CN206059425U - A kind of DBC integrating packaging modules for high-power LED chip - Google Patents
A kind of DBC integrating packaging modules for high-power LED chip Download PDFInfo
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- CN206059425U CN206059425U CN201621041065.1U CN201621041065U CN206059425U CN 206059425 U CN206059425 U CN 206059425U CN 201621041065 U CN201621041065 U CN 201621041065U CN 206059425 U CN206059425 U CN 206059425U
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- dbc
- led chip
- reflector
- lens
- camera lens
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Abstract
The utility model discloses a kind of DBC integrating packaging modules for high-power LED chip, including DBC substrates, the lens bracket being fixedly linked with the DBC substrates and the glass lens being connected through the lens bracket and with the DBC substrates, the DBC substrates include metal level, cover the ceramic layer and the line layer being connected with the ceramic layer of the metal level, the line layer is provided with several LED chips, the lens bracket is provided with several band reflector camera lens installing holes, the band reflector camera lens installing hole is provided with reflector, the LED chip position is corresponding with the position with reflector camera lens installing hole, the glass lens are passed through the reflector and are connected with the LED chip.This utility model light extraction efficiency is high, and high temperature resistant is ageing-resistant, Stability Analysis of Structures, simple, and cost savings had both saved the production time, had reached the high_voltage isolation requirement of electronic product again.
Description
Technical field
This utility model is related to LED chip encapsulation technology, specifically, is related to a kind of for high-power LED chip
DBC integrating packaging modules.
Background technology
The base plate for packaging of the high-power LED module of prior art typically has two kinds, ceramic substrate and metal basal board, encapsulates mirror
Head generally uses gluing camera lens.But its defect is as follows：Ceramic substrate it is relatively costly, and fabrication cycle is longer；Metal basal board
Pressure voltage it is relatively low, there is security risk；Gluing camera lens is aging very fast, will turn to be yellow in 1 year, affects light extraction efficiency.
Drawbacks described above, is worth improving.
The content of the invention
In order to overcome the shortcomings of existing technology, this utility model provides a kind of DBC collection for high-power LED chip
Into package module.
Technical solutions of the utility model are as described below：
A kind of DBC integrating packaging modules for high-power LED chip, it is characterised in that including DBC substrates and described
Lens bracket and the glass lens being connected through the lens bracket and with the DBC substrates that DBC substrates are fixedly linked, it is described
DBC substrates include metal level, cover the ceramic layer and the line layer adjacent with the ceramic layer of the metal level, the line layer
Several LED chips are provided with, the lens bracket is provided with several band reflector camera lens installing holes, the band reflector camera lens
Installing hole is provided with reflector, and the LED chip position is corresponding with the position with reflector camera lens installing hole, the glass
Glass camera lens is connected through the reflector with the LED chip.
Further, the consistency of thickness of the metal level and the line layer, and the metal level and the line layer
Material is copper.
Further, the material of the ceramic layer is aluminium oxide.
Further, the material of the ceramic layer is aluminium nitride.
According to this utility model of such scheme, its advantage is, this utility model simple structure, cost savings,
Both it is time-consuming, the high_voltage isolation requirement of electronic product is reached again.In this utility model, lens bracket is provided with reflector, both improves
Light extraction efficiency, has taken into account the function of support fixed lens again；In this utility model, glass lens high temperature resistant is ageing-resistant, will not go out
The same camera lens jaundice of existing gluing camera lens affects the problem of light.
Description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is this utility model explosive view；
Fig. 3 is this utility model DBC substrate schematic diagrams.
In figure, 1, metal level；2nd, ceramic layer；3rd, line layer；4th, DBC substrates；5th, lens bracket；6th, glass lens；7、
Screw；8th, band reflector camera lens installing hole.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment is conducted further description to this utility model：
As Figure 1-3, a kind of DBC integrating packaging modules for high-power LED chip, including DBC substrates 4, and institute
State lens bracket 5 and the glass mirror being connected through the lens bracket 5 and with the DBC substrates 4 that DBC substrates 4 are fixedly linked
6, the DBC substrates 4 include metal level 1, cover the ceramic layer 2 and the circuit adjacent with the ceramic layer 2 of the metal level 1
Layer 3, the line layer 3 are provided with several LED chips, and the lens bracket 5 is provided with several band reflector camera lens installing holes
8, the band reflector camera lens installing hole 8 is provided with reflector, the LED chip position and the band reflector camera lens installing hole
8 position is corresponding, and the glass lens 6 are connected through the reflector with the LED chip.
The consistency of thickness of the metal level 1 and the line layer 3, and the metal level 1 with the material of the line layer 3 is
Copper, the material of the ceramic layer 2 are aluminium oxide or are aluminium nitride.
According to this utility model of such scheme, its advantage is, this utility model simple structure, cost savings,
Both it is time-consuming, the high_voltage isolation requirement of electronic product is reached again.In this utility model, lens bracket is provided with reflector, both improves
Light extraction efficiency, has taken into account the function of support fixed lens again；In this utility model, glass lens high temperature resistant is ageing-resistant, will not go out
The same camera lens jaundice of existing gluing camera lens affects the problem of light.
This utility model specific embodiment:
By taking the DBC integrating packaging modules of a 40 chips of our company as an example, bottom surface is DBC substrates 4, DBC substrates 4
It is divided into 3 layers, the bottom of DBC substrates 4 and the metal that top layer is consistency of thickness, metal material is copper, the metal etch circuit of top layer
Into line layer 3, it is then metal level 1 that another side is constant, and intermediate layer is ceramic layer 2, and 2 material of ceramic layer is aluminium oxide or nitridation
Aluminum, sets the thickness of metal level 1 and ceramic layer 2 according to the intensity requirement of LED operation current requirements and substrate, on line layer 3
Face is provided with 40 high-power LED chips, and centre is lens bracket 5, and lens bracket 5 is provided with band reflector camera lens installing hole 8, with anti-
The position of light cup camera lens installing hole 8 is corresponding with chip position, and each band reflector camera lens installing hole 8 is provided with reflector, by glass
Glass camera lens 6 is fixed on above DBC substrates 4 through reflector by lens bracket 5, for controlling LED emergent lights, wherein camera lens
Frame 5 is fixed on DBC substrates 4 by screw 7, or lens bracket 5 is directly clamped among on DBC substrates 4.
It should be appreciated that for those of ordinary skills, can be improved according to the above description or be converted,
And all these modifications and variations should all belong to the protection domain of this utility model claims.
Exemplary description is carried out to this utility model patent above in conjunction with accompanying drawing, it is clear that the reality of this utility model patent
Now it is not subject to the restrictions described above, as long as the method design for employing this utility model patent is various with what technical scheme was carried out
Improve, or it is not improved the design of this utility model patent and technical scheme are directly applied to into other occasions, in this reality
With in new protection domain.
Claims (4)
1. a kind of DBC integrating packaging modules for high-power LED chip, it is characterised in that including DBC substrates and the DBC
Lens bracket and the glass lens being connected through the lens bracket and with the DBC substrates that substrate is fixedly linked, the DBC
Substrate includes metal level, covers the ceramic layer and the line layer adjacent with the ceramic layer of the metal level, on the line layer
Several LED chips are provided with, the lens bracket is provided with several band reflector camera lens installing holes, the band reflector camera lens peace
Dress hole is provided with reflector, and the LED chip position is corresponding with the position with reflector camera lens installing hole, the glass
Camera lens is passed through the reflector and is connected with the LED chip.
2. DBC integrating packaging modules for high-power LED chip according to claim 1, it is characterised in that the gold
Belong to the consistency of thickness of layer and the line layer, and the material of the metal level and the line layer is copper.
3. DBC integrating packaging modules for high-power LED chip according to claim 1, it is characterised in that the pottery
The material of enamel coating is aluminium oxide.
4. DBC integrating packaging modules for high-power LED chip according to claim 1, it is characterised in that the pottery
The material of enamel coating is aluminium nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621041065.1U CN206059425U (en) | 2016-09-07 | 2016-09-07 | A kind of DBC integrating packaging modules for high-power LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621041065.1U CN206059425U (en) | 2016-09-07 | 2016-09-07 | A kind of DBC integrating packaging modules for high-power LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206059425U true CN206059425U (en) | 2017-03-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201621041065.1U Active CN206059425U (en) | 2016-09-07 | 2016-09-07 | A kind of DBC integrating packaging modules for high-power LED chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106159065A (en) * | 2016-09-07 | 2016-11-23 | 深圳市蓝谱里克科技有限公司 | A kind of DBC integrating packaging module for high-power LED chip |
-
2016
- 2016-09-07 CN CN201621041065.1U patent/CN206059425U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106159065A (en) * | 2016-09-07 | 2016-11-23 | 深圳市蓝谱里克科技有限公司 | A kind of DBC integrating packaging module for high-power LED chip |
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