CN206040695U - Base plate that bears electronic component and can buckle - Google Patents
Base plate that bears electronic component and can buckle Download PDFInfo
- Publication number
- CN206040695U CN206040695U CN201621069561.8U CN201621069561U CN206040695U CN 206040695 U CN206040695 U CN 206040695U CN 201621069561 U CN201621069561 U CN 201621069561U CN 206040695 U CN206040695 U CN 206040695U
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- Prior art keywords
- substrate
- electronic component
- led chip
- led
- boss
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The utility model provides a base plate that bears electronic component and can buckle, includes base plate, flexible glue and a plurality of LED chip, is equipped with circuit, a plurality of boss and a plurality of fill area that runs through the base plate on the base plate, the flexible glue setting is equipped with the lamp cup that utilizes the flexible glue to make on the base plate in the fill area, and in the boss was in the cup cavity of lamp cup, the LED chip passes through the colloid to be fixed on the boss, and the circuit electric connection on LED chip and the base plate. The utility model discloses a base plate that bears electronic component and can buckle can save the step of preparation lamp pearl, can effectively strengthen the toughness of buckling of base plate to can increase the light -emitting angle of LED chip.
Description
Technical field
The utility model is related to LED technology field, more particularly to a kind of base that carry electronic component and can bend
Plate.
Background technology
LED and LED string are due to being widely used the features such as its energy-conservation, safety, long service life.LED and LED
The main luminescent device of lamp string is lamp bead.The making step of lamp bead mainly includes：
First, metallic support and LED chip are prepared, with the Lamp cup made with duroplasts on metallic support, by dehumidifying
Support and the good brilliant LED chip of expansion are placed on die bond board, are completed die bond according to the program of setting, are made LED chip be connected to gold
In the Lamp cup of category support, the material after admittedly good crystalline substance is put into into oven cooking cycle completion of cure afterwards；
Then, the metallic support for being connected with LED chip is placed on bonding equipment, bonding wire is completed according to the program for setting and moved
Make, LED chip is connected with metallic support electric wire；
Then, prepare glue, glue is covered in LED chip, so as to form lamp bead.
When LED is produced, need to connect on circuit boards lamp bead by soldering；Then profit runs wires to drive electricity
(driving power supply includes circuit board and connection power drives part on circuit boards, and power drives part includes electric capacity, electricity in source
Sense, resistance, power management IC etc., power drives part for by external high voltage power supply be converted to LED chip it is luminous when drive
Dynamic power supply)；Multiple strip circuit boards for being welded with lamp bead are fixed in the fixed seat of lamp component, and make each strip circuit board
Rounded cylindricality is spaced setting, and then driving power supply and fixed seat are fixed in lamp holder, profit run wires to lamp holder and
Driving power supply, last fastening lampshades form LED.When LED string is produced, need for lamp bead to be connected to flexible electrical by soldering
On the plate of road；Then profit runs wires to driving power supply, so as to form LED string.
But, the process for making lamp bead needs to put into more cost, and lamp bead is to be connected to flexible electrical by soldering
On the plate of road, the fusing point of metallic tin is low, LED chip is soldered to after flexible PCB and is easily affected by the external environment, cause LED chip
It is electrically connected with flexible PCB and exception occurs, causes LED chip poor with the stability that flexible PCB is electrically connected with.
And, before LED and LED string is made, need using the external driving power supply of electric wire, due to the restriction of technique,
Driving power supply can not be directly connected on circuit board as lamp bead, need driving power supply is fabricated separately, and cause production cost to increase.
Further, since LED chip is connected directly between on the surface of metallic support, the rising angle of LED chip is up to
180 °, therefore the rising angle of LED chip is little, by made by lamp bead, the illumination effect of LED and LED string is poor, made by
LED and LED string quality are low.
Further, as the Lamp cup of lamp bead is made up of ebonite, after lamp bead is fixed on circuit boards, bending circuit board is easy
Lamp cup is caused to come off or problems of crack, that is to say, that light fixture bending property is poor by made by lamp bead.
Utility model content
The purpose of this utility model is, there is provided a kind of substrate that carry electronic component and can bend, and can save making
The step of lamp bead, can effectively strengthen the bending toughness of substrate, and the rising angle of LED chip can be increased.
A kind of substrate that carry electronic component and can bend, including substrate, flexible glue and multiple LED chips, substrate are provided with
Circuit, multiple boss and multiple fill areas through substrate, flexible glue are arranged in fill area, and substrate is provided with using flexible glue system
Into Lamp cup, and boss, in the cup chamber of Lamp cup, LED chip is fixed on boss by colloid, and on LED chip and substrate
Circuit be electrically connected with.
In preferred embodiment of the present utility model, LED packaging plastics on aforesaid substrate, are additionally provided with, LED packaging plastics are arranged on
In the cup chamber of Lamp cup, and cover LED chip.
In preferred embodiment of the present utility model, gold thread between above-mentioned LED chip and the substrate, is connected with, gold thread makes
LED chip is electrically connected with the circuit on substrate.
In preferred embodiment of the present utility model, aforesaid substrate includes stacked conducting plate, and each metallic plate is spaced to be set
Put, each metallic plate is connected with each other by insulating cement.
In preferred embodiment of the present utility model, the substrate that above-mentioned carrying electronic component can simultaneously bend also is driven including power supply
Dynamic part, power drives part are connected on substrate, and power drives part is electrically connected with the circuit of substrate.
LED chip is connected directly between the boss of substrate by the substrate that carry electronic component and can bend of the present utility model
On, the step of making lamp bead is eliminated, while greatly reducing for carrying the support of LED chip when eliminating making lamp bead
Production cost.And, having on substrate in fill area, and fill area and be filled with flexible glue, the bending that can effectively strengthen substrate is tough
Property.Further, LED chip is connected on boss, and boss is higher by the surface of substrate, therefore increases the rising angle of LED chip,
So that using lamp luminescence effect made by the substrate production method that carry electronic component and can bend of the present utility model more preferably,
Improve the quality of light fixture.
Described above is only the general introduction of technical solutions of the utility model, in order to better understand skill of the present utility model
Art means, and being practiced according to the content of specification, and in order to allow above and other purpose of the present utility model, feature
Can become apparent with advantage, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, describe in detail.
Description of the drawings
Fig. 1 a are the structural representations for carrying electronic component the substrate that can be bent of the present utility model.
Fig. 1 b be it is of the present utility model carry electronic component and the substrate that can bend along I-I line broken section structural representation
Figure.
Fig. 2 a are using the overlooking the structure diagram for carrying electronic component the substrate manufacture lamp string that can be bent.
Fig. 2 b be Fig. 2 a carry electronic component and the substrate that can bend it is cropped after structural representation.
Fig. 3 a are using the overlooking the structure diagram for carrying electronic component the substrate manufacture linear lamp string that can be bent.
Fig. 3 b are the structural representations after the substrate that carry electronic component and can bend of Fig. 3 a bends.
Fig. 4 a are using the overlooking the structure diagram for carrying electronic component the substrate manufacture LED that can be bent.
Fig. 4 b be Fig. 4 a carry electronic component and the substrate that can bend it is cropped after structural representation.
Fig. 4 c are the structural representations after the substrate that carry electronic component and can bend of Fig. 4 b winds.
Fig. 4 d are the structural representations that the substrate that carry electronic component and can bend of Fig. 4 c is connected with lamp holder.
Fig. 4 e are the structural representations that the substrate that carry electronic component and can bend of Fig. 4 d is connected section view with lamp holder.
Fig. 5 is the schematic flow sheet for carrying electronic component the substrate production method that can be bent of the present utility model.
Fig. 6 a to Fig. 6 f are the flow process local for carrying electronic component the substrate production method that can be bent of the present utility model
Cross-sectional schematic.
Specific embodiment
Further to illustrate that the utility model is to reach technological means and effect that predetermined utility model purpose is taken,
Below in conjunction with accompanying drawing and preferred embodiment, to according to the utility model proposes the tool for carrying electronic component the substrate that can be bent
Body embodiment, structure, feature and its effect, describe in detail as follows:
Relevant of the present utility model aforementioned and other technology contents, feature and effect, it is following coordinate with reference to schema compared with
Can clearly appear from the detailed description of good embodiment.By the explanation of specific embodiment, when to the utility model can be up to
The technological means and effect taken into predetermined purpose is able to more go deep into and specific understanding, but institute's accompanying drawings are only to provide
With reference to purposes of discussion, not for being any limitation as to the utility model.
Fig. 1 a are the structural representations for carrying electronic component the substrate that can be bent of the present utility model.Fig. 1 b are this practicalities
Broken section structural representation of the substrate that new carrying electronic component can simultaneously bend along I-I line.As illustrated in figs. ia and ib,
In the present embodiment, the substrate 10 that carrying electronic component can simultaneously bend includes substrate 12, and substrate 12 includes stacked conducting plate 123.
The 123 spaced setting of each layer metallic plate, and using each metallic plate of insulation gemel connection 123, that is to say, that metallic plate 123 and metal
It is to be connected with each other by insulating cement between plate 123.It is clear in order to illustrate, double layer of metal plate has only been shown in Fig. 1 a and Fig. 1 b
123.In the present embodiment, overetched mode can be led on each metallic plate 123 of substrate 12 circuit is set and (not only be defined in erosion
The mode at quarter arranges circuit).It is noted that the metallic plate 123 on 12 upper strata of substrate is made up of copper material, it is convenient that circuit is set；
The metallic plate 123 of bottom is made up of aluminium, convenient to radiate；Each metallic plate 123 of substrate 12 is not limited to above two metal.
In the present embodiment, 123 number of plies of metallic plate can be one layer or be more than two-layer；For example when metallic plate 123 is four layers,
It is upper strata metallic plate 123, middle layer metal plate 123, lower metal plate 123 and underlying metal plate 123 by 123 points of four layers of metallic plate,
Circuit is set on upper strata metallic plate 123, middle layer metal plate 123 and lower metal plate 123 respectively, and each layer metallic plate 123
The conductive loops that circuit is formed are parallel relationship；It should be noted that upper strata metallic plate 123, middle layer metal plate 123, lower floor are golden
The circuit set location of category plate 123 is identical, it is ensured that the circuit on each layer metallic plate 123 will not be caused brokenly when cutting substrate 12
It is bad.In order that the electronic devices and components for being connected to upper strata metallic plate 123 can be formed with middle layer metal plate 123 or lower metal plate 123
Be electrically connected with, single circuit can be set on upper strata metallic plate 123, and by this single circuit and middle layer metal plate 123 or under
Connection on layer metallic plate 123；Therefore, electronic devices and components can connect 123 single line of upper strata metallic plate using gold thread 16
Road, makes electronic devices and components be electrically connected with middle layer metal plate 123 or lower metal plate 123, as illustrated in figs. ia and ib.
That is, electronic devices and components are connected directly to the surface of substrate 12, and the routing of electronic devices and components can be facilitated to install.
Substrate 12 is provided with multiple boss 124, and each boss 124 is to be formed in substrate 12 using the punching press effect of stamping machine
On, i.e., boss 124 is integrally formed with substrate 12, and boss 124 protrudes from the surface of substrate 12.Boss 124 on substrate 12
Can be formed by other means, be not limited to punch forming.In the present embodiment, it is provided with substrate 12 multiple through each gold
The fill area 102 of category plate 123, each fill area 102 make substrate 12 form the engraved structure of patterning.It is partially filled with area 102 to arrange
Region beyond boss 124, is partially filled with the surrounding that area 102 is arranged on boss 124；It is arranged on the filling of 124 surrounding of boss
Substrate 12 is separated into disjunct two parts (equivalent to the positive and negative electrode of circuit) by area 102.In the present embodiment, fill area 102
Shapes and sizes freely can design according to actual needs, for example the fill area 102 being arranged on outside boss 124 can be designed as
The fill area 102 for being arranged on 124 surrounding of boss is designed as rectangle, but is not limited thereto by strip.
Further, substrate 12 can be bent folding, in order to lift the bending toughness of substrate 12, filling in fill area 102
There is flexible glue 125.In the present embodiment, boss 124 is made in the Lamp cup 126 of the making rectangle of 124 surrounding of boss using flexible glue 125
In the cup chamber 104 of Lamp cup 126.The flexible glue 125 in fill area 102 outside boss 124 can greatly increase substrate 12
Bending toughness, makes the shape that substrate 12 is bent to more meet the specification of actual product；It is by flexible glue to be additionally, since Lamp cup 126
125 make, and when substrate 12 is bent, Lamp cup 126 also can be deformed upon therewith, it is to avoid Lamp cup 126 occur comes off or ftracture
Problem.
As illustrated in figs. ia and ib, substrate 12 is provided with multiple with 124 corresponding LED chip 13 of boss, and LED chip 13 is led to
Cross colloid to be fixed on boss 124, in order to accelerate the solidification of colloid, need for substrate 12 to be put into oven for baking, until colloid
Completion of cure.LED chip 13 is, using 16 hard solder connecting substrate 12 of gold thread and LED chip 13, to make LED chip 13 with substrate 12
Circuit is electrically connected with；Specifically, the circuit that gold thread 16 can be on the metallic plate 123 on 12 top layer of connecting substrate, can also stretch into welding hole
In 101, and the circuit on the metallic plate 123 of 12 internal layer of connecting substrate.Include on substrate 12 multiple corresponding with LED chip 13
LED packaging plastics 17 (such as fluorescent glue), LED packaging plastics 17 are arranged in the cup chamber 104 of Lamp cup 126, and are covered in LED chip 13
On, the LED chip 13 of gold thread 16 is welded for protection.In the present embodiment, the colloid between substrate 12 and LED chip 13 can be
Anisotropic conductive adhesive or insulating cement；When colloid is Anisotropic conductive adhesive, LED chip 13 is by from both positive and negative polarity with it with substrate 12
Circuit be electrically connected with.It is noted that due to 16 fusing point of gold thread it is higher, by the circuit hard solder of LED chip 13 and substrate 12
After the completion of be difficult to be affected by the external environment, the stability that the circuit of LED chip 13 and substrate 12 is electrically connected with can be effectively improved.
As illustrated in figs. ia and ib, power drives part 14 is additionally provided with substrate 12, power drives part 14 is directly connected to
On the substrate 12, and it is electrically connected with power drives part 14 and the circuit of substrate 12.Power drives part 14 is used for will be external
High voltage power supply be converted to driving power supply when LED chip 13 lights.In the present embodiment, power drives part 14 includes electricity
The parts such as appearance, inductance, resistance, power management IC, electric capacity, inductance, resistance, power management IC can pass through scolding tin or gold thread hard solder
Mode is directly connected on the substrate 12.
It is of the present utility model carry electronic component and the substrate 10 that can bend as needed, can cut into needs shape or
Person is bent into the shape of needs.
Fig. 2 a are using the overlooking the structure diagram for carrying electronic component the substrate manufacture lamp string that can be bent.Fig. 2 b are figures
Structural representation after the substrate that carry electronic component and can bend of 2a is cropped.As shown in figures 2 a and 2b, the utility model
Carry electronic component and the substrate 10 that can bend can be cut into flexuose structure.In the present embodiment, substrate 12 includes
The first side 121 being oppositely arranged and second side 122 and cutting between first side 121 and second side 122
Area 105 and installing zone 106.Circuit 15, boss 124, fill area 102 are provided with the installing zone 106 of substrate 12.The sanction of substrate 12
Cutting area 105 includes that multiple first sons cut area 105a and multiple second sons cut area 105b, each first son cut area 105a with it is each
Second son cuts area 105b and is crisscross arranged, and each first son is cut one end of area 105a and is connected with first side 121, and each first is sub
The other end for cutting area 105a extends towards the direction near second side 122, but is not connected with second side 122, each second
Son is cut one end of area 105b and is connected with second side 122, and each second son cuts the other end of area 105b towards near the first side
The direction on side 121 extends, but is not connected with first side 121.In the present embodiment, substrate 12 can cut into different shapes,
For example cut remove substrate 12 on cut area 105, make 12 remaining installing zone of substrate 106 formed strip；The sanction of substrate 12
Cut shape and can freely design the position for cutting area 105 according to actual needs, and then cut into the shape of needs.In the present embodiment
In, circuit 15 is provided with the installing zone 106 of substrate 12, for forming conductive loops, circuit 15 can be added using etching or machinery
The modes such as work are arranged in the installing zone 106 of substrate 12, but are not limited with above-mentioned two ways.
As shown in Figure 2 b, cut and remove the first son of substrate 12 and cut area 105a and after the second son cuts area 105b, stretching
12 remaining installing zone 106 of substrate can be formed directly in the lamp string of bending, the lamp string of formation can directly with power supply electrified light emitting.
Fig. 3 a are using the overlooking the structure diagram for carrying electronic component the substrate manufacture linear lamp string that can be bent.Figure
3b is the structural representation after the substrate that carry electronic component and can bend of Fig. 3 a bends.As best shown in figures 3 a and 3b, this practicality
The new substrate 10 that carry electronic component and can bend can be cut into flexuose structure, and be bent into rectilinear lamp
String.In the present embodiment, the installing zone 106 of substrate 12 includes multiple installation portion 106a, the first bending part 106b, the second bending part
106c and the 3rd bending part 106d；Each installation portion 106a is used for the boss 124 for arranging connection LED chip 13；First bending part
106b and the second bending part 106c are connected to the two ends of installation portion 106a, and the 3rd bending part 106d is connected to adjacent two installation
Between the first bending part 106b and the second bending part 106c of portion 106a ends.By first bending part at installation portion 106a two ends
106b and the second bending part 106c bendings, make the first bending part 106b and the second bending part 106c perpendicular to installation portion 106a, together
When the first bending part 106b of the 3rd bending part 106d both sides and the second bending part 106c are bent, make the first bending part 106b and
Second bending part 106c is parallel to each other perpendicular to the 3rd bending part 106d, now each installation portion 106a, forms rectilinear lamp string.
In the present embodiment, the shape of lamp string into arbitrary shape, can be not limited to linear by free folding as needed.
Fig. 4 a are using the overlooking the structure diagram for carrying electronic component the substrate manufacture LED that can be bent.Fig. 4 b are
Structural representation after the substrate that carry electronic component and can bend of Fig. 4 a is cropped.Fig. 4 c are the carrying electronic components of Fig. 4 b
And the structural representation after the substrate winding that can be bent.As shown in Fig. 4 a, Fig. 4 b and Fig. 4 c, carrying electronics unit of the present utility model
The substrate 10 that part can simultaneously bend can it is cropped after be manipulated into column, and be connected to form LED with lamp holder 22.In the present embodiment,
Substrate 12 includes cutting area 105, installing zone 106 and bent area 107, cuts area 105 and installing zone 106 is located at bent area 107
Top.Circuit 15, boss 124, fill area 102 can be provided with the installing zone 106 of substrate 12, in the bent area 107 of substrate 12
Circuit 15, fill area 102 can be set.Substrate 12 is provided with multiple installing zones 106,106 equidistant interval setting of each installing zone,
And the region of each 106 both sides of installing zone is to cut area 105.
Fig. 4 d are the structural representations that the substrate that carry electronic component and can bend of Fig. 4 c is connected with lamp holder.Such as Fig. 4 d institutes
Show, in the present embodiment, cut remove substrate 12 cut area 105 after, bending is mutually drawn close in two sides of bent area 107,
Until two sides of bent area 107 abut, 12 remaining part of substrate is made to form cylindric.It is each above bent area 107
The spaced setting of circumferencial direction of the installing zone 106 around bent area 107, and the LED chip 13 on installing zone 106 is located remotely from
On the outside of the axial line of cylindrical bent area 107.Certainly, the LED chip 13 on installing zone 106 is may be alternatively located near cylinder bending
On the inside of the axial line in area 107, do not stopped by each installing zone 106 to ensure that LED chip 13 is luminous, bent each installing zone 106
With the junction of bent area 107, make each installing zone 106 with junction as axially direction bending near bent area 107 it is certain
Angle, and then form trumpet-shaped structure.In the present embodiment, the bent area 107 of substrate 12 connects away from the part of installing zone 106
It is connected in lamp holder 22, so as to directly form LED 20, as shown in figure 4d.
Fig. 4 e are the structural representations that the substrate that carry electronic component and can bend of Fig. 4 d is connected section view with lamp holder.As schemed
Shown in 4e, in the present embodiment, in order to ensure stability that substrate 12 is connected with lamp holder 22, using boss 124 outside fill out
The flexible glue 125 filled in area 102 makes clamping block 127 on the bent area 107 of substrate 12, and clamping block 127 protrudes from substrate 12
Surface；As fill area 102 is string configuration, bent area 107 makes clamping block 127 in annular shape after winding, by substrate 12
When bent area 107 is arranged in lamp holder 22, clamping block 127 is resisted against on lamp holder 22.For the clamping block 127 that is connected, lamp holder
Draw-in groove 201 can be set on the inside of 22, so as to the bent area 107 for realizing substrate 12 is fixed in lamp holder 22.
It is noted that can directly by substrate using the substrate 10 that carry electronic component and can bend of the present utility model
12 Curved lamp strings for cutting into finished product, or the linear lamp string of finished product is bent into after substrate 12 is cut, or by substrate
12 cut after be bent into column, and the lamp holder 22 that is connected forms the LED 20 of finished product, but is not limited to make above-mentioned three kinds
Product, also using the substrate 10 that carry electronic component and can bend of the present utility model by bending, cutting or directly formed
Similar lamp string or LED.
Fig. 5 is the schematic flow sheet for carrying electronic component the substrate production method that can be bent of the present utility model.Fig. 6 a
It is the flow process partial schematic sectional view for carrying electronic component the substrate production method that can be bent of the present utility model to Fig. 6 f.Please
Include with reference to the step of Fig. 5 to Fig. 6 f, the substrate production method that carrying electronic component of the present utility model can simultaneously bend：
Substrate 12 is provided, circuit 15 is set on the substrate 12, and multiple boss 124 is stamped and formed out to substrate 12, such as Fig. 6 a
It is shown；
There are on substrate 12 multiple fill areas 102, fill area 102 runs through substrate 12, as shown in Figure 6 b；
Flexible glue 125 is provided, and flexible glue 125 is arranged in fill area 102, and lamp is made on the substrate 12 using flexible glue 125
Cup 126, makes boss 124 in the cup chamber 104 of Lamp cup 126, as fig. 6 c；
Multiple LED chips 13 are provided, LED chip 13 are fixed on boss 124 using colloid, and utilize 16 hard solder of gold thread
Circuit 15 in connection LED chip 13 and substrate 12, as shown in fig 6d；
LED packaging plastics 17 are provided, LED packaging plastics 17 are arranged in the cup chamber 104 of Lamp cup 126, and are covered LED chip
13, as shown in fig 6e；
Power drives part 14 is provided, power drives part 14 is connected on the substrate 12, and is made power drives part 14
It is electrically connected with the circuit 15 of substrate 12, as shown in Figure 6 f；
When making lamp string, cut removal substrate 12 cuts area 105, makes 12 remaining installing zone of substrate 106 form strip
The lamp string of shape；Specifically, for example, cut and remove the first son of substrate 12 and cut area 105a and after the second son cuts area 105b, draw
The lamp string that 12 remaining installing zone 106 of substrate can be formed directly in bending is stretched, as shown in Figure 2 b；For example, by the installation of installing zone 106
The first bending part 106b and the second bending part 106c at portion 106a two ends is bent into perpendicular to installation portion 106a, while by the 3rd folding
The first bending part 106b and the second bending part 106c of turn of bilge 106d both sides is bent into perpendicular to the 3rd bending part 106d, makes each peace
Dress portion 106a is parallel to each other, and forms rectilinear lamp string, as shown in Figure 3 b.
When making LED, cut removal substrate 12 cuts area 105, and 12 remaining part of substrate is bent to column, and
It is connected to form LED 20 with lamp holder 22；Specifically, for example, cut removal substrate 12 cuts area 105, by the two of bent area 107
Side is mutually drawn close and is bent to form cylindric, and the bent area 107 of substrate 12 is connected to lamp holder away from the part of installing zone 106
In 22, so as to directly form LED 20, as shown in figure 4d.
The substrate production method that carry electronic component and can bend of the present utility model, LED chip 13 is connected directly between
On the boss 124 of substrate 12, the step of making lamp bead is eliminated, while for carrying LED chip 13 when eliminating making lamp bead
Support, greatly reduce production cost.And, LED chip 13 is connected on the substrate 12 by 16 hard solder of gold thread, gold thread 16
Fusing point is high, will be difficult to be affected by the external environment after the completion of 15 hard solder of circuit of the LED chip 13 with substrate 12, can effectively improve LED
The stability that the circuit 15 of chip 13 and substrate 12 is electrically connected with.Additionally, as needed substrate 12 can be cut or be bent
It is fabricated to lamp string or LED；The step of for example eliminating lamp bead soldering on circuit boards during lamp string is made, can be straight
The lamp string for cutting or bending that substrate 12 forms needs was connected, batch production lamp string is capable of achieving, is improve the production efficiency of lamp string,
Reduce production cost simultaneously；For example during LED is made, only the substrate 12 of coiling and molding need to be connected with lamp holder 22
LED 20 is can be made into so that the step of making LED 20 is simple, can manufacture LED 20, not only production efficiency is high, and
And low production cost.
Further, LED chip 13 is connected on boss 124, and boss 124 is higher by the surface of substrate 12, therefore increases LED
The rising angle of chip 13 so that using made by the substrate production method that carry electronic component and can bend of the present utility model
Lamp luminescence effect more preferably, improves the quality of light fixture.
Preferred embodiment of the present utility model is described in detail above in association with accompanying drawing, but the utility model is not limited to
Detail in above-mentioned embodiment, in range of the technology design of the present utility model, can be to technology of the present utility model
Scheme carries out various simple variants, and these simple variants belong to protection domain of the present utility model.In above-mentioned specific embodiment party
Each particular technique feature described in formula, in the case of reconcilable, can be combined by any suitable means.
In order to avoid unnecessary repetition, the utility model is no longer separately illustrated to various possible combinations.
Claims (5)
1. it is a kind of to carry the substrate that electronic component can simultaneously bend, it is characterised in that including substrate, flexible glue and multiple LED chips, base
Plate is provided with circuit, multiple boss and multiple fill areas through the substrate, and the flexible glue is arranged in the fill area, the substrate
It is provided with using Lamp cup made by the flexible glue, and the boss, in the cup chamber of the Lamp cup, the LED chip is fixed on by colloid
On the boss, and the LED chip is electrically connected with the circuit on the substrate.
2. it is as claimed in claim 1 to carry the substrate that electronic component can simultaneously bend, it is characterised in that to be additionally provided with the substrate
LED packaging plastics, the LED packaging plastics are arranged in the cup chamber of the Lamp cup, and cover the LED chip.
3. it is as claimed in claim 1 to carry the substrate that electronic component can simultaneously bend, it is characterised in that the LED chip and the base
Gold thread is connected between plate, the gold thread makes the LED chip be electrically connected with the circuit on the substrate.
4. it is as claimed in claim 1 to carry the substrate that electronic component can simultaneously bend, it is characterised in that the substrate includes multilayer gold
Category plate, the respectively spaced setting of the metallic plate, respectively the metallic plate be connected with each other by insulating cement.
5. it is as claimed in claim 1 to carry the substrate that electronic component can simultaneously bend, it is characterised in that the carrying electronic component is simultaneously
The substrate that can be bent also includes power drives part, and the power drives part connects on the substrate, and the power drives part
It is electrically connected with the circuit of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621069561.8U CN206040695U (en) | 2016-09-21 | 2016-09-21 | Base plate that bears electronic component and can buckle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621069561.8U CN206040695U (en) | 2016-09-21 | 2016-09-21 | Base plate that bears electronic component and can buckle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206040695U true CN206040695U (en) | 2017-03-22 |
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ID=58296134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621069561.8U Expired - Fee Related CN206040695U (en) | 2016-09-21 | 2016-09-21 | Base plate that bears electronic component and can buckle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206040695U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252488A (en) * | 2016-09-21 | 2016-12-21 | 深圳市光之谷新材料科技有限公司 | Carry electronic component the substrate production method that can bend and substrate |
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2016
- 2016-09-21 CN CN201621069561.8U patent/CN206040695U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252488A (en) * | 2016-09-21 | 2016-12-21 | 深圳市光之谷新材料科技有限公司 | Carry electronic component the substrate production method that can bend and substrate |
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