CN206340524U - A kind of pressing die head - Google Patents
A kind of pressing die head Download PDFInfo
- Publication number
- CN206340524U CN206340524U CN201621174836.4U CN201621174836U CN206340524U CN 206340524 U CN206340524 U CN 206340524U CN 201621174836 U CN201621174836 U CN 201621174836U CN 206340524 U CN206340524 U CN 206340524U
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- Prior art keywords
- die head
- inner chamber
- pressing mold
- mold inner
- pressing
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Abstract
The utility model embodiment discloses a kind of pressing die head, including：Body, pressing mold inner chamber, outside guiding gutter and internal diversion groove；The pressing mold inner chamber is set on the body；The outside guiding gutter, internal diversion groove are arranged on the pressing mold inner chamber, and the internal diversion groove further comprises two intersecting cell bodies, and the intersection of the cell body shows a center pattern.Through the above way, the utility model embodiment can.Prior art is different from, the mobility of melting scolding tin can be improved using the pressing die head so that the sheet scolding tin that pressing die head is pressed out is more uniformly distributed so that the semiconductor components and devices after welding has good packaging effect and higher reliability.
Description
Technical field
The utility model embodiment is related to field of semiconductor package, more particularly to a kind of pressing die head and stamping method.
Background technology
Nowadays, in field of semiconductor package, it is desirable to the thickness more and more thinner of wafer, and wafer size is bigger, thin wafer
Warpage it is also more serious, lead to not the subsequent job for meeting power device.For above-mentioned warpage issues, Disco companies
Tiako grinding wafers equipment provides a kind of preferable solution, i.e., when carrying out grinding to wafer, retains the side of wafer periphery
Edge point (about 3mm or so) so that the warpage of wafer can be effectively reduced by this technique, reduces the wind that thin wafer is carried
Danger.
Pressing die head is essential instrument in semiconductor packages, mainly to scolding tin before bonding die in die bond processing procedure solder technique
Shaping is carried out, plays that scolding tin is ironed, and its shapes and sizes is reached purpose consistent as far as possible with chip, pressing die head is wide
In the general encapsulation production applied to various power devices.
With the application requirement more and more higher and wafer thickness more and more thinner to power device, in order to be further ensured that device
The higher standard of the consistent and quality of performance, there is more strict requirements to die bond processing procedure, and traditional pressing die head can not
Meet existing manufacturing technique requirent, due to structure it is unreasonable scolding tin can be caused to overflow upper chip, scolding tin is too thick, chip corner lacks
The problems such as tin and beneath chips have cavity.
Utility model content
The utility model embodiment provides a kind of pressing die head and stamping method, be able to can improve packaging and die bonding process rate and
Improve product reliability.
In order to solve the above technical problems, the technical scheme that the utility model embodiment is used is：A kind of pressing mold is provided
Head, including：Body, pressing mold inner chamber, outside guiding gutter and internal diversion groove；
The pressing mold inner chamber is set on the body；
The outside guiding gutter, internal diversion groove are arranged on the pressing mold inner chamber, and the internal diversion groove is further wrapped
Two intersecting cell bodies are included, the intersection of the cell body shows a center pattern.
Wherein, the shape of the body include it is following any one：Rectangle, square, pentagon or parallelogram.
Wherein, the pressing mold inner chamber is quadrangle cavity body structure.
Wherein, the pressing mold inner chamber is the cavity body structure or rectangular cavities structure of four side arc concave shape directions.
Wherein, the outside guiding gutter is groove shape, and it is set along pressing mold inner chamber four edges, surrounds one and institute
State pressing mold cavity shape identical quadrangle.
Wherein, it is characterised in that the internal diversion groove shape is groove shape, the similar fork-shaped of global shape, two cell bodies
The corner with the outside guiding gutter is turned on respectively.
Wherein, the center pattern be shaped as include it is following any one:The quadrangle of four side indents, circle, pros
Shape, rectangle or parallelogram.
Wherein, the pressing mold inner chamber is separated by the outside guiding gutter and the internal diversion groove and to be formed four juts, four
Lug boss is symmetrical arranged two-by-two.
The beneficial effect of the utility model embodiment is：Prior art is different from, can improve molten using the pressing die head
Melt the mobility of scolding tin so that the sheet scolding tin that pressing die head is pressed out is more uniformly distributed so that the semiconductor components and devices after welding has
Good packaging effect and higher reliability.Chip is pressed in after the scolding tin in pressing die head, is fully connect with the scolding tin in pressing die head
Touch, while the pressing mold cavity shape is the cavity body structure of four side arc concave shape directions, the spill-out for being easily controlled scolding tin again may be used
Improve the problem of beneath chips corner lacks tin.On the premise of semiconductor components and devices packaging effect is ensured, scolding tin also effectively overflows
The waste of scolding tin can be reduced by going out, and play the cost for saving encapsulation.The intersection of the cell body of internal diversion groove shape two shows one or four
The center pattern of the quadrangle form of side indent, can lift circulation of the scolding tin in pressing mold inner chamber.
Brief description of the drawings
Fig. 1 is a kind of structural representation for pressing die head that the utility model first embodiment is provided；
Fig. 2 is a kind of structural representation for pressing die head that the utility model second embodiment is provided.
Embodiment
Embodiment one
Refering to Fig. 1, first embodiment of the present utility model there is provided a kind of pressing die head, including body 11, pressing mold inner chamber 12,
Outside guiding gutter 13 and internal diversion groove 14；Wherein pressing mold inner chamber 12 is arranged on body 11, outside guiding gutter 13, internal diversion
Groove 14 is arranged on pressing mold inner chamber 12.
Body 11 is rectangular, and the pressing mold inner chamber 12 being disposed above is the cavity body structure of four side arc concave shape directions.
Outside guiding gutter 13 is groove shape, and it is set along the four edges of pressing mold inner chamber 12, surrounds one and pressing mold inner chamber 12
Shape identical quadrangle.
Internal diversion groove shape 13 be groove shape, the similar fork-shaped of global shape, it includes two intersecting cell bodies, two grooves
Body is turned on the corner of outside guiding gutter 13 respectively, and the intersection of two cell bodies is showed in the quadrangle form of one or four side indents
Heart pattern.
Because outside guiding gutter 13 and internal diversion groove 14 are all that outside guiding gutter is set on groove shape, pressing mold inner chamber 12
13 and internal diversion groove 14 after, remainder shows convex, is separated and to be formed by outside guiding gutter 13 and internal diversion groove 14
The jut 15 of four class asterisms.Four lug bosses 15 are symmetrical arranged two-by-two.
In use, carrying out the melting scolding tin after pressing mold shaping, Moulding and shaping to the scolding tin of melting using the pressing die head
Shape with pressing mold inner chamber 12 is corresponding, then with chip and fusion weld tin welding, because chip is pressed down against to melting scolding tin
Core wire is produced the stress that expands outwardly, part scolding tin can overflow outward, the melting scolding tin of overflow outward passes through outside guiding gutter
13 and internal diversion groove 14 carry out water conservancy diversion, final scolding tin can be squeezed into the shape corresponding with chip.
Prior art is different from, the mobility of melting scolding tin can be improved using the pressing die head so that pressing die head is extruded
The sheet scolding tin come is more uniformly distributed so that the semiconductor components and devices after welding has good packaging effect and higher reliability.
Chip is pressed in after the scolding tin in pressing die head, is fully contacted with the scolding tin in pressing die head, while the pressing mold inner chamber 12 is shaped as four
The cavity body structure of side arc concave shape direction, the problem of beneath chips corner lacks tin can be improved again by being easily controlled the spill-out of scolding tin.
On the premise of semiconductor components and devices packaging effect is ensured, scolding tin, which also effectively overflows, can reduce the waste of scolding tin, play saving
The cost of encapsulation.The intersection of the cell body of internal diversion groove shape 13 2 shows the Centered Graphs of the quadrangle form of one or four side indents
Case, can lift circulation of the scolding tin in pressing mold inner chamber 12.
Embodiment two
Refering to Fig. 2, second embodiment of the present utility model there is provided a kind of pressing die head, including body 21, pressing mold inner chamber 22,
Outside guiding gutter 23 and internal diversion groove 24；Wherein pressing mold inner chamber 22 is arranged on body 21, outside guiding gutter 23, internal diversion
Groove 24 is arranged on pressing mold inner chamber 22.
Body 21 is rectangular, and the pressing mold inner chamber 12 being disposed above is the cavity body structure of rectangle.
Outside guiding gutter 23 is groove shape, and it is set along the four edges of pressing mold inner chamber 12, surrounds one and pressing mold inner chamber 22
Shape identical quadrangle.
Internal diversion groove shape 23 be groove shape, the similar fork-shaped of global shape, it includes two intersecting cell bodies, two grooves
Body is turned on the corner of outside guiding gutter 23 respectively, and the intersection of two cell bodies shows the center pattern of a toroidal.
Because outside guiding gutter 23 and internal diversion groove 24 are all that outside guiding gutter is set on groove shape, pressing mold inner chamber 22
23 and internal diversion groove 24 after, remainder shows convex, is separated and to be formed by outside guiding gutter 23 and internal diversion groove 24
The fan-shaped jut 25 of four classes.Four lug bosses 15 are symmetrical arranged two-by-two.
Optionally, pressing mold inner chamber 22 may also be configured to square, pentagon, parallelogram or other shapes.It is internal
The shape of the center pattern of two cell body intersections of guiding gutter 23 may also be configured to circular square, rectangle, parallelogram or
Person's other shapes.
In use, carrying out the melting scolding tin after pressing mold shaping, Moulding and shaping to the scolding tin of melting using the pressing die head
Shape with pressing mold inner chamber 22 is corresponding, then with chip and fusion weld tin welding, because chip is pressed down against to melting scolding tin
Core wire is produced the stress that expands outwardly, part scolding tin can overflow outward, the melting scolding tin of overflow outward passes through outside guiding gutter
23 and internal diversion groove 24 carry out water conservancy diversion, final scolding tin can be squeezed into the shape corresponding with chip.
Prior art is different from, the mobility of melting scolding tin can be improved using the pressing die head so that pressing die head is extruded
The sheet scolding tin come is more uniformly distributed so that the semiconductor components and devices after welding has good packaging effect and higher reliability.
Chip is pressed in after the scolding tin in pressing die head, is fully contacted with the scolding tin in pressing die head, while the pressing mold inner chamber 22 is shaped as four
The cavity body structure of side arc concave shape direction, the problem of beneath chips corner lacks tin can be improved again by being easily controlled the spill-out of scolding tin.
On the premise of semiconductor components and devices packaging effect is ensured, scolding tin, which also effectively overflows, can reduce the waste of scolding tin, play saving
The cost of encapsulation.The intersection of the cell body of internal diversion groove shape 23 2 shows a round-shaped center pattern, can be lifted
Circulation of the scolding tin in pressing mold inner chamber 22.
Embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, it is every
The equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or be directly or indirectly used in
Other related technical fields, are similarly included in scope of patent protection of the present utility model.
Claims (8)
1. a kind of pressing die head, it is characterised in that including：Body, pressing mold inner chamber, outside guiding gutter and internal diversion groove；
The pressing mold inner chamber is set on the body；
The outside guiding gutter, internal diversion groove are arranged on the pressing mold inner chamber, and the internal diversion groove further comprises two
The intersecting cell body of bar, the intersection of the cell body shows a center pattern.
2. pressing die head according to claim 1, it is characterised in that the shape of the body include it is following any one：Square
Shape, square, pentagon or parallelogram.
3. pressing die head according to claim 1, it is characterised in that the pressing mold inner chamber is quadrangle cavity body structure.
4. pressing die head according to claim 3, it is characterised in that the pressing mold inner chamber is the chamber of four side arc concave shape directions
Body structure or rectangular cavities structure.
5. pressing die head according to claim 4, it is characterised in that the outside guiding gutter is groove shape, it is along institute
The four edges setting of pressing mold inner chamber is stated, one and the pressing mold cavity shape identical quadrangle is surrounded.
6. the pressing die head according to claim 1-5 any claims, it is characterised in that the internal diversion groove shape is
Groove shape, the similar fork-shaped of global shape, corner of two cell bodies respectively with the outside guiding gutter is turned on.
7. pressing die head according to claim 6, it is characterised in that being shaped as of the center pattern includes following any one
Kind:Quadrangle, circle, square, rectangle or the parallelogram of four side indents.
8. pressing die head according to claim 1, it is characterised in that the pressing mold inner chamber is by the outside guiding gutter and described
Internal diversion groove is separated to form four juts, and four lug bosses are symmetrical arranged two-by-two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621174836.4U CN206340524U (en) | 2016-10-26 | 2016-10-26 | A kind of pressing die head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621174836.4U CN206340524U (en) | 2016-10-26 | 2016-10-26 | A kind of pressing die head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206340524U true CN206340524U (en) | 2017-07-18 |
Family
ID=59299185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621174836.4U Active CN206340524U (en) | 2016-10-26 | 2016-10-26 | A kind of pressing die head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206340524U (en) |
-
2016
- 2016-10-26 CN CN201621174836.4U patent/CN206340524U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191031 Address after: 519360 Room 1001, Lianshan Lane, Jida Jingshan Road, Xiangzhou District, Zhuhai City, Guangdong Province Co-patentee after: GREE ELECTRIC APPLIANCES Inc. OF ZHUHAI Patentee after: Zhuhai Zero Boundary Integrated Circuit Co.,Ltd. Address before: 519070 Guangdong city of Zhuhai Province Qianshan Patentee before: GREE ELECTRIC APPLIANCES Inc. OF ZHUHAI |
|
| TR01 | Transfer of patent right |