CN106252497A - Make the substrate production method of lamp string and make the substrate of lamp string - Google Patents
Make the substrate production method of lamp string and make the substrate of lamp string Download PDFInfo
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- CN106252497A CN106252497A CN201610838902.1A CN201610838902A CN106252497A CN 106252497 A CN106252497 A CN 106252497A CN 201610838902 A CN201610838902 A CN 201610838902A CN 106252497 A CN106252497 A CN 106252497A
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- lamp string
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- 239000000758 substrate Substances 0.000 title claims abstract description 172
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 239000000084 colloidal system Substances 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 238000005452 bending Methods 0.000 claims description 85
- 238000009434 installation Methods 0.000 claims description 33
- 239000003292 glue Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000004568 cement Substances 0.000 claims description 5
- 239000011324 bead Substances 0.000 abstract description 19
- 241000218202 Coptis Species 0.000 description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
A kind of substrate production method making lamp string, the substrate production method making lamp string includes providing substrate, and substrate includes cutting district and installing zone, and the installing zone at substrate arranges circuit；Multiple LED chip is provided, utilizes colloid that LED chip is fixed on the installing zone of substrate, and make LED chip be electrically connected with the circuit on substrate；Cut removal substrate cuts district, makes the remaining installing zone of substrate form the lamp string of strip.The substrate production method making lamp string of the present invention can save the step making lamp bead, and can manufacture lamp string, improves the production efficiency of lamp string, reduces production cost simultaneously.The invention still further relates to a kind of substrate making lamp string.
Description
Technical field
The present invention relates to LED technology field, particularly to a kind of substrate production method making lamp string and making
The substrate of lamp string.
Background technology
LED string is mainly used as decoration.LED string mainly includes electric power driving module, flexible PCB and lamp bead, wherein
Lamp bead is the light-emitting component of LED string.The making step of lamp bead specifically includes that
First, prepare metal rack and LED chip, good to the support of dehumidifying and expansion brilliant LED chip is placed on die bond board
On, complete die bond according to the program set, make LED chip be connected on this metal rack, afterwards the material after the best crystalline substance is put
Enter oven cooking cycle completion of cure；
Then, connection has the metal rack of LED chip be placed on bonding equipment, complete bonding wire according to the program set and move
Make, make LED chip be connected with metal rack electric wire；
Then, prepare glue, glue is covered in LED chip, thus forms lamp bead.
When assembling LED string, need to be connected on flexible PCB lamp bead by soldering；Then profit runs wires to drive
Galvanic electricity source module, thus form LED string.
But, the process making lamp bead needs to put into more cost, and lamp bead is to be connected to flexible electrical by soldering
On the plate of road, the fusing point of metallic tin is low, is easily affected by the external environment, causes LED chip after LED chip is soldered to flexible PCB
It is electrically connected with flexible PCB and occurs extremely, causing the poor stability that LED chip is electrically connected with flexible PCB.
And, during producing LED string, need the lamp bead made to be fixed on flexible PCB, the most just
It is to say, at least includes lamp bead being fabricated separately and the lamp bead made being fixed on circuit boards in the process manufacturing LED string,
Connect the steps such as electric power driving module afterwards, thus form LED string.Therefore, the method for existing making LED string is the most time-consuming
Longer, production efficiency is low, and relatively costly.
Additionally, before the LED string made, need to utilize electric wire external power supply to drive module, electric power driving module includes electricity
Road plate and power drives part (power drives part includes electric capacity, inductance, resistance, power management IC etc.), power drives part
Connect on circuit boards, driving power supply when power drives part for being converted to lamp bead luminescence by external high voltage power supply.By
In the restriction of technique, electric power driving module can not be connected directly between on the circuit board of lamp string, needs power drives mould is fabricated separately
Block, causes production cost to increase.
Summary of the invention
It is an object of the invention to, it is provided that a kind of substrate production method making lamp string, the step making lamp bead can be saved
Suddenly, and can manufacture lamp string, improve the production efficiency of lamp string, reduce production cost simultaneously.
The present invention solves it and technical problem is that what the following technical scheme of employing realized.
A kind of substrate production method making lamp string, the substrate production method making lamp string includes providing substrate, substrate bag
Including and cut district and installing zone, the installing zone at substrate arranges circuit；Multiple LED chip is provided, utilizes colloid LED chip to be fixed
Substrate installing zone, and make the circuit on LED chip and substrate be electrically connected with；Cut removal substrate cuts district, makes base
The remaining installing zone of plate forms the lamp string of strip.
In the preferred embodiment, aforesaid substrate includes stacked conducting plate, by spaced for each metallic plate setting,
And utilize insulating cement to connect each metallic plate.
In the preferred embodiment, there is multiple filling running through each metallic plate in the installing zone of aforesaid substrate
District, it is provided that flexible glue, is arranged on flexible glue in fill area, utilizes flexible glue to make Lamp cup on substrate, and makes LED chip be in Lamp cup
Cup intracavity, it is provided that LED packaging plastic, LED packaging plastic is arranged on the cup intracavity of Lamp cup, and covers LED chip.
In the preferred embodiment, it is provided that power drives part, power drives part is connected on substrate, and
Power drives part is made to be electrically connected with the circuit of substrate.
In the preferred embodiment, aforesaid substrate includes first side and the second side being oppositely arranged, and cuts
District includes that multiple first son cuts district and multiple second son cuts district, and each first son cuts district and each second son and cuts that district is staggered to be set
Putting, and one end that each first son cuts district is connected with first side, each first son cuts the other end in district towards near the second side
The direction on limit extends, and one end that each second son cuts district is connected with second side, and each second son cuts the other end in district towards leaning on
The direction of nearly first side extends, and cuts and removes the first son of substrate and cut district and the second son cuts district, makes the remaining peace of substrate
Dress district forms the lamp string of Curved.
In the preferred embodiment, the installing zone of aforesaid substrate include multiple installation portion, the first bending part, second
Bending part and the 3rd bending part, each installation portion is used for connecting LED chip, and the first bending part and the second bending part are connected to peace
The two ends in dress portion, the 3rd bending part is connected between the first bending part and second bending part of adjacent two installation portion ends, will peace
First bending part and second bending part at two ends, dress portion are bent into and are perpendicular to installation portion, simultaneously by the first of the 3rd bending part both sides
Bending part and the second bending part are bent into and are perpendicular to the 3rd bending part, make each installation portion be parallel to each other, and form rectilinear lamp string.
It is an object of the invention to, it is provided that a kind of substrate making lamp string, the step making lamp bead can be saved, and can criticize
Amount produces lamp string, improves the production efficiency of lamp string, reduces production cost simultaneously.
A kind of substrate making lamp string, including substrate and multiple LED chip, substrate includes cutting district and installing zone, substrate
Installing zone in be provided with circuit, LED chip is fixed in the installing zone of substrate by colloid, and on LED chip and substrate
Circuit is electrically connected with, cut remove substrate cut district after can form the lamp string of strip.
In the preferred embodiment, the substrate of above-mentioned making lamp string also includes power drives part, power drives
Part is connected on substrate, and the circuit of power drives part and substrate is electrically connected with.
In the preferred embodiment, aforesaid substrate includes first side and the second side being oppositely arranged, and cuts
District includes that multiple first son cuts district and multiple second son cuts district, and each first son cuts district and each second son and cuts that district is staggered to be set
Putting, and one end that each first son cuts district is connected with first side, each first son cuts the other end in district towards near the second side
The direction on limit extends, and one end that each second son cuts district is connected with second side, and each second son cuts the other end in district towards leaning on
The direction of nearly first side extends, and the first son of substrate cuts district and after the second son cuts the cropped removal in district, and substrate is remaining
Installing zone forms the lamp string of Curved.
In the preferred embodiment, the installing zone of aforesaid substrate include multiple installation portion, the first bending part, second
Bending part and the 3rd bending part, each installation portion is used for connecting LED chip, and the first bending part and the second bending part are connected to peace
The two ends in dress portion, the 3rd bending part is connected between the first bending part and second bending part of adjacent two installation portion ends, and peace
First bending part and second bending part at two ends, dress portion are perpendicular to installation portion, first bending part and second of the 3rd bending part both sides
Bending part is perpendicular to the 3rd bending part, and each installation portion is parallel to each other, and the remaining installing zone of substrate forms rectilinear lamp string.
The substrate production method making lamp string of the present invention, is connected directly between LED chip on substrate, eliminates making lamp
The step of pearl, eliminates when making lamp bead for carrying the support of LED chip simultaneously, greatly reduces production cost.And,
The lamp string shape that can make as required, cuts substrate, directly cuts out the lamp string of strip；Or to cut out
Lamp string carries out being bent to form rectilinear lamp string；Therefore, lamp bead is soldered to circuit board making to eliminate during lamp string
On step, can directly by cut or bend substrate formed need lamp string, can realize produce in batches lamp string, improve lamp string
Production efficiency, reduce production cost simultaneously.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of description, and in order to allow the above and other objects, features and advantages of the present invention can
Become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, describe in detail.
Accompanying drawing explanation
Fig. 1 a is the structural representation of the substrate making lamp string of first embodiment of the invention.
Fig. 1 b be Fig. 1 a make lamp string substrate cut after structural representation.
Fig. 2 a is the broken section structural representation of the substrate making lamp string of the present invention.
Fig. 2 b is that the substrate making lamp string of the present invention arranges the broken section structural representation of fill area on substrate.
Fig. 3 a be second embodiment of the invention make lamp string substrate cut after structural representation.
Fig. 3 b is the structural representation after the substrate bending making lamp string of Fig. 3 a.
Fig. 4 is the schematic flow sheet of the substrate production method making lamp string of the present invention.
Fig. 5 a to Fig. 5 e is the flow process partial schematic sectional view of the substrate production method making lamp string of the present invention.
Detailed description of the invention
By further illustrating the technological means and effect that the present invention taked by reaching predetermined goal of the invention, below in conjunction with
Accompanying drawing and preferred embodiment, the tool to the substrate of the substrate production method and making lamp string making lamp string according to proposition of the present invention
Body embodiment, structure, feature and effect thereof, describe in detail as follows:
For the present invention aforementioned and other technology contents, feature and effect, in following cooperation with reference to graphic preferable real
Execute in the detailed description of example and can clearly appear from.By the explanation of detailed description of the invention, when can be to the present invention for reaching predetermined mesh
The technological means taked and effect is able to more deeply and concrete understanding, but institute's accompanying drawings is only to provide with reference to and says
Bright it is used, is not used for the present invention is any limitation as.
Fig. 1 a is the structural representation of the substrate making lamp string of first embodiment of the invention.As shown in Figure 1a, in this reality
Executing in example, the substrate 10a making lamp string includes substrate 12a, multiple LED chip 13 and power drives part 14.
Fig. 1 b be Fig. 1 a make lamp string substrate cut after structural representation.As illustrated in figs. ia and ib, substrate 12a
Including the first side 121 being oppositely arranged and second side 122 and between first side 121 and second side 122
Cut district 101 and installing zone 102.Cut district 101 and include that multiple first son cuts district 101a and multiple second son cuts district 101b,
Each first son cuts district 101a and cuts district 101b with each second son and be crisscross arranged, and each first son cuts one end of district 101a and the
One side 121 connects, and each first son cuts the other end of district 101a and extends towards the direction near second side 122, but not with
Second side 122 connects, and each second son cuts one end of district 101b and is connected with second side 122, and each second son cuts district 101b
The other end extend towards the direction near first side 121, but be not connected with first side 121.In the present embodiment, substrate
12a can cut into different shapes, such as, cut to remove and cut district 101 on substrate 12a, makes the remaining installing zone of substrate 12a
102 form strip；Substrate 12a cuts shape and can the most freely design the position cutting district 101, and then cuts
Become the shape needed.In the present embodiment, it is provided with circuit 15 in the installing zone 102 of substrate 12a, is used for forming conductive loops,
Circuit 15 can use the modes such as etching or machining to be arranged in the installing zone 102 of substrate 12a, but not with above two side
Formula is limited.
Further, Fig. 2 a is the broken section structural representation of substrate making lamp string of the present invention.As shown in Figure 2 a,
Substrate 12a includes stacked conducting plate 123.Each spaced setting of layer metallic plate 123, and utilize insulating cement to connect each metallic plate
123, say, that be to be connected with each other by insulating cement between metallic plate 123 and metallic plate 123.In the present embodiment, in order to scheme
Show clear, Fig. 2 has only shown double layer of metal plate 123.It is noted that the metallic plate 123 on substrate 12a upper strata is by copper material
Make, circuit is conveniently set；The metallic plate 123 of bottom is made up of aluminium, convenient heat radiation；Each metallic plate 123 of substrate 12a is not
It is defined in above two metal.
In the present embodiment, metallic plate 123 number of plies can be one layer or be more than two-layer；Such as when metallic plate 123 is four layers,
Four layers of metallic plate 123 are divided into upper strata metallic plate 123, middle layer metal plate 123, lower metal plate 123 and underlying metal plate 123,
Circuit is set respectively on upper strata metallic plate 123, middle layer metal plate 123 and lower metal plate 123, and each layer metallic plate 123
The conductive loops that circuit is formed is parallel relationship；It should be noted that upper strata metallic plate 123, middle layer metal plate 123, lower floor's gold
It is identical that the circuit of genus plate 123 arranges position, it is ensured that will not cause brokenly circuit on each layer metallic plate 123 when cutting substrate 12
Bad.
Fig. 2 b is that the substrate making lamp string of the present invention arranges the broken section structural representation of fill area on substrate.As
Shown in Fig. 2 b, arranging multiple fill area 104 running through each metallic plate 123 in the installing zone 102 of substrate 12a, each fill area 104 makes
Substrate 12a forms the engraved structure of patterning, and is filled with flexible glue 124 in fill area 104.In the present embodiment, fill area 104
Shapes and sizes can the most freely design；Fill area 104 such as can be essentially designed as the rectangle frame structure of discontinuous
(being not limited to rectangular configuration), is arranged on flexible glue 124 on substrate 12a, makes the flexible glue 124 on substrate 12a connect fill area
Flexible glue 124 in 104, and utilize flexible glue 124 to make the Lamp cup 125 of rectangle on substrate 12a, it is hollow out in the middle part of Lamp cup 125
Cup chamber 105, substrate 12a can expose from cup chamber 105.
Refer to Fig. 1 a to Fig. 2 b, LED chip 13 is connected to the installing zone 102 of substrate 12a by colloid, it is preferable that LED
Chip 13 is connected on the substrate 12a in Lamp cup 125 by colloid, in i.e. LED chip 13 is in the cup chamber 105 of Lamp cup 125；For
Accelerate the solidification of colloid, need substrate 12a is put into oven for baking, until colloid completion of cure.In the present embodiment,
LED chip 13 utilizes gold thread 16 hard solder to connect substrate 12a and LED chip 13, makes circuit 15 electricity of LED chip 13 and substrate 12a
Property connect.Multiple LED packaging plastic 17 (such as fluorescent glue) corresponding with LED chip 13, LED packaging plastic 17 is included on substrate 12a
It is arranged in the cup chamber 105 of Lamp cup 125, and covers in LED chip 13, weld the LED chip 13 of gold thread 16 for protection.?
In the present embodiment, the colloid between substrate 12a and LED chip 13 can be Anisotropic conductive adhesive or insulating cement, according to actual needs may be used
Unrestricted choice.It is noted that owing to gold thread 16 fusing point is higher, circuit 15 hard solder of LED chip 13 with substrate 12a is completed
After be difficult to be affected by the external environment, the stability that the circuit 15 of LED chip 13 and substrate 12a is electrically connected with can be effectively improved.
Power drives part 14 is connected in the installing zone 102 of substrate 12a, and makes power drives part 14 and substrate 12a
Circuit 15 be electrically connected with.Driving when power drives part 14 for being converted to LED chip 13 luminescence by external high voltage power supply
Galvanic electricity source.In the present embodiment, power drives part 14 includes the parts such as electric capacity, inductance, resistance, power management IC, electric capacity, electricity
Sense, resistance, power management IC can be connected directly between on substrate 12a by the way of scolding tin or gold thread hard solder.
As shown in Figure 1 b, cut and remove first son of substrate 12a and cut district 101a and after the second son cuts district 101b, stretching
The remaining installing zone of substrate 12a 102 can be formed directly in the lamp string of bending, and the lamp string of formation can directly and power supply electrified light emitting.
Fig. 3 a be second embodiment of the invention make lamp string substrate cut after structural representation.Fig. 3 b is Fig. 3 a
Make the structural representation after the substrate bending of lamp string.As best shown in figures 3 a and 3b, the substrate 10b making lamp string in the present embodiment
Roughly the same with the structure of the substrate 10a making lamp string in first embodiment, difference is the shape after substrate 12b bending
Different.
Specifically, the installing zone 102 of substrate 12b includes multiple installation portion 102a, the first bending part 102b, the second bending part
102c and the 3rd bending part 102d；Each installation portion 102a is used for connecting LED chip 13；First bending part 102b and the second bending part
102c is connected to the two ends of installation portion 102a, and the 3rd bending part 102d is connected to the first of adjacent two installation portion 102a ends
Between bending part 102b and the second bending part 102c.By the first bending part 102b and second bending part at installation portion 102a two ends
102c bends, and makes the first bending part 102b and the second bending part 102c be perpendicular to installation portion 102a, simultaneously by the 3rd bending part
First bending part 102b and the second bending part 102c bending of 102d both sides, makes the first bending part 102b and the second bending part 102c
It is perpendicular to the 3rd bending part 102d, the most each installation portion 102a be parallel to each other, forms rectilinear lamp string.In the present embodiment,
The shape of lamp string can become arbitrary shape by free folding as required, is not limited to linear.
Fig. 4 is the schematic flow sheet of the substrate production method making lamp string of the present invention.Fig. 5 a to Fig. 5 e is the present invention
Make the flow process partial schematic sectional view of the substrate production method of lamp string.Refer to Fig. 1 a to Fig. 5 e, the making lamp string of the present invention
The step of substrate production method include:
Thering is provided substrate 12a, 12b, substrate 12a, 12b include cutting district 101 and installing zone 102, and at substrate 12a, 12b
Circuit 15 is set in installing zone 102, as shown in Figure 5 a；
There is in the installing zone 102 of substrate 12a, 12b multiple fill area 104, and in fill area 104, fill flexible glue 124,
Flexible glue 124 is utilized to make Lamp cup 125 on substrate 12a, 12b, as shown in Figure 5 b；
Multiple LED chip 13 is provided, utilizes the peace of substrate 12a, 12b that LED chip 13 is fixed in Lamp cup 125 by colloid
Dress district 102, carries out baking-curing colloid, as shown in Figure 5 c afterwards；
Utilize gold thread 16 hard solder to connect substrate 12a, 12b and LED chip 13, make the line of LED chip 13 and substrate 12a, 12b
Road 15 is electrically connected with, as fig 5d；
LED packaging plastic 17 is provided, LED packaging plastic 17 is arranged in the cup chamber 105 of Lamp cup 125, and covers LED chip
13, as depicted in fig. 5e；
Power drives part 14 is provided, power drives part 14 is connected on substrate 12a, 12b, and makes power drives zero
Part 14 is electrically connected with the circuit 15 of substrate 12a, 12b；
Cut removal substrate 12a, 12b cuts district 101, makes the remaining installing zone of substrate 12a, 12b 102 form strip
Lamp string；Specifically, such as, cut and remove first son of substrate 12a and cut district 101a and after the second son cuts district 101b, stretching
The remaining installing zone of substrate 12a 102 can be formed directly in the lamp string of bending, as shown in Figure 1 b；Such as, by the installation of installing zone 102
The first bending part 102b and the second bending part 102c at 102a two ends, portion are bent into and are perpendicular to installation portion 102a, simultaneously by the 3rd folding
The first bending part 102b and the second bending part 102c of turn of bilge 102d both sides are bent into and are perpendicular to the 3rd bending part 102d, make each peace
Dress portion 102a is parallel to each other, and forms rectilinear lamp string, as shown in Figure 3 b.
The substrate production method making lamp string of the present invention, is connected directly between LED chip 13 on substrate 12a, 12b, saves
Go to make the step of lamp bead, eliminated when making lamp bead for carrying the support of LED chip 13 simultaneously, greatly reduce life
Produce cost.And, LED chip 13 is connected on substrate 12a, 12b by gold thread 16 hard solder, and gold thread 16 fusing point is high, by LED chip
13 complete with circuit 15 hard solder of substrate 12a, 12b after be difficult to be affected by the external environment, LED chip 13 and substrate can be effectively improved
The stability that the circuit 15 of 12a, 12b is electrically connected with.Additionally, the lamp string shape that can make as required, substrate 12a, 12b are entered
Row cuts, and directly cuts out the lamp string of strip；Or the lamp string cut out is bent to form rectilinear lamp string；Cause
This, eliminate lamp bead soldering step on circuit boards during lamp string making, can be directly by cutting or bending base
Plate 12a, 12b form the lamp string needed, and can realize producing lamp string in batches, improve the production efficiency of lamp string, reduce life simultaneously
Produce cost.
Describe the preferred embodiment of the present invention in detail above in association with accompanying drawing, but the present invention is not limited to above-mentioned enforcement
Detail in mode, in the technology concept of the present invention, technical scheme can be carried out multiple simply
Modification, these simple variant belong to protection scope of the present invention.Each described in above-mentioned detailed description of the invention is concrete
Technical characteristic, in the case of reconcilable, can be combined by any suitable means.In order to avoid unnecessary weight
Multiple, various possible compound modes are illustrated by the present invention the most separately.
Claims (10)
1. the substrate production method making lamp string, it is characterised in that the method includes:
Thering is provided substrate, this substrate includes cutting district and installing zone, arranges circuit in the installing zone of this substrate；
Multiple LED chip is provided, utilizes colloid this LED chip to be fixed in the installing zone of this substrate, and make this LED chip with
Circuit on this substrate is electrically connected with；And
Cut this substrate of removal cuts district, makes the remaining installing zone of this substrate form the lamp string of strip.
2. the substrate production method making lamp string as claimed in claim 1, it is characterised in that this substrate includes multiple layer metal
Plate, by the respectively spaced setting of this metallic plate, and utilizes insulating cement to connect respectively this metallic plate.
3. the substrate production method making lamp string as claimed in claim 2, it is characterised in that have in the installing zone of this substrate
Multiple fill areas running through respectively this metallic plate, it is provided that flexible glue, are arranged on this flexible glue in this fill area, utilize this flexible glue at this base
Make Lamp cup on plate, and make this LED chip be in the cup intracavity of this Lamp cup, it is provided that LED packaging plastic, this LED packaging plastic is arranged
At the cup intracavity of this Lamp cup, and cover this LED chip.
4. the substrate production method making lamp string as claimed in claim 1, it is characterised in that this offer power drives part,
This power drives part is connected on the substrate, and makes this power drives part be electrically connected with the circuit of this substrate.
5. the as claimed in claim 1 substrate production method making lamp string, it is characterised in that this substrate includes being oppositely arranged
First side and second side, this cuts district and includes that multiple first son cuts district and multiple second son cuts district, respectively this first son
Cut district to cut district with respectively this second son and be crisscross arranged, and respectively this first son cuts the one end in district and is connected with this first side, respectively
This first son cuts the other end in district and extends towards the direction near this second side, and respectively this second son cuts the one end in district and is somebody's turn to do
Second side connects, and respectively this second son cuts the other end direction extension towards this first side close in district, and cutting removal should
First son of substrate cuts district and the second son cuts district, makes the remaining installing zone of this substrate form the lamp string of Curved.
6. the substrate production method making lamp string as claimed in claim 5, it is characterised in that the installing zone of this substrate includes many
Individual installation portion, the first bending part, the second bending part and the 3rd bending part, respectively this installation portion is used for connecting LED chip, this first folding
Turn of bilge and this second bending part are connected to the two ends of this installation portion, and the 3rd bending part is connected to adjacent two these installation portion ends
Between this first bending part and this second bending part in portion, by this first bending part at these installation portion two ends and this second bending part
It is bent into and is perpendicular to this installation portion, this first bending part of the 3rd bending part both sides and this second bending part are bent into simultaneously
It is perpendicular to the 3rd bending part, makes respectively this installation portion be parallel to each other, form rectilinear lamp string.
7. the substrate making lamp string, it is characterised in that include substrate and multiple LED chip, this substrate include cutting district and
Installing zone, is provided with circuit in the installing zone of this substrate, and this LED chip is fixed in the installing zone of this substrate by colloid, and
Circuit on this LED chip and this substrate is electrically connected with, cut remove this substrate cut district after can form the lamp string of strip.
8. the substrate making lamp string as claimed in claim 7, it is characterised in that the substrate of this making lamp string also includes that power supply drives
Dynamic part, this power drives part connects on the substrate, and the circuit of this power drives part and this substrate is electrically connected with.
9. the substrate making lamp string as claimed in claim 7, it is characterised in that this substrate includes the first side being oppositely arranged
And second side, this cuts district and includes that multiple first son cuts district and multiple second son cuts district, respectively this first son cut district with
Respectively this second son cuts district and is crisscross arranged, and respectively this first son cuts the one end in district and is connected with this first side, respectively this first son
The other end cutting district extends towards the direction near this second side, and respectively this second son cuts one end and this second side in district
Connecting, respectively this second son cuts the other end direction extension towards this first side close in district, and the first son of this substrate cuts
After district and the second son cut the cropped removal in district, the remaining installing zone of this substrate forms the lamp string of Curved.
10. the substrate making lamp string as claimed in claim 9, it is characterised in that the installing zone of this substrate includes multiple installation
Portion, the first bending part, the second bending part and the 3rd bending part, respectively this installation portion is used for connecting LED chip, this first bending part and
This second bending part is connected to the two ends of this installation portion, and the 3rd bending part is connected to being somebody's turn to do of adjacent two these installation portion ends
Between first bending part and this second bending part, and this first bending part at these installation portion two ends and this second bending part are perpendicular to
This installation portion, this first bending part of the 3rd bending part both sides and this second bending part are perpendicular to the 3rd bending part, respectively should
Installation portion is parallel to each other, and the remaining installing zone of this substrate forms rectilinear lamp string.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610838902.1A CN106252497A (en) | 2016-09-21 | 2016-09-21 | Make the substrate production method of lamp string and make the substrate of lamp string |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610838902.1A CN106252497A (en) | 2016-09-21 | 2016-09-21 | Make the substrate production method of lamp string and make the substrate of lamp string |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106252497A true CN106252497A (en) | 2016-12-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610838902.1A Pending CN106252497A (en) | 2016-09-21 | 2016-09-21 | Make the substrate production method of lamp string and make the substrate of lamp string |
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| Country | Link |
|---|---|
| CN (1) | CN106252497A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102767707A (en) * | 2012-05-21 | 2012-11-07 | 王定锋 | LED (Light-Emitting Diode) module capable of directly forming LED support on wire circuit board, and manufacturing method of LED module |
| CN104835883A (en) * | 2014-02-08 | 2015-08-12 | 一诠精密电子工业(中国)有限公司 | LED material strap manufacturing method |
| CN205065632U (en) * | 2015-10-29 | 2016-03-02 | 苏州紫昱天成光电有限公司 | Full angle LED light structures |
| CN205508859U (en) * | 2015-12-02 | 2016-08-24 | 王定锋 | Stereo circuit board PACKER MODULE |
-
2016
- 2016-09-21 CN CN201610838902.1A patent/CN106252497A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102767707A (en) * | 2012-05-21 | 2012-11-07 | 王定锋 | LED (Light-Emitting Diode) module capable of directly forming LED support on wire circuit board, and manufacturing method of LED module |
| CN104835883A (en) * | 2014-02-08 | 2015-08-12 | 一诠精密电子工业(中国)有限公司 | LED material strap manufacturing method |
| CN205065632U (en) * | 2015-10-29 | 2016-03-02 | 苏州紫昱天成光电有限公司 | Full angle LED light structures |
| CN205508859U (en) * | 2015-12-02 | 2016-08-24 | 王定锋 | Stereo circuit board PACKER MODULE |
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