CN205005347U - 层叠型陶瓷电子元器件 - Google Patents

层叠型陶瓷电子元器件 Download PDF

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Publication number
CN205005347U
CN205005347U CN201520125697.5U CN201520125697U CN205005347U CN 205005347 U CN205005347 U CN 205005347U CN 201520125697 U CN201520125697 U CN 201520125697U CN 205005347 U CN205005347 U CN 205005347U
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CN
China
Prior art keywords
multilayer ceramic
electronic component
ceramic substrate
dielectric layer
par
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520125697.5U
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English (en)
Chinese (zh)
Inventor
渡边真也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
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Publication of CN205005347U publication Critical patent/CN205005347U/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN201520125697.5U 2014-03-04 2015-03-04 层叠型陶瓷电子元器件 Expired - Fee Related CN205005347U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014041794A JP6032229B2 (ja) 2014-03-04 2014-03-04 積層型セラミック電子部品
JP2014-041794 2014-03-04

Publications (1)

Publication Number Publication Date
CN205005347U true CN205005347U (zh) 2016-01-27

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ID=54257952

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520125697.5U Expired - Fee Related CN205005347U (zh) 2014-03-04 2015-03-04 层叠型陶瓷电子元器件

Country Status (2)

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JP (1) JP6032229B2 (ja)
CN (1) CN205005347U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106257746A (zh) * 2016-07-14 2016-12-28 南京航空航天大学 一种可编程重构的全固态等离子体倒装s‑pin天线

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261443A (ja) * 2001-02-27 2002-09-13 Kyocera Corp 回路基板の製造方法
JP2005116938A (ja) * 2003-10-10 2005-04-28 Ngk Spark Plug Co Ltd キャビティ付き多層セラミック基板およびその製造方法
JP4858538B2 (ja) * 2006-02-14 2012-01-18 株式会社村田製作所 多層セラミック電子部品、多層セラミック基板、および多層セラミック電子部品の製造方法
JP2008159725A (ja) * 2006-12-22 2008-07-10 Kyocera Corp セラミック多層基板およびその製造方法
JP2009252783A (ja) * 2008-04-01 2009-10-29 Murata Mfg Co Ltd セラミック多層基板の製造方法及びセラミック多層基板の反り量の調整方法
JP5527048B2 (ja) * 2010-06-29 2014-06-18 株式会社村田製作所 セラミック多層基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106257746A (zh) * 2016-07-14 2016-12-28 南京航空航天大学 一种可编程重构的全固态等离子体倒装s‑pin天线

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Publication number Publication date
JP2015167210A (ja) 2015-09-24
JP6032229B2 (ja) 2016-11-24

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160127

CF01 Termination of patent right due to non-payment of annual fee