CN206370422U - A kind of copper bridge framework and a kind of semiconductor devices - Google Patents

Abstract

The utility model discloses a kind of copper bridge framework and a kind of semiconductor devices.Copper bridge framework includes supporting region corresponding with chip, and the supporting region offers through hole, and the supporting region is extended with shell fragment into the through hole, and the shell fragment sets the side of chip to protrude to the supporting region.By setting shell fragment, chip can be pressed to lead frame, it is to avoid lead frame is deformed, and prevents product excessive glue from scrapping.

Description

A kind of copper bridge framework and a kind of semiconductor devices

Technical field

The utility model is related to the technical field of semiconductor devices, more particularly to a kind of copper bridge framework and a kind of semiconductor device Part.

Background technology

Semiconductor devices be electric conductivity between good conductor of electricity and insulator, using semi-conducting material specific electrical properties come Complete the electronic device of specific function.It includes crystal diode, bipolar transistor and field-effect transistor etc..Semiconductor device The general side in chip of part sets lead frame, and opposite side sets copper bridge framework.Chip is fixed lead frame, and and Chip realizes that electric signal is connected.In process of production, lead frame is after half-etching, and the intensity of itself can be reduced, chip Between lead frame after Reflow Soldering, due to the contraction of tin cream, lead frame can be caused to deform and protruded to the side of chip, become Product after shape, due to producing gap between the plane of lead frame and lower mould, can cause product excessive glue to be scrapped in injection.

Utility model content

First purpose of the present utility model is to propose a kind of copper bridge framework, by setting shell fragment, can pressed to chip Lead frame, it is to avoid lead frame is deformed, and prevents product excessive glue from scrapping.

For up to this purpose, the utility model uses following technical scheme：

A kind of copper bridge framework, including supporting region corresponding with chip, the supporting region offer through hole, the supporting region to Shell fragment is extended with the through hole, the shell fragment sets the side of chip to protrude to the supporting region.

Wherein, the shell fragment is by punching press and/or is bent to form.

Wherein, the shell fragment is end away from the one end being connected with supporting region, and the end is parallel with the supporting region.

Wherein, the height that the shell fragment protrudes from the supporting region is 0.025mm-0.1mm.

Wherein, the height that the shell fragment protrudes from the supporting region is 0.05mm.

Wherein, the quantity of the through hole is two, and a shell fragment is provided with each through hole, the shell fragment Bearing of trend is vertical with the closure of two through holes.

Wherein, the junction on the shell fragment with the supporting region carries out half-etching processing, forms sunk structure.

Wherein, the thickness of the copper bridge framework at the sunk structure is 0.05mm-0.1mm.

Wherein, the protrusion direction homonymy of the sunk structure and the shell fragment.

Second purpose of the present utility model is to propose a kind of semiconductor devices, by setting shell fragment on copper bridge framework, Chip can be pressed to lead frame, it is to avoid lead frame is deformed, and prevents product excessive glue from scrapping.

For up to this purpose, the utility model uses following technical scheme：

A kind of semiconductor devices, including lead frame, chip and above-mentioned copper bridge framework, the chip are located at the copper bridge Between the supporting region of framework and the lead frame, the shell fragment abuts the chip.

Beneficial effect：The utility model provides a kind of copper bridge framework and a kind of semiconductor devices.Copper bridge framework include with The corresponding supporting region of chip, the supporting region offers through hole, and the supporting region is extended with shell fragment, the bullet into the through hole Piece sets the side of chip to protrude to the supporting region.By setting shell fragment, chip can be pressed to lead frame, it is to avoid lead Frame deformation, prevents product excessive glue from scrapping.

Brief description of the drawings

Fig. 1 is the front view for the copper bridge framework that the utility model is provided.

Fig. 2 is Fig. 1 A-A regarding sectional views.

The B-B direction that Fig. 3 is Fig. 1 regards sectional view.

Fig. 4 is the front view after copper bridge framework, chip and the lead frame assembling that the utility model is provided.

Fig. 5 is Fig. 4 C-C to sectional view.

Fig. 6 is Fig. 4 D-D to sectional view.

Fig. 7 is the partial enlarged drawing at Fig. 6 E.

Section view after copper bridge framework, chip and lead frame assembling that Fig. 8 the utility model is provided in a mold.

Wherein：

1- copper bridge frameworks, 11- supporting regions, 111- through holes, 112- shell fragments, 1121- ends, 1122- sunk structures, 2- leads Framework, 3- chips, 4- scolding tin.Mould under the upper moulds of 5-, 6-.

Embodiment

To make the utility model technical problem solved, the technical scheme used and the technique effect reached clearer, Further illustrate the technical solution of the utility model below in conjunction with the accompanying drawings and by embodiment.

Embodiment 1

With reference to Fig. 1-Fig. 8, a kind of copper bridge framework, including supporting region 11 corresponding with chip are present embodiments provided, is carried Area 11 offers through hole 111, and supporting region 11 is extended with shell fragment 112 into through hole 111, and shell fragment 112 sets chip 3 to supporting region 11 Side protrusion.The supporting region 11 of copper bridge framework 1 outwards sets gradually chip 3 and lead frame 2, as Figure 4-Figure 7, Xiang Xin The shell fragment 112 of the side of piece 3 protrusion can produce thrust to chip 3, chip 3 be pressed into lead frame 2, it is to avoid lead frame 2 is deformed, As shown in figure 8, lead frame 2 will not produce gap between lower mould 6, it is to avoid excessive glue during injection, cause product rejection.

The present embodiment shell fragment 112 is by punching press and/or is bent to form, shell fragment 112 can once strike out with copper bridge framework 1 Type, one-shot forming is convenient, Stability Analysis of Structures；Can also be formed after copper bridge framework 1, then be formed by modes such as bendings, it is only necessary to With shell fragment 112.Apply pressure to chip 3 for the ease of shell fragment 112, shell fragment 112 is away from one be connected with supporting region 11 Hold as end 1121, end 1121 is parallel with supporting region 11, and end 1121 has longer one section to be contacted with chip 3, to core The pressure of piece 3 is smaller.

The height that shell fragment 112 protrudes from supporting region 11 is proper between 0.025mm-0.1mm, and chip 3 can be produced Raw certain thrust, can avoid protrusion from excessively causing thrust excessive, cause the reversal deformation of lead frame 2, cause quality to be asked again Topic.The height that shell fragment 112 protrudes from supporting region 11 is 0.05mm to be more preferably worth, and has now taken into account thrust and lead frame 2 Reversal deformation, and when with certain error, can also be maintained in the range of 0.025mm-0.1mm.

In the present embodiment, the quantity of through hole 111 is to be provided with a shell fragment 112, shell fragment 112 in two, each through hole 111 Bearing of trend it is vertical with the closure of two through holes 111.Two are set in the direction vertical with the bearing of trend of shell fragment 112 Individual shell fragment 112, can apply pressure so that the uniform force of chip 3 from two regions to chip 3.In order to avoid chip 3 is tilted, Enable the uniform force of chip 3, through hole 111 and shell fragment 112 are preferably symmetrically distributed in supporting region 11, so as to offset asymmetry band The problem of discontinuity come.

In the present embodiment, half-etching processing can be carried out on shell fragment 112 with the junction of supporting region 11, sunk structure is formed 1122, the protrusion direction homonymy of sunk structure 1122 and shell fragment 112.The shell fragment 112 for being formed with sunk structure 1122 is easier to become Shape, elastic force is smaller, and too high thrust will not be produced to chip 3 causes the reversal deformation of lead frame 2, and in assembling process, such as When the pressure that fruit chip 3 is subject to is larger, sunk structure 1122 can deform absorption pressure, reduce the thrust to chip 3.Sunk structure 1122 with the protrusion direction homonymy of shell fragment 112, produce elastic force beneficial to shell fragment 112, elastic force will not be caused to reduce too many and lose work With.The thickness of copper bridge framework 1 at sunk structure 1122 is proper in 0.05mm-0.1mm, and being both avoided that copper bridge was too thin causes Insufficient strength, is easily broken off, and being avoided that again too thick can not adjust the thrust of shell fragment 112.

Embodiment 2

Present embodiments provide the copper bridge framework in a kind of semiconductor devices, including lead frame 2, chip 3 and embodiment 1 1, chip 3 is located between the supporting region 11 of copper bridge framework 1 and lead frame 2, and shell fragment 112 abuts chip 3.As shown in Figure 5-Figure 7, The shell fragment 112 protruded to the side of chip 3 can produce thrust to chip 3, chip 3 be pressed into lead frame 2, it is to avoid lead frame 2 Deformation, as shown in figure 8, lead frame 2 will not produce gap between lower mould 6, it is to avoid excessive glue during injection, causes product rejection.

Above content is only preferred embodiment of the present utility model, for one of ordinary skill in the art, according to this reality With new thought, it will change in specific embodiments and applications, this specification content should not be construed as To limitation of the present utility model.

Claims (10)

1. a kind of copper bridge framework, it is characterised in that including supporting region (11) corresponding with chip (3), the supporting region (11) is opened Provided with through hole (111), the supporting region (11) to being extended with shell fragment (112) in the through hole (111), the shell fragment (112) to The supporting region (11) sets the side protrusion of chip (3).

2. copper bridge framework as claimed in claim 1, it is characterised in that the shell fragment (112) passes through punching press and/or bent Into.

3. copper bridge framework as claimed in claim 2, it is characterised in that the shell fragment (112) is remote to be connected with supporting region (11) One end be end (1121), the end (1121) is parallel with the supporting region (11).

4. copper bridge framework as claimed in claim 1, it is characterised in that the shell fragment (112) protrudes from the supporting region (11) Height be 0.025mm-0.1mm.

5. copper bridge framework as claimed in claim 4, it is characterised in that the shell fragment (112) protrudes from the supporting region (11) Height be 0.05mm.

6. copper bridge framework as claimed in claim 1, it is characterised in that the quantity of the through hole (111) is two, each described A shell fragment (112), the bearing of trend of the shell fragment (112) and two through holes (111) are provided with through hole (111) Closure it is vertical.

7. the copper bridge framework as described in claim any one of 1-6, it is characterised in that with the carrying on the shell fragment (112) The junction in area (11) carries out half-etching processing, forms sunk structure (1122).

8. copper bridge framework as claimed in claim 7, it is characterised in that the copper bridge framework (1) at sunk structure (1122) place Thickness be 0.05mm-0.1mm.

9. copper bridge framework as claimed in claim 7, it is characterised in that the sunk structure (1122) and the shell fragment (112) Protrusion direction homonymy.

10. a kind of semiconductor devices, it is characterised in that including any one of lead frame (2), chip (3) and claim 1-9 institute The copper bridge framework (1) stated, the chip (3) be located at the copper bridge framework (1) supporting region (11) and the lead frame (2) it Between, the shell fragment (112) abuts the chip (3).