CN207503967U - The encapsulating structure of fingerprint recognition chip - Google Patents
The encapsulating structure of fingerprint recognition chip Download PDFInfo
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- CN207503967U CN207503967U CN201721136336.6U CN201721136336U CN207503967U CN 207503967 U CN207503967 U CN 207503967U CN 201721136336 U CN201721136336 U CN 201721136336U CN 207503967 U CN207503967 U CN 207503967U
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- recognition chip
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- wiring layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of encapsulating structure of fingerprint recognition chip, including：Re-wiring layer；Fingerprint recognition chip, positioned at the first surface of re-wiring layer；Fingerprint recognition chip includes functional area and several metal pads on the outside of functional area, is provided with function element in functional area, metal pad is located at the front of fingerprint recognition chip, and is electrically connected with function element；Fingerprint recognition chip is connected via metal pad and re-wiring layer；Fingerprint recognition chip positioned at the first surface of re-wiring layer, is encapsulated plastic packaging by capsulation material layer；Through-hole equipped with several up/down perforations formed using laser driller technique in capsulation material layer, through-hole expose the part re-wiring layer；Conductive structure is filled in through-hole, and is electrically connected with re-wiring layer.The utility model uses fan-out package（Fan out）Fingerprint recognition chip for existing other fingerprint recognition chip packages, has the advantages that at low cost, thickness is small, yield is high.
Description
Technical field
The utility model is related to a kind of semiconductor package and packaging method, more particularly to a kind of fingerprint recognition chip
Encapsulating structure.
Background technology
As the function of integrated circuit is increasingly stronger, performance and integrated level is higher and higher and novel integrated circuit goes out
Existing, encapsulation technology plays an increasingly important role in IC products, shared in the value of entire electronic system
Ratio it is increasing.Meanwhile as integrated circuit feature size reaches nanoscale, transistor to more high density, it is higher when
Clock frequency develops, and encapsulation also develops to more highdensity direction.
Since fan-out wafer grade encapsulates (fowlp) technology due to having many advantages, such as miniaturization, low cost and high integration, with
And with better performance and higher energy efficiency, fan-out wafer grade encapsulation (fowlp) technology become the movement of high request/
The important packaging method of the electronic equipments such as wireless network is one of encapsulation technology most with prospects at present.
Fingerprint identification technology is biometrics identification technology most ripe and cheap at present.For at present, fingerprint is known
Other technology is most widely used, not only it can be seen that the figure of fingerprint identification technology, has in the market in gate inhibition, attendance checking system
The applications of more fingerprint recognitions：As laptop, mobile phone, automobile, bank paying all can employing fingerprint identify technology.
A kind of packaging method of existing fingerprint recognition chip is as shown in Fig. 1 a~Fig. 1 c：
The first step as shown in Figure 1a, makes deep trouth, and be bonded on FPC plates 12, then in fingerprint recognition chip 11
Metal connecting line 13 is made by routing technique, realization fingerprint recognition chip 11 is electrically connected with FP C plates 12, wherein, FPC is
The abbreviation of Flexible Printed Circuit, also known as flexible circuit board, with Distribution density is high, light-weight, thickness is thin
The characteristics of.
Second step as shown in Figure 1 b, produces frame 14；
Third walks, and shown in scholar 1c, sapphire cover board 15 is capped on the fingerprint recognition chip, to complete to encapsulate.
This method has the disadvantages that：Including FPC plates, fingerprint recognition chip and sapphire cover board three-decker, envelope
It is thicker to fill thickness, metal connecting line is easily broken caused by FPC soft boards are pullled etc., and whole yield is relatively low.
The packaging method of another fingerprint recognition chip is as shown in Fig. 2 a~Fig. 2 c：
The first step as shown in Figure 2 a, through hole electrode 16 is formed by silicon perforation TSV technology in fingerprint recognition chip 11；
Second step, it is as shown in Figure 2 b, sapphire cover board 15, fingerprint recognition chip 11 and FPC plates 12 is stacked together, lead to
It crosses routing technique and makes metal connecting line 13 to connect the fingerprint recognition chip 11 and FPC plates 12；
Third walks, and as shown in Figure 2 c, produces frame 14.
This method has the disadvantages that：Need with sapphire cover board encapsulate, thickness is thicker, silicon perforation process costs compared with
Height, metal connecting line are easily broken, and the thinner thickness of fingerprint recognition chip caused by FPC soft boards are pullled etc., are susceptible to and split
Piece phenomenon, whole yield are relatively low.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of fingerprint recognition chips
Encapsulating structure is thick using sapphire cover board, encapsulation for solving to need present in fingerprint recognition packaging method in the prior art
Spend the problem of larger, yield is more low.
In order to achieve the above objects and other related objects, the utility model provides a kind of encapsulation knot of fingerprint recognition chip
Structure, the encapsulating structure include：
Re-wiring layer, the re-wiring layer include opposite first surface and second surface；
Fingerprint recognition chip, positioned at the first surface of the re-wiring layer；The fingerprint recognition chip includes functional areas
Domain and several metal pads on the outside of the functional area are provided with function element, the gold in the functional area
Belong to pad and be located at the front of the fingerprint recognition chip, and be electrically connected with the function element；The fingerprint recognition chip via
The metal pad is connected with the re-wiring layer；
The fingerprint recognition chip positioned at the first surface of the re-wiring layer, is encapsulated plastic packaging by capsulation material layer；Institute
The through-hole equipped with several up/down perforations formed using laser driller technique in capsulation material layer is stated, the through-hole exposes portion
Divide the re-wiring layer；And
Conductive structure is filled in the through-hole, and is electrically connected with the re-wiring layer；The conductive structure is far from institute
It states the surface of re-wiring layer and surface flush of the capsulation material layer far from the re-wiring layer or protrudes from described
Except capsulation material layer.
Preferably, the conductive structure is metal connected ball, metal column or metal lead wire.
Preferably, the re-wiring layer includes：
Dielectric layer, the surface that the dielectric layer is in contact with the capsulation material layer for the re-wiring layer the
One surface；
Metal line layer, in the dielectric layer, and the outer surface of the metal line layer and the re-wiring layer
First surface flush；The metal pad and the conductive structure are connected with the metal line layer.
Preferably, the re-wiring layer includes：
Dielectric layer, the surface that the dielectric layer is in contact with the capsulation material layer for the re-wiring layer the
One surface；
Metallic stacked structure, in the dielectric layer；The metallic stacked structure includes the gold of Spaced arrangement
Belong to line layer and metal plug, the metal plug is between the adjacent metal line layer, by the adjacent metal line layer
Electrical connection；The outer surface of the metal line layer of the neighbouring capsulation material layer is equal with the first surface of the re-wiring layer
Together；The metal line layer of the metal pad and the neighbouring capsulation material layer connects.
Preferably, the material of the dielectric layer includes epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorus silicon glass
Any one of glass, fluorine-containing glass, the material of the metal line layer include any one of copper, aluminium, nickel, gold, silver, titanium.
Preferably, several described metal pads are respectively positioned on the side of the functional area, and in the functional area
It arranges in "-" type side.
Preferably, the capsulation material layer includes polyimide layer, layer of silica gel, epoxy resin layer, curable polymer
Any one of based material layer or the curable resin base material bed of material.
Preferably, the cross sectional shape of the through-hole is inverted trapezoidal.
The utility model also provides a kind of packaging method of fingerprint recognition chip, and the packaging method includes step：
1) substrate is provided；
2) a fingerprint recognition chip is provided, the fingerprint recognition chip includes functional area and outside the functional area
Several metal pads of side are provided with function element in the functional area, and the metal pad is located at the fingerprint recognition
The front of chip, and be electrically connected with the function element；By the fingerprint recognition chip front side downward back bonding in the lining
The upper surface at bottom；
3) capsulation material layer is formed in the upper surface of the substrate, the capsulation material layer seals the fingerprint recognition chip
Wrap up in plastic packaging；
4) substrate is removed；
5) in the capsulation material layer expose the fingerprint recognition chip surface formed re-wiring layer, it is described again
Wiring layer includes opposite first surface and second surface, wherein, the first surface of the re-wiring layer and the plastic packaging material
The surface that the bed of material exposes the fingerprint recognition chip is in contact, and the gold of the re-wiring layer and the fingerprint recognition chip
Belong to contact pads connection；
6) using laser drilling process in the through-hole that up/down perforation is formed in the capsulation material layer, the through-hole exposes
The part re-wiring layer；
7) in forming conductive structure in the through-hole, the conductive structure is connected with the re-wiring layer.
Preferably, further included between step 1) and step 2) in the upper surface of the substrate formed peeling layer the step of；This
When, in step 2), back bonding is in the upper surface of the peeling layer, step 3) downward for the fingerprint recognition chip front side, institute
State the upper surface that capsulation material layer is formed in the peeling layer.
Preferably, the peeling layer includes one kind in adhesive tape and polymeric layer, and the polymeric layer uses spin coating first
Technique is coated on the support substrate surface, then makes its curing molding using ultra-violet curing or heat curing process.
Preferably, in step 3), using compressing and forming process, Transfer molding technique, fluid-tight moulding process, vacuum layer
Pressure technique or spin coating proceeding form the capsulation material layer in the upper surface of the substrate；It is sub- that the capsulation material layer includes polyamides
Any in amine layer, layer of silica gel, epoxy resin layer, the curable polymeric substrate bed of material or the curable resin base material bed of material
Kind.
Preferably, in step 7), using welding procedure or metal paste printing technology in formation metal connection in the through-hole
Ball or metal column as the conductive structure or use bonding wire craft in formation metal lead wire in the through-hole as the conduction
Structure.
As described above, the encapsulating structure of the fingerprint recognition chip of the utility model, has the advantages that：
1) the utility model uses fan-out package (Fan out) fingerprint recognition chip, compared to existing other fingerprints
For identification chip encapsulation, have the advantages that at low cost, thickness is small, yield is high；
2) the utility model does not need to routing technique simultaneously, it is not required that the silicon perforation technique (TSV) of high cost, and can be real
The encapsulation of existing fingerprint recognition chip, greatly reduces technology difficulty and cost；
3) the utility model does not need in addition increase blue directly using cover board of the re-wiring layer as fingerprint recognition chip
Jewel cover board greatly reduces the thickness and cost of encapsulation；
4) for the utility model using encapsulation (Fan out) technique is fanned out to, the electricity of chip, which is drawn, does not need to traditional FPC plates,
The thickness of encapsulation and the stability of electrical deriving structure can be reduced, improves encapsulation yield；
5) the utility model is simple for process, creatively using packaging technology encapsulation fingerprint recognition chip is fanned out to, is partly leading
Body encapsulation technology field is with a wide range of applications.
Description of the drawings
What each step of packaging method that Fig. 1 a~Fig. 1 c are shown as a kind of fingerprint recognition chip of the prior art was presented
Structure diagram.
Each step of packaging method that Fig. 2 a~Fig. 2 c are shown as another fingerprint recognition chip of the prior art is presented
Structure diagram.
Fig. 3 is shown as the flow signal of the packaging method of fingerprint recognition chip provided in the utility model embodiment one
Figure.
Fig. 4~Figure 13 is shown as each step of the packaging method of fingerprint recognition chip provided in the utility model embodiment one
The structure diagram presented, wherein, Figure 12 and Figure 13 are shown as the encapsulating structure of the fingerprint recognition chip of the utility model
Structure diagram.
Component label instructions
11 fingerprint recognition chips
12 FPC plates
13 metal connecting lines
14 frames
15 sapphire cover boards
16 through hole electrodes
21 substrates
22 peeling layers
23 fingerprint recognition chips
231 functional areas
232 metal pads
24 capsulation material layers
25 re-wiring layers
251 dielectric layers
252 metal line layers
26 through-holes
27 conductive structures
Specific embodiment
Illustrate the embodiment of the utility model below by way of specific specific example, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition
Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints with answering
With carrying out various modifications or alterations under the spirit without departing from the utility model.
Please refer to Fig. 3~Figure 13.It should be noted that the diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of utility model, though when only display is with related component in the utility model rather than according to actual implementation in diagram
Component count, shape and size are drawn, and form, quantity and the ratio of each component can be a kind of random change during actual implementation
Become, and its assembly layout kenel may also be increasingly complex.
Embodiment one
Referring to Fig. 3, the utility model provides a kind of packaging method of fingerprint recognition chip, the packaging method includes step
Suddenly：1 packaging method includes step：
1) substrate is provided；
2) a fingerprint recognition chip is provided, the fingerprint recognition chip includes functional area and outside the functional area
Several metal pads of side are provided with function element in the functional area, and the metal pad is located at the fingerprint recognition
The front of chip, and be electrically connected with the function element；By the fingerprint recognition chip front side downward back bonding in the lining
The upper surface at bottom；
3) capsulation material layer is formed in the upper surface of the substrate, the capsulation material layer seals the fingerprint recognition chip
Wrap up in plastic packaging；
4) substrate is removed；
5) in the capsulation material layer expose the fingerprint recognition chip surface formed re-wiring layer, it is described again
Wiring layer includes opposite first surface and second surface, wherein, the first surface of the re-wiring layer and the plastic packaging material
The surface that the bed of material exposes the fingerprint recognition chip is in contact, and the gold of the re-wiring layer and the fingerprint recognition chip
Belong to contact pads connection；
6) using laser drilling process in the through-hole that up/down perforation is formed in the capsulation material layer, the through-hole exposes
The part re-wiring layer；
7) in forming conductive structure in the through-hole, the conductive structure is connected with the re-wiring layer.
In step 1), S1 steps and Fig. 4 in Fig. 3 are please referred to, a substrate 21 is provided.
As an example, the material of the substrate 21 can include in silicon, glass, silica, ceramics, polymer and metal
One or more kinds of composite materials, shape can be wafer shape, it is rectangular or it is other it is arbitrary needed for shape；The present embodiment
The problems such as rupture, warpage, fracture occur for semiconductor chip in subsequent preparation process is prevented by the substrate 21.
As an example, as shown in figure 5, after providing the substrate 21, further include and formed in the upper surface of the substrate 21
The step of peeling layer 22.
As an example, the peeling layer 22 in subsequent technique as the capsulation material layer 25 that is subsequently formed and the substrate
Separating layer between 21 preferably selects the jointing material with smooth finish surface to be made, must be with the capsulation material layer 25
With certain binding force, to ensure that the capsulation material layer 25 will not generate situations such as mobile in subsequent technique, in addition, its
Also there is stronger binding force with the substrate 21, in general, with the binding force of the substrate 21 need to be more than with it is described
The binding force of capsulation material layer 25.As an example, the material of the peeling layer 22 is selected from the two-sided adhesive tape for being respectively provided with viscosity or logical
Polymeric layer of spin coating proceeding making etc. is crossed, the polymeric layer is coated on 21 table of support substrate using spin coating proceeding first
Then face makes its curing molding using ultra-violet curing or heat curing process.Adhesive tape is preferably using UV adhesive tapes, after the irradiation of UV light
It is easy to pull off.In other embodiments, physical vaporous deposition or chemical vapor deposition also can be selected in the peeling layer 22
Area method formed other materials layer, as epoxy resin (Epoxy), silicon rubber (silicone rubber), polyimides (PI),
Polybenzoxazoles (PBO), benzocyclobutene (BCB) etc..In substrate 21 described in later separation, wet etching, chemistry can be used
Mechanical lapping, the methods of removing, remove the peeling layer 22.
In step 2), S2 steps and Fig. 6 and Fig. 7 in Fig. 3 are please referred to, a fingerprint recognition chip 23, the finger are provided
Line identification chip 23 includes functional area 231 and several metal pads 232 positioned at 231 outside of functional area, described
Function element (not shown) is provided in functional area 231, the metal pad 232 is being located at the fingerprint recognition chip 23 just
Face, and be electrically connected with the function element；By the 2321 face down back bonding of fingerprint recognition chip in the substrate
Upper surface.
The fingerprint recognition chip 23 is bonded to as an example, bonding back tracking method (bond-on-trace) may be used
The upper surface of the substrate 21；The bonding back tracking method is not repeated herein known to those skilled in the art.Certainly, this implementation
It can also use a kind of any other bonding method that the fingerprint recognition chip 23 is bonded to the upper table of the substrate 21 in example
Face.
As an example, as shown in fig. 7, several described metal pads 232 are respectively positioned on the side of the functional area 231,
And it arranges in the side of the functional area 231 in "-" type.
In step 3), S3 steps and Fig. 8 in Fig. 3 are please referred to, capsulation material is formed in the upper surface of the substrate 21
Layer 24, the fingerprint recognition chip 23 is encapsulated plastic packaging by the capsulation material layer 24.
As an example, compressing and forming process, transfer shaping technology, hydraulic seal moulding process, molding bottom may be used
Fill process, capillary underfill technique, vacuum lamination process or spin coating proceeding form described in the upper surface of the substrate 21
Capsulation material layer 24.Preferably, in the present embodiment, institute is formed in the upper surface of the substrate 21 using molded underfill technique
Capsulation material layer 24 is stated, can be effectively prevented from interface debonding occur, and molded underfill will not be as in the prior art in this way
Capillary underfill technique be restricted like that, greatly reduce technology difficulty, can be used for smaller joint gap, it is more suitable
For stacked structure.
As an example, the material of the capsulation material layer 24 can be but be not limited only to polyimide layer, layer of silica gel, epoxy
Resin layer, the curable polymeric substrate bed of material or the curable resin base material bed of material.
As an example, the height of the capsulation material layer 24 is higher than the height of the fingerprint recognition chip 23, i.e., described modeling
The fingerprint recognition chip 23 is encapsulated plastic packaging by closure material layer 24 completely.
In step 4), S4 steps and Fig. 9 in Fig. 3 are please referred to, removes the substrate 21.
As an example, grinding technics, reduction process etc., which may be used, is removed the substrate 21 and the peeling layer 22.
Preferably, in the present embodiment, the peeling layer 22 is UV adhesive tapes, and the mode for tearing the peeling layer 22 may be used to remove
State substrate 21.
In step 5), S5 steps and Figure 10 in Fig. 3 are please referred to, exposes the fingerprint in the capsulation material layer 24
The surface of identification chip 23 forms re-wiring layer 25, and the re-wiring layer 25 includes opposite first surface and the second table
Face, wherein, the first surface of the re-wiring layer 25 exposes the fingerprint recognition chip 23 with the capsulation material layer 24
Surface be in contact, and the re-wiring layer 24 and the metal pad 232 of the fingerprint recognition chip 23 connect.
In one example, as shown in Figure 10, the re-wiring layer 25 includes one layer of dielectric layer 251 and one layer of metal wire
Layer 252, the surface that the fingerprint recognition chip 23 is exposed in the capsulation material layer 24 form re-wiring layer 25 including such as
Lower step：
5-1) surface that the fingerprint recognition chip 23 is exposed in the capsulation material layer 24 forms the metal line layer
252；
5-2) surface that the fingerprint recognition chip 23 is exposed in the capsulation material layer 24 forms dielectric layer 251,
The surface that the dielectric layer 251 is in contact with the capsulation material layer 24 is the first surface of the re-wiring layer 25；Institute
State the outer surface of metal line layer 252 and the first surface flush of the re-wiring layer 25, i.e., described metal line layer 252 it is outer
The surface flush that surface is in contact with the dielectric layer 251 with the capsulation material layer 24；The metal pad 232 and institute
Metal line layer 252 is stated to connect.
In another example, the re-wiring layer 25 includes one layer of dielectric layer 251 and one layer of metal line layer 252, in
The surface formation re-wiring layer 25 that the capsulation material layer 24 exposes the fingerprint recognition chip 23 includes the following steps：
5-1) surface that the fingerprint recognition chip 23 is exposed in the capsulation material layer 24 forms the dielectric layer
251, the metal pad is exposed in formation groove, the groove in the dielectric layer 251 by photoetching and etching technics
232, and define the shape of the metal line layer 252；The table that the dielectric layer 251 is in contact with the capsulation material layer 24
Face is the first surface of the re-wiring layer 25；
5-2) in forming the metal line layer 252 in the groove.
In another example, at least double layer of metal line layer 252 is included in the re-wiring layer 25 and at least one layer of electricity is situated between
Matter layer 251, the surface formation re-wiring layer 25 that the fingerprint recognition chip 23 is exposed in the capsulation material layer 24 include
Following steps：
5-1) surface that the fingerprint recognition chip 23 is exposed in the capsulation material layer 24 forms first layer metal line
Layer 252；
5-2) surface that the fingerprint recognition chip 23 is exposed in the capsulation material layer 24 forms dielectric layer 251,
The upper surface of the dielectric layer 251 is higher than the upper surface of the metal line layer 252, and the dielectric layer 251 and the modeling
The surface phase that the surface that closure material layer 24 is in contact is in contact with metal line layer described in first layer 252 with the capsulation material layer 24
Concordantly；
5-3) in the interval that if formation dried layer is electrically connected with metal line layer described in first layer 252 in the dielectric layer 251
Other metal line layers 252 of arrangement are stacked, are electrically connected between the adjacent metal line layer 252 via metal plug.
As an example, in above-mentioned example, the material of the metal line layer 252 can be but be not limited only to copper, aluminium, nickel, gold,
Silver, a kind of material in titanium or two kinds and two or more combined materials, and PVD, CVD, sputtering, plating or chemical plating can be used
Etc. techniques form the metal line layer 252.The material of the dielectric layer 261 can be low k dielectric；It is specifically, described
One kind in epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorosilicate glass and fluorine-containing glass may be used in dielectric layer 251
Material, and the techniques such as spin coating, CVD, plasma enhanced CVD may be used and form the dielectric layer 251.
In step 6), S6 steps and Figure 11 in Fig. 3 are please referred to, using laser drilling process in the capsulation material layer
The through-hole 26 of up/down perforation is formed in 24, the through-hole 26 exposes the part re-wiring layer 25.
As an example, the cross sectional shape of the through-hole 26 can be but be not limited only to inverted trapezoidal.Laser drilling process is compared
Have many advantages, such as that accuracy is high, at low cost in techniques such as existing etchings.
It should be noted that in the step, the techniques such as etching can also be used in the interior formation of the capsulation material layer 24
The through-hole 26 of lower perforation.
In step 7), S7 steps and Figure 12 to Figure 13 in Fig. 3 are please referred to, in formation conductive structure in the through-hole 26
27, the conductive structure 27 is connected with the re-wiring layer 25.
In one example, as shown in figure 12, metal connected ball is formed as institute in the through-hole 26 using welding procedure
State conductive structure 27.The metal connected ball can be but be not limited only to copper ball or tin ball.At this point, the metal connected ball should be
The bigger metal connected ball of major diameter, i.e., the height of described metal connected ball are significantly greater than the diameter of the metal connected ball, with
Meet the needs of follow-up plastic package process.
In another example, as shown in figure 13, using metal paste printing technology in formation metal connection in the through-hole 26
As the conductive structure 27, the metal connected ball can be but be not limited only to copper ball or tin ball, the gold for ball or metal column
Belonging to column can be but be not limited only to copper post, tin column etc..At this point, the metal connected ball should be the bigger metal connection of major diameter
Ball, i.e., the height of described metal connected ball is significantly greater than the diameter of the metal connected ball, to meet the need of follow-up plastic package process
It will.
In another example, bonding wire craft can also be used in formation metal lead wire in the through-hole 26 as the conduction
Structure 27, the metal lead wire can be copper lead or tin lead etc..Using bonding wire craft, process warm can be substantially reduced
Degree, so as to improve the scope of application of technique.
Embodiment two
Please continue to refer to Figure 12 and Figure 13, the utility model also provides a kind of encapsulating structure of fingerprint recognition chip, described
Encapsulating structure is prepared by the packaging method described in embodiment one, and the encapsulating structure includes：Re-wiring layer 25, institute
It states re-wiring layer 25 and includes opposite first surface and second surface；Fingerprint recognition chip 23, the fingerprint recognition chip 23
Positioned at the first surface of the re-wiring layer 25；The fingerprint recognition chip 23 includes functional area 231 and positioned at the work(
Can the outside of region 231 several metal pads 232, be provided with function element (not shown) in the functional area 231, it is described
Metal pad 232 is located at the front of the fingerprint recognition chip 23, and is electrically connected with the function element；The fingerprint recognition core
Piece 23 is connected via the metal pad 232 and the re-wiring layer 25；Capsulation material layer 24, the capsulation material layer
24 are located at the first surface of the re-wiring layer 25, and the fingerprint recognition chip 23 is encapsulated plastic packaging；The capsulation material layer
Through-hole equipped with several up/down perforations formed using laser driller technique in 24, the through-hole are exposed described in part again
Wiring layer 25；And conductive structure 27, the conductive structure 27 are filled in the through-hole, and are electrically connected with the re-wiring layer 25
It connects；Surface of the conductive structure 27 far from the re-wiring layer 25 is with the capsulation material layer 24 far from the rewiring
The surface flush of layer 25 is protruded from except the capsulation material layer 24.
In one example, the re-wiring layer 25 includes：Dielectric layer 251, the dielectric layer 251 and the plastic packaging
The surface that material layer 24 is in contact is the first surface of the re-wiring layer 25；Metal line layer 252, the metal line layer 252
In the dielectric layer 251, and the outer surface of the metal line layer 252 and the first surface phase of the re-wiring layer 25
Concordantly；The metal pad 232 and the conductive structure 27 are connected with the metal line layer 252.
In another example, the re-wiring layer 25 includes：Dielectric layer 251, the dielectric layer 251 and the modeling
The surface that closure material layer 24 is in contact is the first surface of the re-wiring layer 25；Metallic stacked structure, it is described metal laminated
Structure is located in the dielectric layer 251；The metallic stacked structure includes the metal line layer 252 and metal of Spaced arrangement
The adjacent metal line layer 252 is electrically connected by plug, the metal plug between the adjacent metal line layer 252；
The outer surface of the metal line layer 252 of the neighbouring capsulation material layer 24 is equal with the first surface of the re-wiring layer 25
Together；The metal line layer 252 of the metal pad 232 and the neighbouring capsulation material layer 24 connects.
As an example, the material of the dielectric layer 251 includes epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorus
Any one of silica glass, fluorine-containing glass, the material of the metal line layer 252 include any in copper, aluminium, nickel, gold, silver, titanium
Kind.
As an example, several described metal pads 232 are respectively positioned on the side of the functional area 231, and in the work(
It arranges in "-" type the side in energy region 231.
As an example, the capsulation material layer 24 includes polyimide layer, layer of silica gel, epoxy resin layer, curable poly-
Close any one of object based material layer or the curable resin base material bed of material.
As an example, the cross sectional shape of the through-hole can be but be not limited only to inverted trapezoidal.
As an example, the conductive structure 27 is metal connected ball, metal column or metal lead wire.
In conclusion the utility model provides a kind of encapsulating structure of fingerprint recognition chip, the encapsulating structure includes：Weight
New route layer, the re-wiring layer include opposite first surface and second surface；Fingerprint recognition chip, positioned at it is described again
The first surface of wiring layer；The fingerprint recognition chip includes functional area and several gold on the outside of the functional area
Belonging to pad, function element is provided in the functional area, the metal pad is located at the front of the fingerprint recognition chip, and
It is electrically connected with the function element；The fingerprint recognition chip contacts company via the metal pad with the re-wiring layer
It connects；The fingerprint recognition chip positioned at the first surface of the re-wiring layer, is encapsulated plastic packaging by capsulation material layer；The modeling
Through-hole equipped with several up/down perforations formed using laser driller technique in closure material layer, the through-hole expose part institute
State re-wiring layer；And conductive structure, it is filled in the through-hole, and be electrically connected with the re-wiring layer；The conductive knot
The surface flush or prominent of surface of the structure far from the re-wiring layer and the capsulation material layer far from the re-wiring layer
Except the capsulation material layer.The encapsulating structure of the fingerprint recognition chip of the utility model, has the advantages that：1)
The utility model uses fan-out package (Fan out) fingerprint recognition chip, is sealed compared to existing other fingerprint recognition chips
For dress, have the advantages that at low cost, thickness is small, yield is high；2) the utility model does not need to routing technique simultaneously, it is not required that
The silicon perforation technique (TSV) of high cost, and can realize the encapsulation of fingerprint recognition chip, greatly reduce technology difficulty and cost；
3) the utility model does not need in addition increase sapphire lid directly using cover board of the re-wiring layer as fingerprint recognition chip
Plate greatly reduces the thickness and cost of encapsulation；4) the utility model uses and is fanned out to encapsulation (Fan out) technique, the electricity of chip
Extraction does not need to traditional FPC plates, can reduce the thickness of encapsulation and the stability of electrical deriving structure, and it is good to improve encapsulation
Rate；5) the utility model is simple for process, creatively using packaging technology encapsulation fingerprint recognition chip is fanned out to, in semiconductor packages
Technical field is with a wide range of applications.
The above embodiments are only illustrative of the principle and efficacy of the utility model, new not for this practicality is limited
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications completed under refreshing and technological thought or change, should be covered by the claim of the utility model.
Claims (8)
1. a kind of encapsulating structure of fingerprint recognition chip, which is characterized in that the encapsulating structure includes：
Re-wiring layer, the re-wiring layer include opposite first surface and second surface；
Fingerprint recognition chip, positioned at the first surface of the re-wiring layer；The fingerprint recognition chip include functional area and
Several metal pads on the outside of the functional area are provided with function element, the metal welding in the functional area
Disk is located at the front of the fingerprint recognition chip, and is electrically connected with the function element；The fingerprint recognition chip is via described
Metal pad is connected with the re-wiring layer；
The fingerprint recognition chip positioned at the first surface of the re-wiring layer, is encapsulated plastic packaging by capsulation material layer；The modeling
Through-hole equipped with several up/down perforations formed using laser driller technique in closure material layer, the through-hole expose part institute
State re-wiring layer；And
Conductive structure is filled in the through-hole, and is electrically connected with the re-wiring layer；The conductive structure is far from described heavy
Surface flush far from the re-wiring layer of the surface of new route layer and the capsulation material layer protrudes from the plastic packaging
Except material layer.
2. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The conductive structure is metal
Connected ball, metal column or metal lead wire.
3. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The re-wiring layer packet
It includes：
Dielectric layer, the surface that the dielectric layer is in contact with the capsulation material layer are the first table of the re-wiring layer
Face；
Metal line layer, in the dielectric layer, and the outer surface of the metal line layer and the first of the re-wiring layer
Surface flush；The metal pad and the conductive structure are connected with the metal line layer.
4. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The re-wiring layer packet
It includes：
Dielectric layer, the surface that the dielectric layer is in contact with the capsulation material layer are the first table of the re-wiring layer
Face；
Metallic stacked structure, in the dielectric layer；The metallic stacked structure includes the metal wire of Spaced arrangement
The adjacent metal line layer is electrically connected by layer and metal plug, the metal plug between the adjacent metal line layer
It connects；The outer surface of the metal line layer of the neighbouring capsulation material layer and the first surface flush of the re-wiring layer；
The metal line layer of the metal pad and the neighbouring capsulation material layer connects.
5. the encapsulating structure of fingerprint recognition chip according to claim 3 or 4, it is characterised in that：The dielectric layer
Material includes epoxy resin, silica gel, PI, PBO, BCB, silica, any one of phosphorosilicate glass, fluorine-containing glass, the metal
The material of line layer includes any one of copper, aluminium, nickel, gold, silver, titanium.
6. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：Several described metal pads
The side of the functional area is respectively positioned on, and is arranged in the side of the functional area in "-" type.
7. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The capsulation material layer includes
In polyimide layer, layer of silica gel, epoxy resin layer, the curable polymeric substrate bed of material or the curable resin base material bed of material
It is any.
8. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The cross sectional shape of the through-hole
For inverted trapezoidal.
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| CN201721136336.6U CN207503967U (en) | 2017-09-06 | 2017-09-06 | The encapsulating structure of fingerprint recognition chip |
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| CN201721136336.6U CN207503967U (en) | 2017-09-06 | 2017-09-06 | The encapsulating structure of fingerprint recognition chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107481992A (en) * | 2017-09-06 | 2017-12-15 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and method for packing of fingerprint recognition chip |
| CN114242796A (en) * | 2021-12-06 | 2022-03-25 | 华天科技(南京)有限公司 | Optical sensor structure and manufacturing method thereof |
-
2017
- 2017-09-06 CN CN201721136336.6U patent/CN207503967U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107481992A (en) * | 2017-09-06 | 2017-12-15 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and method for packing of fingerprint recognition chip |
| CN114242796A (en) * | 2021-12-06 | 2022-03-25 | 华天科技(南京)有限公司 | Optical sensor structure and manufacturing method thereof |
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Address after: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province (place of business: No.9 Dongsheng West Road, Jiangyin City) Patentee after: Shenghejing micro semiconductor (Jiangyin) Co.,Ltd. Address before: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province Patentee before: SJ Semiconductor (Jiangyin) Corp. |