CN206040707U - Base plate of preparation lamp cluster - Google Patents

Abstract

The utility model provides a base plate of preparation lamp cluster, includes base plate and a plurality of LED chip, and the base plate includes the installing zone, and the installing zone is rectangular shape, is provided with the circuit in the installing zone of base plate, and the LED chip passes through the colloid to be fixed in the installing zone of base plate, makes the lamp cluster of the rectangular shape of circuit electric connection formation of LED chip and base plate. The utility model discloses a base plate of preparation lamp cluster can save the step of preparation lamp pearl to ability batch production lamp cluster has improved the production efficiency that the lamp was gone here and there, has reduced manufacturing cost simultaneously.

Description

Make the substrate of lamp string

Technical field

The utility model is related to LED technology field, more particularly to a kind of substrate for making lamp string.

Background technology

LED string is mainly used as decoration.LED string mainly includes electric power driving module, flexible PCB and lamp bead, wherein Light-emitting component of the lamp bead for LED string.The making step of lamp bead mainly includes：

First, prepare metallic support and LED chip, the support of dehumidifying and the LED chip for expanding good crystalline substance are placed on into die bond board On, die bond being completed according to the program of setting, LED chip is connected on the metallic support, afterwards the material after admittedly good crystalline substance is put Enter oven cooking cycle completion of cure；

Then, the metallic support for being connected with LED chip is placed on bonding equipment, bonding wire is completed according to the program for setting and moved Make, LED chip is connected with metallic support electric wire；

Then, prepare glue, glue is covered in LED chip, so as to form lamp bead.

During assembling LED string, need lamp bead is connected on flexible PCB by soldering；Then profit runs wires to drive Dynamic power module, so as to form LED string.

But, the process for making lamp bead needs to put into more cost, and lamp bead is to be connected to flexible electrical by soldering On the plate of road, the fusing point of metallic tin is low, LED chip is soldered to after flexible PCB and is easily affected by the external environment, cause LED chip It is electrically connected with flexible PCB and exception occurs, causes LED chip poor with the stability that flexible PCB is electrically connected with.

And, during production LED string, needs are fixed on the lamp bead made on flexible PCB, also It is to say, at least includes lamp bead is fabricated separately in the process for manufacturing LED string and lamp bead is fixed on circuit boards made by general, Connect the steps such as electric power driving module afterwards, so as to form LED string.Therefore, the existing method for making LED string not only takes It is longer, low production efficiency, and it is relatively costly.

Additionally, made by before LED string, need using electric wire external power supply drive module, electric power driving module includes electricity Road plate and power drives part (power drives part includes electric capacity, inductance, resistance, power management IC etc.), power drives part Connection on circuit boards, power drives part for by external high voltage power supply be converted to lamp bead it is luminous when driving power supply.By In the restriction of technique, electric power driving module can not be connected directly between on the circuit board of lamp string, need power drives mould is fabricated separately Block, causes production cost to increase.

Utility model content

The purpose of this utility model is, there is provided a kind of substrate for making lamp string, the step of making lamp bead can be saved, and Lamp string is can manufacture, the production efficiency of lamp string is improve, while reducing production cost.

It is realizing using following technical scheme that the utility model solves its technical problem.

A kind of substrate for making lamp string, including substrate and multiple LED chips, substrate include installing zone, and installing zone is in strip Shape, is provided with circuit in the installing zone of substrate, LED chip is fixed in the installing zone of substrate by colloid, makes LED chip and base The circuit of plate is electrically connected with the lamp string to form strip.

In preferred embodiment of the present utility model, aforesaid substrate includes stacked conducting plate, and each metallic plate is spaced to be set Put, each metallic plate is connected with each other by insulating cement.

In preferred embodiment of the present utility model, there are in the installing zone of aforesaid substrate multiple filling out through each metallic plate Area is filled, flexible glue in fill area, is provided with, substrate is provided with the Lamp cup by made by flexible glue, and LED chip is in the cup chamber of Lamp cup.

In preferred embodiment of the present utility model, the substrate of above-mentioned making lamp string also includes LED packaging plastics, LED encapsulation Glue is arranged in the cup chamber of Lamp cup, and covers LED chip.

In preferred embodiment of the present utility model, the substrate of above-mentioned making lamp string also includes power drives part, power supply Drive part to be connected on substrate, and power drives part is electrically connected with the circuit of substrate.

In preferred embodiment of the present utility model, the string configuration of the installing zone in bending of aforesaid substrate, installing zone Including multiple installation portions, the first bending part, the second bending part and the 3rd bending part, each installation portion is used to connecting LED chip, and first Bending part and the second bending part are connected to the two ends of installation portion, and the 3rd bending part is connected to the of adjacent two installation portions end Between one bending part and the second bending part.

In preferred embodiment of the present utility model, the linear string configuration of the installing zone of aforesaid substrate is installed Area includes multiple installation portions, the first bending part, the second bending part and the 3rd bending part, and each installation portion is used to connect LED chip, the One bending part and the second bending part are connected to the two ends of installation portion, and the 3rd bending part is connected to adjacent two installation portions end Between first bending part and the second bending part, and the first bending part and the second bending part are perpendicular to the 3rd bending part, each installation portion It is parallel to each other.

The substrate for making lamp string of the present utility model, LED chip is connected directly between on substrate, is eliminated and is made lamp bead Step, while greatly reducing production cost for carrying the support of LED chip when eliminating making lamp bead.And, can root According to the lamp string shape for needing to make, substrate is cut, the lamp string of strip is directly cut out；Or the lamp string to cutting out Carry out being bent to form rectilinear lamp string；Therefore, eliminate lamp bead soldering on circuit boards during lamp string is made Step, directly can form the lamp string for needing by cutting or bending substrate, be capable of achieving batch production lamp string, improve the life of lamp string Efficiency is produced, while reducing production cost.

Described above is only the general introduction of technical solutions of the utility model, in order to better understand skill of the present utility model Art means, and being practiced according to the content of specification, and in order to allow above and other purpose of the present utility model, feature Can become apparent with advantage, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, describe in detail.

Description of the drawings

Fig. 1 a are the structural representations of the substrate of the making lamp string of the utility model first embodiment.

Fig. 1 b are the structural representations after the substrate of the making lamp string of Fig. 1 a cuts.

Fig. 2 a are the broken section structural representations of the substrate for making lamp string of the present utility model.

Fig. 2 b are the broken section structural representations that the substrate for making lamp string of the present utility model arranges fill area on substrate Figure.

Fig. 3 a are the structural representations after the substrate of the making lamp string of the utility model second embodiment cuts.

Fig. 3 b are the structural representations after the substrate bending of the making lamp string of Fig. 3 a.

Fig. 4 is the schematic flow sheet of the substrate production method for making lamp string of the present utility model.

Fig. 5 a to Fig. 5 e are the flow process partial schematic sectional views of the substrate production method for making lamp string of the present utility model.

Specific embodiment

Further to illustrate that the utility model is to reach technological means and effect that predetermined utility model purpose is taken, Below in conjunction with accompanying drawing and preferred embodiment, to according to the utility model proposes making lamp string substrate specific embodiment, Structure, feature and its effect, describe in detail as follows:

Relevant of the present utility model aforementioned and other technology contents, feature and effect, it is following coordinate with reference to schema compared with Can clearly appear from the detailed description of good embodiment.By the explanation of specific embodiment, when to the utility model can be up to The technological means and effect taken into predetermined purpose is able to more go deep into and specific understanding, but institute's accompanying drawings are only to provide With reference to purposes of discussion, not for being any limitation as to the utility model.

Fig. 1 a are the structural representations of the substrate of the making lamp string of the utility model first embodiment.As shown in Figure 1a, exist In the present embodiment, the substrate 10a for making lamp string includes substrate 12a, multiple LED chips 13 and power drives part 14.

Fig. 1 b are the structural representations after the substrate of the making lamp string of Fig. 1 a cuts.As illustrated in figs. ia and ib, substrate 12a Including the first side 121 and second side 122 being oppositely arranged and between first side 121 and second side 122 Cut area 101 and installing zone 102.Cutting area 101 includes that multiple first sons cut area 101a and multiple second sons cut area 101b, Each first son cuts area 101a and cuts area 101b with each second son and is crisscross arranged, and each first son cuts one end of area 101a and the One side 121 connects, and each first son cuts the other end of area 101a and extends towards the direction near second side 122, but not with Second side 122 connects, and each second son is cut one end of area 101b and is connected with second side 122, and each second son cuts area 101b The other end extend towards the direction near first side 121, but be not connected with first side 121.In the present embodiment, substrate 12a can cut into different shapes, for example cut remove substrate 12a on cut area 101, make the remaining installing zones of substrate 12a 102 form strip；Substrate 12a's cuts shape and can freely design the position for cutting area 101 according to actual needs, and then cuts Into the shape for needing.In the present embodiment, circuit 15 is provided with the installing zone 102 of substrate 12a, for forming conductive loops, Circuit 15 can be arranged in the installing zone 102 of substrate 12a, but not with above two side using the mode such as etching or machining Formula is limited.

Further, Fig. 2 a are the broken section structural representations of the substrate for making lamp string of the present utility model.Such as Fig. 2 a Shown, substrate 12a includes stacked conducting plate 123.The 123 spaced setting of each layer metallic plate, and using each gold of insulation gemel connection Category plate 123, that is to say, that be to be connected with each other by insulating cement between metallic plate 123 and metallic plate 123.In the present embodiment, it is Diagram is clear, has only shown double layer of metal plate 123 in Fig. 2.It is noted that the metallic plate 123 on substrate 12a upper stratas by Copper material is made, convenient to arrange circuit；The metallic plate 123 of bottom is made up of aluminium, convenient to radiate；Each metallic plate 123 of substrate 12a It is not limited to above two metal.

In the present embodiment, 123 number of plies of metallic plate can be one layer or be more than two-layer；For example when metallic plate 123 is four layers, It is upper strata metallic plate 123, middle layer metal plate 123, lower metal plate 123 and underlying metal plate 123 by 123 points of four layers of metallic plate, Circuit is set on upper strata metallic plate 123, middle layer metal plate 123 and lower metal plate 123 respectively, and each layer metallic plate 123 The conductive loops that circuit is formed are parallel relationship；It should be noted that upper strata metallic plate 123, middle layer metal plate 123, lower floor are golden The circuit set location of category plate 123 is identical, it is ensured that the circuit on each layer metallic plate 123 will not be caused brokenly when cutting substrate 12 It is bad.

Fig. 2 b are the broken section structural representations that the substrate for making lamp string of the present utility model arranges fill area on substrate Figure.As shown in Figure 2 b, multiple fill areas 104 through each metallic plate 123, each fill area are set in the installing zone 102 of substrate 12a 104 forms substrate 12a be filled with the engraved structure of patterning, and fill area 104 flexible glue 124.In the present embodiment, fill The shapes and sizes in area 104 freely can be designed as needed；Fill area 104 can be for example essentially designed as the rectangle frame of discontinuous Structure (is not limited to rectangular configuration), and flexible glue 124 is arranged on substrate 12a, connects the flexible glue 124 on substrate 12a and fills out The flexible glue 124 filled in area 104, and the Lamp cup 125 of rectangle is made using flexible glue 124 on substrate 12a, it is to engrave in the middle part of Lamp cup 125 Empty cup chamber 105, substrate 12a can be exposed from cup chamber 105.

Fig. 1 a to Fig. 2 b are refer to, LED chip 13 is connected to the installing zone 102 of substrate 12a by colloid, it is preferable that LED On the substrate 12a that chip 13 is connected in Lamp cup 125 by colloid, i.e., LED chip 13 is in the cup chamber 105 of Lamp cup 125；For Accelerate the solidification of colloid, need for substrate 12a to be put into oven for baking, until colloid completion of cure.In the present embodiment, LED chip 13 utilizes 16 hard solder connecting substrate 12a of gold thread and LED chip 13, makes LED chip 13 electric with the circuit 15 of substrate 12a Property connection.Include on substrate 12a multiple with 13 corresponding LED packaging plastics 17 (such as fluorescent glue) of LED chip, LED packaging plastics 17 Be arranged in the cup chamber 105 of Lamp cup 125, and be covered in LED chip 13, the LED chip 13 of gold thread 16 is welded for protection. In the present embodiment, the colloid between substrate 12a and LED chip 13 can be Anisotropic conductive adhesive or insulating cement, according to actual needs may be used Unrestricted choice.It is noted that as 16 fusing point of gold thread is higher, circuit 15 hard solder of the LED chip 13 with substrate 12a is completed After be difficult to be affected by the external environment, the stability that the circuit 15 of LED chip 13 and substrate 12a is electrically connected with can be effectively improved.

Power drives part 14 is connected in the installing zone 102 of substrate 12a, and makes power drives part 14 and substrate 12a Circuit 15 be electrically connected with.Power drives part 14 is for external high voltage power supply to be converted to drive when LED chip 13 lights Dynamic power supply.In the present embodiment, power drives part 14 includes the parts such as electric capacity, inductance, resistance, power management IC, electric capacity, electricity Sense, resistance, power management IC can be connected directly between on substrate 12a by way of scolding tin or gold thread hard solder.

As shown in Figure 1 b, cut and remove first son of substrate 12a and cut area 101a and after the second son cuts area 101b, stretching The remaining installing zones of substrate 12a 102 can be formed directly in the lamp string of bending, the lamp string of formation can directly with power supply electrified light emitting.

Fig. 3 a are the structural representations after the substrate of the making lamp string of the utility model second embodiment cuts.Fig. 3 b are figures Structural representation after the substrate bending of the making lamp string of 3a.As best shown in figures 3 a and 3b, the base of the making lamp string in the present embodiment Plate 10b is roughly the same with the structure of the substrate 10a of the making lamp string in first embodiment, after difference is substrate 12b bendings Shape it is different.

Specifically, the installing zone 102 of substrate 12b includes multiple installation portion 102a, the first bending part 102b, the second bending part 102c and the 3rd bending part 102d；Each installation portion 102a is used to connect LED chip 13；First bending part 102b and the second bending part 102c is connected to the two ends of installation portion 102a, and the 3rd bending part 102d is connected to the first of adjacent two installation portions 102a ends Between bending part 102b and the second bending part 102c.By the first bending part 102b and the second bending part at installation portion 102a two ends 102c bends, and makes the first bending part 102b and the second bending part 102c perpendicular to installation portion 102a, while by the 3rd bending part First bending part 102b and the second bending part 102c bending of 102d both sides, makes the first bending part 102b and the second bending part 102c Perpendicular to the 3rd bending part 102d, now each installation portion 102a is parallel to each other, and forms rectilinear lamp string.In the present embodiment, The shape of lamp string into arbitrary shape, can be not limited to linear by free folding as needed.

Fig. 4 is the schematic flow sheet of the substrate production method for making lamp string of the present utility model.Fig. 5 a to Fig. 5 e are this realities With the flow process partial schematic sectional view of the substrate production method of new making lamp string.Fig. 1 a to Fig. 5 e are refer to, this practicality is new The step of substrate production method of the making lamp string of type, includes：

Substrate 12a, 12b are provided, substrate 12a, 12b include cutting area 101 and installing zone 102, and in substrate 12a, 12b Circuit 15 is set in installing zone 102, as shown in Figure 5 a；

There are in the installing zone 102 of substrate 12a, 12b multiple fill areas 104, and flexible glue 124 be filled in fill area 104, Lamp cup 125 is made on substrate 12a, 12b using flexible glue 124, as shown in Figure 5 b；

Multiple LED chips 13 are provided, the peace of substrate 12a, 12b for LED chip 13 being fixed in Lamp cup 125 using colloid Dress area 102, carries out baking-curing colloid, as shown in Figure 5 c afterwards；

Using 16 hard solder connecting substrate 12a, 12b of gold thread and LED chip 13, the line of LED chip 13 and substrate 12a, 12b is made Road 15 is electrically connected with, as fig 5d；

LED packaging plastics 17 are provided, LED packaging plastics 17 are arranged in the cup chamber 105 of Lamp cup 125, and are covered LED chip 13, as depicted in fig. 5e；

Power drives part 14 is provided, power drives part 14 is connected on substrate 12a, 12b, and is made power drives zero Part 14 is electrically connected with the circuit 15 of substrate 12a, 12b；

Cut removal substrate 12a, 12b cuts area 101, makes the remaining installing zone 102 of substrate 12a, 12b form strip Lamp string；Specifically, for example, cut and remove first son of substrate 12a and cut area 101a and after the second son cuts area 101b, stretching The remaining installing zones of substrate 12a 102 can be formed directly in the lamp string of bending, as shown in Figure 1 b；For example, by the installation of installing zone 102 The first bending part 102b and the second bending part 102c at portion 102a two ends is bent into perpendicular to installation portion 102a, while by the 3rd folding The first bending part 102b and the second bending part 102c of turn of bilge 102d both sides is bent into perpendicular to the 3rd bending part 102d, makes each peace Dress portion 102a is parallel to each other, and forms rectilinear lamp string, as shown in Figure 3 b.

LED chip 13 is connected directly between substrate 12a, 12b by the substrate production method for making lamp string of the present utility model On, the step of making lamp bead is eliminated, while greatly dropping for carrying the support of LED chip 13 when eliminating making lamp bead Low production cost.And, LED chip 13 is connected on substrate 12a, 12b by 16 hard solder of gold thread, and 16 fusing point of gold thread is high, will It is difficult to be affected by the external environment after the completion of LED chip 13 and 15 hard solder of circuit of substrate 12a, 12b, LED chip can be effectively improved 13 stability being electrically connected with the circuit 15 of substrate 12a, 12b.Additionally, the lamp string shape that can be made as needed, to substrate 12a, 12b are cut, and directly cut out the lamp string of strip；Or the lamp string to cutting out carry out being bent to form it is rectilinear Lamp string；Therefore, the step of eliminating lamp bead soldering on circuit boards during lamp string is made, can directly by cutting or Bending substrate 12a, 12b form the lamp string for needing, and are capable of achieving batch production lamp string, improve the production efficiency of lamp string, while drop Low production cost.

Preferred embodiment of the present utility model is described in detail above in association with accompanying drawing, but the utility model is not limited to Detail in above-mentioned embodiment, in range of the technology design of the present utility model, can be to technology of the present utility model Scheme carries out various simple variants, and these simple variants belong to protection domain of the present utility model.In above-mentioned specific embodiment party Each particular technique feature described in formula, in the case of reconcilable, can be combined by any suitable means. In order to avoid unnecessary repetition, the utility model is no longer separately illustrated to various possible combinations.

Claims (7)

1. a kind of substrate for making lamp string, it is characterised in that including substrate and multiple LED chips, the substrate includes installing zone, should Installing zone is elongated, is provided with circuit in the installing zone of the substrate, and the LED chip is fixed on the installation of the substrate by colloid In area, the LED chip and the circuit of the substrate is made to be electrically connected with the lamp string to form strip.

2. the substrate of lamp string is made as claimed in claim 1, it is characterised in that the substrate includes stacked conducting plate, respectively the gold Belong to the spaced setting of plate, respectively the metallic plate is connected with each other by insulating cement.

3. the substrate of lamp string is made as claimed in claim 2, it is characterised in that there is in the installing zone of the substrate multiple running through Respectively the fill area of the metallic plate, is provided with flexible glue in the fill area, and the substrate is provided with by Lamp cup made by the flexible glue, the LED core Piece is in the cup chamber of the Lamp cup.

4. the substrate of lamp string is made as claimed in claim 3, it is characterised in that the substrate of the making lamp string is also sealed including LED Dress glue, the LED packaging plastics are arranged in the cup chamber of the Lamp cup, and cover the LED chip.

5. the substrate of lamp string is made as claimed in claim 1, it is characterised in that the substrate of the making lamp string is also driven including power supply Dynamic part, the power drives part connect on the substrate, and the power drives part is electrically connected with the circuit of the substrate.

6. the substrate of lamp string is made as claimed in claim 1, it is characterised in that strip of the installing zone of the substrate in bending Structure, the installing zone include multiple installation portions, the first bending part, the second bending part and the 3rd bending part, and respectively the installation portion is used for Connection LED chip, first bending part and second bending part are connected to the two ends of the installation portion, and the 3rd bending part connects It is connected between first bending part of the adjacent two installation portion ends and second bending part.

7. the as claimed in claim 1 substrate for making lamp string, it is characterised in that the linear strip of the installing zone of the substrate Shape structure, the installing zone include multiple installation portions, the first bending part, the second bending part and the 3rd bending part, and respectively the installation portion is used In connection LED chip, first bending part and second bending part are vertically connected at the two ends of the installation portion, the 3rd folding respectively Turn of bilge is connected between first bending part of the adjacent two installation portion ends and second bending part, and first bending part and Second bending part is parallel to each other perpendicular to the 3rd bending part, the respectively installation portion.