CN206685375U - A kind of high density frameworks of DFN2013 2 - Google Patents
A kind of high density frameworks of DFN2013 2 Download PDFInfo
- Publication number
- CN206685375U CN206685375U CN201720510248.1U CN201720510248U CN206685375U CN 206685375 U CN206685375 U CN 206685375U CN 201720510248 U CN201720510248 U CN 201720510248U CN 206685375 U CN206685375 U CN 206685375U
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- chip
- installation portion
- framework
- chip installation
- dfn2013
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- 238000009434 installation Methods 0.000 claims abstract description 73
- 241000276425 Xiphophorus maculatus Species 0.000 claims abstract description 4
- 238000005520 cutting process Methods 0.000 claims description 40
- 210000003205 muscle Anatomy 0.000 claims description 35
- 238000000926 separation method Methods 0.000 claims description 6
- 230000002787 reinforcement Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000011159 matrix material Substances 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000005022 packaging material Substances 0.000 description 5
- 230000011218 segmentation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Reinforcement Elements For Buildings (AREA)
Abstract
It the utility model is related to technical field of manufacturing semiconductors, more particularly to a kind of high density frameworks of DFN2013 2, rectangular frame including platy structure, multiple chip installation portions being adapted with the encapsulating structures of DFN2013 2 on framework, the chip installation portion includes chip placing area and pin settlement, and the ratio in the chip placing area and pin settlement is 2:1 or 3:1 or 4:1,2 pins of chip are welded in pin settlement.The framework arranges in the chip placing area of chip installation portion and pin settlement in proportion, 2 pins are welded in pin settlement simultaneously, without individually setting pin groove around chip installation portion, chip installation portion can be set get Geng Mi, improve framework matrix material utilization rate, reduce production cost.
Description
Technical field
A kind of semiconductor fabrication is the utility model is related to, particularly a kind of DFN2013-2 high density framework.
Background technology
Semiconductor refers to material of the electric conductivity between conductor and insulator under normal temperature, its radio, television set with
And had a wide range of applications on thermometric, if diode is exactly the device using semiconductor fabrication.No matter sent out from science and technology or economy
From the perspective of exhibition, the importance of semiconductor is all very huge.
In the manufacturing process of semiconductor, typically semiconductor is integrated on lead frame, allows lead frame as collection
Into the chip carrier of circuit, electric loop is formed, serves the function served as bridge connected with outer lead.Chip package form is
DFN2013-2（DFN is the chip packaging unit model of miniature electric component, and 2013 represent the size of one single chip installation portion
2 pins are indicated for long 2.0mm, wide 1.25mm, 2）, it is both needed to arrange that special pin groove enters around traditional chip installation portion
Line lead welds, but such improvement lacks and problems be present：
For the more chip installation portion of pin number, it is more normal that special multiple pin mounting grooves are set around it
The way of rule, but for the less chip installation portion of pin number, special pin groove is set then to make between chip installation portion
Distance increase, causing the stock utilization of framework matrix reduces, can not be arranged on the framework matrix of identical size more
Chip installation portion, cause the raising of waste of material and production cost.
Utility model content
Goal of the invention of the present utility model is：For existing lead frame in order to meet the arrangement of chip installation portion pin
It is required that special pin mounting groove is provided with around chip installation portion so that the increase of the distance between chip installation portion, cause
The problem of stock utilization of framework matrix reduces, production cost is high, there is provided a kind of DFN2013-2 high density framework, the framework
The chip placing area of chip installation portion and pin settlement are arranged in proportion, 2 pins are welded in pin settlement simultaneously
It is interior, without individually setting pin groove around chip installation portion, chip installation portion can be set get Geng Mi, improve framework matrix material
Expect utilization rate, reduce production cost.
To achieve these goals, the technical solution adopted in the utility model is：
A kind of DFN2013-2 high density framework, include the rectangular frame of platy structure, multiple on framework and DFN2013-
The adaptable chip installation portion of 2 encapsulating structures, the chip installation portion include chip placing area and pin settlement, the chip
The ratio of settlement and pin settlement is 2:1 or 3:1 or 4:1,2 pins of chip are welded in pin settlement.
The framework arranges in the chip placing area of chip installation portion and pin settlement in proportion, and pin settlement accounts for
Than for 2:1 or 3:1 or 4:1, there is larger space, 2 pins can be welded in pin settlement simultaneously, without individually in core
Pin groove is set around piece installation portion, and 2 lead-foot-lines are put into pin settlement, reduce the size between chip installation portion
It is reserved to require, chip installation portion can be set get Geng Mi, improve framework matrix material utilization rate, reduce production cost.
As preferred scheme of the present utility model, the chip installation portion is rectangle, the long side of all chip installation portions with
The short side parallel arrangement of framework, it is cutting part between chip installation portion, the cutting part is that the Cutting Road to interlock anyhow connects muscle,
The width that the Cutting Road connects muscle is 0.1 ± 0.05mm.Reduce relative to existing even muscle width, further improve material use
Rate；Cutting Road connects the reduction of muscle width dimensions simultaneously, makes heat caused by blade cutting less, produces less thermal stress, keep away
Exempt to produce layering between the metal and plastic packaging material of adjacent product pin, strengthen the moisture sensitivity of product and improve product
Reliability.
As preferred scheme of the present utility model, it is half corrosion structure that the Cutting Road, which connects muscle,.Cutting Road connects muscle and is set as half
Corrosion structure, i.e., Cutting Road is connected to the thickness skiving of muscle, further reduce cutting difficulty.
As preferred scheme of the present utility model, multiple reinforcements even block is provided with around chip installation portion, it is adjacent
Chip installation portion is connected by strengthening even block.
As preferred scheme of the present utility model, 5 reinforcements are connected with around the chip placing area of each chip installation portion
Even block.Set around chip placing area and strengthen even block, to ensure the stability after chip installation, be easier bonding wire.
As preferred scheme of the present utility model, on four angles around chip installation portion being additionally provided with cross connects muscle, uses
Connect muscle in the Cutting Road that connection is staggered anyhow.The Cutting Road for connecting the vertical and horizontal intervening portion of muscle connection using cross connects muscle, is easy to
Attended operation, cutting operation efficiency and segmentation accuracy are improved, ensures product quality.
As preferred scheme of the present utility model, the framework is provided with unit separation trough, and the unit separation trough is set
Portion in the frame, framework is divided into 2 chip mount units.Framework is increased operation rate in itself, reduces cost, will be traditional
More than 4 chip mount units of every framework are optimized for the design of 2 every, can have more on identical area on every framework
More chip mount units, improve stock utilization, reduce the cost of framework.
As preferred scheme of the present utility model, the lengths of frame is 250 ± 0.1mm, and width is 70 ± 0.05mm,
27 rows, 78 row chip installation portions are arranged with each chip mount unit.Framework has 2 chip mount units, each chip
Installation unit sets 27 rows, 78 row chip installation portions, i.e., 4212 chip installation portions is arranged on whole framework, than existing framework
Utilization rate is higher.
In summary, by adopting the above-described technical solution, the beneficial effects of the utility model are：
1st, the framework arranges in the chip placing area of chip installation portion and pin settlement in proportion, by 2 pins simultaneously
It is welded in pin settlement, without individually setting pin groove around chip installation portion, chip installation portion can be set more
It is close, improve framework matrix material utilization rate, reduce production cost；
2nd, reduce relative to existing even muscle width, further improve stock utilization；Cutting Road connects muscle broad-ruler simultaneously
Very little reduction, make heat caused by blade cutting less, produce less thermal stress, avoid the metal of adjacent product pin
Layering is produced between plastic packaging material, strengthens the moisture sensitivity of product and improves the reliability of product；
3rd, Cutting Road connects muscle and is set as half corrosion structure, i.e., Cutting Road is connected to the thickness skiving of muscle, and it is difficult further to reduce cutting
Degree；And set around chip placing area and strengthen even block, to ensure the stability after chip installation, it is easier bonding wire；Using
The Cutting Road that cross connects the vertical and horizontal intervening portion of muscle connection connects muscle, is easy to attended operation, improves cutting operation efficiency and segmentation is accurate
Property, ensure product quality；
4th, framework has 2 chip mount units, and each chip mount unit sets 27 rows, 78 row chip installation portions, that is, existed
4212 chip installation portions are arranged on whole framework, it is higher than existing framework utilization rate.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model DFN2013-2 high density frameworks.
Fig. 2 is distribution map of multiple chip installation portions on framework in Fig. 1.
Fig. 3 is the structural representation of one single chip installation portion.
Marked in figure：1- frameworks, 101- chip mount units, 2- unit separation troughs, 3- chip installation portions, 301- chips dissipate
Hot portion, 302- wafer supports portion, 303- pins settlement, 304- strengthen even block, 4- cutting parts, 401- Cutting Roads and connect muscle, 402-
Cross connects muscle.
Embodiment
Below in conjunction with the accompanying drawings, the utility model is described in detail.
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining this
Utility model, it is not used to limit the utility model.
Embodiment 1
As shown in Figure 1 to Figure 3, the DFN2013-2 high density frameworks of the present embodiment, the rectangular frame 1 of platy structure is included,
Multiple chip installation portions 3 being adapted with DFN2013-2 encapsulating structures, the chip installation portion 3 are pacified including chip on framework 1
Put area and pin settlement 303, in the present embodiment, the chip placing area includes wafer support portion 302 and chip cooling portion
301, the ratio in the chip placing area and pin settlement 303 is 3:1,2 pins of chip are welded in pin settlement
In 303.
Further, the chip installation portion 3 is rectangle, and the long side of all chip installation portions 3 is parallel with the short side of framework 1
Arrangement, it is cutting part 4 between chip installation portion 3, the cutting part 4 is that the Cutting Road to interlock anyhow connects muscle 401, the cutting
The width that road connects muscle 401 is 0.1 ± 0.05mm.Reduce relative to existing even muscle width, further improve stock utilization；Together
When Cutting Road connect muscle width dimensions reduction, make blade cut caused by heat it is less, produce less thermal stress, avoid phase
Layering is produced between the metal and plastic packaging material of adjacent product pin, strengthens the moisture sensitivity of product and improves the reliable of product
Property.
In the present embodiment, it is half corrosion structure that the Cutting Road, which connects muscle 401,.Cutting Road connects muscle and is set as half corrosion structure, i.e.,
Cutting Road is connected to the thickness skiving of muscle, further reduces cutting difficulty.
Further, multiple reinforcements even block 304 is provided with around chip installation portion 3, adjacent chip installation portion 3 is logical
Crossing reinforcement, even block 304 connects.
Specifically, the present embodiment is connected with 5 around the chip placing area 303 of each chip installation portion 3 and strengthens connecting block
304.Set around chip placing area and strengthen even block, to ensure the stability after chip installation, be easier bonding wire.
Further, it is additionally provided with cross on four angles around chip installation portion 3 and connects muscle 402, it is vertical and horizontal for connecting
The Cutting Road being staggered connects muscle.The Cutting Road for connecting the vertical and horizontal intervening portion of muscle connection using cross connects muscle, is easy to attended operation, carries
Height segmentation operating efficiency and segmentation accuracy, ensure product quality.
In the present embodiment, the arrangement ratio of chip placing area and pin settlement can also be 2:1 or 4:1.
In summary, the framework of the present embodiment is by the chip placing area of chip installation portion and pin settlement cloth in proportion
Put, and the accounting of pin settlement is 2:1 or 3:1 or 4:1, there is larger space, 2 pins can be welded in pin peace simultaneously
Put in area, without individually setting pin groove around chip installation portion, and 2 lead-foot-lines are put into pin settlement, are reduced
Size between chip installation portion is reserved to be required, chip installation portion can be set into get Geng Mi, improve framework matrix material utilization rate,
Reduce production cost.
Embodiment 2
As shown in Figure 1 to Figure 3, the DFN2013-2 high density frameworks according to embodiment 1, the framework 1 are provided with single
First separation trough 2, the unit separation trough 2 are arranged on the middle part of framework 1, framework 1 are divided into 2 chip mount units 101.Framework
Itself increases operation rate, and reduces cost, and traditional more than 4 chip mount units of every framework are optimized for into 2 every sets
Meter, can there is more chip mount units on every framework on identical area, improve stock utilization, reduce framework into
This.
Further, the length of framework 1 in the present embodiment is 250 ± 0.1mm, and width is 70 ± 0.05mm, in each core
27 rows, 78 row chip installation portions 3 are arranged with piece installation unit 101.Framework has 2 chip mount units, each chip peace
Fill unit and 27 rows, 78 row chip installation portions are set, i.e., 4212 chip installation portions are arranged on whole framework, than existing framework profit
It is higher with rate.
In the present embodiment, the chip placing area in each chip installation portion is designed to maximum 1.145mmx1.100mm, this
It is the limit capacity of current supplier so that chip placing area has the chip compatibility size of maximum capacity, makes to select the remaining of chip
Ground is bigger.
In the present embodiment, increase by half corrosion design in the tapping of the frame portion of framework 1, to increase plastic packaging material and framework
Adhesion between 1.So that being easier removal frame when cutting and separating, the remaining plastic packaging material on frame will not also call in product
It is interior, avoid producing harmful effect to subsequent handling.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (8)
1. a kind of DFN2013-2 high density framework, include the rectangular frame of platy structure, it is characterised in that multiple on framework
The chip installation portion being adapted with DFN2013-2 encapsulating structures, the chip installation portion includes chip placing area and pin disposes
Area, the ratio in the chip placing area and pin settlement is 2:1 or 3:1 or 4:1, and 2 pins of chip are welded in and drawn
In pin settlement.
2. DFN2013-2 high density framework according to claim 1, it is characterised in that the chip installation portion is rectangle,
The short side of the long sides of all chip installation portions and framework is arranged in parallel, and is cutting part between chip installation portion, the cutting part
Connect muscle for Cutting Road anyhow staggeredly, the width that the Cutting Road connects muscle is 0.1 ± 0.05mm.
3. DFN2013-2 high density framework according to claim 2, it is characterised in that it is rotten for half that the Cutting Road connects muscle
Arbor.
4. the DFN2013-2 high density frameworks according to one of claim 1-3, it is characterised in that in chip installation portion
Surrounding is provided with multiple reinforcements even block, and adjacent chip installation portion, which passes through, strengthens even block connection.
5. DFN2013-2 high density framework according to claim 4, it is characterised in that in the core of each chip installation portion
5 are connected with around piece settlement and strengthens even block.
6. DFN2013-2 high density framework according to claim 5, it is characterised in that four around chip installation portion
Cross is additionally provided with individual angle and connects muscle, connects muscle for connecting the Cutting Road being staggered anyhow.
7. DFN2013-2 high density framework according to claim 1, it is characterised in that the framework is provided with unit point
Separate slot, the unit separation trough are arranged on frame mid portion, and framework is divided into 2 chip mount units.
8. DFN2013-2 high density framework according to claim 7, it is characterised in that the lengths of frame be 250 ±
0.1mm, width are 70 ± 0.05mm, and 27 rows, 78 row chip installation portions are arranged with each chip mount unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720510248.1U CN206685375U (en) | 2017-05-10 | 2017-05-10 | A kind of high density frameworks of DFN2013 2 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720510248.1U CN206685375U (en) | 2017-05-10 | 2017-05-10 | A kind of high density frameworks of DFN2013 2 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206685375U true CN206685375U (en) | 2017-11-28 |
Family
ID=60406704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720510248.1U Active CN206685375U (en) | 2017-05-10 | 2017-05-10 | A kind of high density frameworks of DFN2013 2 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206685375U (en) |
-
2017
- 2017-05-10 CN CN201720510248.1U patent/CN206685375U/en active Active
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