CN207587718U - The encapsulating structure of fingerprint recognition chip - Google Patents
The encapsulating structure of fingerprint recognition chip Download PDFInfo
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- CN207587718U CN207587718U CN201721136285.7U CN201721136285U CN207587718U CN 207587718 U CN207587718 U CN 207587718U CN 201721136285 U CN201721136285 U CN 201721136285U CN 207587718 U CN207587718 U CN 207587718U
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- recognition chip
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- wiring layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The utility model provides a kind of encapsulating structure of fingerprint recognition chip, and encapsulating structure includes：Re-wiring layer；Conductive structure is electrically connected positioned at the first surface of re-wiring layer, and with re-wiring layer；Fingerprint recognition chip, positioned at the first surface of re-wiring layer；Fingerprint recognition chip includes functional area and several metal pads on the outside of functional area, is provided with function element in functional area, metal pad is located at the front of fingerprint recognition chip, and is electrically connected with function element；Fingerprint recognition chip is connected via metal pad and re-wiring layer；And capsulation material layer, positioned at the first surface of re-wiring layer, fingerprint recognition chip and conductive structure are encapsulated into plastic packaging.The utility model uses fan-out package（Fan out）Fingerprint recognition chip for existing other fingerprint recognition chip packages, has the advantages that at low cost, thickness is small, yield is high.
Description
Technical field
The utility model is related to a kind of semiconductor package and packaging method, more particularly to a kind of fingerprint recognition chip
Encapsulating structure.
Background technology
As the function of integrated circuit is increasingly stronger, performance and integrated level is higher and higher and novel integrated circuit goes out
Existing, encapsulation technology plays an increasingly important role in IC products, shared in the value of entire electronic system
Ratio it is increasing.Meanwhile as integrated circuit feature size reaches nanoscale, transistor to more high density, it is higher when
Clock frequency develops, and encapsulation also develops to more highdensity direction.
Since fan-out wafer grade encapsulates (fowlp) technology due to having many advantages, such as miniaturization, low cost and high integration, with
And with better performance and higher energy efficiency, fan-out wafer grade encapsulation (fowlp) technology become the movement of high request/
The important packaging method of the electronic equipments such as wireless network is one of encapsulation technology most with prospects at present.
Fingerprint identification technology is biometrics identification technology most ripe and cheap at present.For at present, fingerprint is known
Other technology is most widely used, not only it can be seen that the figure of fingerprint identification technology, has in the market in gate inhibition, attendance checking system
The applications of more fingerprint recognitions：As laptop, mobile phone, automobile, bank paying all can employing fingerprint identify technology.
A kind of packaging method of existing fingerprint recognition chip is as shown in Fig. 1 a~Fig. 1 c：
The first step as shown in Figure 1a, makes deep trouth, and be bonded on FPC plates 12, then in fingerprint recognition chip 11
Metal connecting line 13 is made by routing technique, realization fingerprint recognition chip 11 is electrically connected with FP C plates 12, wherein, FPC is
The abbreviation of Flexible Printed Circuit, also known as flexible circuit board, with Distribution density is high, light-weight, thickness is thin
The characteristics of.
Second step as shown in Figure 1 b, produces frame 14；
Third walks, and shown in scholar 1c, sapphire cover board 15 is capped on the fingerprint recognition chip, to complete to encapsulate.
This method has the disadvantages that：Including FPC plates, fingerprint recognition chip and sapphire cover board three-decker, envelope
It is thicker to fill thickness, metal connecting line is easily broken caused by FPC soft boards are pullled etc., and whole yield is relatively low.
The packaging method of another fingerprint recognition chip is as shown in Fig. 2 a~Fig. 2 c：
The first step as shown in Figure 2 a, through hole electrode 16 is formed by silicon perforation TSV technology in fingerprint recognition chip 11；
Second step, it is as shown in Figure 2 b, sapphire cover board 15, fingerprint recognition chip 11 and FPC plates 12 is stacked together, lead to
It crosses routing technique and makes metal connecting line 13 to connect the fingerprint recognition chip 11 and FPC plates 12；
Third walks, and as shown in Figure 2 c, produces frame 14.
This method has the disadvantages that：Need with sapphire cover board encapsulate, thickness is thicker, silicon perforation process costs compared with
Height, metal connecting line are easily broken, and the thinner thickness of fingerprint recognition chip caused by FPC soft boards are pullled etc., are susceptible to and split
Piece phenomenon, whole yield are relatively low.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of fingerprint recognition chips
Encapsulating structure is thick using sapphire cover board, encapsulation for solving to need present in fingerprint recognition packaging method in the prior art
Spend the problem of larger, yield is more low.
In order to achieve the above objects and other related objects, the utility model provides a kind of encapsulation knot of fingerprint recognition chip
Structure, the encapsulating structure include：
Re-wiring layer, the re-wiring layer include opposite first surface and second surface；
Conductive structure is electrically connected positioned at the first surface of the re-wiring layer, and with the re-wiring layer；
Fingerprint recognition chip, positioned at the first surface of the re-wiring layer；The fingerprint recognition chip includes functional areas
Domain and several metal pads on the outside of the functional area are provided with function element, the gold in the functional area
Belong to pad and be located at the front of the fingerprint recognition chip, and be electrically connected with the function element；The fingerprint recognition chip via
The metal pad is connected with the re-wiring layer；And
Capsulation material layer, positioned at the first surface of the re-wiring layer, by the fingerprint recognition chip and the conduction
Structure encapsulate plastic packaging, and surface of the capsulation material layer far from the re-wiring layer with the conductive structure far from described heavy
The surface flush of new route layer.
Preferably, the conductive structure is metal connected ball or metal column.
Preferably, the re-wiring layer includes：
Dielectric layer, the surface that the dielectric layer is in contact with the capsulation material layer for the re-wiring layer the
One surface；
Metal line layer, in the dielectric layer, and the outer surface of the metal line layer and the re-wiring layer
First surface flush；The metal pad and the conductive structure are connected with the metal line layer.
Preferably, the re-wiring layer includes：
Dielectric layer, the surface that the dielectric layer is in contact with the capsulation material layer for the re-wiring layer the
One surface；
Metallic stacked structure, in the dielectric layer；The metallic stacked structure includes the gold of Spaced arrangement
Belong to line layer and metal plug, the metal plug is between the adjacent metal line layer, by the adjacent metal line layer
Electrical connection；The outer surface of the metal line layer of the neighbouring capsulation material layer is equal with the first surface of the re-wiring layer
Together；The metal line layer of the metal pad and the neighbouring capsulation material layer connects.
Preferably, the material of the dielectric layer includes epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorus silicon glass
Any one of glass, fluorine-containing glass, the material of the metal line layer include any one of copper, aluminium, nickel, gold, silver, titanium.
Preferably, several described metal pads are respectively positioned on the side of the functional area, and in the functional area
It arranges in "-" type side.
Preferably, the capsulation material layer includes polyimide layer, layer of silica gel, epoxy resin layer, curable polymer
Any one of based material layer or the curable resin base material bed of material.
The utility model also provides a kind of packaging method of fingerprint recognition chip, and the packaging method includes step：Described in 1
Packaging method includes step：
1) substrate is provided；
2) conductive structure is formed in the upper surface of the substrate；
3) a fingerprint recognition chip is provided, the fingerprint recognition chip includes functional area and outside the functional area
Several metal pads of side are provided with function element in the functional area, and the metal pad is located at the fingerprint recognition
The front of chip, and be electrically connected with the function element；By the fingerprint recognition chip front side downward back bonding in the lining
The upper surface at bottom；
4) capsulation material layer is formed in the upper surface of the substrate, the capsulation material layer is by the conductive structure and described
Fingerprint recognition chip encapsulates plastic packaging；
5) substrate is removed；
6) surface that the conductive structure and the fingerprint recognition chip are exposed in the capsulation material layer is formed again
Wiring layer, the re-wiring layer include opposite first surface and second surface, wherein, the first table of the re-wiring layer
Face with the capsulation material layer expose the surface of the conductive structure and the fingerprint recognition chip and be in contact, and described heavy
New route layer and the metal pad of the fingerprint recognition chip connect.
Preferably, further included between step 1) and step 2) in the upper surface of the substrate formed peeling layer the step of；This
When, in step 2), the conductive structure is formed in the upper surface of the peeling layer, and in step 3), the fingerprint recognition chip is just
For face-down back bonding in the upper surface of the peeling layer, step 4), the capsulation material layer is formed in the peeling layer
Upper surface.
Preferably, the peeling layer includes one kind in adhesive tape and polymeric layer, and the polymeric layer uses spin coating first
Technique is coated on the support substrate surface, then makes its curing molding using ultra-violet curing or heat curing process.
Preferably, in step 2), gold is formed in the upper surface of the substrate using welding procedure or metal paste printing technology
Belong to connected ball or metal column as the conductive structure.
Preferably, in step 4), using compressing and forming process, Transfer molding technique, fluid-tight moulding process, vacuum layer
Pressure technique or spin coating proceeding form the capsulation material layer in the upper surface of the substrate；It is sub- that the capsulation material layer includes polyamides
Any in amine layer, layer of silica gel, epoxy resin layer, the curable polymeric substrate bed of material or the curable resin base material bed of material
Kind.
Preferably, it after step 6), further includes to surface of the capsulation material layer far from the re-wiring layer
The step of carrying out reduction processing, to expose the conductive structure.
As described above, the encapsulating structure of the fingerprint recognition chip of the utility model, has the advantages that：
1) the utility model uses fan-out package (Fan out) fingerprint recognition chip, compared to existing other fingerprints
For identification chip encapsulation, have the advantages that at low cost, thickness is small, yield is high；
2) the utility model does not need to routing technique simultaneously, it is not required that the silicon perforation technique (TSV) of high cost, and can be real
The encapsulation of existing fingerprint recognition chip, greatly reduces technology difficulty and cost；
3) the utility model does not need in addition increase blue directly using cover board of the re-wiring layer as fingerprint recognition chip
Jewel cover board greatly reduces the thickness and cost of encapsulation；
4) for the utility model using encapsulation (Fan out) technique is fanned out to, the electricity of chip, which is drawn, does not need to traditional FPC plates,
The thickness of encapsulation and the stability of electrical deriving structure can be reduced, improves encapsulation yield；
5) the utility model is simple for process, creatively using packaging technology encapsulation fingerprint recognition chip is fanned out to, is partly leading
Body encapsulation technology field is with a wide range of applications.
Description of the drawings
What each step of packaging method that Fig. 1 a~Fig. 1 c are shown as a kind of fingerprint recognition chip of the prior art was presented
Structure diagram.
Each step of packaging method that Fig. 2 a~Fig. 2 c are shown as another fingerprint recognition chip of the prior art is presented
Structure diagram.
Fig. 3 is shown as the flow signal of the packaging method of fingerprint recognition chip provided in the utility model embodiment one
Figure.
Fig. 4~Figure 13 is shown as each step of the packaging method of fingerprint recognition chip provided in the utility model embodiment one
The structure diagram presented, wherein, the structure that Figure 13 is shown as the encapsulating structure of the fingerprint recognition chip of the utility model is shown
It is intended to.
Component label instructions
11 fingerprint recognition chips
12 FPC plates
13 metal connecting lines
14 frames
15 sapphire cover boards
16 through hole electrodes
21 substrates
22 peeling layers
23 conductive structures
24 fingerprint recognition chips
241 functional areas
242 metal pads
25 capsulation material layers
26 re-wiring layers
261 dielectric layers
262 metal line layers
Specific embodiment
Illustrate the embodiment of the utility model below by way of specific specific example, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition
Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints with answering
With carrying out various modifications or alterations under the spirit without departing from the utility model.
Please refer to Fig. 3~Figure 13.It should be noted that the diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of utility model, though when only display is with related component in the utility model rather than according to actual implementation in diagram
Component count, shape and size are drawn, and form, quantity and the ratio of each component can be a kind of random change during actual implementation
Become, and its assembly layout kenel may also be increasingly complex.
Embodiment one
Referring to Fig. 3, the utility model provides a kind of packaging method of fingerprint recognition chip, the packaging method includes step
Suddenly：1 packaging method includes step：
1) substrate is provided；
2) conductive structure is formed in the upper surface of the substrate；
3) a fingerprint recognition chip is provided, the fingerprint recognition chip includes functional area and outside the functional area
Several metal pads of side are provided with function element in the functional area, and the metal pad is located at the fingerprint recognition
The front of chip, and be electrically connected with the function element；By the fingerprint recognition chip front side downward back bonding in the lining
The upper surface at bottom；
4) capsulation material layer is formed in the upper surface of the substrate, the capsulation material layer is by the conductive structure and described
Fingerprint recognition chip encapsulates plastic packaging；
5) substrate is removed；
6) surface that the conductive structure and the fingerprint recognition chip are exposed in the capsulation material layer is formed again
Wiring layer, the re-wiring layer include opposite first surface and second surface, wherein, the first table of the re-wiring layer
Face with the capsulation material layer expose the surface of the conductive structure and the fingerprint recognition chip and be in contact, and described heavy
New route layer and the metal pad of the fingerprint recognition chip connect.
In step 1), S1 steps and Fig. 4 in Fig. 3 are please referred to, a substrate 21 is provided.
As an example, the material of the substrate 21 can include in silicon, glass, silica, ceramics, polymer and metal
One or more kinds of composite materials, shape can be wafer shape, it is rectangular or it is other it is arbitrary needed for shape；The present embodiment
The problems such as rupture, warpage, fracture occur for semiconductor chip in subsequent preparation process is prevented by the substrate 21.
As an example, as shown in figure 4, after providing the substrate 21, further include and formed in the upper surface of the substrate 21
The step of peeling layer 22.
As an example, the peeling layer 22 in subsequent technique as the capsulation material layer 25 that is subsequently formed and the substrate
Separating layer between 21 preferably selects the jointing material with smooth finish surface to be made, must be with the capsulation material layer 25
With certain binding force, to ensure that the capsulation material layer 25 will not generate situations such as mobile in subsequent technique, in addition, its
Also there is stronger binding force with the substrate 21, in general, with the binding force of the substrate 21 need to be more than with it is described
The binding force of capsulation material layer 25.As an example, the material of the peeling layer 22 is selected from the two-sided adhesive tape for being respectively provided with viscosity or logical
Polymeric layer of spin coating proceeding making etc. is crossed, the polymeric layer is coated on 21 table of support substrate using spin coating proceeding first
Then face makes its curing molding using ultra-violet curing or heat curing process.Adhesive tape is preferably using UV adhesive tapes, after the irradiation of UV light
It is easy to pull off.In other embodiments, physical vaporous deposition or chemical vapor deposition also can be selected in the peeling layer 22
Area method formed other materials layer, as epoxy resin (Epoxy), silicon rubber (silicone rubber), polyimides (PI),
Polybenzoxazoles (PBO), benzocyclobutene (BCB) etc..In substrate 21 described in later separation, wet etching, chemistry can be used
Mechanical lapping, the methods of removing, remove the peeling layer 22.
In step 2), S2 steps and Fig. 6 to Fig. 7 in Fig. 3 are please referred to, conduction is formed in the upper surface of the substrate 21
Structure 23.
In one example, make as shown in fig. 6, forming metal connected ball in the upper surface of the substrate 21 using welding procedure
For the conductive structure 23.The metal connected ball can be but be not limited only to copper ball or tin ball.At this point, the metal connected ball
The bigger metal connected ball of major diameter is should be, i.e., the height of described metal connected ball is significantly greater than the straight of the metal connected ball
Diameter, to meet the needs of follow-up plastic package process.
In another example, as shown in fig. 7, forming metal in the upper surface of the substrate 21 using metal paste printing technology
As the conductive structure, the metal connected ball can be but be not limited only to copper ball or tin ball, described for connected ball or metal column
Metal column can be but be not limited only to copper post, tin column etc..Connect at this point, the metal connected ball should be the bigger metal of major diameter
It receives, i.e., the height of described metal connected ball is significantly greater than the diameter of the metal connected ball, to meet follow-up plastic package process
It needs.
In step 3), S3 steps and Fig. 8 and Fig. 9 in please referring to Fig.1 provide a fingerprint recognition chip 24, the finger
Line identification chip 24 includes functional area 241 and several metal pads 242 positioned at 241 outside of functional area, described
Function element (not shown) is provided in functional area 241, the metal pad 242 is being located at the fingerprint recognition chip 24 just
Face, and be electrically connected with the function element；By the 24 face down back bonding of fingerprint recognition chip in the substrate 21
Upper surface.
The fingerprint recognition chip 24 is bonded to as an example, bonding back tracking method (bond-on-trace) may be used
The upper surface of the substrate 21；The bonding back tracking method is not repeated herein known to those skilled in the art.Certainly, this implementation
It can also use a kind of any other bonding method that the fingerprint recognition chip 24 is bonded to the upper table of the substrate 21 in example
Face.
As an example, as shown in figure 9, several described metal pads 242 are respectively positioned on the side of the functional area 241,
And it arranges in the side of the functional area 241 in "-" type.
In step 4), S4 steps and Figure 10 in Fig. 3 are please referred to, capsulation material is formed in the upper surface of the substrate 21
The conductive structure 23 and the fingerprint recognition chip are encapsulated plastic packaging by layer 25, the capsulation material layer 25.
As an example, compressing and forming process, transfer shaping technology, hydraulic seal moulding process, molding bottom may be used
Fill process, capillary underfill technique, vacuum lamination process or spin coating proceeding form described in the upper surface of the substrate 21
Capsulation material layer 25.Preferably, in the present embodiment, institute is formed in the upper surface of the substrate 21 using molded underfill technique
Capsulation material layer 25 is stated, can be effectively prevented from interface debonding occur, and molded underfill will not be as in the prior art in this way
Capillary underfill technique be restricted like that, greatly reduce technology difficulty, can be used for smaller joint gap, it is more suitable
For stacked structure.
As an example, the material of the capsulation material layer 25 can be but be not limited only to polyimide layer, layer of silica gel, epoxy
Resin layer, the curable polymeric substrate bed of material or the curable resin base material bed of material.
As an example, the height of the capsulation material layer 25 is higher than the height of the conductive structure 23, i.e., described plastic packaging material
The conductive structure 23 and the fingerprint recognition chip 24 are encapsulated plastic packaging by the bed of material 25 completely.
Certainly, in other examples, can also be according to the formation plastic packaging material according to the top of the conductive structure 23
The bed of material 25 so that the height of the capsulation material layer 25 of formation is just identical with the height of the conductive structure 23.In this way may be used
To save the technique being subsequently ground to the capsulation material layer 25, so as to reduce processing step, cost has been saved.
In step s 5, S5 steps and Figure 11 in Fig. 3 are please referred to, removes the substrate 21.
As an example, grinding technics, reduction process etc., which may be used, is removed the substrate 21 and the peeling layer 22.
Preferably, in the present embodiment, the peeling layer 22 is UV adhesive tapes, and the mode for tearing the peeling layer 22 may be used to remove
State substrate 21.
In step s 6, S6 steps and Figure 12 in Fig. 3 are please referred to, exposes the conduction in the capsulation material layer 25
The surface of structure 23 and the fingerprint recognition chip 24 forms re-wiring layer 26, and the re-wiring layer 26 includes opposite the
One surface and second surface, wherein, the first surface of the re-wiring layer 26 exposes institute with the capsulation material layer 23
The surface for stating conductive structure 23 and the fingerprint recognition chip 24 is in contact, and the re-wiring layer 26 and the fingerprint recognition
The metal pad 242 of chip 24 connects.
In one example, as shown in figure 12, the re-wiring layer 26 includes one layer of dielectric layer 261 and one layer of metal wire
Layer 262, the surface that the conductive structure 23 and the fingerprint recognition chip 24 are exposed in the capsulation material layer 25 form weight
New route layer 26 includes the following steps：
The surface of the conductive structure 23 and the fingerprint recognition chip 24 6-1) is exposed in the capsulation material layer 25
Form the metal line layer 262；
The surface of the conductive structure 23 and the fingerprint recognition chip 24 6-2) is exposed in the capsulation material layer 25
Dielectric layer 261 is formed, the surface that the dielectric layer 261 is in contact with the capsulation material layer 25 is the re-wiring layer
26 first surface；The outer surface of the metal line layer 262 and the first surface flush of the re-wiring layer 26, i.e., it is described
The surface flush that the outer surface of metal line layer 262 is in contact with the dielectric layer 261 with the capsulation material layer 25；It is described
Metal pad 242 and the conductive structure 23 are connected with the metal line layer 262.
In another example, the re-wiring layer 26 includes one layer of dielectric layer 261 and one layer of metal line layer 262, in
The capsulation material layer 25 exposes the conductive structure 23 and the surface of the fingerprint recognition chip 24 forms re-wiring layer
26 include the following steps：
The surface of the conductive structure 23 and the fingerprint recognition chip 24 6-1) is exposed in the capsulation material layer 25
The dielectric layer 261 is formed, by photoetching and etching technics in forming groove in the dielectric layer 261, the groove is sudden and violent
Expose the metal pad 242 and the conductive structure 23, and define the shape of the metal line layer 262；The dielectric
The surface that layer 261 is in contact with the capsulation material layer 25 is the first surface of the re-wiring layer 26；
6-2) in forming the metal line layer 262 in the groove.
In another example, at least double layer of metal line layer 262 is included in the re-wiring layer 26 and at least one layer of electricity is situated between
Matter layer 261, the surface that the conductive structure 23 and the fingerprint recognition chip 24 are exposed in the capsulation material layer 25 are formed
Re-wiring layer 26 includes the following steps：
The surface of the conductive structure 23 and the fingerprint recognition chip 24 6-1) is exposed in the capsulation material layer 25
Form first layer metal line layer 262；
The surface of the conductive structure 23 and the fingerprint recognition chip 24 6-2) is exposed in the capsulation material layer 25
Dielectric layer 261 is formed, the upper surface of the dielectric layer 261 is higher than the upper surface of the metal line layer 262, and the electricity is situated between
Metal line layer 262 described in surface that matter layer 261 is in contact with the capsulation material layer 25 and first layer and the capsulation material layer
The 25 surface flushes being in contact；
6-3) in the interval that if formation dried layer is electrically connected with metal line layer described in first layer 262 in the dielectric layer 261
Other metal line layers 262 of arrangement are stacked, are electrically connected between the adjacent metal line layer 262 via metal plug.
As an example, in above-mentioned example, the material of the metal line layer 262 can be but be not limited only to copper, aluminium, nickel, gold,
Silver, a kind of material in titanium or two kinds and two or more combined materials, and PVD, CVD, sputtering, plating or chemical plating can be used
Etc. techniques form the metal line layer 262.The material of the dielectric layer 261 can be low k dielectric；It is specifically, described
One kind in epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorosilicate glass and fluorine-containing glass may be used in dielectric layer 261
Material, and the techniques such as spin coating, CVD, plasma enhanced CVD may be used and form the dielectric layer 261.
After step 6), further include and surface of the capsulation material layer 25 far from the re-wiring layer 26 is carried out
The step of reduction processing, to expose the conductive structure 23, i.e., so that the conductive structure 23 is far from the re-wiring layer
26 surface and surface flush of the capsulation material layer 25 far from the re-wiring layer 26.
Embodiment two
Please continue to refer to Figure 13, the utility model also provides a kind of encapsulating structure of fingerprint recognition chip, the encapsulation knot
Structure is prepared by the packaging method described in embodiment one, and the encapsulating structure includes：Re-wiring layer 26, it is described again
Wiring layer 26 includes opposite first surface and second surface；Conductive structure 23, the conductive structure 23 are located at the cloth again
The first surface of line layer 26, and be electrically connected with the re-wiring layer 26；Fingerprint recognition chip 24, the fingerprint recognition chip 24
Positioned at the first surface of the re-wiring layer 26；The fingerprint recognition chip 24 includes functional area 241 and positioned at the work(
Can the outside of region 241 several metal pads 242, be provided with function element, the metal pad in the functional area 241
242 are located at the front of the fingerprint recognition chip 24, and are electrically connected with the function element；The fingerprint recognition chip 24 via
The metal pad 242 is connected with the re-wiring layer 26；And capsulation material layer 25, the capsulation material layer 25 are located at
The fingerprint recognition chip 24 and the conductive structure 23 are encapsulated plastic packaging, and institute by the first surface of the re-wiring layer 26
Surface of the capsulation material layer 25 far from the re-wiring layer 26 is stated with the conductive structure 23 far from the re-wiring layer 26
Surface flush.
As an example, the conductive structure 23 can be metal connected ball or metal column.The metal connected ball can be
But it is not limited only to copper ball or tin ball；The metal column can be but be not limited only to copper post or tin column.
In one example, the re-wiring layer 26 includes：Dielectric layer 261, the dielectric layer 261 and the plastic packaging
The surface that material layer 25 is in contact is the first surface of the re-wiring layer 26；Metal line layer 262, the metal line layer 262
In the dielectric layer 261, and the outer surface of the metal line layer 262 and the first surface phase of the re-wiring layer 26
Concordantly；The metal pad 242 and the conductive structure 23 are connected with the metal line layer 262.
In another example, the re-wiring layer 26 includes：Dielectric layer 261, the dielectric layer 261 and the modeling
The surface that closure material layer 25 is in contact is the first surface of the re-wiring layer 26；Metallic stacked structure, it is described metal laminated
Structure is located in the dielectric layer 594；The metallic stacked structure includes the metal line layer 262 and metal of Spaced arrangement
The adjacent metal line layer 262 is electrically connected by plug, the metal plug between the adjacent metal line layer 262；
The outer surface of the metal line layer 262 of the neighbouring capsulation material layer 25 is equal with the first surface of the re-wiring layer 26
Together；The metal line layer 262 of the metal pad 242 and the neighbouring capsulation material layer 25 connects.
As an example, the material of the dielectric layer 261 includes epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorus
Any one of silica glass, fluorine-containing glass, the material of the metal line layer 262 include any in copper, aluminium, nickel, gold, silver, titanium
Kind.
As an example, several described metal pads 242 are respectively positioned on the side of the functional area 241, and in the work(
It arranges in "-" type the side in energy region 241.
As an example, the capsulation material layer 25 includes polyimide layer, layer of silica gel, epoxy resin layer, curable poly-
Close any one of object based material layer or the curable resin base material bed of material.
In conclusion the utility model provides a kind of encapsulating structure of fingerprint recognition chip, the encapsulating structure includes：Weight
New route layer, the re-wiring layer include opposite first surface and second surface；Conductive structure, positioned at the rewiring
The first surface of layer, and be electrically connected with the re-wiring layer；Fingerprint recognition chip, positioned at the first table of the re-wiring layer
Face；The fingerprint recognition chip includes functional area and several metal pads on the outside of the functional area, the work(
Can be provided with function element in region, the metal pad is located at the front of the fingerprint recognition chip, and with the effector
Part is electrically connected；The fingerprint recognition chip is connected via the metal pad and the re-wiring layer；And capsulation material
The fingerprint recognition chip and the conductive structure positioned at the first surface of the re-wiring layer, are encapsulated plastic packaging, and institute by layer
State surface of the capsulation material layer far from the re-wiring layer and surface phase of the conductive structure far from the re-wiring layer
Concordantly.The encapsulating structure of the fingerprint recognition chip of the utility model, has the advantages that：1) the utility model is used and is fanned out to
Type encapsulate (Fan out) fingerprint recognition chip, for existing other fingerprint recognition chip packages, have it is at low cost,
The advantages of thickness is small, yield is high；2) the utility model does not need to routing technique simultaneously, it is not required that the silicon perforation technique of high cost
(TSV), it can realize the encapsulation of fingerprint recognition chip, greatly reduce technology difficulty and cost；3) the utility model is directly adopted
By the use of re-wiring layer as the cover board of fingerprint recognition chip, do not need in addition increase sapphire cover board, greatly reduce encapsulation
Thickness and cost；4) for the utility model using encapsulation (Fan out) technique is fanned out to, the electricity of chip, which is drawn, does not need to traditional FPC
Plate can reduce the thickness of encapsulation and the stability of electrical deriving structure, improve encapsulation yield；5) the utility model technique letter
It is single, creatively using packaging technology encapsulation fingerprint recognition chip is fanned out to, have in technical field of semiconductor encapsulation and widely should
Use prospect.
The above embodiments are only illustrative of the principle and efficacy of the utility model, new not for this practicality is limited
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications completed under refreshing and technological thought or change, should be covered by the claim of the utility model.
Claims (7)
1. a kind of encapsulating structure of fingerprint recognition chip, which is characterized in that the encapsulating structure includes：
Re-wiring layer, the re-wiring layer include opposite first surface and second surface；
Conductive structure is electrically connected positioned at the first surface of the re-wiring layer, and with the re-wiring layer；
Fingerprint recognition chip, positioned at the first surface of the re-wiring layer；The fingerprint recognition chip include functional area and
Several metal pads on the outside of the functional area are provided with function element, the metal welding in the functional area
Disk is located at the front of the fingerprint recognition chip, and is electrically connected with the function element；The fingerprint recognition chip is via described
Metal pad is connected with the re-wiring layer；And
Capsulation material layer, positioned at the first surface of the re-wiring layer, by the fingerprint recognition chip and the conductive structure
Encapsulate plastic packaging, and surface of the capsulation material layer far from the re-wiring layer and the separate cloth again of the conductive structure
The surface flush of line layer.
2. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The conductive structure is metal
Connected ball or metal column.
3. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The re-wiring layer packet
It includes：
Dielectric layer, the surface that the dielectric layer is in contact with the capsulation material layer are the first table of the re-wiring layer
Face；
Metal line layer, in the dielectric layer, and the outer surface of the metal line layer and the first of the re-wiring layer
Surface flush；The metal pad and the conductive structure are connected with the metal line layer.
4. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The re-wiring layer packet
It includes：
Dielectric layer, the surface that the dielectric layer is in contact with the capsulation material layer are the first table of the re-wiring layer
Face；
Metallic stacked structure, in the dielectric layer；The metallic stacked structure includes the metal wire of Spaced arrangement
The adjacent metal line layer is electrically connected by layer and metal plug, the metal plug between the adjacent metal line layer
It connects；The outer surface of the metal line layer of the neighbouring capsulation material layer and the first surface flush of the re-wiring layer；
The metal line layer of the metal pad and the neighbouring capsulation material layer connects.
5. the encapsulating structure of fingerprint recognition chip according to claim 3 or 4, it is characterised in that：The dielectric layer
Material includes epoxy resin, silica gel, PI, PBO, BCB, silica, any one of phosphorosilicate glass, fluorine-containing glass, the metal
The material of line layer includes any one of copper, aluminium, nickel, gold, silver, titanium.
6. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：Several described metal pads
The side of the functional area is respectively positioned on, and is arranged in the side of the functional area in "-" type.
7. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The capsulation material layer includes
In polyimide layer, layer of silica gel, epoxy resin layer, the curable polymeric substrate bed of material or the curable resin base material bed of material
It is any.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107644845A (en) * | 2017-09-06 | 2018-01-30 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and method for packing of fingerprint recognition chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107644845A (en) * | 2017-09-06 | 2018-01-30 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and method for packing of fingerprint recognition chip |
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Address after: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province (place of business: No.9 Dongsheng West Road, Jiangyin City) Patentee after: Shenghejing micro semiconductor (Jiangyin) Co.,Ltd. Address before: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province Patentee before: SJ Semiconductor (Jiangyin) Corp. |
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