CN209328893U - The encapsulating structure of antenna - Google Patents
The encapsulating structure of antenna Download PDFInfo
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- CN209328893U CN209328893U CN201920270043.XU CN201920270043U CN209328893U CN 209328893 U CN209328893 U CN 209328893U CN 201920270043 U CN201920270043 U CN 201920270043U CN 209328893 U CN209328893 U CN 209328893U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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Abstract
The utility model provides a kind of encapsulating structure of antenna, encapsulating structure includes: re-wiring layer, the first metal feeder column, antenna circuit chip, the first encapsulated layer, first antenna metal layer, the second metal feeder column, the second encapsulated layer, the second antenna metal layer and metal coupling, and the first encapsulated layer coats the first metal feeder column and the antenna circuit chip.The utility model can prepare the antenna structure of the multilayer of bottom-up stacking, can effectively improve the efficiency of antenna and reduce occupied area.Antenna circuit chip manufacturing be packaged it in the side of antenna metal layer, and using encapsulated layer by the utility model, can be packaged protection to antenna circuit chip while not additional process step, improve the stability of antenna packages structure.
Description
Technical field
The utility model belongs to field of semiconductor package, more particularly to the encapsulating structure and packaging method of a kind of antenna.
Background technique
Due to the progress of science and technology, various high-tech electronic products are developed to facilitate people's lives, including each
Kind electronic device, such as: notebook computer, mobile phone, tablet computer (PAD).
With universal and people's demand the increase of these high-tech electronic products, in addition to institute in these high-tech products
Outside the various functions of configuration and application increase considerably, wireless telecommunications are increased especially for the mobile demand of cooperation people
Function.Then, people can be installed on any place or be appointed by these high-tech electronics with wireless communication function
When quarter uses these high-tech electronic products.To significantly increase the flexibility that these high-tech electronic products use
With convenience, therefore, people need not be again limited in a fixed region, break the boundary of use scope, so that
The application of these electronic products veritably facilitates people's lives.
In general, existing antenna structure generally include dipole antenna, unipole antenna, plate aerial, inverted-F antenna,
Indentation antenna, inversed l-shaped antenna, cycle antenna, helical antenna and spring antenna etc..The known practice is that antenna is direct
It is made in the surface of circuit board, this practice can allow antenna to occupy additional board area, and conformability is poor.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of encapsulating structures of antenna
And packaging method, the efficiency and performance for solving the problems, such as antenna in the prior art are lower.
In order to achieve the above objects and other related objects, the utility model provides a kind of encapsulating structure of antenna, the envelope
Assembling structure includes: re-wiring layer, and the re-wiring layer includes the first face and the second opposite face；First metal feeder
Column is formed on the second face of the re-wiring layer；Antenna circuit chip is incorporated into the second face of the re-wiring layer,
And it is connect by the re-wiring layer with the first metal feeder column；First encapsulated layer coats first metal feeder
Column and the antenna circuit chip, and its top surface appears the first metal feeder column；First antenna metal layer is formed in described
On first encapsulated layer, the first antenna metal layer is connect with the first metal feeder column；Second metal feeder column, is formed in
On the first antenna metal layer；Second encapsulated layer coats the second metal feeder column, and its top surface appears second gold medal
Belong to feeder pillar；Second antenna metal layer is formed on second encapsulated layer, the second antenna metal layer and second gold medal
Belong to feeder pillar connection；Metal coupling is formed in the first face of the re-wiring layer, to realize the electrical property of the re-wiring layer
It draws.
It optionally, further include the antenna structure of several stackings on the second antenna metal layer, the antenna structure includes:
Third metal feeder column is formed on the second antenna metal layer；Third encapsulated layer coats the third metal feeder column,
And its top surface appears the third metal feeder column；Third antenna metal layer is formed on the third encapsulated layer, the third
Antenna metal layer is connect with the third metal feeder column.
Optionally, the number of the antenna structure on the second antenna metal layer is stacked between 1~5.
Optionally, the material of the first metal feeder column and the second metal feeder column includes one in Au, Ag, Cu, Al
Kind.
Optionally, the material of first encapsulated layer and the second encapsulated layer includes polyimides, silica gel and epoxy resin
One of.
Optionally, the antenna circuit chip includes one or both of driving component and passive component, wherein described
Driving component includes one of electric power management circuit, transmit circuit and reception circuit, and the passive component includes resistance, capacitor
And one of inductance.
Optionally, the metal coupling includes one of tin solder, silver solder and gold-tin eutectic solder.
The utility model also provides a kind of packaging method of antenna, 1) packaging method is comprising steps of provide a support
Substrate forms separating layer in Yu Suoshu support substrate；2) re-wiring layer, the re-wiring layer are formed in Yu Suoshu separating layer
Including the first face and the second opposite face being connect with the separating layer；3) it is formed on the second face of Yu Suoshu re-wiring layer
First metal feeder column；4) an antenna circuit chip is provided, the antenna circuit chip is engaged in the re-wiring layer
Second face, so that the antenna circuit chip is connect by the re-wiring layer with the first metal feeder column；5) it uses
First encapsulated layer encapsulates the first metal feeder column, first encapsulated layer is thinned, to appear the first metal feeder column；
6) first antenna metal layer, the first antenna metal layer and the first metal feeder column are formed on the first encapsulated layer of Yu Suoshu
Connection；7) the second metal feeder column is formed on Yu Suoshu first antenna metal layer；8) using the second encapsulated layer encapsulation described second
Second encapsulated layer is thinned in metal feeder column, to appear the second metal feeder column；9) shape on the second encapsulated layer of Yu Suoshu
At the second antenna metal layer, the second antenna metal layer is connect with the second metal feeder column；10) it is based on the separating layer
The re-wiring layer and the support substrate are removed, the first face of the re-wiring layer is exposed；11) Yu Suoshu rewiring
First face of layer forms metal coupling, to realize that the electrical of the re-wiring layer is drawn.
Optionally, between step 9)~step 10) further include: repeat step 7)~step 9), to form multilayer heap
Folded antenna structure.
Optionally, the duplicate number is between 1~5 time.
Optionally, the support substrate includes glass substrate, metal substrate, semiconductor substrate, polymer substrate and ceramics
One of substrate.
Optionally, the separating layer includes photothermal transformation layer, and step 6) uses photothermal transformation layer described in laser irradiation, so that
The photothermal transformation layer is separated with the encapsulated layer and the support substrate, and then removes the re-wiring layer and the support
Substrate.
Optionally, the material of the first metal feeder column and the second metal feeder column includes one in Au, Ag, Cu, Al
Kind.
Optionally, step 5) and step 8) using the method that encapsulated layer encapsulates the metal feeder column include compression forming,
One of Transfer molding, fluid-tight molding, vacuum lamination and spin coating, the material of first encapsulated layer and the second encapsulated layer
Including one of polyimides, silica gel and epoxy resin.
Optionally, the metal coupling includes one of tin solder, silver solder and gold-tin eutectic solder.
Optionally, the antenna circuit chip includes one or both of driving component and passive component, wherein described
Driving component includes one of electric power management circuit, transmit circuit and reception circuit, and the passive component includes resistance, capacitor
And one of inductance.
As described above, the encapsulating structure and packaging method of the antenna of the utility model, have the advantages that
The utility model can prepare the antenna structure of the multilayer of bottom-up stacking, can effectively improve the efficiency of antenna with
And reduce occupied area.
The utility model by antenna circuit chip manufacturing in the side of antenna metal layer, and using encapsulated layer carry out to its into
Row encapsulation can be packaged protection to antenna circuit chip while not additional process step, improve antenna packages knot
The stability of structure.
The utility model uses fan-out package method encapsulating antenna structure, encapsulation volume can be effectively reduced, so that antenna
Encapsulating structure integrated level with higher and better encapsulation performance, before field of semiconductor package has a wide range of applications
Scape.
Detailed description of the invention
Fig. 1~Figure 18 is shown as the structural schematic diagram that each step of packaging method of the antenna of the utility model is presented,
In, Figure 18 is shown as the structural schematic diagram of the encapsulating structure of the antenna of the utility model.
Component label instructions
101 support substrates
102 separating layers
20 re-wiring layers
201 dielectric layers
202 metal wiring layers
203 first metal feeder columns
204 first encapsulated layers
205 first antenna metal layers
206 second metal feeder columns
207 second encapsulated layers
208 second antenna metal layers
209 third metal feeder columns
210 third encapsulated layers
211 third antenna metal layers
301 antenna circuit chips
401 metal couplings
Specific embodiment
Illustrate the embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition
Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints and answer
With carrying out various modifications or alterations under the spirit without departing from the utility model.
Please refer to Fig. 1~Figure 18.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of utility model is only shown with related component in the utility model rather than when according to actual implementation in diagram then
Component count, shape and size are drawn, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind
Become, and its assembly layout kenel may also be increasingly complex.
As shown in Fig. 1~Figure 18, the present embodiment provides a kind of packaging method of antenna, the packaging method includes:
As shown in FIG. 1 to FIG. 2, step 1) is carried out first, a support substrate 101, shape in Yu Suoshu support substrate 101 are provided
At separating layer 102.
As an example, the support substrate 101 include glass substrate, metal substrate, semiconductor substrate, polymer substrate and
One of ceramic substrate.In the present embodiment, it is glass substrate, the glass substrate cost that the support substrate 101, which is selected,
It is lower, it is easy to be formed on its surface separating layer 102, and the difficulty of subsequent stripping technology can be reduced.
As an example, the separating layer 102 includes photothermal transformation layer (LTHC), the support is formed in by spin coating proceeding
After in substrate 101, its curing molding is made by curing process.Photothermal transformation layer (LTHC) performance is stablized, and surface is more smooth, favorably
In the production of subsequent re-wiring layer 20, also, in subsequent stripping technology, the difficulty of removing is lower.
As shown in figure 3, then carrying out step 2), re-wiring layer 20, the cloth again are formed in Yu Suoshu separating layer 102
Line layer 20 includes the first face connecting with the separating layer 102 and the second opposite face, and the re-wiring layer 20 includes being situated between
Matter layer 201 and metal wiring layer 202.
For example, it may include step that step 2), which makes the re-wiring layer 20:
Step 2-1), using chemical vapor deposition process or physical gas-phase deposition in the 102 surface shape of separating layer
At first medium layer, the material of the first medium layer includes epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorus silicon glass
Glass, the combination of one or more of fluorine-containing glass.The material of the first medium layer can be selected as PI (polyimides),
To further decrease technology difficulty and process costs.
Step 2-2), the first metal layer is formed in the first medium layer surface using sputtering technology, and to the metal
Layer performs etching to form patterned first metal wiring layer.The material of first metal wiring layer include copper, aluminium, nickel, gold,
The combination of one or more of silver, titanium.
Step 2-3), using chemical vapor deposition process or physical gas-phase deposition in patterned first metal
It is routed layer surface and forms second dielectric layer, and the second dielectric layer is performed etching and to form second Jie with graphical through-hole
Matter layer.The material of the second dielectric layer includes epoxy resin, silica gel, PI, PBO, BCB, silica, phosphorosilicate glass, fluorine-containing glass
The combination of one or more of glass.The material of the second dielectric layer can be selected as PI (polyimides), with further
Reduce technology difficulty and process costs.
Rapid 2-4), in filling conductive plug in the graphical through-hole, then using sputtering technology in the second medium
Layer surface forms second metal layer, and performs etching to form patterned second metal wiring layer to the metal layer.Described
The material of two metal wiring layers includes the combination of one or more of copper, aluminium, nickel, gold, silver, titanium.
Then, above-mentioned steps 2-3 can be repeated)~step 2-4), there is multilayer lamination structure again to be formed
Wiring layer 20, to realize different wiring functions.
As shown in figure 4, then carrying out step 3), the first metal feeder is formed on the second face of Yu Suoshu re-wiring layer 20
Column 203, the first metal feeder column 203 are electrically connected with the re-wiring layer 20, for example, routing technique can be used
The first metal feeder column 203 is formed on second face of (wire bond) Yu Suoshu re-wiring layer 20.
The material of the first metal feeder column 203 can be one of Au, Ag, Cu, Al.For example, the metal feedback
Terminal can be selected as Cu.
As shown in figure 5, then carrying out step 4), an antenna circuit chip 301 is provided, by the antenna circuit chip 301
Be engaged in the second face of the re-wiring layer 20 so that the antenna circuit chip 301 by the re-wiring layer 20 with
The first metal feeder column 203 connects.For example, by welding procedure or ball technique can be planted by the antenna circuit chip
301 are engaged in the second face of the re-wiring layer 20, so that the antenna circuit chip 301 and the re-wiring layer 20
It is electrically connected.
For example, the antenna circuit chip 301 can be one or both of driving component and passive component, wherein institute
Stating driving component includes one of electric power management circuit, transmit circuit and reception circuit, and the passive component includes resistance, electricity
One of appearance and inductance.
As shown in Fig. 6~Fig. 7, step 5) is then carried out, the first metal feeder column is encapsulated using the first encapsulated layer 204
203 and the antenna circuit chip 301, first encapsulated layer 204 is thinned, so that the top of the first metal feeder column 203
Face is revealed in first encapsulated layer 204.
As an example, encapsulating the first metal feeder column 203 and the antenna circuit chip using the first encapsulated layer 204
301 method includes one of compression forming, Transfer molding, fluid-tight molding, vacuum lamination and spin coating, first envelope
The material for filling layer 204 includes one of polyimides, silica gel and epoxy resin.
Antenna circuit chip 301 is made in the side of antenna metal layer by the utility model, and is carried out pair using encapsulated layer
It is packaged, and can be packaged protection to antenna circuit chip 301 while not additional process step, improve antenna
The stability of encapsulating structure.
As shown in figure 8, then carrying out step 6), 204 surface of the first encapsulated layer of Yu Suoshu forms first antenna metal layer
205, the first antenna metal layer 205 is connect with the metal feeder column.
For example, can make the first antenna metal layer 205 using depositing operation and etching technics can for another example adopt
The first antenna metal layer 205 is made with metal lift-off material (lift-off).
As shown in figure 9, then carrying out step 7), the second metal feeder column is formed on Yu Suoshu first antenna metal layer 205
206。
Described second is formed for example, can use on routing technique (wire bond) Yu Suoshu first antenna metal layer 205
Metal feeder column 206.The material of the second metal feeder column 206 can be one of Au, Ag, Cu, Al.For example, described
Second metal feeder column 206 can be selected as Cu.
As shown in Figure 10~Figure 11, step 8) is then carried out, second metal feeder is encapsulated using the second encapsulated layer 207
Second encapsulated layer 207 is thinned in column 206, to appear the second metal feeder column 206.
As an example, including being compressed into using the method that the second encapsulated layer 207 encapsulates the second metal feeder column 206
One of type, Transfer molding, fluid-tight molding, vacuum lamination and spin coating, the material of second encapsulated layer 207 include poly-
One of acid imide, silica gel and epoxy resin.
As shown in figure 12, step 9) is then carried out, forms the second antenna metal layer 208 on the second encapsulated layer of Yu Suoshu 207,
The second antenna metal layer 208 is connect with the second metal feeder column 206.
For example, can make the second antenna metal layer 208 using depositing operation and etching technics can for another example adopt
The second antenna metal layer 208 is made with metal lift-off material (lift-off).
As shown in FIG. 13 to 16, step 7)~step 9) can be repeated, to form the antenna structure of multiple-level stack.
The duplicate number is between 1~5 time.
Specifically, it may include steps of:
As shown in figure 13, third metal feeder column 209 is formed on the second antenna metal of Yu Suoshu layer 208.
The third is formed for example, can use on routing technique (wire bond) the second antenna metal of Yu Suoshu layer 208
Metal feeder column 209.The material of the third metal feeder column 209 can be one of Au, Ag, Cu, Al.For example, described
Third metal feeder column 209 can be selected as Cu.
As shown in Figure 14~Figure 15, the third metal feeder column 209 is encapsulated using third encapsulated layer 210, is thinned described
Third encapsulated layer 210, to appear the third metal feeder column 209.
As an example, including being compressed into using the method that third encapsulated layer 210 encapsulates the third metal feeder column 209
One of type, Transfer molding, fluid-tight molding, vacuum lamination and spin coating, the material of the third encapsulated layer 210 include poly-
One of acid imide, silica gel and epoxy resin.
As shown in figure 16, third antenna metal layer 211, the third antenna gold are formed on Yu Suoshu third encapsulated layer 210
Belong to layer 211 to connect with the third metal feeder column 209.
For example, can make the third antenna metal layer 211 using depositing operation and etching technics can for another example adopt
The third antenna metal layer 211 is made with metal lift-off material (lift-off).
It can further repeat the above steps, to obtain the antenna structure of required stacking number.
As shown in figure 17, step 10) is then carried out, the re-wiring layer 20 and institute are removed based on the separating layer 102
Support substrate 101 is stated, the first face of the re-wiring layer 20 is exposed.
Specifically, the separating layer 102 includes photothermal transformation layer, uses photothermal transformation layer described in laser irradiation herein, with
It separates the photothermal transformation layer with the re-wiring layer 20 and the support substrate 101, and then removes the rewiring
Layer 20 and the support substrate 101.
As shown in figure 18, step 11) is finally carried out, the first face of Yu Suoshu re-wiring layer 20 forms metal coupling 401,
To realize that the electrical of the re-wiring layer 20 is drawn.
For example, the metal coupling 401 can be one of tin solder, silver solder and gold-tin eutectic solder.
As shown in figure 18, the present embodiment also provides a kind of encapsulating structure of antenna, and the encapsulating structure includes: rewiring
Layer 20, the re-wiring layer 20 include the first face and the second opposite face；First metal feeder column 203 is formed in described
On second face of re-wiring layer 20；Antenna circuit chip 301, is incorporated into the second face of the re-wiring layer 20, and passes through
The re-wiring layer 20 is connect with the first metal feeder column 203；First encapsulated layer 204 coats the first metal feedback
Terminal 203 and the antenna circuit chip 301, and its top surface appears the first metal feeder column 203；First antenna metal layer
205, it is formed on first encapsulated layer 204, the first antenna metal layer 205 connects with the first metal feeder column 203
It connects；Second metal feeder column 206 is formed on the first antenna metal layer 205；Second encapsulated layer 207, cladding described second
Metal feeder column 206, and its top surface appears the second metal feeder column 206；Second antenna metal layer 208 is formed in described
On second encapsulated layer 207, the second antenna metal layer 208 is connect with the second metal feeder column 206；Metal coupling 401,
It is formed in the first face of the re-wiring layer 20, to realize that the electrical of the re-wiring layer 20 is drawn.
As an example, further including the antenna structure of several stackings, the antenna structure on the second antenna metal layer 208
Include: third metal feeder column 209, is formed on the second antenna metal layer 208；Third encapsulated layer 210 coats described the
Three metal feeder columns 209, and its top surface appears the third metal feeder column 209；Third antenna metal layer 211 is formed in institute
It states on third encapsulated layer 210, the third antenna metal layer 211 is connect with the third metal feeder column 209.
As an example, being stacked on the number of the antenna structure on the second antenna metal layer 208 between 1~5.
As an example, the material of the first metal feeder column 203 and the second metal feeder column 206 include Au, Ag, Cu,
One of Al.
As an example, the material of first encapsulated layer 204 and the second encapsulated layer 207 include polyimides, silica gel and
One of epoxy resin.
As an example, the antenna circuit chip 301 includes one or both of driving component and passive component, wherein
The driving component includes electric power management circuit, transmit circuit and receives one of circuit, the passive component include resistance,
One of capacitor and inductance.
As an example, the metal coupling 401 includes one of tin solder, silver solder and gold-tin eutectic solder.
As described above, the encapsulating structure and packaging method of the antenna of the utility model, have the advantages that
The utility model can prepare the antenna structure of the multilayer of bottom-up stacking, can effectively improve the efficiency of antenna with
And reduce occupied area.
The utility model by antenna circuit chip manufacturing in the side of antenna metal layer, and using encapsulated layer carry out to its into
Row encapsulation can be packaged protection to antenna circuit chip while not additional process step, improve antenna packages knot
The stability of structure.
The utility model uses fan-out package method encapsulating antenna structure, encapsulation volume can be effectively reduced, so that antenna
Encapsulating structure integrated level with higher and better encapsulation performance, before field of semiconductor package has a wide range of applications
Scape.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (7)
1. a kind of encapsulating structure of antenna, which is characterized in that the encapsulating structure includes:
Re-wiring layer, the re-wiring layer include the first face and the second opposite face；
First metal feeder column, is formed on the second face of the re-wiring layer；
Antenna circuit chip is incorporated into the second face of the re-wiring layer, and passes through the re-wiring layer and described first
The connection of metal feeder column；
First encapsulated layer coats the first metal feeder column and the antenna circuit chip, and its top surface appears described first
Metal feeder column；
First antenna metal layer is formed on first encapsulated layer, and the first antenna metal layer and first metal are presented
Terminal connection；
Second metal feeder column is formed on the first antenna metal layer；
Second encapsulated layer coats the second metal feeder column, and its top surface appears the second metal feeder column；
Second antenna metal layer is formed on second encapsulated layer, and the second antenna metal layer and second metal are presented
Terminal connection；
Metal coupling is formed in the first face of the re-wiring layer, to realize that the electrical of the re-wiring layer is drawn.
2. the encapsulating structure of antenna according to claim 1, it is characterised in that: further include on the second antenna metal layer
The antenna structure of several stackings, the antenna structure include:
Third metal feeder column is formed on the second antenna metal layer；
Third encapsulated layer coats the third metal feeder column, and its top surface appears the third metal feeder column；
Third antenna metal layer is formed on the third encapsulated layer, and the third antenna metal layer and the third metal are presented
Terminal connection.
3. the encapsulating structure of antenna according to claim 2, it is characterised in that: be stacked on the second antenna metal layer
The number of the antenna structure is between 1~5.
4. the encapsulating structure of antenna according to claim 1, it is characterised in that: the first metal feeder column and the second gold medal
The material for belonging to feeder pillar includes one of Au, Ag, Cu, Al.
5. the encapsulating structure of antenna according to claim 1, it is characterised in that: first encapsulated layer and the second encapsulated layer
Material include one of polyimides, silica gel and epoxy resin.
6. the encapsulating structure of antenna according to claim 1, it is characterised in that: the antenna circuit chip includes active set
One or both of part and passive component, wherein the driving component includes electric power management circuit, transmit circuit and receives electric
One of road, the passive component include one of resistance, capacitor and inductance.
7. the encapsulating structure of antenna according to claim 1, it is characterised in that: the metal coupling includes tin solder, silver
One of solder and gold-tin eutectic solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920270043.XU CN209328893U (en) | 2019-03-04 | 2019-03-04 | The encapsulating structure of antenna |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920270043.XU CN209328893U (en) | 2019-03-04 | 2019-03-04 | The encapsulating structure of antenna |
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| Publication Number | Publication Date |
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| CN209328893U true CN209328893U (en) | 2019-08-30 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109768031A (en) * | 2019-03-04 | 2019-05-17 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and packaging method of antenna |
| WO2021056859A1 (en) * | 2019-09-29 | 2021-04-01 | 上海先方半导体有限公司 | 2.5-d multi-chip packaging structure for integrated antenna structure, and manufacturing method |
-
2019
- 2019-03-04 CN CN201920270043.XU patent/CN209328893U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109768031A (en) * | 2019-03-04 | 2019-05-17 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and packaging method of antenna |
| WO2021056859A1 (en) * | 2019-09-29 | 2021-04-01 | 上海先方半导体有限公司 | 2.5-d multi-chip packaging structure for integrated antenna structure, and manufacturing method |
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Address after: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province (place of business: No.9 Dongsheng West Road, Jiangyin City) Patentee after: Shenghejing micro semiconductor (Jiangyin) Co.,Ltd. Address before: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province Patentee before: SJ Semiconductor (Jiangyin) Corp. |
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