CN203277361U - Lead frame and its packaging structure - Google Patents
Lead frame and its packaging structure Download PDFInfo
- Publication number
- CN203277361U CN203277361U CN 201320193174 CN201320193174U CN203277361U CN 203277361 U CN203277361 U CN 203277361U CN 201320193174 CN201320193174 CN 201320193174 CN 201320193174 U CN201320193174 U CN 201320193174U CN 203277361 U CN203277361 U CN 203277361U
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- Prior art keywords
- lead frame
- shape
- star
- chip bearing
- corner star
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Abstract
The utility model discloses a lead frame and its packaging structure. The lead frame contains a chip holder and several pins. The pins encircle at least one side of the chip holder. At least one contact surface of the lead frame during packaging is provided with several asteroid-shaped pits. During packaging, as packaging colloid can be filled into the asteroid-shaped pits, total surface area for contact between the lead frame and a packaging body can be further increased, thus raising bonding strength of the lead frame and the packaging body, preventing the stratification phenomenon, raising reliability of a packaging product and prolonging service life of the packaging product.
Description
Technical field
The utility model relates to a kind of lead frame and packaging structure thereof, and particularly a kind of surface has the multi-corner star-shape pit to improve lead frame and the packaging structure thereof of encapsulation bond strength.
Background technology
The utility model is about a kind of lead frame and packaging structure thereof, especially for semiconductor packages square surface encapsulation (QFP), square surface a kind of lead frame and the packaging structure thereof without outer pin package (QFN), small-sized encapsulated (SOP) and direct insertion encapsulation (DIP) etc.along with the speed of chip design is more and more faster, power is also increasing, the chip of low-k (low-k) material is more and more, the problems such as the chip machinery ductility of low-k material and stability of material, at high voltage, high electric current, high-frequency, high sensitivity, high-accuracy, the situations such as high humility and the high low temperature temperature difference are large, reliability quality requirement to microelectronic product is also more and more higher, yet, be the chip bearing generation layerings different from the thermal coefficient of expansion between packing colloid (delamination) of lead frame take lead frame as the common problem of the semiconductor packages of chip bearing body, perhaps the silver-plated routing region subdivision of surrounding causes the electrical property loose contact even to be ruptured outside the chip bearing, reduce performance reliability and the useful life of semiconductor construction.
Therefore, be necessary the lead frame and the packaging structure thereof that provide a kind of surface to have the multi-corner star-shape pit, to solve the existing problem of prior art.
The utility model content
In view of this, lead frame and packaging structure thereof that the utility model provides a kind of surface to have the multi-corner star-shape pit are to solve the technical problem in the chip bearing generation layerings different from the thermal coefficient of expansion between packing colloid of lead frame.
Main purpose of the present utility model is to provide a kind of lead frame and packaging structure thereof, and a lead frame comprises a chip bearing and several pins, and described pin is arranged around at least one side of described chip bearing.The contact surface that described lead frame encapsulates is provided with several multi-corner star-shape pits, and packing colloid can be inserted in described multi-corner star-shape pit when carrying out packaging operation, to improve the bond strength of lead frame and packaging body.
For reaching aforementioned purpose of the present utility model, the utility model one embodiment provide a kind of lead frame, Qi Bao Han ︰ one chip bearing, and several pins.Described pin is arranged around at least one side of described chip bearing; Described lead frame is provided with several multi-corner star-shape pits at least one contact surface that encapsulates.
For reaching aforementioned purpose of the present utility model, another embodiment of the utility model provides a kind of packaging structure of lead frame, Qi Bao Han ︰ one lead frame, at least one semiconductor chip, several wires and a packing colloid.Described lead frame comprises a chip bearing and several pins, and described several pins are at least one sides that are arranged around described chip bearing, and described lead frame is provided with several multi-corner star-shape pits at least one contact surface that encapsulates; Described at least one semiconductor chip is located on described chip bearing; Described several wires is electrically connected respectively described semiconductor chip to each described pin; And described packing colloid encapsulation coats the part of described chip bearing, described semiconductor chip, described several wires and described several pins, and described packing colloid is inserted in the multi-corner star-shape pit of described contact surface, can further increase the total surface area of the contact surface that encapsulates, to improve the bond strength of lead frame and packaging body, prevent layering, improve reliability and the useful life of encapsulating products.
Description of drawings
Fig. 1 is the top view of the utility model one embodiment lead frame moulding.
Fig. 2 A is the top view of the utility model one embodiment lead frame.
Fig. 2 B is the lower view of the utility model one embodiment lead frame.
Fig. 3 A-3F is the schematic diagram of the glue sealing method of the utility model one embodiment lead frame
Fig. 4 is a plurality of top view examples of the multi-corner star-shape pit of the utility model lead frame.
Fig. 5 is the schematic diagram of a plurality of positive multi-corner star-shapes.
Fig. 6 is a plurality of sectional view examples of the multi-corner star-shape pit of the utility model lead frame.
Fig. 7 is the lower view of another embodiment lead frame of the utility model.
Fig. 8 is the partial enlarged drawing of Fig. 7 lead frame.
Embodiment
Below the explanation of each embodiment be with reference to additional graphic, can be in order to the specific embodiment of implementing in order to illustration the utility model.Moreover, the direction term that the utility model is mentioned, such as upper and lower, top, the end, front, rear, left and right, inside and outside, side, on every side, central authorities, level, laterally, vertically, vertically, axially, radially, the superiors or orlop etc., be only the direction with reference to annexed drawings.Therefore, the direction term of use is in order to explanation and understands the utility model, but not in order to limit the utility model.
Please refer to shown in Fig. 1,2A and 2B, Fig. 1 is the top view of the utility model one embodiment lead frame moulding; Fig. 2 A is the top view of the utility model one embodiment lead frame; And Fig. 2 B is the lower view of the utility model one embodiment lead frame.The utility model one embodiment provides a kind of lead frame moulding 100, and described lead frame moulding 100 is to utilize a metallic plate to be made, and described metallic plate can be selected from the metal of various tool satisfactory electrical conductivities, such as copper, iron, aluminium, nickel, zinc or its alloy etc.The utility model will be in the detail structure, assembled relation and the operation principles thereof that hereinafter describe one by one each element in detail.
Described lead frame moulding 100 comprises several lead frames 10, and each lead frame 10 comprises a chip bearing 11, several pins 12 and several support bars 13.Described several pins 12 are at least one sides (directly not being connected with described chip bearing 11) that are arranged around described chip bearing 11, and described chip bearing 11 is to be supported on described lead frame moulding 100 by described several support bars 13.
In the present embodiment, described lead frame 10 is provided with several multi-corner star-shape pits at least one contact surface that encapsulates.For example, as shown in Fig. 2 A and Fig. 2 B, described contact surface refers to upper surface and/or the lower surface of described chip bearing 11, and described contact surface is provided with several described multi-corner star-shape pits 14; And the lower surface of each described pin 12 close described chip bearing 11 end is provided with several described multi-corner star-shape pits 14.Therefore, when carrying out the injecting glue packaging operation, can be received in due to packing colloid (not illustrating) in the multi-corner star-shape pit 14 of described contact surface, therefore can further increase the total surface area that described lead frame 10 contacts with packaging body, thereby improve the bond strength of described lead frame 10 and packaging body.
Please coordinate the A to 3E with reference to Fig. 3, the glue sealing method of the lead frame 10 of the present embodiment can comprise the steps:
As shown in Figure 3A, purchase a lead frame moulding 100 (as Fig. 1), described lead frame moulding 100 comprises several lead frames 10 (Fig. 3 A to 3E only shows a lead frame 10 in described lead frame moulding 100), and each described lead frame 10 comprises a chip bearing 11, several pins 12 and several support bars 13.The upper surface 111 of described chip bearing 11 and/or lower surface 112 are provided with several multi-corner star-shape pits 14; In addition, described contact surface also can comprise described pin 12 simultaneously near a lower surface of an interior leads ends of described chip bearing 11 ends, also can be provided with several multi-corner star-shape pits 14 on it.
Subsequently, as shown in Fig. 3 B, semiconductor chip 15 is fixed on described chip bearing 11, utilizes routing in conjunction with the mode of (wire bonding), several conducting elements (as bonding wire, not indicating) to be electrically connected described pin 12 and described chip 11.
Then, as shown in Figure 3 C, described lead frame moulding 100 is positioned in a mould (not illustrating), and fills packing colloid 16 encapsulation and coat described chip bearings 11, described pin 12, described several support bars 13, described several multi-corner star-shape pits 14 and described semiconductor chip 15 and form the lead frame 100 with several packaging bodies unit.
Then, please refer to Fig. 3 D, 3E and 3F, wherein Fig. 3 E is the sectional view of Fig. 3 D; And Fig. 3 F is the partial enlarged drawing of Fig. 3 E.As shown in Fig. 3 D, 3E and 3F, break and cut and bend described pin, described colloid 16 is separated with described lead frame moulding 100, form an encapsulation finished product.
Because upper surface and/or the lower surface of described chip bearing 11 is provided with several multi-corner star-shape pits 14, and the lower surface of the interior leads ends of each described pin 12 close described chip bearing 11 end is provided with several multi-corner star-shape pits 14, therefore, packing colloid 16 can be inserted in described multi-corner star-shape pit 14 when carrying out packaging operation.The utility model can further increase the total surface area of the contact surface that described chip bearing 11 and described pin 12 encapsulate, to provide more surface area in conjunction with packing colloid 16, to improve the bond strength of lead frame 11 and packing colloid 16, prevent layering, improve reliability and the useful life of encapsulating products.
In the present embodiment, described multi-corner star-shape pit 14 be arranged on the upper and lower surface of described chip bearing 11 and described pin 12 near the lower surface of described chip bearing 11 ends.The lower surface that the idea of above-mentioned design is based on described chip bearing 11 occupies maximum surface areas that contacts with packing colloid, and therefore described multi-corner star-shape pit 14 is arranged at this and can obtains maximum effect; Though the upper surface of described chip bearing 11 is mainly used in chip placement, but still have larger contact area, for the convenience on processing and consider that described multi-corner star-shape pit 14 also can help the bonding of chip and described chip bearing 11, therefore in this, described multi-corner star-shape pit 14 is set another and consider described pin 12 upper surfaces and need to carry out routing, therefore only on the lower surface for the interior leads ends of described pin 12, described multi-corner star-shape pit 14 is set.
Yet described lead frame 10 arranges described multi-corner star-shape pit 14 at which contact surface, can decide according to the demand of product, and the utility model is not limited.For example, the upper surface of described chip bearing 11 can not arrange described multi-corner star-shape pit 14, or only arranges on the surface of not binding with semiconductor chip 15; Or for the larger situation of interior leads ends area of described pin 12, the upper surface of the interior leads ends of described pin 12 also may arrange described multi-corner star-shape pit 14, as long as be arranged on beyond the routing zone, or only arranges on the lower surface of routing not having.Moreover, if the upper surface of described chip bearing 11 arranges described multi-corner star-shape pit 14 in the zone with described semiconductor chip 15 bondings, can increase the bond strength of upper surface and a mucigel (not illustrating) of described chip bearing 11.In addition, also can be according to size, quantity and the arrangement mode of the described multi-corner star-shape pit 14 of Demand Design, for example each described multi-corner star-shape pit 14 is rectangular or the circular array shape is arranged, perhaps random arrangement.
In addition, the setting of described multi-corner star-shape pit 14 of the present utility model, go on any product that need to increase described lead frame 10 and the bond strength of described packing colloid 16, the both sides of chip bearing 11 have the encapsulating products of pin as described, a perhaps side of described chip bearing 11, three sides or four sides have the encapsulating products of pin; From the encapsulation form, the setting of described multi-corner star-shape pit 14 of the present utility model, can be used for the product that described pin 12 has an outer pin, as square surface encapsulation (QFP), small-sized encapsulated (SOP) and direct insertion encapsulation (DIP) etc., perhaps do not have the product of an outer pin, as square surface without outer pin package (QFN).
Moreover, please refer to shown in Figure 4, the design of described multi-corner star-shape pit 14 of the present utility model, it is the multi-corner star-shape that is at least three angles, compared to general polygonal (and even for example 3 dihedrals, 4 dihedrals, 5 dihedral 12 dihedrals), under equal area (circumscribed circle is identical), multi-corner star-shape pit 14 can increase more surface area with in conjunction with packing colloid 16.Especially the design of the multi-corner star-shape in the utility model can be in the increase of largeizationr under equal area and the contact area of colloid 16, the multi-corner star-shape of described multi-corner star-shape pit 14 is defined as follows: the shape of described multi-corner star-shape is arranged and is formed by a plurality of star wedge angles 141 and inner reflex angle 142 intervals, described star wedge angle 141 be one less than 90 the degree acute angles, and described inner reflex angle 142 be one greater than 180 the degree and less than 360 the degree inner corners.Show a kind of pit 14 that is shaped as triangle star as Fig. 4 (a); Show a kind of pit 14 that is shaped as four jiaos of stars as Fig. 4 (b); Show a kind of pit 14 that is shaped as pentalpha as Fig. 4 (c); Show a kind of pit 14 that is shaped as hexagram as Fig. 4 (d); And show a kind of pit 14 that is shaped as heptangle star as Fig. 4 (e).
In addition, because the quantity of the star wedge angle 141 of described multi-corner star-shape wishes that with angular range and the utility model the bond strength of the described lead frame of the raising that reaches and packaging body is relevant, in general, cross the difficulty that point or excessively blunt star wedge angle 141 meeting raisings are made, also can reduce the effect in conjunction with packing colloid 16 simultaneously.Therefore, in the utility model, the average angle scope of the star wedge angle 141 of the described multi-corner star-shape that is fit to is between 90 degree between 30 degree, can make so described multi-corner star-shape pit 14 obtain preferably effect in conjunction with packing colloid 16, thereby the lamination of preventing, reliability and the useful life of improving encapsulating products.
Further, in the scope of multi-corner star-shape described above, a kind of positive multi-corner star-shape preferably, so-called positive multi-corner star-shape is that (for example positive pentagon has 5 Along ents obtain several Along ents on the circumference of virtual circumscribed circle, the formed peripheral shape of line that n the Along ent (for example every 2,3 or 4 Along ents) of being separated by by that analogy), and often made is called positive multi-corner star-shape.Please refer to shown in Figure 5ly, show a positive pentalpha as Fig. 5 (a), it is for doing the formed star of line every 2 on circumscribed circle, and its each star wedge angle is 36 to spend; Show a positive hexagram as Fig. 5 (b), it is for doing the formed star of line every 2 on circumscribed circle, and its each star wedge angle is 60 to spend; Show a positive anistree star as Fig. 5 (c), it is for doing the formed star of line every 3 on circumscribed circle, and its each star wedge angle is 45 degree; Show one positive ten jiao of star as Fig. 5 (d), it is for doing the formed star of line every 3 on circumscribed circle, and its each star wedge angle is 72 degree; And Fig. 5 (e) shows positive 12 jiaos of stars, and it is for doing the formed star of line every 3 on circumscribed circle, and its each star wedge angle is 90 degree.Therefore, positive multi-corner star-shape as described multi-corner star-shape pit 14 shapes that are fit to, to get rid of the star wedge angle that quantity is excessive or the mistake point is excessively blunt, the star angle quantity of described positive multi-corner star-shape is the positive multi-corner star-shape between 5 to 12, and the angle of its each interior angle be between 36 degree between 90 degree, can make so described multi-corner star-shape pit 14 obtain preferably effect in conjunction with packing colloid 16.
Moreover described multi-corner star-shape pit 14 manufactures can be selected from punching press (stamping) method, or are selected from the mode of photoresist (photo-resist) exposure imaging collocation etching solution etching (etching).As shown in Fig. 6 (a), described multi-corner star-shape pit 14 is for example to make with pressing, and its cross section presents a kind of up and down size shape all identical or wide outside and narrow inside; Perhaps as shown in Fig. 6 (b), described multi-corner star-shape pit 14 is for example to make in the etched mode of photoresist exposure imaging collocation etching solution, its cross section presents a kind of shape of outer narrow inner width, therefore can also further improve the bond strength of described lead frame 10 and packaging body 16.Moreover, in pressing, when if the drift that uses has slightly wide front end (being that similar match is bar-shaped), the opening edge of the described multi-corner star-shape pit 14 a bit of distance of plastic elongation that will make progress on the cross section, this extended structure also can further improve the bond strength of described lead frame 10 and packaging body 16.
Referring again to Fig. 7 and shown in Figure 8, it shows the lower view of another embodiment lead frame of the utility model, and Fig. 8 is the partial enlarged drawing of Fig. 7 lead frame.the lead frame 10a of the utility model Fig. 7 embodiment is similar in appearance to the lead frame 10 of the embodiment of the utility model Fig. 2, and roughly continue to use same components title and figure number, but the difference characteristic of the present embodiment is: in the present embodiment, the edge of described chip bearing 11a and described several pins 12a present a kind of shape of concavo-convex arrangement of cross-linking, be in the recess of the interior leads ends of each the described pin 12a correspondence that can protrude out described chip bearing 11a edge, when the side surface that can further increase so described chip bearing 11a and described pin 12a encapsulates and the total surface area of the contact surface of packing colloid 16, to provide more surface area in conjunction with the bond strength of packing colloid with raising lead frame and packaging body.
Moreover, as shown in Figure 8, in partial enlarged drawing by the described lead frame 10a of Fig. 7, can find out in the present embodiment, the edge of described chip bearing 11a and/or described several pins 12a all presents a zigzag, so also can further increase again the total surface area of the contact surface of the side surface of described chip bearing 11a and described pin 12a and packing colloid 16 combinations, also can effectively improve the encapsulation bond strength.
The utility model is described by above-mentioned related embodiment, yet above-described embodiment is only for implementing example of the present utility model.Must be pointed out that, published embodiment does not limit scope of the present utility model.On the contrary, being contained in the spirit of claims and modification and impartial setting of scope is included in scope of the present utility model.
Claims (14)
1. lead frame, it is characterized in that: described lead frame bag contains ︰
One chip bearing; And
Several pins are arranged around at least one side of described chip bearing;
Wherein said lead frame is provided with several multi-corner star-shape pits at least one contact surface that encapsulates.
2. lead frame as claimed in claim 1, it is characterized in that: the shape of described multi-corner star-shape pit is the multi-corner star-shape that is at least three angles.
3. lead frame as claimed in claim 2 is characterized in that: the average angle of the star wedge angle of described multi-corner star-shape pit between 30 degree between 90 degree.
4. lead frame as claimed in claim 2 is characterized in that: the star angle quantity of described multi-corner star-shape is the positive multi-corner star-shape between 5 to 12, and the angle of its each interior angle between 36 degree between 90 degree.
5. lead frame as claimed in claim 1, it is characterized in that: described contact surface is a upper surface and/or a lower surface of described chip bearing.
6. lead frame as claimed in claim 1 is characterized in that: described contact surface is that described pin is near a upper surface and/or a lower surface of an interior leads ends of described chip bearing end.
7. lead frame as claimed in claim 1, it is characterized in that: the longitudinal cross-section of described multi-corner star-shape pit presents the shape of outer narrow inner width.
8. lead frame as claimed in claim 1 is characterized in that: the edge of described chip bearing and described several pins are and intert concavo-convex arrangement.
9. lead frame as claimed in claim 1, is characterized in that: the edge indentation of described chip bearing, described several pins and/or described chip bearing.
10. the packaging structure of a lead frame, it is characterized in that: described packaging structure bag contains ︰
One lead frame comprises a chip bearing and several pins, and described several pins are at least one sides that are arranged around described chip bearing, and described lead frame is provided with several multi-corner star-shape pits at least one contact surface that encapsulates;
At least one semiconductor chip is located on described chip bearing;
Several wires is electrically connected respectively described semiconductor chip to each described pin; And
One packing colloid, encapsulation coats the part of described chip bearing, described semiconductor chip, described several wires and described several pins, and described packing colloid is inserted in the multi-corner star-shape pit of described contact surface.
11. the packaging structure of lead frame as claimed in claim 10 is characterized in that: the shape of described multi-corner star-shape pit is the multi-corner star-shape that is at least three angles.
12. the packaging structure of lead frame as claimed in claim 11 is characterized in that: the average angle of the star wedge angle of described multi-corner star-shape pit is between 30 degree are spent to 90.
13. the packaging structure of lead frame as claimed in claim 10 is characterized in that: the star angle quantity of described multi-corner star-shape is the positive multi-corner star-shape between 5 to 12, and the angle of its each interior angle between 36 degree between 90 degree.
14. the packaging structure of lead frame as claimed in claim 10 is characterized in that: the edge of described chip bearing and described several pins are interspersed concavo-convex arrangement; Described chip bearing, described several pins or both edge indentations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320193174 CN203277361U (en) | 2013-04-17 | 2013-04-17 | Lead frame and its packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320193174 CN203277361U (en) | 2013-04-17 | 2013-04-17 | Lead frame and its packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203277361U true CN203277361U (en) | 2013-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201320193174 Expired - Fee Related CN203277361U (en) | 2013-04-17 | 2013-04-17 | Lead frame and its packaging structure |
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| CN (1) | CN203277361U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103227162A (en) * | 2013-04-17 | 2013-07-31 | 日月光封装测试(上海)有限公司 | Wire frame and packaging structure thereof |
| CN109119396A (en) * | 2018-09-14 | 2019-01-01 | 上海凯虹科技电子有限公司 | Lead frame and the packaging body for using the lead frame |
-
2013
- 2013-04-17 CN CN 201320193174 patent/CN203277361U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103227162A (en) * | 2013-04-17 | 2013-07-31 | 日月光封装测试(上海)有限公司 | Wire frame and packaging structure thereof |
| CN109119396A (en) * | 2018-09-14 | 2019-01-01 | 上海凯虹科技电子有限公司 | Lead frame and the packaging body for using the lead frame |
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| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170106 Address after: 201201 room T3-100201, No. 5001 East Road, Shanghai, Pudong New Area Patentee after: Advanced integrated circuit manufacturing (Chinese) Co. Ltd. Patentee after: ASE Assembly & Test (Shanghai) Ltd. Address before: 201203 Shanghai City, Pudong New Area Shanghai City, Guo Shou Jing Road, Pudong Zhangjiang hi tech Park No. 669 Patentee before: ASE Assembly & Test (Shanghai) Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170401 Address after: 201203 Shanghai city Chinese (Shanghai) free trade zone 669 GuoShouJing Road No. six building Patentee after: ASE Assembly & Test (Shanghai) Limited Address before: 201201 room T3-100201, No. 5001 East Road, Shanghai, Pudong New Area Patentee before: Advanced integrated circuit manufacturing (Chinese) Co. Ltd. Patentee before: ASE Assembly & Test (Shanghai) Limited |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131106 Termination date: 20180417 |