the encapsulating material.The utility model uses fan-out package（Fan out）Fingerprint recognition chip, for existing other fingerprint recognition chip packages, has the advantages that cost is low, thickness is small, yield is high.
Description
Technical field
A kind of semiconductor package and method for packing are the utility model is related to, more particularly to a kind of fingerprint recognition chip
Encapsulating structure and method for packing.
Background technology
As the integrated circuit that the function of integrated circuit is increasingly stronger, performance and integrated level are higher and higher and new goes out
Existing, encapsulation technology plays an increasingly important role in IC products, shared in the value of whole electronic system
Ratio it is increasing.Meanwhile as integrated circuit feature size reaches nanoscale, transistor to more high density, higher when
Clock frequency develops, and encapsulation also develops to more highdensity direction.
Since fan-out wafer level encapsulates (fowlp) technology due to having the advantages that miniaturization, low cost and high integration, with
And the energy efficiency with better performance and higher, fan-out wafer level encapsulation (fowlp) technology as high request movement/
The important method for packing of the electronic equipments such as wireless network, is one of encapsulation technology most with prospects at present.
Fingerprint identification technology is biometrics identification technology most ripe and cheap at present.For at present, fingerprint is known
Other technology is most widely used, not only it can be seen that the figure of fingerprint identification technology, in the market have in gate inhibition, attendance checking system
The applications of more fingerprint recognitions：As laptop, mobile phone, automobile, bank paying all can employing fingerprint identify technology.
A kind of method for packing of existing fingerprint recognition chip is as shown in Fig. 1 a~Fig. 1 c：
The first step, as shown in Figure 1a, deep trouth is made in fingerprint recognition chip 101, and is bonded on FPC plates 102, so
Metal connecting line 103 is made by routing technique afterwards, realizes being electrically connected for fingerprint recognition chip 101 and FP C plates 102, wherein, FPC
It is the abbreviation of Flexible Printed Circuit, also known as flexible circuit board, it is with Distribution density is high, light-weight, thickness
The characteristics of thin.
Second step, as shown in Figure 1 b, produces frame 104；
3rd step, shown in scholar 1c, is capped sapphire cover board 105, to complete to encapsulate on the fingerprint recognition chip.
This method has the disadvantages that：Including FPC plates, fingerprint recognition chip and sapphire cover board three-decker, envelope
It is thicker to fill thickness, metal connecting line is easily broken caused by FPC soft boards are pullled etc., and overall yield is relatively low.
The method for packing of another fingerprint recognition chip is as shown in Fig. 2 a~Fig. 2 c：
The first step, as shown in Figure 2 a, through hole electrode is formed by silicon perforation TSV technology in fingerprint recognition chip 101
106；
Second step, as shown in Figure 2 b, one is layered in by sapphire cover board 105, fingerprint recognition chip 101 and FPC plates 102
Rise, metal connecting line 103 is made by routing technique to connect the fingerprint recognition chip 101 and FPC plates 102；
3rd step, as shown in Figure 2 c, produces frame 104.
This method has the disadvantages that：Need with sapphire cover board encapsulate, thickness is thicker, silicon perforation process costs compared with
Height, metal connecting line is easily broken caused by FPC soft boards are pullled etc., and the thinner thickness of fingerprint recognition chip, is easily split
Piece phenomenon, overall yield are relatively low.
Based on the above, there is provided a kind of encapsulation of the fingerprint recognition chip of low cost, low thickness and high encapsulation yield
Structure and method for packing are necessary.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of fingerprint recognition chip
Encapsulating structure and method for packing, for solving the problems, such as that fingerprint recognition package thickness is larger in the prior art, yield is more low.
In order to achieve the above objects and other related objects, the utility model provides a kind of encapsulation knot of fingerprint recognition chip
Structure, the encapsulating structure include：Re-wiring layer；Metal coupling, is formed on the re-wiring layer；Fingerprint recognition chip,
Be installed in by metal solder joints on the re-wiring layer, wherein, the fingerprint recognition chip front toward it is described again
Wiring layer；And encapsulating material, the fingerprint recognition chip is covered in, and the metal coupling is exposed to the encapsulating material.
Preferably, there is gap between the fingerprint recognition chip and the re-wiring layer, in the gap formed with
The front of the fingerprint recognition chip is completely covered in protective layer, the protective layer.
Further, it is epoxy resin that the protective layer, which is selected,.
Preferably, the vertical corresponding region of the re-wiring layer and fingerprint recognition chip includes continuous dielectric layer,
And do not include metal layer, using the identification window as the fingerprint recognition chip.
Preferably, the encapsulating material includes one kind in polyimides, silica gel and epoxy resin.
Preferably, the re-wiring layer includes patterned dielectric layer and patterned metal wiring layer.
Further, the material of the dielectric layer includes epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorus silicon glass
One or both of glass, fluorine-containing glass combination of the above, the material of the metal wiring layer are included in copper, aluminium, nickel, gold, silver, titanium
One or more kinds of combinations.
Preferably, the metal coupling includes copper post, the nickel layer positioned at the copper post upper surface and positioned at the nickel layer
On solder bump.
Further, the metal barrier includes nickel layer, and the material of the solder bump includes one in lead, tin and silver
Kind or the alloy for including any one above-mentioned solder metal.
The utility model also provides a kind of method for packing of fingerprint recognition chip, and the method for packing includes step：1) carry
For a support substrate, separating layer is formed in the substrate surface；2) in forming re-wiring layer in the separating layer, and in described
Metal coupling is formed on re-wiring layer；3) a fingerprint recognition chip is provided, by metal solder joints by the fingerprint recognition chip
It is installed on the re-wiring layer, wherein, the front of the fingerprint recognition chip is toward the re-wiring layer；4) use
Encapsulating material encapsulates the fingerprint recognition chip, and the metal coupling is exposed to the encapsulating material；And 5) based on described point
The absciss layer separation support deposition and the re-wiring layer.
Preferably, in step 3), the fingerprint recognition chip is installed on the re-wiring layer by metal solder joints
Afterwards, there is gap, step 3) is further included to be formed in the gap between the fingerprint recognition chip and the re-wiring layer
The front of the fingerprint recognition chip is completely covered in the step of protective layer, the protective layer.
Further, it is epoxy resin that the protective layer, which is selected, and the finger is formed at by the way of dispensing or molding
Gap between line identification chip and the re-wiring layer.
Preferably, the support substrate includes glass substrate, metal substrate, Semiconductor substrate, polymer substrate and ceramics
One kind in substrate.
Preferably, the separating layer includes one kind in adhesive tape and polymeric layer, and the polymeric layer uses spin coating first
Technique is coated on the support substrate surface, then makes its curing molding using ultra-violet curing or heat curing process.
Preferably, the vertical corresponding region of the re-wiring layer and fingerprint recognition chip includes continuous dielectric layer,
And do not include metal layer, using the identification window as the fingerprint recognition chip.
Preferably, step 2), which makes the re-wiring layer, includes step：2-1) use chemical vapor deposition method or thing
Physical vapor deposition technique forms dielectric layer in the separation layer surface, and the dielectric layer is performed etching to form patterned Jie
Matter layer；2-2) using chemical vapor deposition method, evaporation process, sputtering technology, electroplating technology or chemical plating process in the figure
Shape dielectric layer surface forms metal layer, and the metal layer is performed etching to form patterned metal wiring layer.
Further, the material of the dielectric layer includes epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorus silicon glass
One or both of glass, fluorine-containing glass combination of the above, the material of the metal wiring layer are included in copper, aluminium, nickel, gold, silver, titanium
One or more kinds of combinations.
Preferably, the preparation method of the metal coupling includes step：A) using galvanoplastic in the re-wiring layer table
Face forms copper post；B) using galvanoplastic metal barrier is formed in the copper post surface；C) hindered using galvanoplastic in the metal
Barrier surface forms solder metal, and forms solder bump in the metal barrier layer surface using high temperature reflow processes.
Further, the metal barrier includes nickel layer, and the material of the solder bump includes one in lead, tin and silver
Kind or the alloy for including any one above-mentioned solder metal.
Preferably, using encapsulating material encapsulate the fingerprint recognition chip method include compression forming, transfer modling into
One kind in type, fluid-tight shaping, vacuum lamination and spin coating, the encapsulating material include polyimides, silica gel and epoxy resin
In one kind.
As described above, the encapsulating structure and method for packing of the fingerprint recognition chip of the utility model, have below beneficial to effect
Fruit：
1) the utility model uses fan-out package (Fan out) fingerprint recognition chip, compared to existing other fingerprints
For identification chip encapsulation, have the advantages that cost is low, thickness is small, yield is high；
2) routing technique is not required in the utility model at the same time, it is not required that the silicon perforation technique (TSV) of high cost, and can be real
The encapsulation of existing fingerprint recognition chip, greatly reduces technology difficulty and cost；
3) the utility model directly uses cover board of the re-wiring layer as fingerprint recognition chip, it is not necessary to which in addition increase is blue
Jewel cover board, greatly reduces the thickness and cost of encapsulation；
4) for the utility model using encapsulation (Fan out) technique is fanned out to, the electricity of chip, which is drawn, is not required traditional FPC plates,
The thickness of encapsulation and the stability of electrical deriving structure can be reduced, improves encapsulation yield；
5) the utility model technique is simple, creatively using packaging technology encapsulation fingerprint recognition chip is fanned out to, is partly leading
Body encapsulation technology field is with a wide range of applications.
Brief description of the drawings
What each step of method for packing that Fig. 1 a~Fig. 1 c are shown as a kind of fingerprint recognition chip of the prior art was presented
Structure diagram.
Each step of method for packing that Fig. 2 a~Fig. 2 c are shown as another fingerprint recognition chip of the prior art is presented
Structure diagram.
The structure that each step of method for packing that Fig. 3~Figure 10 is shown as the fingerprint recognition chip of the utility model is presented is shown
It is intended to, wherein, Figure 10 is shown as the structure diagram of the encapsulating structure of the fingerprint recognition chip of the utility model.
Figure 11 is shown as the use principle schematic diagram of the encapsulating structure of the fingerprint recognition chip of the utility model.
Component label instructions
201 support substrates
202 separating layers
203 dielectric layers
204 metal wiring layers
205 metal couplings
206 fingerprint recognition chips
207 metal solder joints
208 protective layers
209 encapsulating materials
210 identification windows
Embodiment
Illustrate the embodiment of the utility model below by way of specific instantiation, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition
Different embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints with answering
With carrying out various modifications or alterations under the spirit without departing from the utility model.
Refer to Fig. 3~Figure 11.It should be noted that the diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of utility model, when only display is with related component in the utility model rather than according to actual implementation in illustrating then
Component count, shape and size are drawn, and kenel, quantity and the ratio of each component can be a kind of random change during its actual implementation
Become, and its assembly layout kenel may also be increasingly complex.
As shown in Fig. 3~Figure 10, the present embodiment provides a kind of method for packing of fingerprint recognition chip 206, the fingerprint is known
The fingerprint recognition chip of fingerprint recognition chip of the other chip including optical profile type, capacitive fingerprint recognition chip and ultrasonic type,
The method for packing includes step：
As shown in figure 3, step 1) is carried out first, there is provided a support substrate 201, separating layer is formed in the substrate surface
202。
As an example, the support substrate 201 include glass substrate, metal substrate, Semiconductor substrate, polymer substrate and
One kind in ceramic substrate.In the present embodiment, it is glass substrate that the support substrate 201, which is selected, the glass substrate cost
It is relatively low, separating layer 202 easily is formed on its surface, and the difficulty of follow-up stripping technology can be reduced.
As an example, the separating layer 202 includes one kind in adhesive tape and polymeric layer, the polymeric layer uses first
Spin coating proceeding is coated on 201 surface of support substrate, then makes its curing molding using ultra-violet curing or heat curing process.
In the present embodiment, it is heat-curable glue that the separating layer 202, which is selected, and being formed at the support by spin coating proceeding serves as a contrast
After on bottom 201, its curing molding is made by heat curing process.Heat-curable glue performance is stablized, and surface is more smooth, is conducive to follow-up
The making of re-wiring layer, also, in follow-up stripping technology, the difficulty of stripping is relatively low, can be obtained after stripping it is complete and
Re-wiring layer of good performance.
As shown in Fig. 4~Fig. 6, step 2) is then carried out, in forming re-wiring layer in the separating layer 202, and in institute
State formation metal coupling 205 on re-wiring layer.
As an example, step 2), which makes the re-wiring layer, includes step：
As shown in figure 4, carrying out step 2-1), using chemical vapor deposition method or physical gas-phase deposition in described point
202 surface of absciss layer forms dielectric layer 203, and the dielectric layer 203 is performed etching to form patterned dielectric layer 203.
As an example, the material of the dielectric layer 203 includes epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorus silicon
One or both of glass, fluorine-containing glass combination of the above.In the present embodiment, it is silica that the dielectric layer 203, which is selected,.
As shown in figure 5, carrying out step 2-2), using chemical vapor deposition method, evaporation process, sputtering technology, galvanizer
Skill or chemical plating process perform etching to be formed in 203 forming metal layer on surface of patterned media layer to the metal layer
Patterned metal wiring layer 204.
As an example, the material of the metal wiring layer 204 include copper, aluminium, nickel, gold, silver, one or both of titanium with
Upper combination.In the present embodiment, the material selection of the metal wiring layer 204 is copper.
It should be noted that the re-wiring layer can include the multiple dielectric layers 203 stacked gradually and multiple gold
Belong to wiring layer 204, according to line demand, each layer metal is realized by being patterned or making through hole to each dielectric layer 203
Interconnection between wiring layer 204, to realize the line demand of difference in functionality.
As an example, the metal coupling 205 can select for copper post, nickel column, solder metal (such as tin ball), copper post and
The combination of the combination of solder metal, nickel column and solder metal, or the combination etc. of copper post, metal barrier and solder metal.
In the present embodiment, the metal coupling 205 selects the combination for copper post, metal barrier and solder metal, institute
Stating the preparation method of metal coupling 205 includes step：
Step a), copper post is formed using galvanoplastic in the rewiring layer surface；
Step b), metal barrier is formed using galvanoplastic in the copper post surface；
Step c), solder metal is formed using galvanoplastic in the metal barrier layer surface, and uses high temperature reflow processes
Solder bump is formed in the metal barrier layer surface.
As an example, the metal barrier includes nickel layer, the material of the solder bump includes one in lead, tin and silver
Kind or the alloy for including any one above-mentioned solder metal.
The copper post of high quality can be prepared using galvanoplastic, improves the quality of metal coupling 205.The metal barrier
It can stop the diffusion of solder metal, improve the electrical property of metal coupling 205.
As an example, the vertical corresponding region of the re-wiring layer and fingerprint recognition chip 206 includes continuous Jie
Matter layer 203, and do not include metal layer, using the identification window 210 as the fingerprint recognition chip 206.For capacitive finger
Line identification chip and ultrasonic type, especially for the fingerprint recognition chip of optical profile type, the identification window 210 can obtain good
Good recognition effect.
As shown in Fig. 7~8, step 3) is then carried out, there is provided a fingerprint recognition chip 206, by metal solder joints 207 by institute
Fingerprint recognition chip 206 is stated to be installed on the re-wiring layer, wherein, the fingerprint recognition chip 206 front toward
The re-wiring layer；
As an example, the material that the metal solder joints 207 can be can be the metal materials such as copper, gold, silver, aluminium, tin.
As an example, in step 3), by metal solder joints 207 by the fingerprint recognition chip 206 be installed in it is described again
After on wiring layer, there is gap between the fingerprint recognition chip 206 and the re-wiring layer, step 3) is further included in described
The step of protective layer 208 are formed in gap, the front of the fingerprint recognition chip 206 is completely covered in the protective layer 208.
As an example, the protective layer 208 is transparent polymeric layer, in the present embodiment, the protective layer 208 is selected
For epoxy resin, be formed at by the way of dispensing or molding the fingerprint recognition chip 206 and the re-wiring layer it
Between gap.Fingerprint recognition chip 206 described in 208 can effectively protect of protective layer, for example, the entry types such as steam can be prevented
The other chip of fingerprint, and can as such as hit, press excessively etc. buffer structure.
As shown in figure 9, then carrying out step 4), the fingerprint recognition chip 206 is encapsulated using encapsulating material 209, it is described
Metal coupling 205 is exposed to the encapsulating material 209.
As an example, the method for the fingerprint recognition chip 206 is encapsulated using encapsulating material 209 includes compression forming, biography
Pass one kind in molded, fluid-tight shaping, vacuum lamination and spin coating, the encapsulating material 209 include polyimides, silica gel with
And one kind in epoxy resin.After encapsulation, the metal coupling 205 is exposed to the encapsulating material 209, in favor of its with it is other
The electrical connection of device or the electrical extraction of itself.
As shown in Figure 10, finally carry out step 5), based on the separating layer 202 separate it is described support deposition with it is described again
Wiring layer.
As an example, the attribute according to the separating layer 202, can use such as mechanical stripping, laser lift-off, chemical stripping
The methods of (such as wet etching), separates the support deposition and the re-wiring layer.
Finally, suitable frame is configured to packaged fingerprint recognition chip 206, so that it is applied to different function groups
In part, such as mobile phone, tablet computer, gate inhibition.
As shown in Figure 10, the present embodiment also provides a kind of encapsulating structure of fingerprint recognition chip 206, the encapsulating structure bag
Include：Re-wiring layer；Metal coupling 205, is formed on the re-wiring layer；Fingerprint recognition chip 206, passes through metal solder joints
207 are installed on the re-wiring layer, wherein, the front of the fingerprint recognition chip 206 is toward the re-wiring layer；
And encapsulating material 209, the fingerprint recognition chip 206 is covered in, and the metal coupling 205 is exposed to the encapsulating material
209。
As an example, there is gap between the fingerprint recognition chip 206 and the re-wiring layer, shape in the gap
Into matcoveredn 208, the front of the fingerprint recognition chip 206 is completely covered in the protective layer 208.Further, the guarantor
It is epoxy resin that sheath 208, which is selected,.
As an example, the vertical corresponding region of the re-wiring layer and fingerprint recognition chip 206 includes continuous Jie
Matter layer 203, and do not include metal layer, using the identification window 210 as the fingerprint recognition chip 206.
As an example, the encapsulating material 209 includes one kind in polyimides, silica gel and epoxy resin.
As an example, the re-wiring layer includes patterned dielectric layer 203 and patterned metal wiring layer
204.Further, the material of the dielectric layer 203 includes epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorosilicate glass,
One or both of fluorine-containing glass combination of the above, the material of the metal wiring layer 204 are included in copper, aluminium, nickel, gold, silver, titanium
One or more kinds of combinations.
As an example, the metal coupling 205 includes copper post, the nickel layer positioned at the copper post upper surface and positioned at institute
State the solder bump on nickel layer.Further, the metal barrier includes nickel layer, the material of the solder bump include lead,
One kind in tin and silver or the alloy for including any one above-mentioned solder metal.
As shown in figure 11, the use principle of the encapsulating structure of the fingerprint recognition chip 206 of the present embodiment is as shown in figure 11, its
Including：
The first step, the image of required identification fingerprint is obtained by the encapsulating structure of fingerprint recognition chip 206.In the present embodiment
In, the required image for identifying fingerprint is obtained by the identification window 210 in the re-wiring layer.
Second step, pre-processes the fingerprint image of collection as follows, including：Picture quality judgement, image enhancement, fingerprint
The gray value of each pixel in fingerprint image (is arranged to 0 by region detection, fingerprint orientation and frequence estimation, image binaryzation
Or 255) and image thinning.
3rd step, from pretreated image, obtains the crestal line data of fingerprint.
4th step, from the crestal line data of fingerprint, take the fingerprint the required characteristic point of identification.
5th step, the feature that takes the fingerprint (information of characteristic point) is matched one by one with the fingerprint characteristic preserved in database,
Determine whether identical fingerprints.
6th step, after completing fingerprint matching processing, exports the handling result of fingerprint recognition.
As described above, the encapsulating structure and method for packing of the fingerprint recognition chip 206 of the utility model, have beneficial below
Effect：
1) the utility model uses fan-out package (Fan out) fingerprint recognition chip 206, compared to existing other fingers
For the encapsulation of line identification chip 206, have the advantages that cost is low, thickness is small, yield is high；
2) routing technique is not required in the utility model at the same time, it is not required that the silicon perforation technique (TSV) of high cost, and can be real
The encapsulation of existing fingerprint recognition chip 206, greatly reduces technology difficulty and cost；
3) the utility model directly uses cover board of the re-wiring layer as fingerprint recognition chip 206, it is not necessary in addition increases
Add sapphire cover board, greatly reduce the thickness and cost of encapsulation；
4) for the utility model using encapsulation (Fan out) technique is fanned out to, the electricity of chip, which is drawn, is not required traditional FPC plates,
The thickness of encapsulation and the stability of electrical deriving structure can be reduced, improves encapsulation yield；
5) the utility model technique is simple, creatively using packaging technology encapsulation fingerprint recognition chip 206 is fanned out to, half
Conductor encapsulation technology field is with a wide range of applications.
So the utility model effectively overcomes various shortcoming of the prior art and has high industrial utilization.
The above embodiments are only illustrative of the principle and efficacy of the utility model, new not for this practicality is limited
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
God and all equivalent modifications completed under technological thought or change, should be covered by the claim of the utility model.
Claims (9)
1. a kind of encapsulating structure of fingerprint recognition chip, it is characterised in that the encapsulating structure includes：
Re-wiring layer；
Metal coupling, is formed on the re-wiring layer；
Fingerprint recognition chip, is installed on the re-wiring layer by metal solder joints, wherein, the fingerprint recognition chip is just
Facing in the re-wiring layer；And
Encapsulating material, is covered in the fingerprint recognition chip, and the metal coupling is exposed to the encapsulating material.
2. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The fingerprint recognition chip with
There is gap between the re-wiring layer, matcoveredn is formed in the gap, the fingerprint is completely covered in the protective layer
The front of identification chip.
3. the encapsulating structure of fingerprint recognition chip according to claim 2, it is characterised in that：It is ring that the protective layer, which is selected,
Oxygen tree fat.
4. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The re-wiring layer is with referring to
The vertical corresponding region of line identification chip includes continuous dielectric layer, and does not include metal layer, to be used as the fingerprint recognition
The identification window of chip.
5. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The encapsulating material includes poly-
One kind in acid imide, silica gel and epoxy resin.
6. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The re-wiring layer includes
Patterned dielectric layer and patterned metal wiring layer.
7. the encapsulating structure of fingerprint recognition chip according to claim 6, it is characterised in that：The material bag of the dielectric layer
Include one or both of epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorosilicate glass, fluorine-containing glass combination of the above, institute
Stating the material of metal wiring layer includes one or both of copper, aluminium, nickel, gold, silver, titanium combination of the above.
8. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The metal coupling includes copper
Column, the nickel layer positioned at the copper post upper surface and the solder bump on the nickel layer.
9. the encapsulating structure of fingerprint recognition chip according to claim 8, it is characterised in that：The material of the solder bump
Including one kind in lead, tin and silver or include the alloy of any one above-mentioned solder metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720781880.XU CN207353228U (en) | 2017-06-30 | 2017-06-30 | The encapsulating structure of fingerprint recognition chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720781880.XU CN207353228U (en) | 2017-06-30 | 2017-06-30 | The encapsulating structure of fingerprint recognition chip |
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| CN207353228U true CN207353228U (en) | 2018-05-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107146778A (en) * | 2017-06-30 | 2017-09-08 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and method for packing of fingerprint recognition chip |
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2017
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107146778A (en) * | 2017-06-30 | 2017-09-08 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and method for packing of fingerprint recognition chip |
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