CN206774518U - 一种高散热能力的小型贴片固态继电器 - Google Patents
一种高散热能力的小型贴片固态继电器 Download PDFInfo
- Publication number
- CN206774518U CN206774518U CN201720318025.5U CN201720318025U CN206774518U CN 206774518 U CN206774518 U CN 206774518U CN 201720318025 U CN201720318025 U CN 201720318025U CN 206774518 U CN206774518 U CN 206774518U
- Authority
- CN
- China
- Prior art keywords
- electrode
- pin
- support plates
- pcb support
- gallium arsenide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Thyristors (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720318025.5U CN206774518U (zh) | 2017-03-29 | 2017-03-29 | 一种高散热能力的小型贴片固态继电器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720318025.5U CN206774518U (zh) | 2017-03-29 | 2017-03-29 | 一种高散热能力的小型贴片固态继电器 |
Publications (1)
Publication Number | Publication Date |
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CN206774518U true CN206774518U (zh) | 2017-12-19 |
Family
ID=60632759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201720318025.5U Withdrawn - After Issue CN206774518U (zh) | 2017-03-29 | 2017-03-29 | 一种高散热能力的小型贴片固态继电器 |
Country Status (1)
Country | Link |
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CN (1) | CN206774518U (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107154389A (zh) * | 2017-03-29 | 2017-09-12 | 江苏捷捷微电子股份有限公司 | 一种高散热能力的小型贴片固态继电器及其制造方法 |
CN108336044A (zh) * | 2018-01-25 | 2018-07-27 | 周元忠 | 一种基于沟槽介质隔离的双极集成电路芯片 |
CN108470689A (zh) * | 2018-06-06 | 2018-08-31 | 捷捷半导体有限公司 | 一种塑封小型固态继电器及其制造方法 |
CN112908962A (zh) * | 2021-01-26 | 2021-06-04 | 江苏云意电气股份有限公司 | 一种车用贴片式二极管封装结构及方法 |
-
2017
- 2017-03-29 CN CN201720318025.5U patent/CN206774518U/zh not_active Withdrawn - After Issue
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107154389A (zh) * | 2017-03-29 | 2017-09-12 | 江苏捷捷微电子股份有限公司 | 一种高散热能力的小型贴片固态继电器及其制造方法 |
CN107154389B (zh) * | 2017-03-29 | 2023-07-21 | 捷捷半导体有限公司 | 一种高散热能力的小型贴片固态继电器及其制造方法 |
CN108336044A (zh) * | 2018-01-25 | 2018-07-27 | 周元忠 | 一种基于沟槽介质隔离的双极集成电路芯片 |
CN108470689A (zh) * | 2018-06-06 | 2018-08-31 | 捷捷半导体有限公司 | 一种塑封小型固态继电器及其制造方法 |
CN112908962A (zh) * | 2021-01-26 | 2021-06-04 | 江苏云意电气股份有限公司 | 一种车用贴片式二极管封装结构及方法 |
CN112908962B (zh) * | 2021-01-26 | 2024-01-23 | 江苏云意电气股份有限公司 | 一种车用贴片式二极管封装结构及方法 |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180202 Address after: Chongchuan District 226017 Jiangsu city of Nantong province science and Technology Industrial Park of Su Tong Jiang Cheng Road No. 1088 Jiang Park Building 3, room 2159, R & D Patentee after: JIEJIE SEMICONDUCTOR CO.,LTD. Address before: No. 8 Xinglong Road, Qidong science and Technology Pioneer Park, Nantong, Jiangsu Province Patentee before: JIANGSU JIEJIE MICROELECTRONICS Co.,Ltd. |
|
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: 226200 Jinggangshan Road, Jinggangshan Road, Sutong science and Technology Industrial Park, Nantong City, Jiangsu Province, No. 6 Patentee after: JIEJIE SEMICONDUCTOR CO.,LTD. Address before: Chongchuan District 226017 Jiangsu city of Nantong province science and Technology Industrial Park of Su Tong Jiang Cheng Road No. 1088 Jiang Park Building 3, room 2159, R & D Patentee before: JIEJIE SEMICONDUCTOR CO.,LTD. |
|
AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20171219 Effective date of abandoning: 20230721 |
|
AV01 | Patent right actively abandoned |
Granted publication date: 20171219 Effective date of abandoning: 20230721 |