CN207022276U - A kind of ceramic substrate - Google Patents
A kind of ceramic substrate Download PDFInfo
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- CN207022276U CN207022276U CN201720580328.4U CN201720580328U CN207022276U CN 207022276 U CN207022276 U CN 207022276U CN 201720580328 U CN201720580328 U CN 201720580328U CN 207022276 U CN207022276 U CN 207022276U
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- ceramic substrate
- ceramic
- radiation aluminium
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- foil
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Abstract
It the utility model is related to a kind of ceramic substrate, including laminating printed circuit copper foil layer, ceramic substrate layer and radiation aluminium layers of foil successively from top to bottom, the ceramic substrate layer is made up of plural block ceramic wafer, each ceramic wafer be arranged in parallel in the horizontal direction, it is bonded between two pieces of adjacent ceramic wafers by heat conductive silica gel, the radiation aluminium layers of foil includes the spaced radiation aluminium chaff of plural bar, is parallel to each other between each radiation aluminium chaff.Solve existing ceramic substrate because area is big or outside temperature drastically changes by the utility model, cause ceramic substrate to be also easy to produce crackle, or even the problem of cracking breaking-up.
Description
Technical field
It the utility model is related to matrix technique field, more particularly to a kind of ceramic substrate.
Background technology
Ceramic substrate refers to the spy that copper foil layer is bonded directly on aluminum oxide or aluminium nitride ceramic substrate surface at high temperature
Different board, the etched circuit typically on copper foil layer, the relevant position welding of the pins of circuit components on copper foil layer.It is made
Into ceramic substrate there is good electrical insulation performance, high heat conduction characteristic and high-adhesion.
Such as a kind of new ceramics base disclosed on 02 11st, 2014 Chinese patent Authorization Notice No. CN204155956U
Plate, including LED chip and ceramic substrate, the ceramic base plate surface is provided with applies copper circuit, the LED chip upside-down mounting without medium
It is connected on ceramic substrate, and with applying copper circuit without medium by gold thread, LED chip is in ceramic substrate arrangement form annular in shape
LED chip array.The Novel ceramic base plate simple structure, cost is low, using ceramic substrate uvioresistant made of aluminium oxide ceramics
Line is strong, good heat conductivity, using the deposited copper circuit without medium, avoids the sulfation that original silver paste circuit occurs.
But the inventors discovered that, above-mentioned Novel ceramic base plate in actual applications, it mainly leads by ceramic substrate
Heat and radiating, because the fragility of ceramic substrate is bigger, the bigger fragility of area of ceramic substrate is bigger, if being installed in ceramic substrate
High-power LED chip, LED chip can produce high heat when working, cause ceramic substrate high temperature, if if now outside temperature
Change is compared drastically, repeated multiple times to get off and ceramic substrate be caused to crack, or even cracking damages.
Kafra fiber, English original name KEVLAR, it is a kind of aramid fiber material, with density is low, intensity is high, toughness
The advantages of good, high temperature resistant, easy to process and shaping.
Utility model content
Therefore, for it is above-mentioned the problem of, the utility model proposes a kind of ceramic substrate, solve existing ceramic substrate by
Drastically change in the big or outside temperature of area, cause ceramic substrate to be also easy to produce crackle, or even the problem of cracking breaking-up.
To achieve the above object, the utility model employs following technical scheme：A kind of ceramic substrate, including from top to bottom
Laminating printed circuit copper foil layer, ceramic substrate layer and radiation aluminium layers of foil successively, the ceramic substrate layer is by plural block ceramic wafer
Composition, each ceramic wafer be arranged in parallel, is bonded between adjacent two pieces of ceramic wafers by heat conductive silica gel in the horizontal direction, described
Radiation aluminium layers of foil includes the spaced radiation aluminium chaff of plural bar, is parallel to each other between each radiation aluminium chaff.
Further, each ceramic wafer uses the closed pore ceramic material with loose structure.
Further, between ceramic substrate layer and the radiation aluminium layers of foil from top to bottom also it is laminating have the first adhesive linkage,
Kafra fiber layer, the second adhesive linkage.
By using preceding solution, the beneficial effects of the utility model are：The ceramic substrate layer of this ceramic substrate by
Plural block ceramic wafer composition, ceramic plate suqare is small, reduces ceramic substrate layer fragility.Each ceramic wafer is put down in the horizontal direction
Row is set, and is bonded between adjacent two pieces of ceramic wafers by heat conductive silica gel, ceramic substrate layer is had certain pliability；Radiating
Aluminium foil layer is made up of the spaced radiation aluminium chaff of plural bar, reduces the usage amount of aluminium foil, saves cost；Further,
Ceramic wafer uses closed pore ceramic material, has porosity height, anti-thermal shock, high temperature resistant and good mechanical strength；Further, make pottery
Kafra fiber layer is bonded between porcelain substrate layer and radiation aluminium layers of foil, strengthens the intensity and pliability of ceramic substrate.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model embodiment.
Embodiment
The utility model is further illustrated in conjunction with the drawings and specific embodiments.
With reference to figure 1, the present embodiment provides a kind of ceramic substrate, including printed circuit copper foil layer 1, ceramic substrate layer 2, bonding
Layer 4, Kafra fiber layer 5, adhesive linkage 6 and radiation aluminium layers of foil.The ceramic substrate layer 2 is made up of two pieces of ceramic wafers, the pottery
Porcelain plate uses the closed pore ceramic material with loose structure, and two pieces of ceramic wafers are bonded together by heat conductive silica gel 3, can
Reduce ceramic substrate layer fragility, make ceramic substrate layer that there is certain pliability；The adhesive linkage 4 and adhesive linkage 6 use resin
Glue sticking agent, the radiation aluminium layers of foil include plural bar radiation aluminium chaff 7.The printed circuit copper foil layer 1 is laminating in ceramic base
The upper surface of flaggy 2, the upper surface of Kafra fiber layer 5 is bonded in the lower surface of ceramic substrate layer 2 by adhesive linkage 4, each described
Radiation aluminium chaff 7 is bonded in the lower surface of Kafra fiber layer 5 by adhesive linkage 6, is mutually put down between each radiation aluminium chaff 7
OK.
Above-mentioned ceramic substrate layer 2 can also be more than three pieces of ceramic wafer composition, and each ceramic wafer is in the horizontal direction
It is arranged in parallel, is bonded between adjacent two pieces of ceramic wafers by heat conductive silica gel.
Although specifically showing and describing the utility model with reference to preferred embodiment, those skilled in the art should
This is understood, is not departing from the spirit and scope of the present utility model that appended claims are limited, in form and details
On the utility model can be made a variety of changes, be the scope of protection of the utility model.
Claims (3)
- A kind of 1. ceramic substrate, it is characterised in that：Including from top to bottom laminating printed circuit copper foil layer, ceramic substrate layer successively With radiation aluminium layers of foil, the ceramic substrate layer is made up of plural block ceramic wafer, and each ceramic wafer be arranged in parallel in the horizontal direction, It is bonded between two pieces of adjacent ceramic wafers by heat conductive silica gel, the radiation aluminium layers of foil includes the spaced radiation aluminium of plural bar Chaff, it is parallel to each other between each radiation aluminium chaff.
- A kind of 2. ceramic substrate according to claim 1, it is characterised in that：Each ceramic wafer, which uses, has loose structure Closed pore ceramic material.
- A kind of 3. ceramic substrate according to claim 1 or 2, it is characterised in that：The ceramic substrate layer and heat radiation aluminum foil It is also laminating from top to bottom between layer to have the first adhesive linkage, Kafra fiber layer, the second adhesive linkage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720580328.4U CN207022276U (en) | 2017-05-23 | 2017-05-23 | A kind of ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720580328.4U CN207022276U (en) | 2017-05-23 | 2017-05-23 | A kind of ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207022276U true CN207022276U (en) | 2018-02-16 |
Family
ID=61476472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720580328.4U Active CN207022276U (en) | 2017-05-23 | 2017-05-23 | A kind of ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207022276U (en) |
-
2017
- 2017-05-23 CN CN201720580328.4U patent/CN207022276U/en active Active
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