CN205005347U - 层叠型陶瓷电子元器件 - Google Patents
层叠型陶瓷电子元器件 Download PDFInfo
- Publication number
- CN205005347U CN205005347U CN201520125697.5U CN201520125697U CN205005347U CN 205005347 U CN205005347 U CN 205005347U CN 201520125697 U CN201520125697 U CN 201520125697U CN 205005347 U CN205005347 U CN 205005347U
- Authority
- CN
- China
- Prior art keywords
- multilayer ceramic
- electronic component
- ceramic substrate
- dielectric layer
- par
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 129
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 30
- 239000004020 conductor Substances 0.000 claims description 29
- 239000010410 layer Substances 0.000 claims 8
- 239000011229 interlayer Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 10
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 230000008961 swelling Effects 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 21
- 102100040853 PRKC apoptosis WT1 regulator protein Human genes 0.000 description 13
- 101710162991 PRKC apoptosis WT1 regulator protein Proteins 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 101100489713 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND1 gene Proteins 0.000 description 2
- 101100489717 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND2 gene Proteins 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000009766 low-temperature sintering Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014041794A JP6032229B2 (ja) | 2014-03-04 | 2014-03-04 | 積層型セラミック電子部品 |
JP2014-041794 | 2014-03-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205005347U true CN205005347U (zh) | 2016-01-27 |
Family
ID=54257952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520125697.5U Expired - Fee Related CN205005347U (zh) | 2014-03-04 | 2015-03-04 | 层叠型陶瓷电子元器件 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6032229B2 (ja) |
CN (1) | CN205005347U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106257746A (zh) * | 2016-07-14 | 2016-12-28 | 南京航空航天大学 | 一种可编程重构的全固态等离子体倒装s‑pin天线 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002261443A (ja) * | 2001-02-27 | 2002-09-13 | Kyocera Corp | 回路基板の製造方法 |
JP2005116938A (ja) * | 2003-10-10 | 2005-04-28 | Ngk Spark Plug Co Ltd | キャビティ付き多層セラミック基板およびその製造方法 |
JP4858538B2 (ja) * | 2006-02-14 | 2012-01-18 | 株式会社村田製作所 | 多層セラミック電子部品、多層セラミック基板、および多層セラミック電子部品の製造方法 |
JP2008159725A (ja) * | 2006-12-22 | 2008-07-10 | Kyocera Corp | セラミック多層基板およびその製造方法 |
JP2009252783A (ja) * | 2008-04-01 | 2009-10-29 | Murata Mfg Co Ltd | セラミック多層基板の製造方法及びセラミック多層基板の反り量の調整方法 |
JP5527048B2 (ja) * | 2010-06-29 | 2014-06-18 | 株式会社村田製作所 | セラミック多層基板 |
-
2014
- 2014-03-04 JP JP2014041794A patent/JP6032229B2/ja not_active Expired - Fee Related
-
2015
- 2015-03-04 CN CN201520125697.5U patent/CN205005347U/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106257746A (zh) * | 2016-07-14 | 2016-12-28 | 南京航空航天大学 | 一种可编程重构的全固态等离子体倒装s‑pin天线 |
Also Published As
Publication number | Publication date |
---|---|
JP2015167210A (ja) | 2015-09-24 |
JP6032229B2 (ja) | 2016-11-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160127 |
|
CF01 | Termination of patent right due to non-payment of annual fee |